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MHW9186AN MHW9186AN NXP USA Inc. MHW9186AN.pdf Description: IC AMP CATV 7-CATV MODULE
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MHW9186N MHW9186N NXP USA Inc. MHW9186N.pdf Description: IC AMP CATV 7-CATV MODULE
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MHW9187N MHW9187N NXP USA Inc. MHW9187N.pdf Description: IC AMP CATV 7-CATV MODULE
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MHW9188AN MHW9188AN NXP USA Inc. MHW9188AN.pdf Description: IC AMP CATV 7-CATV MODULE
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MHW9188N MHW9188N NXP USA Inc. MHW9188N.pdf Description: IC AMP CATV 7-CATV MODULE
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MHW9189AN MHW9189AN NXP USA Inc. MHW9189AN.pdf Description: IC AMP CATV 7-CATV MODULE
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MHW9206N MHW9206N NXP USA Inc. MHW9206N.pdf Description: IC CATV AMP MOD 870MHZ 7-CATV
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MHW9227AN MHW9227AN NXP USA Inc. MHW9227AN.pdf Description: IC CATV AMP MOD 870MHZ 7-CATV
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MHW9236N MHW9236N NXP USA Inc. MHW9236N.pdf Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 255 mA
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MHW9247AN MHW9247AN NXP USA Inc. MHW9247AN.pdf Description: IC CATV AMP MOD 870MHZ 7-CATV
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MHW9247N MHW9247N NXP USA Inc. MHW9247N.pdf Description: IC CATV AMP MOD 870MHZ 7-CATV
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MHW9267AN MHW9267AN NXP USA Inc. MHW9267AN.pdf Description: IC CATV AMP MOD 870MHZ 7-CATV
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MHW9267N MHW9267N NXP USA Inc. MHW9267N.pdf Description: IC CATV AMP MOD 870MHZ 7-CATV
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MM908E622ACEK MM908E622ACEK NXP USA Inc. MM908E622.pdf Description: IC HALF-BRIDGE QUAD 54-SOIC
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MMA1260EG MMA1260EG NXP USA Inc. MMA1260KEG.pdf Description: ACCEL 1.55G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±1.55g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 1200
Grade: Automotive
Qualification: AEC-Q100
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MMA1260EGR2 MMA1260EGR2 NXP USA Inc. MMA1260KEG.pdf Description: ACCEL 1.55G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±1.55g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 1200
Grade: Automotive
Qualification: AEC-Q100
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MMA2202EGR2 MMA2202EGR2 NXP USA Inc. MMA2202KEG.pdf Description: ACCEL 56.3G ANALOG 16SOIC
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MMA2204EGR2 MMA2204EGR2 NXP USA Inc. MMA2204KEG.pdf Description: ACCEL 112.5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±112.5g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 20
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MMA2260EGR2 MMA2260EGR2 NXP USA Inc. MMA2260.pdf Description: ACCELEROMETER 1.5G ANALOG 16SOIC
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MMA6233QR2 NXP USA Inc. MMA6231Q.pdf Description: ACCELEROMETER 10G ANALOG 16QFN
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MMA6260QR2 NXP USA Inc. MMA6260Q.pdf Description: ACCELEROMETER 1.5G ANALOG 16QFN
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MMA6261QR2 NXP USA Inc. MMA6260Q.pdf Description: ACCELEROMETER 1.5G ANALOG 16QFN
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MMC2114CFCAG33 MMC2114CFCAG33 NXP USA Inc. MMC2114PB.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M210
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 67
DigiKey Programmable: Not Verified
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MMG3003NT1 MMG3003NT1 NXP USA Inc. MMG3003NT1.pdf Description: IC AMP CELL 40MHZ-3.6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 40MHz ~ 3.6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 6.2V
Gain: 20dB
Current - Supply: 180mA
Noise Figure: 4dB
P1dB: 24dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
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MMG3005NT1 MMG3005NT1 NXP USA Inc. MMG3005NT1.pdf Description: IC AMP CELL 800MHZ-2.2GHZ 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 800MHz ~ 2.2GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 15dB
Current - Supply: 480mA
Noise Figure: 5dB
P1dB: 30dBm
Test Frequency: 2.14GHz
Supplier Device Package: 16-PQFN (5x5)
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MMG3008NT1 MMG3008NT1 NXP USA Inc. MMG3008NT1.pdf Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 18.5dB
Current - Supply: 38mA
Noise Figure: 4dB
P1dB: 15dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Obsolete
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MP3H6115A6U MP3H6115A6U NXP USA Inc. MP3H6115A.pdf Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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MP3H6115AC6T1 MP3H6115AC6T1 NXP USA Inc. MP3H6115A.pdf Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
на замовлення 900 шт:
термін постачання 21-31 дні (днів)
300+887.85 грн
600+832.22 грн
Мінімальне замовлення: 300
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MP3H6115AC6U MP3H6115AC6U NXP USA Inc. MP3H6115A.pdf description Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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MPC17510EJ MPC17510EJ NXP USA Inc. MPC17510.pdf Description: IC MOTOR DRIVER 4V-5.5V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.220", 5.60mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1.2A
Interface: Parallel
Operating Temperature: -30°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 4V ~ 5.5V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 15V
Supplier Device Package: 24-TSSOP
Motor Type - AC, DC: Brushed DC
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MPC17510EJR2 MPC17510EJR2 NXP USA Inc. MPC17510.pdf Description: IC MOTOR DRIVER 4V-5.5V 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.220", 5.60mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1.2A
Interface: Parallel
Operating Temperature: -30°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 4V ~ 5.5V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 15V
Supplier Device Package: 24-TSSOP
Motor Type - AC, DC: Brushed DC
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MPC17511EP MPC17511EP NXP USA Inc. MPC17511.pdf Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 24-QFN-EP (4x4)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17511EPR2 MPC17511EPR2 NXP USA Inc. MPC17511.pdf Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 24-QFN-EP (4x4)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17533EVEL MPC17533EVEL NXP USA Inc. DS_568_MPC17533.pdf Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17550EV MPC17550EV NXP USA Inc. MPC17550.pdf Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP
Packaging: Tube
Package / Case: 36-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -10°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 1.6V ~ 5.5V
Supplier Device Package: 36-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
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MPC17C724EP MPC17C724EP NXP USA Inc. MPC17C724.pdf Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Packaging: Tray
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 400mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Camera
Technology: Power MOSFET
Voltage - Load: 2.7V ~ 5.5V
Supplier Device Package: 16-QFN (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC184VFB MPC184VFB NXP USA Inc. MPC184.pdf Description: IC SECURITY PROCESSOR 252-MAPBGA
Packaging: Tray
Package / Case: 252-BGA
Mounting Type: Surface Mount
Type: Security Processor
Supplier Device Package: 252-MAPBGA (21x21)
DigiKey Programmable: Not Verified
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MPC18730EPR2 MPC18730EPR2 NXP USA Inc. MPC18730.pdf Description: IC PMIC PROGR 5-OUTPUTS 64-QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -10°C ~ 65°C
Voltage - Supply: 0.9V ~ 4.2V
Applications: Handheld/Mobile Devices
Current - Supply: 9mA
Supplier Device Package: 64-QFN (9x9)
Part Status: Obsolete
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MPC5554MVR132 MPC5554MVR132 NXP USA Inc. MPC5554.pdf Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
DigiKey Programmable: Not Verified
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+6720.47 грн
10+5400.20 грн
25+5132.70 грн
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MPC5554MVR132R2 MPC5554MVR132R2 NXP USA Inc. MPC5554.pdf Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 256
DigiKey Programmable: Not Verified
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MPC5554MZP132 MPC5554MZP132 NXP USA Inc. MPC5554.pdf Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
DigiKey Programmable: Not Verified
на замовлення 287 шт:
термін постачання 21-31 дні (днів)
1+6209.56 грн
10+4989.87 грн
25+4742.62 грн
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MPC555LFMZP40R2 MPC555LFMZP40R2 NXP USA Inc. MPC555PB.pdf Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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MPC561MVR56 MPC561MVR56 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
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MPC561MZP56R2 MPC561MZP56R2 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
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MPC562MZP56R2 MPC562MZP56R2 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
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MPC562MZP66R2 MPC562MZP66R2 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388BGA
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MPC563MVR56R2 MPC563MVR56R2 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC563MVR66R MPC563MVR66R NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC563MZP56R2 MPC563MZP56R2 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC563MZP66R2 MPC563MZP66R2 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC564MVR56R2 MPC564MVR56R2 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC564MZP56R2 MPC564MZP56R2 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC564MZP66R2 MPC564MZP66R2 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT 512KB FLASH 388PBGA
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MPC565MZP56R2 MPC565MZP56R2 NXP USA Inc. MPC565PB.pdf Description: IC MCU 32BIT 1MB FLASH 388BGA
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MPC603RRX200TC MPC603RRX200TC NXP USA Inc. MPC603E7TEC.pdf Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MPC603RRX266TC MPC603RRX266TC NXP USA Inc. MPC603E7TEC.pdf Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MPC7410HX450LE MPC7410HX450LE NXP USA Inc. MPC7410.pdf Description: IC MPU MPC74XX 450MHZ 360FCCBGA
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MPC7410HX500LE MPC7410HX500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MPC7410THX400LE MPC7410THX400LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 400MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MPC7410THX500LE MPC7410THX500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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MHW9186AN MHW9186AN.pdf
MHW9186AN
Виробник: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
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MHW9186N MHW9186N.pdf
MHW9186N
Виробник: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
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MHW9187N MHW9187N.pdf
MHW9187N
Виробник: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
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MHW9188AN MHW9188AN.pdf
MHW9188AN
Виробник: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
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MHW9188N MHW9188N.pdf
MHW9188N
Виробник: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
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MHW9189AN MHW9189AN.pdf
MHW9189AN
Виробник: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
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MHW9206N MHW9206N.pdf
MHW9206N
Виробник: NXP USA Inc.
