Продукція > NXP SEMICONDUCTORS > Всі товари виробника NXP SEMICONDUCTORS (65116) > Сторінка 40 з 1086
Фото | Назва | Виробник | Інформація |
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MC34717EPR2 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 26-VFQFN Exposed Pad Voltage - Output: 0.7V ~ 3.6V Mounting Type: Surface Mount Number of Outputs: 2 Voltage - Input: 3V ~ 6V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 26-QFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||
MC908JK3EMDWE | NXP Semiconductors |
![]() ![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 10x8b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 20-SOIC Number of I/O: 15 |
товару немає в наявності |
В кошику од. на суму грн. | |||
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MC33790HEGR2 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Type: Distributed Systems Interface Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified Output Type: Logic Operating Temperature: -40°C ~ 85°C Input Type: Logic Current - Supply: 1 mA |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MC33790HEG | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Type: Distributed Systems Interface Supplier Device Package: 16-SOIC Output Type: Logic Operating Temperature: -40°C ~ 85°C Input Type: Logic Current - Supply: 1 mA |
на замовлення 89 шт: термін постачання 21-31 дні (днів) |
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MCIMX7S3EVK08SC557 | NXP Semiconductors |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
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LPC2930FBD208,551 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 125MHz RAM Size: 56K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM968E-S Data Converters: A/D 24x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 152 |
на замовлення 103 шт: термін постачання 21-31 дні (днів) |
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S1JVMJD31CT4G | NXP Semiconductors |
Description: S1JVMJDBDPNTRANSISTA Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
BC847CW/DG/B4115 | NXP Semiconductors |
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
S908QY1E0CDTER | NXP Semiconductors |
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Supplier Device Package: 16-TSSOP DigiKey Programmable: Not Verified |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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S908GR8E0CDWE | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 7.5KB (7.5K x 8) RAM Size: 384 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x8b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 28-SOIC Number of I/O: 21 DigiKey Programmable: Not Verified |
на замовлення 320 шт: термін постачання 21-31 дні (днів) |
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S908GZ32G3MFAE | NXP Semiconductors |
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 37 |
на замовлення 7000 шт: термін постачання 21-31 дні (днів) |
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S908GZ60H0CFJE | NXP Semiconductors |
Description: IC MCU 8BIT 60KB FLASH 32LQFP Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 24x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Not Verified |
на замовлення 3967 шт: термін постачання 21-31 дні (днів) |
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S908AB32AG0MFUE | NXP Semiconductors |
Description: S908AB32AG0MFUE Packaging: Bulk |
на замовлення 84 шт: термін постачання 21-31 дні (днів) |
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BZB784-C11115 | NXP Semiconductors |
![]() Tolerance: ±5% Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 11 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOT-323 Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
PCA9450AHNY | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: i.MX Processors Current - Supply: 23µA Supplier Device Package: 56-HVQFN (7x7) |
на замовлення 4210 шт: термін постачання 21-31 дні (днів) |
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AFSC5G37E38T2 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.6GHz ~ 3.8GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 27.3dB Test Frequency: 3.6GHz Supplier Device Package: 26-HLQFN (10x6) |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MC68040RC25V | NXP Semiconductors |
![]() ![]() Packaging: Bulk Package / Case: 179-BPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: 68040 Voltage - I/O: 5V Supplier Device Package: 179-PGA (47.24x47.24) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | |||
MC68040FE33A157 | NXP Semiconductors |
Description: MC68MICROPROCESSO32-BIMC680FAMIL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
MC68040RC40A | NXP Semiconductors |
![]() Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
IP5311CX5/LF/P,135 | NXP Semiconductors |
Description: 1P5311CDALIFILTPIN(SPLASTIC Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
A3I35D012WNR1 | NXP Semiconductors |
Description: A3I35D012 - Airfast RF LDMOS Wid Packaging: Bulk Package / Case: TO-270-17 Variant, Flat Leads Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 3.2GHz ~ 4GHz Configuration: 2 N-Channel Power - Output: 1.8W Gain: 27.8dB Technology: LDMOS (Dual) Supplier Device Package: TO-270WB-17 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 138 mA |
на замовлення 396 шт: термін постачання 21-31 дні (днів) |
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BGU8M1UKAZ | NXP Semiconductors |
