Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (41255) > Сторінка 57 з 688
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 116-93-422-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-422-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-422-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-424-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
|
|
116-93-424-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
|
|
116-93-424-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. |
| 116-93-424-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-424-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-428-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-428-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-428-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-428-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-428-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-432-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-432-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-432-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-432-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-432-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-624-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-624-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-624-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-624-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-624-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-628-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-628-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-628-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-628-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-628-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-632-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
|
|
116-93-632-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. |
| 116-93-632-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-632-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-636-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-636-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-636-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-636-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-636-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-640-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-640-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-640-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-640-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-640-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-642-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 42POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-642-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 42POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-642-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 42POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-642-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 42POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-642-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 42POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-648-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-648-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-648-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-648-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-648-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-650-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-650-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-650-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-650-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-650-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-652-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 52POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-93-652-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 52POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
| 116-93-422-41-006000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-422-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-422-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-424-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-424-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-424-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
на замовлення 4 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 116-93-424-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-424-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-428-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-428-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-428-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-428-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-428-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-432-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-432-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-432-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-432-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-432-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-624-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-624-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-624-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-624-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-624-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-628-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-628-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-628-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-628-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-628-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-632-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-632-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-632-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
на замовлення 1 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 116-93-632-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-632-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-636-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-636-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-636-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-636-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-636-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-640-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-640-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-640-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-640-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-640-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-642-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-642-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-642-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-642-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-642-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-648-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-648-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-648-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-648-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-648-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-650-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-650-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-650-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-650-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-650-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-652-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-93-652-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Description: CONN IC DIP SOCKET 52POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
