Продукція > NXP SEMICONDUCTORS > Всі товари виробника NXP SEMICONDUCTORS (65475) > Сторінка 39 з 1092
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||
---|---|---|---|---|---|---|---|
KMZ80J | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Output: Analog Voltage Operating Temperature: -40°C ~ 150°C Termination Style: Gull Wing Voltage - Supply: 4.5V ~ 5.5V Linearity: ±0.95° Actuator Type: External Magnet, Not Included Technology: Magnetoresistive For Measuring: Angle Supplier Device Package: 8-SOIC Output Signal: Clockwise Increase Part Status: Active Resistance: 5 kOhms Grade: Automotive Qualification: AEC-Q100 |
на замовлення 112726 шт: термін постачання 21-31 дні (днів) |
|
|||
LPC54101J512UK49Z | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Part Status: Active Number of I/O: 39 |
на замовлення 32000 шт: термін постачання 21-31 дні (днів) |
|
|||
LPC54101J256UK49Z | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Part Status: Active Number of I/O: 39 |
на замовлення 2469 шт: термін постачання 21-31 дні (днів) |
|
|||
P1014NSN5DFB | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI Part Status: Obsolete |
на замовлення 65 шт: термін постачання 21-31 дні (днів) |
|
|||
![]() |
PCA9670PW,112 | NXP Semiconductors |
![]() Packaging: Bulk Features: POR Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 16-TSSOP Current - Output Source/Sink: 300µA, 41mA Part Status: Obsolete |
на замовлення 1269 шт: термін постачання 21-31 дні (днів) |
|
||
PCA9672BS,118 | NXP Semiconductors |
![]() Packaging: Bulk Features: POR Package / Case: 16-VFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 16-HVQFN (3x3) Current - Output Source/Sink: 300µA, 43mA Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 80038 шт: термін постачання 21-31 дні (днів) |
|
|||
MC34PF1510A1EPR2 | NXP Semiconductors |
Description: PF1510 - PMIC with 1A Li+ Linear Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 4.1V ~ 6V Frequency - Switching: 2MHz Topology: Step-Down (Buck) (3), Linear (LDO) (3) Supplier Device Package: 40-HVQFN (5x5) Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A w/LED Driver: No w/Supervisor: No w/Sequencer: Yes Part Status: Active Number of Outputs: 6 |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
|
|||
![]() |
74HCT30PW,112 | NXP Semiconductors |
![]() Packaging: Bulk Part Status: Active |
на замовлення 14405 шт: термін постачання 21-31 дні (днів) |
|
||
![]() |
74AHCT30PW,118 | NXP Semiconductors |
![]() Packaging: Bulk Part Status: Active |
на замовлення 11547 шт: термін постачання 21-31 дні (днів) |
|
||
S25FL127SABMFI000 | NXP Semiconductors |
![]() Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
![]() |
74LVC257ADB,112 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 24mA, 24mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Active |
на замовлення 6102 шт: термін постачання 21-31 дні (днів) |
|
||
![]() |
PDTD113EQAZ | NXP Semiconductors |
![]() Packaging: Bulk Part Status: Active |
на замовлення 25000 шт: термін постачання 21-31 дні (днів) |
|
||
S2ZMMBZ27VALT1G | NXP Semiconductors |
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
MC10XS3435BHFKR2 | NXP Semiconductors |
Description: MC10XS3435 - 12 V Automotive Ext Packaging: Bulk Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Package / Case: 24-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side Rds On (Typ): 10mOhm, 35mOhm Input Type: Non-Inverting Voltage - Load: 6V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:1 Supplier Device Package: 24-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Part Status: Obsolete |
на замовлення 1175 шт: термін постачання 21-31 дні (днів) |
|
|||
BAS321135 | NXP Semiconductors |
![]() Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
BZX79-B15143 | NXP Semiconductors |
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0 Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
MC9S08AW60MFGE | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 |
на замовлення 780 шт: термін постачання 21-31 дні (днів) |
|
|||
MIMXRT1051DVL6A | NXP Semiconductors |
Description: MXRT1050 - i.MX RT1050 Crossover Packaging: Bulk Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 96KB (96K x 8) RAM Size: 512K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Obsolete Number of I/O: 127 |
на замовлення 700 шт: термін постачання 21-31 дні (днів) |
|
|||
LPC1102LVUKZ | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 25-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 6x8b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V Connectivity: I2C, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 25-WLCSP (2.17x2.32) Part Status: Active Number of I/O: 21 |