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP Packaging: Bulk Package / Case: 6-XFBGA, WLCSP Mounting Type: Surface Mount Frequency: 1.805GHz ~ 2.2GHz RF Type: Cellular, LTE Voltage - Supply: 1.5V ~ 3.1V Gain: 16dB Current - Supply: 5mA Noise Figure: 0.8dB P1dB: -3dBm Test Frequency: 2.14GHz Supplier Device Package: 6-WLCSP (0.65x0.44) |
на замовлення 2800000 шт: термін постачання 21-31 дні (днів) |
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RN5RK251A-TR-FE | NXP Semiconductors |
![]() Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
MAX823MEXK-T | NXP Semiconductors |
Description: MAX5-PMICROPROCESSSUPERVISOCIRCU Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
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LPC11A12FBD48/101, | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 |
на замовлення 207 шт: термін постачання 21-31 дні (днів) |
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LPC11A13JHI33/201E | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 |
на замовлення 580 шт: термін постачання 21-31 дні (днів) |
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HEF4013BTT-Q100118 | NXP Semiconductors |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PN5120A0HN/C2,551 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 2420 шт: термін постачання 21-31 дні (днів) |
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FXTH87EH11DT1 | NXP Semiconductors |
![]() Packaging: Bulk Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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FXTH871511DT1 | NXP Semiconductors |
![]() Packaging: Bulk Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
на замовлення 41435 шт: термін постачання 21-31 дні (днів) |
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2N7002BKM/V,315 | NXP Semiconductors |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
MCIMX6U8DVM10AD557 | NXP Semiconductors |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
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74ABT32D,112 | NXP Semiconductors |
![]() Packaging: Bulk |
на замовлення 10964 шт: термін постачання 21-31 дні (днів) |
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BC847C/DG/B4215 | NXP Semiconductors |
Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0. Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
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HEF4094BTT118 | NXP Semiconductors |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PESD15VL1BAZ | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: CAN, Telecom Capacitance @ Frequency: 16pF @ 1MHz Current - Peak Pulse (10/1000µs): 5A (8/20µs) Voltage - Reverse Standoff (Typ): 15V (Max) Supplier Device Package: SOD-323 Bidirectional Channels: 1 Voltage - Breakdown (Min): 17.1V Voltage - Clamping (Max) @ Ipp: 44V Power - Peak Pulse: 200W Power Line Protection: No |
на замовлення 26550 шт: термін постачання 21-31 дні (днів) |
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LTC1148HVCS#PBF | NXP Semiconductors |
![]() Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||
BAV21-T50A | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 50 ns Technology: Standard Capacitance @ Vr, F: 5pF @ 0V, 1MHz Current - Average Rectified (Io): 200mA Supplier Device Package: DO-204AH (DO-35) Operating Temperature - Junction: 175°C Voltage - DC Reverse (Vr) (Max): 250 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA Current - Reverse Leakage @ Vr: 100 nA @ 200 V |
на замовлення 146 шт: термін постачання 21-31 дні (днів) |
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MCIMX7S3EVK08SC | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 488-TFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 488-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
на замовлення 6080 шт: термін постачання 21-31 дні (днів) |
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MIMX8MN2DVTJZAA | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 486-LFBGA Mounting Type: Surface Mount Speed: 1.5GHz, 750MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 486-LFBGA (14x14) Ethernet: GbE (1) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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MCIMX6X1CVK08AB | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 200MHz, 800MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (14x14) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, LPDDR2, LVDDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC |
на замовлення 3151 шт: термін постачання 21-31 дні (днів) |
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MVF30NN151CKU26 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 176-HLQFP (24x24) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M4, Multimedia; NEON™ MPE RAM Controllers: DDR3, DRAM, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Additional Interfaces: CANbus, I2C, IrDA, SCI, SDHC, SPI, UART/USART |
на замовлення 720 шт: термін постачання 21-31 дні (днів) |
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NX3P191UK,023 | NXP Semiconductors |
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на замовлення 9000 шт: термін постачання 21-31 дні (днів) |
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74LVCH16245ADGG-Q100118 | NXP Semiconductors |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
BZX384-C47115 | NXP Semiconductors |
Description: NOW NEXPERIA BZX384-C43 - ZENER Packaging: Bulk Tolerance: ±5% Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C (TJ) Voltage - Zener (Nom) (Vz): 47 V Impedance (Max) (Zzt): 170 Ohms Supplier Device Package: SOD-323 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 50 V |
товару немає в наявності |
В кошику од. на суму грн. | |||
