Продукція > NXP SEMICONDUCTORS > Всі товари виробника NXP SEMICONDUCTORS (69963) > Сторінка 43 з 1167
| Фото | Назва | Виробник | Інформація |
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Ціна |
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| MPC8545VJATGD | NXP Semiconductors |
Description: IC MPU MPC85XX 1.2GHZ 783BGAPackaging: Bulk Package / Case: 783-BBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-PBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: AES, Cryptography, Kasumi, Random Number Generator Additional Interfaces: DUART, I2C, PCI, RapidIO |
на замовлення 118 шт: термін постачання 21-31 дні (днів) |
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SCC2698BC1A84,512 | NXP Semiconductors |
Description: IC UART OCTAL ENHANCED 84-PLCCPackaging: Bulk Features: Configurable GPIO, Internal Oscillator, Timer/Counter Package / Case: 84-LCC (J-Lead) Number of Channels: 8 Mounting Type: Surface Mount Voltage - Supply: 5V Protocol: RS485 Supplier Device Package: 84-PLCC (29.26x29.26) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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MFRC53101T/0FE,112 | NXP Semiconductors |
Description: STANDARD ISO/IEC 14443 A/B READE Packaging: Bulk |
на замовлення 1050 шт: термін постачання 21-31 дні (днів) |
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PMEG2010EPASX | NXP Semiconductors |
Description: DIODE SCHOTTKY 20V 1A DFN2020D-3Packaging: Bulk Package / Case: 3-UDFN Exposed Pad Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 50 ns Technology: Schottky Capacitance @ Vr, F: 175pF @ 1V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: DFN2020D-3 Operating Temperature - Junction: 150°C (Max) Grade: Automotive Voltage - DC Reverse (Vr) (Max): 20 V Voltage - Forward (Vf) (Max) @ If: 375 mV @ 1 A Current - Reverse Leakage @ Vr: 335 µA @ 20 V Qualification: AEC-Q101 |
на замовлення 27000 шт: термін постачання 21-31 дні (днів) |
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| PMEG6010ESBYL | NXP Semiconductors |
Description: DIODE SCHOTTKY 60V 1A DSN1006-2Packaging: Bulk Package / Case: 2-XDFN Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 2.4 ns Technology: Schottky Capacitance @ Vr, F: 20pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: DSN1006-2 Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 60 V Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A Current - Reverse Leakage @ Vr: 30 µA @ 60 V |
на замовлення 199680 шт: термін постачання 21-31 дні (днів) |
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BZX884-C12,315 | NXP Semiconductors |
Description: DIODE ZENER 12V 250MW DFN1006-2Tolerance: ±5% Packaging: Bulk Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 12 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: DFN1006-2 Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V |
на замовлення 18159 шт: термін постачання 21-31 дні (днів) |
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BFG505/X,215 | NXP Semiconductors |
Description: RF TRANS NPN 15V 9GHZ SOT-143BPackaging: Bulk Package / Case: TO-253-4, TO-253AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 150mW Current - Collector (Ic) (Max): 18mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz Supplier Device Package: SOT-143B |
на замовлення 4610 шт: термін постачання 21-31 дні (днів) |
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PBSS5230QAZ | NXP Semiconductors |
Description: TRANS PNP 30V 2A DFN1010D-3Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V Frequency - Transition: 170MHz Supplier Device Package: DFN1010D-3 Current - Collector (Ic) (Max): 2 A Voltage - Collector Emitter Breakdown (Max): 30 V Power - Max: 325 mW |
на замовлення 554308 шт: термін постачання 21-31 дні (днів) |
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TDA3664AT/N1,118 | NXP Semiconductors |
Description: IC REG LINEAR 5V 100MA 8-SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Fixed Mounting Type: Surface Mount Current - Output: 100mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 30 µA Voltage - Input (Max): 45V Number of Regulators: 1 Supplier Device Package: 8-SO Voltage - Output (Min/Fixed): 5V PSRR: 60dB (120Hz) Voltage Dropout (Max): 0.3V @ 50mA Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage Current - Supply (Max): 2.5 mA |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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74AUP3G17GTX | NXP Semiconductors |
Description: NEXPERIA 74AUP3G17 - LOW-POWER TPackaging: Bulk |
на замовлення 4973 шт: термін постачання 21-31 дні (днів) |
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| MC33886PVWR2 | NXP Semiconductors |
Description: 5.0 A H-BridgePackaging: Bulk Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 40V Applications: General Purpose Technology: CMOS Voltage - Load: 5V ~ 40V Supplier Device Package: 20-HSOP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
на замовлення 625 шт: термін постачання 21-31 дні (днів) |
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TEA1733MT/N2,118 | NXP Semiconductors |
Description: IC OFFLINE SWITCH FLYBACK 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 72% Frequency - Switching: 91.5kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12V ~ 30V Supplier Device Package: 8-SO Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage Voltage - Start Up: 20.6 V Power (Watts): 75 W |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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TEA1703T/N1,118 | NXP Semiconductors |
Description: IC CTRLR SMPS GREEN OVP 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Voltage - Input: 5V ~ 30V Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 30V Applications: Secondary-Side Controller Supplier Device Package: 8-SO Current - Supply: 30 µA DigiKey Programmable: Not Verified |
