Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (34090) > Сторінка 87 з 569
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MHW9189AN | NXP USA Inc. |
 Description: IC AMP CATV 7-CATV MODULE |
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MHW9206N | NXP USA Inc. |
Description: IC CATV AMP MOD 870MHZ 7-CATV |
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MHW9227AN | NXP USA Inc. |
Description: IC CATV AMP MOD 870MHZ 7-CATV |
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MHW9236N | NXP USA Inc. |
Description: IC AMP CATV 7-CATV MODULE Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: 7-CATV Module Part Status: Obsolete Number of Circuits: 1 Current - Supply: 255 mA |
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MHW9247AN | NXP USA Inc. |
Description: IC CATV AMP MOD 870MHZ 7-CATV |
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MHW9247N | NXP USA Inc. |
Description: IC CATV AMP MOD 870MHZ 7-CATV |
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MHW9267AN | NXP USA Inc. |
Description: IC CATV AMP MOD 870MHZ 7-CATV |
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MHW9267N | NXP USA Inc. |
Description: IC CATV AMP MOD 870MHZ 7-CATV |
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MM908E622ACEK | NXP USA Inc. |
Description: IC HALF-BRIDGE QUAD 54-SOIC |
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MMA2202EGR2 | NXP USA Inc. |
Description: ACCEL 56.3G ANALOG 16SOIC |
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MMA2260EGR2 | NXP USA Inc. |
Description: ACCELEROMETER 1.5G ANALOG 16SOIC |
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| MMA6233QR2 | NXP USA Inc. |
Description: ACCELEROMETER 10G ANALOG 16QFN |
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| MMA6260QR2 | NXP USA Inc. |
Description: ACCELEROMETER 1.5G ANALOG 16QFN |
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| MMA6261QR2 | NXP USA Inc. |
Description: ACCELEROMETER 1.5G ANALOG 16QFN |
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MMC2114CFCAG33 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 33MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: M210 Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: EBI/EMI, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Last Time Buy Number of I/O: 67 DigiKey Programmable: Not Verified |
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MMG3003NT1 | NXP USA Inc. |
Description: IC AMP CELL 40MHZ-3.6GHZ SOT89-4 Packaging: Tape & Reel (TR) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 40MHz ~ 3.6GHz RF Type: Cellular, PCS, PHS, WLL Voltage - Supply: 6.2V Gain: 20dB Current - Supply: 180mA Noise Figure: 4dB P1dB: 24dBm Test Frequency: 900MHz Supplier Device Package: SOT-89-4 |
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MMG3005NT1 | NXP USA Inc. |
Description: IC AMP CELL 800MHZ-2.2GHZ 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Mounting Type: Surface Mount Frequency: 800MHz ~ 2.2GHz RF Type: Cellular, PCS, PHS, WLL Voltage - Supply: 5V Gain: 15dB Current - Supply: 480mA Noise Figure: 5dB P1dB: 30dBm Test Frequency: 2.14GHz Supplier Device Package: 16-PQFN (5x5) |
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MMG3008NT1 | NXP USA Inc. |
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4 Packaging: Tape & Reel (TR) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 0Hz ~ 6GHz RF Type: Cellular, PCS, PHS, WLL Voltage - Supply: 5V Gain: 18.5dB Current - Supply: 38mA Noise Figure: 4dB P1dB: 15dBm Test Frequency: 900MHz Supplier Device Package: SOT-89-4 Part Status: Obsolete |
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MP3H6115A6U | NXP USA Inc. |
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP Features: Temperature Compensated Packaging: Tube Package / Case: 8-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.12 V ~ 2.8 V Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 2.7V ~ 3.3V Port Size: Male - 0.13" (3.3mm) Tube Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: Barbless Maximum Pressure: 58.02PSI (400kPa) Part Status: Obsolete |
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MP3H6115AC6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP Features: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.12 V ~ 2.8 V Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 2.7V ~ 3.3V Port Size: Male - 0.13" (3.3mm) Tube Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: Barbless Maximum Pressure: 58.02PSI (400kPa) Part Status: Active |
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MP3H6115AC6U | NXP USA Inc. |
 Description: SENSOR 16.68PSIA 0.13" 2.8V SSOPFeatures: Temperature Compensated Packaging: Tube Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.12 V ~ 2.8 V Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 2.7V ~ 3.3V Port Size: Male - 0.13" (3.3mm) Tube Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: Barbless Maximum Pressure: 58.02PSI (400kPa) