Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36263) > Сторінка 605 з 605
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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74HC08D,653 | NXP USA Inc. |
 Description: IC GATE AND 4CH 2-INP 14-SOPackaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
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MPC8536AVTAULA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783BGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
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MFS2613HMDAAAD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 36V Applications: System Basis Chip Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) |
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PBSS5140T,215 | NXP USA Inc. |
Description: TRANS PNP 40V 1A SOT23 Packaging: Tape & Reel (TR) |
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PBLS4005Y,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 6TSSOP Packaging: Tape & Reel (TR) |
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PBLS4001Y,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 6TSSOP Packaging: Tape & Reel (TR) |
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PBLS4003D,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 0.6W 6TSOP Packaging: Tape & Reel (TR) |
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PBLS4003Y,115 | NXP USA Inc. |
Description: TRANS NPN PREBIAS/PNP 6TSSOP Packaging: Tape & Reel (TR) |
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PBLS4001V,115 | NXP USA Inc. |
Description: TRANS PREBIAS 1NPN 1PNP SOT-666 Packaging: Tape & Reel (TR) Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Transistor Type: 1 NPN Pre-Biased, 1 PNP Power - Max: 300mW Current - Collector (Ic) (Max): 100mA, 500mA Voltage - Collector Emitter Breakdown (Max): 50V, 40V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V / 150 @ 100mA, 2V Frequency - Transition: 300MHz Resistor - Base (R1): 2.2kOhms Resistor - Emitter Base (R2): 2.2kOhms Supplier Device Package: SOT-666 |
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BZV55-C24,135 | NXP USA Inc. |
Description: DIODE ZENER 24V 500MW LLDS Packaging: Tape & Reel (TR) |
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BZV55-C24,115 | NXP USA Inc. |
Description: DIODE ZENER 24V 500MW SOD80C Packaging: Tape & Reel (TR) |
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74HCT00D,652 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 40 µA |
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74HCT00N,652 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 40 µA |
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74LVC16245ADGG,112 | NXP USA Inc. |
Description: IC BUS TXRX TRI-ST 16BIT 48TSSOP Packaging: Tube |
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74LVC16245ADGG,118 | NXP USA Inc. |
Description: IC BUS TRCVR 3-ST 16BIT 48TSSOP Packaging: Tape & Reel (TR) |
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74LVC374AD,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Tape & Reel (TR) |
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74LVC374ABQ,115 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20DHVQFN Packaging: Tape & Reel (TR) |
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74LVC374AD,112 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Tube |
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74LVC374ADB,112 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SSOP Packaging: Tube |
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74LVC374ADB,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SSOP Packaging: Tape & Reel (TR) |
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74LVC374APW,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP Packaging: Tape & Reel (TR) |
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74HC4066DB,118 | NXP USA Inc. |
Description: IC SWITCH QUAD 1X2 14SSOP Packaging: Tape & Reel (TR) Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 95Ohm -3db Bandwidth: 200MHz Supplier Device Package: 14-SSOP Voltage - Supply, Single (V+): 2V ~ 10V Crosstalk: -60dB @ 1MHz Switch Circuit: SPST - NO Switch Time (Ton, Toff) (Max): 30ns, 20ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 1µA Number of Circuits: 4 |
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SC16C850IBS/Q900,5 | NXP USA Inc. |
Description: UART IC 1, UART CHANNEL RS485 12 Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Number of Channels: 1, UART Mounting Type: Surface Mount Voltage - Supply: 2.5V ~ 3.3V FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
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| 74HC08D,653 |
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Виробник: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE AND 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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| MPC8536AVTAULA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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| MFS2613HMDAAAD |
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Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
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| PBLS4001V,115 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 2.2kOhms
Resistor - Emitter Base (R2): 2.2kOhms
Supplier Device Package: SOT-666
Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 2.2kOhms
Resistor - Emitter Base (R2): 2.2kOhms
Supplier Device Package: SOT-666
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| 74HCT00D,652 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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| 74HCT00N,652 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Description: IC GATE NAND 4CH 2-INP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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| 74HC4066DB,118 |
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Виробник: NXP USA Inc.
Description: IC SWITCH QUAD 1X2 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 30ns, 20ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 4
Description: IC SWITCH QUAD 1X2 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 30ns, 20ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 4
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| SC16C850IBS/Q900,5 |
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Виробник: NXP USA Inc.
Description: UART IC 1, UART CHANNEL RS485 12
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V ~ 3.3V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: UART IC 1, UART CHANNEL RS485 12
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V ~ 3.3V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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