на замовлення 9883 шт: термін постачання 21-31 дні (днів) |
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TEA1750T/N1,518 | NXP Semiconductors |
Description: IC OFFLINE SWITCH FLYBACK 16SOPackaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Frequency - Switching: 125kHz Internal Switch(s): No Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 15V ~ 38V Supplier Device Package: 16-SO Fault Protection: Current Limiting, Over Temperature, Over Voltage Voltage - Start Up: 22 V Power (Watts): 250 W |
на замовлення 4502 шт: термін постачання 21-31 дні (днів) |
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NTS0103GU10,115 | NXP Semiconductors |
Description: NTS0103 - DUAL SUPPLY TRANSLATINPackaging: Bulk |
на замовлення 6604 шт: термін постачання 21-31 дні (днів) |
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CGY1047,112 | NXP Semiconductors |
Description: NARROW BAND HIGH POWER AMPLIFIERPackaging: Tube Package / Case: SOT-115J Output Type: Push-Pull Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: SOT115J Number of Circuits: 1 Current - Supply: 250 mA |
на замовлення 2194 шт: термін постачання 21-31 дні (днів) |
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PMXB350UPEZ | NXP Semiconductors |
Description: NEXPERIA PMXB350UPE - 20 V, P-CHPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta) Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V Power Dissipation (Max): 360mW (Ta), 5.68W (Tc) Vgs(th) (Max) @ Id: 950mV @ 250µA Supplier Device Package: DFN1010D-3 Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V |
на замовлення 659217 шт: термін постачання 21-31 дні (днів) |
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| MPC8377VRAGDA | NXP Semiconductors |
Description: IC MPU MPC83XX 400MHZ PBGA689Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
на замовлення 339 шт: термін постачання 21-31 дні (днів) |
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| MPC8536EBVJAULA | NXP Semiconductors |
Description: IC MPU 1.333GHZ 783FCPBGAPackaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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LPC11U14FET48/201, | NXP Semiconductors |
Description: LPC11U14- Scalable Entry Level 3Packaging: Bulk Package / Case: 48-TFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-TFBGA (4.5x4.5) Number of I/O: 40 |
на замовлення 861 шт: термін постачання 21-31 дні (днів) |
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LPC11U13FBD48/201, | NXP Semiconductors |
Description: LPC11U13 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
на замовлення 1095 шт: термін постачання 21-31 дні (днів) |
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TDA10025HN/C1,518 | NXP Semiconductors |
Description: IC DEMODULATOR DUAL 48-HVQFNPackaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Processor Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V Applications: Consumer Video Supplier Device Package: 48-HVQFN (7x7) Control Interface: I2C |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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| LPC4076FBD144E | NXP Semiconductors |
Description: LPC4000 - Mid-range 32-bit MicroPackaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 109 |
на замовлення 654 шт: термін постачання 21-31 дні (днів) |
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BC54-10PASX | NXP Semiconductors |
Description: TRANS NPN 45V 1A DFN2020D-3Packaging: Bulk Package / Case: 3-UDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V Frequency - Transition: 180MHz Supplier Device Package: DFN2020D-3 Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 420 mW |
на замовлення 146990 шт: термін постачання 21-31 дні (днів) |
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BC51PASX | NXP Semiconductors |
Description: TRANS PNP 45V 1A DFN2020D-3Packaging: Bulk Package / Case: 3-UDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V Frequency - Transition: 145MHz Supplier Device Package: DFN2020D-3 Current - Collector (Ic) (Max): 1 A Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 420 mW |
на замовлення 51000 шт: термін постачання 21-31 дні (днів) |
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MC9S08GT8ACFDE | NXP Semiconductors |
Description: IC MCU 8BIT 8KB FLASH 48MAPQFNPackaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: HCS08 Data Converters: A/D 8x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-MAPQFN-EP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 393 шт: термін постачання 21-31 дні (днів) |
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| MCF51AC128CCFGE | NXP Semiconductors |
Description: IC MCU 32BIT 128KB FLASH 44LQFPPackaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 50.33MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 9x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 125 шт: термін постачання 21-31 дні (днів) |
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| AFT27S010NT1 | NXP Semiconductors |
Description: RF MOSFET LDMOS 28V PLD-1.5WPackaging: Bulk Package / Case: PLD-1.5W Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 728MHz ~ 3.6GHz Power - Output: 1.26W Gain: 21.7dB Technology: LDMOS Supplier Device Package: PLD-1.5W Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 90 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| MKM33Z64CLH5 | NXP Semiconductors |
Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR, 24b Sigma-Delta Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, LVD, POR, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 38 DigiKey Programmable: Not Verified |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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MWPR1516CFM | NXP Semiconductors |
Description: WIRELESS CHARGER RECEIVER ASSP WPackaging: Bulk Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.5V ~ 20V Applications: Wireless Power Transmitter Supplier Device Package: 32-QFN (5x5) |
на замовлення 49239 шт: термін постачання 21-31 дні (днів) |
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TEA1738GT/N1,118 | NXP Semiconductors |
Description: IC OFFLINE SWITCH FLYBACK 8SOPackaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 80% Frequency - Switching: 26.5kHz ~ 118kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V Supplier Device Package: 8-SO Fault Protection: Current Limiting, Over Power, Over Temperature Voltage - Start Up: 13.2 V Power (Watts): 75 W |
на замовлення 3861 шт: термін постачання 21-31 дні (днів) |
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BAP1321-03,115 | NXP Semiconductors |
Description: RF DIODE PIN 60V 500MW SOD-323Packaging: Bulk Package / Case: SC-76, SOD-323 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 60V Supplier Device Package: SOD-323 Current - Max: 100 mA Power Dissipation (Max): 500 mW |
на замовлення 9190 шт: термін постачання 21-31 дні (днів) |
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| HT2MOA4S20/E/3/RJ | NXP Semiconductors |
Description: HITAG 2 transponder ICPackaging: Bulk Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 125kHz Type: RFID Transponder Operating Temperature: -55°C ~ 140°C Voltage - Supply: 6.5V Standards: ISO 11784, ISO 11785 Supplier Device Package: PLLMC |
на замовлення 33666 шт: термін постачання 21-31 дні (днів) |
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74AUP3G34GDH | NXP Semiconductors |
Description: NEXPERIA 74AUP3G34 - NON INVERTIPackaging: Bulk |
на замовлення 2928 шт: термін постачання 21-31 дні (днів) |
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74AUP3G34GNX | NXP Semiconductors |
Description: NEXPERIA 74AUP3G34 - LOW-POWER TPackaging: Bulk |
на замовлення 69900 шт: термін постачання 21-31 дні (днів) |
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UBA2024BP/N1,112 | NXP Semiconductors |
Description: IC DRIVER HALF BRIDGE 8-DIPPackaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 11.4V ~ 13.3V Supplier Device Package: 8-DIP Dimming: No Current - Output Source/Sink: 2.5A Current - Supply: 5 mA |
на замовлення 400 шт: термін постачання 21-31 дні (днів) |
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| MC9S08JM16CLD | NXP Semiconductors |
Description: IC MCU 8BIT 16KB FLASH 44LQFPPackaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: HCS08 Data Converters: A/D 8x12b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI, USB Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 33 DigiKey Programmable: Not Verified |
на замовлення 2327 шт: термін постачання 21-31 дні (днів) |
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| MCIMX6Q5EZK08AD | NXP Semiconductors |
Description: IC MPU I.MX6Q 800MHZ 569MAPBGAPackaging: Bulk Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
на замовлення 2208 шт: термін постачання 21-31 дні (днів) |
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PMEG4002AESFYL | NXP Semiconductors |
Description: DIODE SCHOTTK 40V 200MA DSN06032Packaging: Bulk Package / Case: 0201 (0603 Metric) Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 1.25 ns Technology: Schottky Capacitance @ Vr, F: 18pF @ 1V, 1MHz Current - Average Rectified (Io): 200mA Supplier Device Package: DSN0603-2 Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 525 mV @ 200 mA Current - Reverse Leakage @ Vr: 80 µA @ 40 V |
на замовлення 1131762 шт: термін постачання 21-31 дні (днів) |
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PMEG4002ESFYL | NXP Semiconductors |
Description: DIODE SCHOTTK 40V 200MA DSN06032Packaging: Bulk Package / Case: 0201 (0603 Metric) Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 1.28 ns Technology: Schottky Capacitance @ Vr, F: 17pF @ 1V, 1MHz Current - Average Rectified (Io): 200mA Supplier Device Package: DSN0603-2 Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 600 mV @ 200 mA Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V |
на замовлення 1278000 шт: термін постачання 21-31 дні (днів) |
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MCIMX6X3EVK10AB | NXP Semiconductors |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGAPackaging: Bulk Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 1GHz, 227MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (14x14) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC |
на замовлення 139 шт: термін постачання 21-31 дні (днів) |
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MCIMX6X3EVN10AB | NXP Semiconductors |
Description: IC MPU 227MHZ/1GHZ 400MAPBGAPackaging: Bulk Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (14x14) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC |
на замовлення 207 шт: термін постачання 21-31 дні (днів) |
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74HCT4538D,112 | NXP Semiconductors |
Description: NEXPERIA 74HCT4538D - MONOSTABLEPackaging: Bulk |
на замовлення 7403 шт: термін постачання 21-31 дні (днів) |
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LPC11U34FBD48/421, | NXP Semiconductors |
Description: LPC11U3X - 32-BIT ARM CORTEX-M0Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 48KB (48K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 554 шт: термін постачання 21-31 дні (днів) |
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LPC11U35FBD64/401, | NXP Semiconductors |
Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 40841 шт: термін постачання 21-31 дні (днів) |
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LPC11U37FBD64/501, | NXP Semiconductors |
Description: LPC11U37 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
на замовлення 4759 шт: термін постачання 21-31 дні (днів) |
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LPC11U24FHI33/301, | NXP Semiconductors |
Description: LPC11U24 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 26 |
на замовлення 15263 шт: термін постачання 21-31 дні (днів) |
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LPC11U34FHN33/311, | NXP Semiconductors |
Description: IC MCU 32BIT 40KB FLASH 32HVQFNPackaging: Bulk Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 40KB (40K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
на замовлення 504 шт: термін постачання 21-31 дні (днів) |
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LPC11U34FBD48/311, | NXP Semiconductors |
Description: LPC11U34 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 40KB (40K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
на замовлення 566 шт: термін постачання 21-31 дні (днів) |
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LPC11U35FET48/501, | NXP Semiconductors |
Description: IC MCU 32BIT 64KB FLASH 48TFBGAPackaging: Bulk Package / Case: 48-TFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-TFBGA (4.5x4.5) Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 15316 шт: термін постачання 21-31 дні (днів) |
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LPC11U66JBD48E | NXP Semiconductors |
Description: LPC11U66 - Scalable 32-bit MicroPackaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 8x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 34 |
на замовлення 87 шт: термін постачання 21-31 дні (днів) |
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LPC11U36FBD64/401, | NXP Semiconductors |
Description: LPC11U36 - Cortex-M0+/M0 RISC MiPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 96KB (96K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
на замовлення 891 шт: термін постачання 21-31 дні (днів) |
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BZV85-C27,113 | NXP Semiconductors |
Description: DIODE ZENER 27V 1W DO41Tolerance: ±5% Packaging: Bulk Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 27 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: DO-41 Power - Max: 1 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 50 nA @ 19 V |
на замовлення 184000 шт: термін постачання 21-31 дні (днів) |
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JN5168-001-M00Z | NXP Semiconductors |
Description: RF TXRX MOD 802.15.4 TH SMDPackaging: Bulk Package / Case: 40-VFQFN Exposed Pad Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 17mA Current - Transmitting: 15.3mA Antenna Type: Integrated, Trace Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART |
на замовлення 417 шт: термін постачання 21-31 дні (днів) |
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BAP65-05,215 | NXP Semiconductors |
Description: RF DIODE PIN 30V 250MW SOT-23Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Diode Type: PIN - 1 Pair Common Cathode Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz Resistance @ If, F: 350mOhm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 30V Supplier Device Package: SOT-23 (TO-236AB) Current - Max: 100 mA Power Dissipation (Max): 250 mW |
на замовлення 31515 шт: термін постачання 21-31 дні (днів) |
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| AFV10700HR5 | NXP Semiconductors |
Description: RF MOSFET LDMOS 52V NI780Packaging: Bulk Package / Case: NI-780-4 Current Rating (Amps): 1µA Mounting Type: Chassis Mount Frequency: 960MHz ~ 1.215GHz Configuration: 2 N-Channel Power - Output: 700W Gain: 19.2dB Technology: LDMOS (Dual) Supplier Device Package: NI-780-4 Voltage - Rated: 105 V Voltage - Test: 52 V Current - Test: 100 mA |
на замовлення 237 шт: термін постачання 21-31 дні (днів) |
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TDA10027HN/C1,518 | NXP Semiconductors |
Description: IC DEMOD DUAL W/RX 64-HVQFNPackaging: Bulk Package / Case: 64-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Function: Demodulator Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V Applications: Consumer Video Supplier Device Package: 64-HVQFN (9x9) Control Interface: I2C |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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BF1100R,215 | NXP Semiconductors |
Description: RF MOSFET 9V SOT143RPackaging: Bulk Package / Case: SOT-143R Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 800MHz Configuration: N-Channel Dual Gate Technology: MOSFET (Metal Oxide) Noise Figure: 2dB Supplier Device Package: SOT-143R Voltage - Rated: 14 V Voltage - Test: 9 V Current - Test: 10 mA |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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TDA18273HN/C1,518 | NXP Semiconductors |
Description: IC SILICON TUNER HYBRID 40HVQFNPackaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V ~ 3.6V Applications: Professional Video Standards: DVB-T2, DVB-C2 Supplier Device Package: 40-HVQFN (6x6) Control Interface: I2C |
на замовлення 218821 шт: термін постачання 21-31 дні (днів) |
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PCA9306GF,115 | NXP Semiconductors |
Description: IC XLTR VL BIDIR 8-XSON/SOT1089Features: Auto-Direction Sensing Packaging: Bulk Package / Case: 8-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 8-XSON, SOT1089 (1.35x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Number of Circuits: 1 |
товару немає в наявності |