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74LVC1G34GS,132 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 32mA, 32mA Supplier Device Package: 6-XSON, SOT1202 (1x1) |
на замовлення 132735 шт: термін постачання 21-31 дні (днів) |
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MPC860TCZQ50D4 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
на замовлення 2634 шт: термін постачання 21-31 дні (днів) |
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PUMD9115 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual) Power - Max: 300mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V Resistor - Base (R1): 10kOhms Resistor - Emitter Base (R2): 47kOhms Supplier Device Package: 6-TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | |||
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PC33772ASP1AE | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-LQFP (7x7) Fault Protection: Over/Under Voltage |
на замовлення 93 шт: термін постачання 21-31 дні (днів) |
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74AUP1Z125GM,115 | NXP Semiconductors |
![]() Packaging: Bulk |
на замовлення 25144 шт: термін постачання 21-31 дні (днів) |
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PCF8551BTT/AY | NXP Semiconductors |
Description: PCF8551BTT - Universal 36 × Packaging: Bulk Package / Case: 48-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 36 Segment Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 9 Characters, 18 Characters, 144 Elements Supplier Device Package: 48-TSSOP Current - Supply: 1.2 µA |
товару немає в наявності |
В кошику од. на суму грн. | |||
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BC857BW/ZL115 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: SC-70 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 200 mW |
на замовлення 114000 шт: термін постачання 21-31 дні (днів) |
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PQMD10147 | NXP Semiconductors |
![]() Packaging: Bulk |
на замовлення 13699 шт: термін постачання 21-31 дні (днів) |
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PQMD2147 | NXP Semiconductors |
![]() Packaging: Bulk |
на замовлення 13697 шт: термін постачання 21-31 дні (днів) |
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PTVS7V5U1UPA,147 | NXP Semiconductors |
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на замовлення 9000 шт: термін постачання 21-31 дні (днів) |
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PQMD16147 | NXP Semiconductors |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
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74AHC244D,112 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 20-SO |
на замовлення 12422 шт: термін постачання 21-31 дні (днів) |
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74LVC14APW | NXP Semiconductors |
![]() Features: Schmitt Trigger Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Current - Output High, Low: 24mA, 24mA Number of Inputs: 1 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1V ~ 2V Input Logic Level - Low: 0.12V ~ 0.8V Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 40 µA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PDTC114TMB315 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 10 kOhms Grade: Automotive Qualification: AEC-Q101 |
на замовлення 276400 шт: термін постачання 21-31 дні (днів) |
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PCF7952LTT/M1CC15, | NXP Semiconductors |
![]() Packaging: Bulk Features: RSSI Equipped Package / Case: 24-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Memory Size: 512B RAM, 16kB EEPROM, 8kB ROM Modulation or Protocol: UHF Applications: Remote Keyless Entry Supplier Device Package: 24-TSSOP DigiKey Programmable: Not Verified |
на замовлення 29944 шт: термін постачання 21-31 дні (днів) |
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MC34717EPR2 |
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Виробник: NXP Semiconductors
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
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MC908JK3EMDWE |
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Виробник: NXP Semiconductors
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
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MC33790HEGR2 |
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Виробник: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
72+ | 302.65 грн |
MC33790HEG |
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Виробник: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
на замовлення 89 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
89+ | 302.65 грн |
LPC2930FBD208,551 |
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Виробник: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
на замовлення 103 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
26+ | 867.02 грн |
BC847CW/DG/B4115 |
Виробник: NXP Semiconductors
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0
Packaging: Tape & Reel (TR)
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0
Packaging: Tape & Reel (TR)
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S908QY1E0CDTER |
Виробник: NXP Semiconductors
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
177+ | 134.96 грн |
S908GR8E0CDWE |
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Виробник: NXP Semiconductors
Description: IC MCU 8BIT 7.5KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 7.5KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
на замовлення 320 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