Description: IC CATV AMP MOD 870MHZ 7-CATV
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MHW9227AN MHW9227AN.pdf
MHW9227AN
Виробник: NXP USA Inc.
Description: IC CATV AMP MOD 870MHZ 7-CATV
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MHW9236N MHW9236N.pdf
MHW9236N
Виробник: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 255 mA
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MHW9247AN MHW9247AN.pdf
MHW9247AN
Виробник: NXP USA Inc.
Description: IC CATV AMP MOD 870MHZ 7-CATV
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MHW9247N MHW9247N.pdf
MHW9247N
Виробник: NXP USA Inc.
Description: IC CATV AMP MOD 870MHZ 7-CATV
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MHW9267AN MHW9267AN.pdf
MHW9267AN
Виробник: NXP USA Inc.
Description: IC CATV AMP MOD 870MHZ 7-CATV
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MHW9267N MHW9267N.pdf
MHW9267N
Виробник: NXP USA Inc.
Description: IC CATV AMP MOD 870MHZ 7-CATV
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MM908E622ACEK MM908E622.pdf
MM908E622ACEK
Виробник: NXP USA Inc.
Description: IC HALF-BRIDGE QUAD 54-SOIC
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MMA1260EG MMA1260KEG.pdf
MMA1260EG
Виробник: NXP USA Inc.
Description: ACCEL 1.55G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±1.55g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 1200
Grade: Automotive
Qualification: AEC-Q100
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MMA1260EGR2 MMA1260KEG.pdf
MMA1260EGR2
Виробник: NXP USA Inc.
Description: ACCEL 1.55G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±1.55g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 1200
Grade: Automotive
Qualification: AEC-Q100
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MMA2202EGR2 MMA2202KEG.pdf
MMA2202EGR2
Виробник: NXP USA Inc.
Description: ACCEL 56.3G ANALOG 16SOIC
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MMA2204EGR2 MMA2204KEG.pdf
MMA2204EGR2
Виробник: NXP USA Inc.
Description: ACCEL 112.5G ANALOG 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X
Acceleration Range: ±112.5g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 20
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MMA2260EGR2 MMA2260.pdf
MMA2260EGR2
Виробник: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
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MMA6233QR2 MMA6231Q.pdf
Виробник: NXP USA Inc.
Description: ACCELEROMETER 10G ANALOG 16QFN
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MMA6260QR2 MMA6260Q.pdf
Виробник: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 16QFN
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MMA6261QR2 MMA6260Q.pdf
Виробник: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 16QFN
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MMC2114CFCAG33 MMC2114PB.pdf
MMC2114CFCAG33
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M210
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 67
DigiKey Programmable: Not Verified
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MMG3003NT1 MMG3003NT1.pdf
MMG3003NT1
Виробник: NXP USA Inc.
Description: IC AMP CELL 40MHZ-3.6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 40MHz ~ 3.6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 6.2V
Gain: 20dB
Current - Supply: 180mA
Noise Figure: 4dB
P1dB: 24dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
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MMG3005NT1 MMG3005NT1.pdf
MMG3005NT1
Виробник: NXP USA Inc.
Description: IC AMP CELL 800MHZ-2.2GHZ 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 800MHz ~ 2.2GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 15dB
Current - Supply: 480mA
Noise Figure: 5dB
P1dB: 30dBm
Test Frequency: 2.14GHz
Supplier Device Package: 16-PQFN (5x5)
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MMG3008NT1 MMG3008NT1.pdf
MMG3008NT1
Виробник: NXP USA Inc.