В кошику од. на суму грн. |
| MPC8545VJATGD |
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Виробник: NXP Semiconductors
Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
Description: IC MPU MPC85XX 1.2GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-PBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: AES, Cryptography, Kasumi, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, RapidIO
на замовлення 118 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 17711.79 грн |
| SCC2698BC1A84,512 |
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Виробник: NXP Semiconductors
Description: IC UART OCTAL ENHANCED 84-PLCC
Packaging: Bulk
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 84-LCC (J-Lead)
Number of Channels: 8
Mounting Type: Surface Mount
Voltage - Supply: 5V
Protocol: RS485
Supplier Device Package: 84-PLCC (29.26x29.26)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: IC UART OCTAL ENHANCED 84-PLCC
Packaging: Bulk
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 84-LCC (J-Lead)
Number of Channels: 8
Mounting Type: Surface Mount
Voltage - Supply: 5V
Protocol: RS485
Supplier Device Package: 84-PLCC (29.26x29.26)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9+ | 2518.31 грн |
| MFRC53101T/0FE,112 |
на замовлення 1050 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 21+ | 1173.73 грн |
| PMEG2010EPASX |
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Виробник: NXP Semiconductors
Description: DIODE SCHOTTKY 20V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Schottky
Capacitance @ Vr, F: 175pF @ 1V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DFN2020D-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 375 mV @ 1 A
Current - Reverse Leakage @ Vr: 335 µA @ 20 V
Qualification: AEC-Q101
Description: DIODE SCHOTTKY 20V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Schottky
Capacitance @ Vr, F: 175pF @ 1V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DFN2020D-3
Operating Temperature - Junction: 150°C (Max)
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 375 mV @ 1 A
Current - Reverse Leakage @ Vr: 335 µA @ 20 V
Qualification: AEC-Q101
на замовлення 27000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2647+ | 8.52 грн |
| PMEG6010ESBYL |
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Виробник: NXP Semiconductors
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
Description: DIODE SCHOTTKY 60V 1A DSN1006-2
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 730 mV @ 1 A
Current - Reverse Leakage @ Vr: 30 µA @ 60 V
на замовлення 199680 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7088+ | 3.20 грн |
| BZX884-C12,315 |
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Виробник: NXP Semiconductors
Description: DIODE ZENER 12V 250MW DFN1006-2
Tolerance: ±5%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Description: DIODE ZENER 12V 250MW DFN1006-2
Tolerance: ±5%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DFN1006-2
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
на замовлення 18159 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 18159+ | 1.60 грн |
| BFG505/X,215 |
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Виробник: NXP Semiconductors
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
на замовлення 4610 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1366+ | 15.75 грн |
| PBSS5230QAZ |
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Виробник: NXP Semiconductors
Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
Description: TRANS PNP 30V 2A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 210mV @ 50mA, 1A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Frequency - Transition: 170MHz
Supplier Device Package: DFN1010D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 325 mW
на замовлення 554308 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4691+ | 4.80 грн |
| TDA3664AT/N1,118 |
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Виробник: NXP Semiconductors
Description: IC REG LINEAR 5V 100MA 8-SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 30 µA
Voltage - Input (Max): 45V
Number of Regulators: 1
Supplier Device Package: 8-SO
Voltage - Output (Min/Fixed): 5V
PSRR: 60dB (120Hz)
Voltage Dropout (Max): 0.3V @ 50mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Current - Supply (Max): 2.5 mA
Description: IC REG LINEAR 5V 100MA 8-SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 30 µA
Voltage - Input (Max): 45V
Number of Regulators: 1
Supplier Device Package: 8-SO
Voltage - Output (Min/Fixed): 5V
PSRR: 60dB (120Hz)
Voltage Dropout (Max): 0.3V @ 50mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Current - Supply (Max): 2.5 mA
на замовлення 59 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 59+ | 365.73 грн |
| 74AUP3G17GTX |
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на замовлення 4973 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2565+ | 9.30 грн |
| MC33886PVWR2 |
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Виробник: NXP Semiconductors
Description: 5.0 A H-Bridge
Packaging: Bulk
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: 5.0 A H-Bridge
Packaging: Bulk
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
на замовлення 625 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 52+ | 430.45 грн |
| TEA1733MT/N2,118 |
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Виробник: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Power (Watts): 75 W
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 519+ | 42.07 грн |
| TEA1703T/N1,118 |
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Виробник: NXP Semiconductors
Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