39+ | 625.59 грн |
S908GZ32G3MFAE |
Виробник: NXP Semiconductors
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
на замовлення 7000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
27+ | 893.92 грн |
S908GZ60H0CFJE |
Виробник: NXP Semiconductors
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
на замовлення 3967 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
21+ | 1085.82 грн |
S908AB32AG0MFUE |
на замовлення 84 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
21+ | 1151.14 грн |
BZB784-C11115 |
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Виробник: NXP Semiconductors
Description: NOW NEXPERIA BZB784-C10 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Description: NOW NEXPERIA BZB784-C10 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
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PCA9450AHNY |
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Виробник: NXP Semiconductors
Description: PCA9450AHN - Power Management IC
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PCA9450AHN - Power Management IC
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
на замовлення 4210 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
77+ | 312.00 грн |
AFSC5G37E38T2 |
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Виробник: NXP Semiconductors
Description: AFSC5G37E38 - Airfast Power Ampl
Packaging: Bulk
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AFSC5G37E38 - Airfast Power Ampl
Packaging: Bulk
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
11+ | 2106.27 грн |
MC68040RC25V |
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Виробник: NXP Semiconductors
Description: MICROPROCESSOR, 32-BIT, MC68000
Packaging: Bulk
Package / Case: 179-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: 68040
Voltage - I/O: 5V
Supplier Device Package: 179-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: MICROPROCESSOR, 32-BIT, MC68000
Packaging: Bulk
Package / Case: 179-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: 68040
Voltage - I/O: 5V
Supplier Device Package: 179-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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A3I35D012WNR1 |
Виробник: NXP Semiconductors
Description: A3I35D012 - Airfast RF LDMOS Wid
Packaging: Bulk
Package / Case: TO-270-17 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
Configuration: 2 N-Channel
Power - Output: 1.8W
Gain: 27.8dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-17
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 138 mA
Description: A3I35D012 - Airfast RF LDMOS Wid
Packaging: Bulk
Package / Case: TO-270-17 Variant, Flat Leads
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 3.2GHz ~ 4GHz
Configuration: 2 N-Channel
Power - Output: 1.8W
Gain: 27.8dB
Technology: LDMOS (Dual)
Supplier Device Package: TO-270WB-17
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 138 mA
на замовлення 396 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
10+ | 2619.84 грн |
BGU8M1UKAZ |
Виробник: NXP Semiconductors
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 16dB
Current - Supply: 5mA
Noise Figure: 0.8dB
P1dB: -3dBm
Test Frequency: 2.14GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 16dB
Current - Supply: 5mA
Noise Figure: 0.8dB
P1dB: -3dBm
Test Frequency: 2.14GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
на замовлення 2800000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3116+ | 7.94 грн |
MAX823MEXK-T |
Виробник: NXP Semiconductors
Description: MAX5-PMICROPROCESSSUPERVISOCIRCU
Packaging: Tape & Reel (TR)
Description: MAX5-PMICROPROCESSSUPERVISOCIRCU
Packaging: Tape & Reel (TR)
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од. на суму грн.
LPC11A12FBD48/101, |
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Виробник: NXP Semiconductors
Description: LPC11A12 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
Description: LPC11A12 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
на замовлення 207 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
128+ | 167.05 грн |
LPC11A13JHI33/201E |
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Виробник: NXP Semiconductors
Description: LPC11A13 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
Description: LPC11A13 - Cortex-M0+/M0 RISC Mi
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
на замовлення 580 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
115+ | 185.45 грн |
PN5120A0HN/C2,551 |
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Виробник: NXP Semiconductors
Description: PN5120A0HN/C2 - Full NFC Fronten
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PN5120A0HN/C2 - Full NFC Fronten
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2420 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
53+ | 435.67 грн |
FXTH87EH11DT1 |
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Виробник: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
67+ | 329.50 грн |
FXTH871511DT1 |
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Виробник: NXP Semiconductors
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Bulk
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
на замовлення 41435 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
45+ | 531.11 грн |
74ABT32D,112 |
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на замовлення 10964 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
701+ | 31.20 грн |
BC847C/DG/B4215 |
Виробник: NXP Semiconductors
Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0.
Packaging: Tape & Reel (TR)
Description: NEXPERBC8SMASIGNBIPOLTRANSISTO0.