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 18.5dB
Current - Supply: 38mA
Noise Figure: 4dB
P1dB: 15dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Obsolete
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MP3H6115A6U MP3H6115A.pdf
MP3H6115A6U
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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MP3H6115AC6T1 MP3H6115A.pdf
MP3H6115AC6T1
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
на замовлення 900 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
300+887.85 грн
600+832.22 грн
Мінімальне замовлення: 300
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MP3H6115AC6U description MP3H6115A.pdf
MP3H6115AC6U
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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MPC17510EJ MPC17510.pdf
MPC17510EJ
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 4V-5.5V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.220", 5.60mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1.2A
Interface: Parallel
Operating Temperature: -30°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 4V ~ 5.5V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 15V
Supplier Device Package: 24-TSSOP
Motor Type - AC, DC: Brushed DC
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MPC17510EJR2 MPC17510.pdf
MPC17510EJR2
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 4V-5.5V 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.220", 5.60mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1.2A
Interface: Parallel
Operating Temperature: -30°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 4V ~ 5.5V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 15V
Supplier Device Package: 24-TSSOP
Motor Type - AC, DC: Brushed DC
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MPC17511EP MPC17511.pdf
MPC17511EP
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 24-QFN-EP (4x4)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17511EPR2 MPC17511.pdf
MPC17511EPR2
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 24-QFN-EP (4x4)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17533EVEL DS_568_MPC17533.pdf
MPC17533EVEL
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC17550EV MPC17550.pdf
MPC17550EV
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP
Packaging: Tube
Package / Case: 36-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -10°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 1.6V ~ 5.5V
Supplier Device Package: 36-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
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MPC17C724EP MPC17C724.pdf
MPC17C724EP
Виробник: NXP USA Inc.
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Packaging: Tray
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 400mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Camera
Technology: Power MOSFET
Voltage - Load: 2.7V ~ 5.5V
Supplier Device Package: 16-QFN (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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MPC184VFB MPC184.pdf
MPC184VFB
Виробник: NXP USA Inc.
Description: IC SECURITY PROCESSOR 252-MAPBGA
Packaging: Tray
Package / Case: 252-BGA
Mounting Type: Surface Mount
Type: Security Processor
Supplier Device Package: 252-MAPBGA (21x21)
DigiKey Programmable: Not Verified
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MPC18730EPR2 MPC18730.pdf
MPC18730EPR2
Виробник: NXP USA Inc.
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -10°C ~ 65°C
Voltage - Supply: 0.9V ~ 4.2V
Applications: Handheld/Mobile Devices
Current - Supply: 9mA
Supplier Device Package: 64-QFN (9x9)
Part Status: Obsolete
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MPC5554MVR132 MPC5554.pdf
MPC5554MVR132
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
DigiKey Programmable: Not Verified
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+6720.47 грн
10+5400.20 грн
25+5132.70 грн
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MPC5554MVR132R2 MPC5554.pdf
MPC5554MVR132R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 256
DigiKey Programmable: Not Verified
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MPC5554MZP132 MPC5554.pdf
MPC5554MZP132
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
DigiKey Programmable: Not Verified
на замовлення 287 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+6209.56 грн
10+4989.87 грн
25+4742.62 грн
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MPC555LFMZP40R2 MPC555PB.pdf
MPC555LFMZP40R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tape & Reel (TR)
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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MPC561MVR56 MPC561RM.pdf
MPC561MVR56
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
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MPC561MZP56R2 MPC561RM.pdf
MPC561MZP56R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
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MPC562MZP56R2 MPC561RM.pdf
MPC562MZP56R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
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MPC562MZP66R2 MPC561RM.pdf
MPC562MZP66R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388BGA
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MPC563MVR56R2 MPC561RM.pdf
MPC563MVR56R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC563MVR66R MPC561RM.pdf
MPC563MVR66R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC563MZP56R2 MPC561RM.pdf
MPC563MZP56R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC563MZP66R2 MPC561RM.pdf
MPC563MZP66R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC564MVR56R2 MPC561RM.pdf
MPC564MVR56R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC564MZP56R2 MPC561RM.pdf
MPC564MZP56R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC564MZP66R2 MPC561RM.pdf
MPC564MZP66R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
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MPC565MZP56R2 MPC565PB.pdf
MPC565MZP56R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388BGA
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MPC603RRX200TC MPC603E7TEC.pdf
MPC603RRX200TC
Виробник: NXP USA Inc.
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MPC603RRX266TC MPC603E7TEC.pdf
MPC603RRX266TC
Виробник: NXP USA Inc.
Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MPC7410HX450LE MPC7410.pdf
MPC7410HX450LE
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 450MHZ 360FCCBGA
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MPC7410HX500LE DS_568_MPC7410.pdf
MPC7410HX500LE
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MPC7410THX400LE DS_568_MPC7410.pdf
MPC7410THX400LE
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 400MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MPC7410THX500LE DS_568_MPC7410.pdf
MPC7410THX500LE
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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