Description: IC CTRLR SMPS GREEN OVP 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 5V ~ 30V
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 30V
Applications: Secondary-Side Controller
Supplier Device Package: 8-SO
Current - Supply: 30 µA
DigiKey Programmable: Not Verified
на замовлення 9883 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 404+ | 53.67 грн |
| TEA1750T/N1,518 |
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Виробник: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 125kHz
Internal Switch(s): No
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 15V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Voltage - Start Up: 22 V
Power (Watts): 250 W
на замовлення 4502 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 202+ | 108.07 грн |
| NTS0103GU10,115 |
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на замовлення 6604 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 409+ | 52.59 грн |
| CGY1047,112 |
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Виробник: NXP Semiconductors
Description: NARROW BAND HIGH POWER AMPLIFIER
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 250 mA
Description: NARROW BAND HIGH POWER AMPLIFIER
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 250 mA
на замовлення 2194 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 12+ | 1860.60 грн |
| PMXB350UPEZ |
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Виробник: NXP Semiconductors
Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
Description: NEXPERIA PMXB350UPE - 20 V, P-CH
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.2A (Ta)
Rds On (Max) @ Id, Vgs: 447mOhm @ 1.2A, 4.5V
Power Dissipation (Max): 360mW (Ta), 5.68W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 2.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 116 pF @ 10 V
на замовлення 659217 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3703+ | 5.91 грн |
| MPC8377VRAGDA |
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Виробник: NXP Semiconductors
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 339 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 4046.06 грн |
| MPC8536EBVJAULA |
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Виробник: NXP Semiconductors
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU 1.333GHZ 783FCPBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 18765.29 грн |
| LPC11U14FET48/201, |
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Виробник: NXP Semiconductors
Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
Description: LPC11U14- Scalable Entry Level 3
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
на замовлення 861 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 103+ | 211.07 грн |
| LPC11U13FBD48/201, |
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Виробник: NXP Semiconductors
Description: LPC11U13 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: LPC11U13 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
на замовлення 1095 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 112+ | 194.39 грн |
| TDA10025HN/C1,518 |
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Виробник: NXP Semiconductors
Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
Description: IC DEMODULATOR DUAL 48-HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 117+ | 184.31 грн |
| LPC4076FBD144E |
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Виробник: NXP Semiconductors
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
Description: LPC4000 - Mid-range 32-bit Micro
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 109
на замовлення 654 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 37+ | 601.74 грн |
| BC54-10PASX |
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Виробник: NXP Semiconductors
Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
Description: TRANS NPN 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 180MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
на замовлення 146990 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3904+ | 5.91 грн |
| BC51PASX |
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Виробник: NXP Semiconductors
Description: TRANS PNP 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 145MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
Description: TRANS PNP 45V 1A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 63 @ 150mA, 2V
Frequency - Transition: 145MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 1 A
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 420 mW
на замовлення 51000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3904+ | 5.91 грн |
| MC9S08GT8ACFDE |
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Виробник: NXP Semiconductors
Description: IC MCU 8BIT 8KB FLASH 48MAPQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-MAPQFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 48MAPQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-MAPQFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 393 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 60+ | 361.93 грн |
| MCF51AC128CCFGE |
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Виробник: NXP Semiconductors
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50.33MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50.33MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 125 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 29+ | 755.05 грн |
| AFT27S010NT1 |
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Виробник: NXP Semiconductors
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 1.26W
Gain: 21.7dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
товару немає в наявності
В кошику
од. на суму грн.