на замовлення 9651 шт: термін постачання 21-31 дні (днів) |
|
|||
![]() |
SAF7741HV/N125ZK | NXP Semiconductors |
Description: SAF7741HV - CAR RADIO DIGITAL SI Packaging: Bulk Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, LSB, SPDIF Type: Car Signal Processor Operating Temperature: -40°C ~ 85°C (TA) Voltage - I/O: 3.30V Voltage - Core: 1.80V Clock Rate: 44.1kHz, 48kHz, 96kHz Supplier Device Package: 144-HLQFP Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
![]() |
74AHCT2G241GD,125 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 8-XSON (2x3) Part Status: Active |
на замовлення 25005 шт: термін постачання 21-31 дні (днів) |
|
||
![]() |
MK21DX128AVMC5 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 1x16b SAR; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Active Number of I/O: 64 |
на замовлення 161 шт: термін постачання 21-31 дні (днів) |
|
||
![]() |
74AHC1G04GW-Q100125 | NXP Semiconductors |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
74AHC541PW-Q100118 | NXP Semiconductors |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
S912XDG128F2VAA | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
на замовлення 84 шт: термін постачання 21-31 дні (днів) |
|
|||
BC847RA147 | NXP Semiconductors |
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
MC74HC42D | NXP Semiconductors |
Description: 74HBDECIMDECOD1-OF-10 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
S32V-SONYCAM | NXP Semiconductors |
Description: S32V - MIPI CAMERAS AND DE-SERIA Packaging: Bulk For Use With/Related Products: S32V234 Accessory Type: Camera |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
|
|||
S912XEG128J2MAA | NXP Semiconductors |
Description: MC9S12XE - KIPPER-16-BIT MCU, 12 Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 |
товару немає в наявності |
В кошику од. на суму грн. | |||
MPC875CVR66 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART |
на замовлення 43 шт: термін постачання 21-31 дні (днів) |
|
|||
AFT20P060-4NR3 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: OM-780-4L Mounting Type: Surface Mount Frequency: 2.17GHz Configuration: 2 N-Channel Power - Output: 60W Gain: 18.9dB Technology: LDMOS (Dual) Supplier Device Package: OM-780-4L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 450 mA |
на замовлення 1730 шт: термін постачання 21-31 дні (днів) |
|
|||
BC847BS/DG/B3115 | NXP Semiconductors |
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
![]() |
PMEG2020EJ/ZL135 | NXP Semiconductors |
Description: PMEG2020EJ - Nexperia PMEG2020EJ Packaging: Bulk Package / Case: SC-90, SOD-323F Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Technology: Schottky Capacitance @ Vr, F: 50pF @ 5V, 1MHz Current - Average Rectified (Io): 2A Supplier Device Package: SOD-323F Operating Temperature - Junction: 150°C Voltage - DC Reverse (Vr) (Max): 20 V Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A Current - Reverse Leakage @ Vr: 200 µA @ 20 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
LPC2294U029 | NXP Semiconductors |
Description: LPC2294 - Arm7, 32-Bit RISC Micr Packaging: Bulk |
на замовлення 6327 шт: термін постачання 21-31 дні (днів) |
|
|||
74HC125DAUJ | NXP Semiconductors |
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
BC860CW/ZL115 | NXP Semiconductors |
Description: BC8PGENERPURPOTRANSISTORS Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
SIT8924AA-23-33N-30.000000G | NXP Semiconductors |
Description: SIT89LPOWPROGRAMMABOSCILLATOAUTE Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
SIT8924AA-23-18E-27.000000G | NXP Semiconductors |
Description: SIT8LPOWPROGRAMMABOSCILLATOAUTEM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
74HC73PW112 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Reset Type: JK Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Negative Edge Clock Frequency: 83 MHz Input Capacitance: 3.5 pF Supplier Device Package: 14-TSSOP Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 1 |
товару немає в наявності |
В кошику од. на суму грн. | |||
74HCT04DAUJ | NXP Semiconductors |
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
![]() |
MC34717EPR2 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 26-VFQFN Exposed Pad Voltage - Output: 0.7V ~ 3.6V Mounting Type: Surface Mount Number of Outputs: 2 Voltage - Input: 3V ~ 6V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 26-QFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||
MC908JK3EMDWE | NXP Semiconductors |
![]() ![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 10x8b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 20-SOIC Number of I/O: 15 |
товару немає в наявності |
В кошику од. на суму грн. | |||
![]() |
MC33790HEGR2 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Type: Distributed Systems Interface Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified Output Type: Logic Operating Temperature: -40°C ~ 85°C Input Type: Logic Current - Supply: 1 mA |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
|
||
![]() |
MC33790HEG | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Type: Distributed Systems Interface Supplier Device Package: 16-SOIC Output Type: Logic Operating Temperature: -40°C ~ 85°C Input Type: Logic Current - Supply: 1 mA |
на замовлення 89 шт: термін постачання 21-31 дні (днів) |
|
||
MCIMX7S3EVK08SC557 | NXP Semiconductors |
![]() Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
![]() |
LPC2930FBD208,551 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 125MHz RAM Size: 56K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM968E-S Data Converters: A/D 24x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 152 |
на замовлення 103 шт: термін постачання 21-31 дні (днів) |
|
||
S1JVMJD31CT4G | NXP Semiconductors |
Description: S1JVMJDBDPNTRANSISTA Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
BC847CW/DG/B4115 | NXP Semiconductors |
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||
S908QY1E0CDTER | NXP Semiconductors |
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Supplier Device Package: 16-TSSOP DigiKey Programmable: Not Verified |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
|
|||
S908GR8E0CDWE | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 7.5KB (7.5K x 8) RAM Size: 384 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x8b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 28-SOIC Number of I/O: 21 DigiKey Programmable: Not Verified |
на замовлення 320 шт: термін постачання 21-31 дні (днів) |
|
|||
![]() |
S908GZ32G3MFAE | NXP Semiconductors |
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 37 |
на замовлення 7000 шт: термін постачання 21-31 дні (днів) |
|
||
S908GZ60H0CFJE | NXP Semiconductors |
Description: IC MCU 8BIT 60KB FLASH 32LQFP Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: M68HC08 Data Converters: A/D 24x10b SAR Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Not Verified |
на замовлення 3967 шт: термін постачання 21-31 дні (днів) |
|
|||
S908AB32AG0MFUE | NXP Semiconductors |
Description: S908AB32AG0MFUE Packaging: Bulk |
на замовлення 84 шт: термін постачання 21-31 дні (днів) |
|
|||
![]() |
BZB784-C11115 | NXP Semiconductors |
![]() Tolerance: ±5% Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 11 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOT-323 Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
PCA9450AHNY | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: i.MX Processors Current - Supply: 23µA Supplier Device Package: 56-HVQFN (7x7) |
на замовлення 4210 шт: термін постачання 21-31 дні (днів) |
|
|||
AFSC5G37E38T2 | NXP Semiconductors |
![]() Packaging: Bulk Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.6GHz ~ 3.8GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 27.3dB Test Frequency: 3.6GHz Supplier Device Package: 26-HLQFN (10x6) |
на замовлення 1992 шт: термін постачання 21-31 дні (днів) |
|
|||
MC68040RC25V | NXP Semiconductors |
![]() ![]() Packaging: Bulk Package / Case: 179-BPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: 68040 Voltage - I/O: 5V Supplier Device Package: 179-PGA (47.24x47.24) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | |||
MC68040FE33A157 | NXP Semiconductors |
Description: MC68MICROPROCESSO32-BIMC680FAMIL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
MC68040RC40A | NXP Semiconductors |
![]() Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
IP5311CX5/LF/P,135 | NXP Semiconductors |
Description: 1P5311CDALIFILTPIN(SPLASTIC Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. |
KMZ80J |
![]() |
Виробник: NXP Semiconductors
Description: KMZ80 - Programmable Angle Senso
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±0.95°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SOIC
Output Signal: Clockwise Increase
Part Status: Active
Resistance: 5 kOhms
Grade: Automotive
Qualification: AEC-Q100
Description: KMZ80 - Programmable Angle Senso
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±0.95°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SOIC
Output Signal: Clockwise Increase
Part Status: Active
Resistance: 5 kOhms
Grade: Automotive
Qualification: AEC-Q100
на замовлення 112726 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
133+ | 158.44 грн |
LPC54101J512UK49Z |
![]() |
Виробник: NXP Semiconductors