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
PESD15VL1BAZ |
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Виробник: NXP Semiconductors
Description: TVS DIODE 15VWM 44VC SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: CAN, Telecom
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SOD-323
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 200W
Power Line Protection: No
Description: TVS DIODE 15VWM 44VC SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: CAN, Telecom
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 15V (Max)
Supplier Device Package: SOD-323
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.1V
Voltage - Clamping (Max) @ Ipp: 44V
Power - Peak Pulse: 200W
Power Line Protection: No
на замовлення 26550 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
6985+ | 3.04 грн |
BAV21-T50A |
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Виробник: NXP Semiconductors
Description: DIODE STD 250V 200MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: 175°C
Voltage - DC Reverse (Vr) (Max): 250 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
Description: DIODE STD 250V 200MA DO204AH
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: 175°C
Voltage - DC Reverse (Vr) (Max): 250 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
на замовлення 146 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 16699.12 грн |
MCIMX7S3EVK08SC |
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Виробник: NXP Semiconductors
Description: IC MPU 800MHZ 488MAPBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Description: IC MPU 800MHZ 488MAPBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
на замовлення 6080 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
18+ | 1312.48 грн |
MIMX8MN2DVTJZAA |
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Виробник: NXP Semiconductors
Description: IC MPU 1.5GHZ/750MHZ 486LFBGA
Packaging: Bulk
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz, 750MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Description: IC MPU 1.5GHZ/750MHZ 486LFBGA
Packaging: Bulk
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz, 750MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
на замовлення 250 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
15+ | 1525.54 грн |
MCIMX6X1CVK08AB |
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Виробник: NXP Semiconductors
Description: IC MPU 200MHZ/800MHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, LPDDR2, LVDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Description: IC MPU 200MHZ/800MHZ 400MAPBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (14x14)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, LPDDR2, LVDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CANbus, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
на замовлення 3151 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
13+ | 1889.71 грн |
MVF30NN151CKU26 |
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Виробник: NXP Semiconductors
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4, Multimedia; NEON™ MPE
RAM Controllers: DDR3, DRAM, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CANbus, I2C, IrDA, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4, Multimedia; NEON™ MPE
RAM Controllers: DDR3, DRAM, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CANbus, I2C, IrDA, SCI, SDHC, SPI, UART/USART
на замовлення 720 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
12+ | 1944.77 грн |
NX3P191UK,023 |
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на замовлення 9000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1332+ | 17.52 грн |
BZX384-C47115 |
Виробник: NXP Semiconductors
Description: NOW NEXPERIA BZX384-C43 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: SOD-323
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 50 V
Description: NOW NEXPERIA BZX384-C43 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 170 Ohms
Supplier Device Package: SOD-323
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 50 V
товару немає в наявності
В кошику
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74LVC1G34GS,132 |
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Виробник: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Description: IC BUFFER NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
на замовлення 132735 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3878+ | 6.08 грн |
MPC860TCZQ50D4 |
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Виробник: NXP Semiconductors
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 2634 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 12350.58 грн |
PUMD9115 |
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Виробник: NXP Semiconductors
Description: PUMD9 - NPN/PNP RESISTOR-EQUIPPE
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: 6-TSSOP
Description: PUMD9 - NPN/PNP RESISTOR-EQUIPPE
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: 6-TSSOP
товару немає в наявності
В кошику
од. на суму грн.
PC33772ASP1AE |
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Виробник: NXP Semiconductors
Description: PC33772ASP1AE - LI-ION BATTERY C
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-LQFP (7x7)
Fault Protection: Over/Under Voltage
Description: PC33772ASP1AE - LI-ION BATTERY C
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-LQFP (7x7)
Fault Protection: Over/Under Voltage
на замовлення 93 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
22+ | 993.30 грн |
74AUP1Z125GM,115 |
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на замовлення 25144 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1490+ | 14.51 грн |
PCF8551BTT/AY |
Виробник: NXP Semiconductors
Description: PCF8551BTT - Universal 36 ×
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 36 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
Description: PCF8551BTT - Universal 36 ×
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 36 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 9 Characters, 18 Characters, 144 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 1.2 µA
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BC857BW/ZL115 |
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Виробник: NXP Semiconductors
Description: NEXPERIA BC857BW - SMALL SIGNAL
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-70
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Description: NEXPERIA BC857BW - SMALL SIGNAL
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-70
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
на замовлення 114000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
15000+ | 1.45 грн |
PQMD10147 |
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на замовлення 13699 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8460+ | 2.92 грн |
PQMD2147 |
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на замовлення 13697 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8460+ | 2.90 грн |
PTVS7V5U1UPA,147 |
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на замовлення 9000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3050+ | 7.31 грн |
74AHC244D,112 |
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Виробник: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
на замовлення 12422 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1216+ | 19.00 грн |
74LVC14APW |
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Виробник: NXP Semiconductors
Description: NOW NEXPERIA 74LVC14APW - INVERT
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Description: NOW NEXPERIA 74LVC14APW - INVERT
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
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PDTC114TMB315 |
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Виробник: NXP Semiconductors
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Grade: Automotive
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Grade: Automotive
Qualification: AEC-Q101
на замовлення 276400 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
11225+ | 2.18 грн |
PCF7952LTT/M1CC15, |
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Виробник: NXP Semiconductors
Description: PCF7952LTT - IMMO ACTIC
Packaging: Bulk
Features: RSSI Equipped
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 16kB EEPROM, 8kB ROM
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
Description: PCF7952LTT - IMMO ACTIC
Packaging: Bulk
Features: RSSI Equipped
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512B RAM, 16kB EEPROM, 8kB ROM
Modulation or Protocol: UHF
Applications: Remote Keyless Entry
Supplier Device Package: 24-TSSOP
DigiKey Programmable: Not Verified
на замовлення 29944 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
54+ | 429.39 грн |