| MKM33Z64CLH5 |
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Виробник: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR, 24b Sigma-Delta
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR, 24b Sigma-Delta
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
на замовлення 160 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 89+ | 241.64 грн |
| MWPR1516CFM |
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Виробник: NXP Semiconductors
Description: WIRELESS CHARGER RECEIVER ASSP W
Packaging: Bulk
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.5V ~ 20V
Applications: Wireless Power Transmitter
Supplier Device Package: 32-QFN (5x5)
Description: WIRELESS CHARGER RECEIVER ASSP W
Packaging: Bulk
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.5V ~ 20V
Applications: Wireless Power Transmitter
Supplier Device Package: 32-QFN (5x5)
на замовлення 49239 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 132+ | 162.75 грн |
| TEA1738GT/N1,118 |
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Виробник: NXP Semiconductors
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 118kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12.2V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature
Voltage - Start Up: 13.2 V
Power (Watts): 75 W
на замовлення 3861 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 466+ | 46.42 грн |
| BAP1321-03,115 |
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Виробник: NXP Semiconductors
Description: RF DIODE PIN 60V 500MW SOD-323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
Description: RF DIODE PIN 60V 500MW SOD-323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-323
Current - Max: 100 mA
Power Dissipation (Max): 500 mW
на замовлення 9190 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2597+ | 8.64 грн |
| HT2MOA4S20/E/3/RJ |
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Виробник: NXP Semiconductors
Description: HITAG 2 transponder IC
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
Description: HITAG 2 transponder IC
Packaging: Bulk
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 125kHz
Type: RFID Transponder
Operating Temperature: -55°C ~ 140°C
Voltage - Supply: 6.5V
Standards: ISO 11784, ISO 11785
Supplier Device Package: PLLMC
на замовлення 33666 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 175+ | 124.03 грн |
| 74AUP3G34GDH |
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на замовлення 2928 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1457+ | 15.03 грн |
| 74AUP3G34GNX |
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на замовлення 69900 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1139+ | 18.61 грн |
| UBA2024BP/N1,112 |
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Виробник: NXP Semiconductors
Description: IC DRIVER HALF BRIDGE 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
Description: IC DRIVER HALF BRIDGE 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 11.4V ~ 13.3V
Supplier Device Package: 8-DIP
Dimming: No
Current - Output Source/Sink: 2.5A
Current - Supply: 5 mA
на замовлення 400 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 237+ | 90.90 грн |
| MC9S08JM16CLD |
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Виробник: NXP Semiconductors
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x12b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
на замовлення 2327 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 73+ | 296.32 грн |
| MCIMX6Q5EZK08AD |
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Виробник: NXP Semiconductors
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 2208 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 4776.83 грн |
| PMEG4002AESFYL |
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Виробник: NXP Semiconductors
Description: DIODE SCHOTTK 40V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.25 ns
Technology: Schottky
Capacitance @ Vr, F: 18pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 200 mA
Current - Reverse Leakage @ Vr: 80 µA @ 40 V
Description: DIODE SCHOTTK 40V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.25 ns
Technology: Schottky
Capacitance @ Vr, F: 18pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 200 mA
Current - Reverse Leakage @ Vr: 80 µA @ 40 V
на замовлення 1131762 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6527+ | 3.58 грн |
| PMEG4002ESFYL |
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Виробник: NXP Semiconductors
Description: DIODE SCHOTTK 40V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 600 mV @ 200 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
Description: DIODE SCHOTTK 40V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.28 ns
Technology: Schottky
Capacitance @ Vr, F: 17pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 600 mV @ 200 mA
Current - Reverse Leakage @ Vr: 6.5 µA @ 40 V
на замовлення 1278000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6527+ | 3.58 грн |
| MCIMX6X3EVK10AB |
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Виробник: NXP Semiconductors
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz, 227MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz, 227MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
на замовлення 139 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 12+ | 1811.54 грн |
| MCIMX6X3EVN10AB |
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Виробник: NXP Semiconductors
Description: IC MPU 227MHZ/1GHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Description: IC MPU 227MHZ/1GHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
на замовлення 207 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 12+ | 1830.16 грн |
| 74HCT4538D,112 |
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на замовлення 7403 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 776+ | 28.09 грн |
| LPC11U34FBD48/421, |
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Виробник: NXP Semiconductors
Description: LPC11U3X - 32-BIT ARM CORTEX-M0
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: LPC11U3X - 32-BIT ARM CORTEX-M0
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 554 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 83+ | 261.84 грн |
| LPC11U35FBD64/401, |