Description: LPC54101 - Cortex-M4/M0 32-bit M
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
Description: LPC54101 - Cortex-M4/M0 32-bit M
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
на замовлення 32000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
61+ | 352.25 грн |
LPC54101J256UK49Z |
![]() |
Виробник: NXP Semiconductors
Description: LPC5410 - Low Power 32-bit Micro
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
Description: LPC5410 - Low Power 32-bit Micro
Packaging: Bulk
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Part Status: Active
Number of I/O: 39
на замовлення 2469 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
72+ | 317.50 грн |
P1014NSN5DFB |
![]() |
Виробник: NXP Semiconductors
Description: IC MPU QORIQ P1 533MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Description: IC MPU QORIQ P1 533MHZ 425TEPBGA
Packaging: Bulk
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: CANbus, DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
на замовлення 65 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
10+ | 2305.46 грн |
PCA9670PW,112 |
![]() |
Виробник: NXP Semiconductors
Description: Remote 8-bit I\/O expander for F
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 300µA, 41mA
Part Status: Obsolete
Description: Remote 8-bit I\/O expander for F
Packaging: Bulk
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 300µA, 41mA
Part Status: Obsolete
на замовлення 1269 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
301+ | 69.80 грн |
PCA9672BS,118 |
![]() |
Виробник: NXP Semiconductors
Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFN
Packaging: Bulk
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 300µA, 43mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 1MHZ I2C SMBUS 16HVQFN
Packaging: Bulk
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 300µA, 43mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 80038 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
222+ | 96.26 грн |
MC34PF1510A1EPR2 |
Виробник: NXP Semiconductors
Description: PF1510 - PMIC with 1A Li+ Linear
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (3), Linear (LDO) (3)
Supplier Device Package: 40-HVQFN (5x5)
Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
Description: PF1510 - PMIC with 1A Li+ Linear
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (3), Linear (LDO) (3)
Supplier Device Package: 40-HVQFN (5x5)
Voltage/Current - Output 1: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 2: 0.6V ~ 1.3875V, 1A
Voltage/Current - Output 3: 1.8V ~ 3.3V, 1A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: Yes
Part Status: Active
Number of Outputs: 6
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
106+ | 226.26 грн |
74HCT30PW,112 |
![]() |
на замовлення 14405 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1697+ | 13.71 грн |
74AHCT30PW,118 |
![]() |
Виробник: NXP Semiconductors
Description: NEXPERIA 74AHCT30PW - NAND GATE,
Packaging: Bulk
Part Status: Active
Description: NEXPERIA 74AHCT30PW - NAND GATE,
Packaging: Bulk
Part Status: Active
на замовлення 11547 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2133+ | 11.11 грн |
S25FL127SABMFI000 |
![]() |
Виробник: NXP Semiconductors
Description: S25FL127S - (16 MB) 3.0 V SPI Fl
Packaging: Bulk
Part Status: Active
Description: S25FL127S - (16 MB) 3.0 V SPI Fl
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
74LVC257ADB,112 |
![]() |
Виробник: NXP Semiconductors
Description: NEXPERIA 74LVC257ADB - MULTIPLEX
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Description: NEXPERIA 74LVC257ADB - MULTIPLEX
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
на замовлення 6102 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1410+ | 16.67 грн |
PDTD113EQAZ |
![]() |
на замовлення 25000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8959+ | 2.28 грн |
S2ZMMBZ27VALT1G |
Виробник: NXP Semiconductors
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
Description: S2ZMMBZ - ZEN SOT23 REG .225W SP
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
MC10XS3435BHFKR2 |
Виробник: NXP Semiconductors
Description: MC10XS3435 - 12 V Automotive Ext
Packaging: Bulk
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Description: MC10XS3435 - 12 V Automotive Ext
Packaging: Bulk
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 35mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
на замовлення 1175 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
61+ | 394.56 грн |
BAS321135 |
![]() |
Виробник: NXP Semiconductors
Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BAS321 - RECTIFIER
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