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Виробник: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 40841 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 73+ | 298.11 грн |
| LPC11U37FBD64/501, |
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Виробник: NXP Semiconductors
Description: LPC11U37 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: LPC11U37 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
на замовлення 4759 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 64+ | 340.90 грн |
| LPC11U24FHI33/301, |
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Виробник: NXP Semiconductors
Description: LPC11U24 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
Description: LPC11U24 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
на замовлення 15263 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 98+ | 221.95 грн |
| LPC11U34FHN33/311, |
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Виробник: NXP Semiconductors
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 40KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
на замовлення 504 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 94+ | 231.38 грн |
| LPC11U34FBD48/311, |
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Виробник: NXP Semiconductors
Description: LPC11U34 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: LPC11U34 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 40KB (40K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
на замовлення 566 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 89+ | 245.16 грн |
| LPC11U35FET48/501, |
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Виробник: NXP Semiconductors
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 15316 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 73+ | 298.11 грн |
| LPC11U66JBD48E |
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Виробник: NXP Semiconductors
Description: LPC11U66 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Description: LPC11U66 - Scalable 32-bit Micro
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
на замовлення 87 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 73+ | 298.11 грн |
| LPC11U36FBD64/401, |
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Виробник: NXP Semiconductors
Description: LPC11U36 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: LPC11U36 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
на замовлення 891 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 66+ | 330.02 грн |
| BZV85-C27,113 |
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Виробник: NXP Semiconductors
Description: DIODE ZENER 27V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
Description: DIODE ZENER 27V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
на замовлення 184000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2844+ | 7.98 грн |
| JN5168-001-M00Z |
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Виробник: NXP Semiconductors
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 15.3mA
Antenna Type: Integrated, Trace
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 15.3mA
Antenna Type: Integrated, Trace
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
на замовлення 417 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 22+ | 986.17 грн |
| BAP65-05,215 |
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Виробник: NXP Semiconductors
Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
на замовлення 31515 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2237+ | 9.37 грн |
| AFV10700HR5 |
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Виробник: NXP Semiconductors
Description: RF MOSFET LDMOS 52V NI780
Packaging: Bulk
Package / Case: NI-780-4
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.215GHz
Configuration: 2 N-Channel
Power - Output: 700W
Gain: 19.2dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-780-4
Voltage - Rated: 105 V
Voltage - Test: 52 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 52V NI780
Packaging: Bulk
Package / Case: NI-780-4
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.215GHz
Configuration: 2 N-Channel
Power - Output: 700W
Gain: 19.2dB
Technology: LDMOS (Dual)
Supplier Device Package: NI-780-4
Voltage - Rated: 105 V
Voltage - Test: 52 V
Current - Test: 100 mA
на замовлення 237 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 50510.21 грн |
| TDA10027HN/C1,518 |
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Виробник: NXP Semiconductors
Description: IC DEMOD DUAL W/RX 64-HVQFN
Packaging: Bulk
Package / Case: 64-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 64-HVQFN (9x9)
Control Interface: I2C
Description: IC DEMOD DUAL W/RX 64-HVQFN
Packaging: Bulk
Package / Case: 64-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.15V ~ 1.3V, 3.0V ~ 3.6V
Applications: Consumer Video
Supplier Device Package: 64-HVQFN (9x9)
Control Interface: I2C
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 89+ | 241.90 грн |
| BF1100R,215 |
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Виробник: NXP Semiconductors
Description: RF MOSFET 9V SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
Description: RF MOSFET 9V SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: SOT-143R
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1069+ | 20.16 грн |
| TDA18273HN/C1,518 |
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Виробник: NXP Semiconductors
Description: IC SILICON TUNER HYBRID 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Standards: DVB-T2, DVB-C2
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
Description: IC SILICON TUNER HYBRID 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Standards: DVB-T2, DVB-C2
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
на замовлення 218821 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 170+ | 126.71 грн |
| PCA9306GF,115 |
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Виробник: NXP Semiconductors
Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Features: Auto-Direction Sensing
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Features: Auto-Direction Sensing
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
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