BZX79-B15143 |
Виробник: NXP Semiconductors
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
Description: NEXPERIA ZENER DIODE, 15V, 2%, 0
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
MC9S08AW60MFGE |
![]() |
Виробник: NXP Semiconductors
Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
Description: MC9S08AW - Microcontroller, 8-Bi
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
на замовлення 780 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
34+ | 660.17 грн |
MIMXRT1051DVL6A |
Виробник: NXP Semiconductors
Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
Description: MXRT1050 - i.MX RT1050 Crossover
Packaging: Bulk
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 127
на замовлення 700 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
47+ | 510.47 грн |
LPC1102LVUKZ |
![]() |
Виробник: NXP Semiconductors
Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
Description: LPC1102 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x8b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 25-WLCSP (2.17x2.32)
Part Status: Active
Number of I/O: 21
на замовлення 9651 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
111+ | 205.12 грн |
SAF7741HV/N125ZK |
Виробник: NXP Semiconductors
Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
Description: SAF7741HV - CAR RADIO DIGITAL SI
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, LSB, SPDIF
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Clock Rate: 44.1kHz, 48kHz, 96kHz
Supplier Device Package: 144-HLQFP
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
74AHCT2G241GD,125 |
![]() |
Виробник: NXP Semiconductors
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 8-XSON (2x3)
Part Status: Active
на замовлення 25005 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2049+ | 10.88 грн |
MK21DX128AVMC5 |
![]() |
Виробник: NXP Semiconductors
Description: MK21DX128AVMC5 - Kinetis K21: 50
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
Description: MK21DX128AVMC5 - Kinetis K21: 50
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
на замовлення 161 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
46+ | 500.22 грн |
S912XDG128F2VAA |
![]() |
Виробник: NXP Semiconductors
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
на замовлення 84 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
22+ | 1008.35 грн |
BC847RA147 |
Виробник: NXP Semiconductors
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
Description: BC1NPN/PGENERAL-PURPODOUBTRANSIS
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
S32V-SONYCAM |
Виробник: NXP Semiconductors
Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
Description: S32V - MIPI CAMERAS AND DE-SERIA
Packaging: Bulk
For Use With/Related Products: S32V234
Accessory Type: Camera
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 19650.02 грн |
S912XEG128J2MAA |
Виробник: NXP Semiconductors
Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
Description: MC9S12XE - KIPPER-16-BIT MCU, 12
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
товару немає в наявності
В кошику
од. на суму грн.
MPC875CVR66 |
![]() |
Виробник: NXP Semiconductors
Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART
Description: IC MPU MPC87XX 66MHZ 256BGA
Packaging: Bulk
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC, I2C, PCMCIA, SPI, TDM, UART
на замовлення 43 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8+ | 2803.23 грн |
AFT20P060-4NR3 |
![]() |
Виробник: NXP Semiconductors
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: 2 N-Channel
Power - Output: 60W
Gain: 18.9dB
Technology: LDMOS (Dual)
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 450 mA
на замовлення 1730 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8+ | 2879.64 грн |
BC847BS/DG/B3115 |
Виробник: NXP Semiconductors
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
Description: BCSMASIGNBIPOLTRANSISTO0.1452-EL
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
PMEG2020EJ/ZL135 |
Виробник: NXP Semiconductors
Description: PMEG2020EJ - Nexperia PMEG2020EJ
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-323F
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
Description: PMEG2020EJ - Nexperia PMEG2020EJ
Packaging: Bulk
Package / Case: SC-90, SOD-323F
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Capacitance @ Vr, F: 50pF @ 5V, 1MHz
Current - Average Rectified (Io): 2A
Supplier Device Package: SOD-323F
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 20 V
Voltage - Forward (Vf) (Max) @ If: 525 mV @ 2 A
Current - Reverse Leakage @ Vr: 200 µA @ 20 V
товару немає в наявності
В кошику
од. на суму грн.
LPC2294U029 |
на замовлення 6327 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
21+ | 1162.26 грн |
74HC125DAUJ |
Виробник: NXP Semiconductors
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
Description: 74HC1BDRIVEHC/SERIE4-FUN1-BITROU
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
74HC73PW112 |
![]() |
Виробник: NXP Semiconductors
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
Description: IC FF JK TYPE DUAL 1BIT 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
товару немає в наявності
В кошику
од. на суму грн.
74HCT04DAUJ |
Виробник: NXP Semiconductors
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
Description: 74HCTINVERTEHSERIE6-FUN1-INPUCMO
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
MC34717EPR2 |
![]() |
Виробник: NXP Semiconductors
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Description: MC34717 - Switch-Mode Power Supp
Packaging: Bulk
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
товару немає в наявності
В кошику
од. на суму грн.
MC908JK3EMDWE |
![]() ![]() |
Виробник: NXP Semiconductors
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
Description: MC9S08JK - MICROCONTROLLER, 8-BI
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 10x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
товару немає в наявності
В кошику
од. на суму грн.
MC33790HEGR2 |
![]() |
Виробник: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
72+ | 302.65 грн |
MC33790HEG |
![]() |
Виробник: NXP Semiconductors
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
Description: IC DIST SYST INTERFACE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Supplier Device Package: 16-SOIC
Output Type: Logic
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Current - Supply: 1 mA
на замовлення 89 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
89+ | 302.65 грн |
LPC2930FBD208,551 |
![]() |
Виробник: NXP Semiconductors
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
Description: LPC2900 - Arm9, 32-Bit RISC Micr
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
на замовлення 103 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
26+ | 828.52 грн |
BC847CW/DG/B4115 |
Виробник: NXP Semiconductors
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0
Packaging: Tape & Reel (TR)
Description: NEXPERBC84SMASIGNBIPOLTRANSISTO0
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
S908QY1E0CDTER |
Виробник: NXP Semiconductors
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Supplier Device Package: 16-TSSOP
DigiKey Programmable: Not Verified
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
177+ | 134.96 грн |
S908GR8E0CDWE |
![]() |
Виробник: NXP Semiconductors
Description: IC MCU 8BIT 7.5KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 7.5KB FLASH 28SOIC
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
на замовлення 320 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
39+ | 625.59 грн |
S908GZ32G3MFAE |
Виробник: NXP Semiconductors
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
Description: S908GZ32G3MFAE - AUTO 8 BIT MCU
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V, 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
на замовлення 7000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
27+ | 893.92 грн |
S908GZ60H0CFJE |
Виробник: NXP Semiconductors
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: M68HC08
Data Converters: A/D 24x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
на замовлення 3967 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
21+ | 1085.82 грн |
S908AB32AG0MFUE |
на замовлення 84 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
21+ | 1151.14 грн |
BZB784-C11115 |
![]() |
Виробник: NXP Semiconductors
Description: NOW NEXPERIA BZB784-C10 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Description: NOW NEXPERIA BZB784-C10 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
товару немає в наявності
В кошику
од. на суму грн.
PCA9450AHNY |
![]() |
Виробник: NXP Semiconductors
Description: PCA9450AHN - Power Management IC
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PCA9450AHN - Power Management IC
Packaging: Bulk
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 23µA
Supplier Device Package: 56-HVQFN (7x7)
на замовлення 4210 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
77+ | 312.00 грн |
AFSC5G37E38T2 |
![]() |
Виробник: NXP Semiconductors
Description: AFSC5G37E38 - Airfast Power Ampl
Packaging: Bulk
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AFSC5G37E38 - Airfast Power Ampl
Packaging: Bulk
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.3dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
на замовлення 1992 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
13+ | 1730.99 грн |
MC68040RC25V |
![]() ![]() |
Виробник: NXP Semiconductors
Description: MICROPROCESSOR, 32-BIT, MC68000
Packaging: Bulk
Package / Case: 179-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: 68040
Voltage - I/O: 5V
Supplier Device Package: 179-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: MICROPROCESSOR, 32-BIT, MC68000
Packaging: Bulk
Package / Case: 179-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: 68040
Voltage - I/O: 5V
Supplier Device Package: 179-PGA (47.24x47.24)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товару немає в наявності
В кошику
од. на суму грн.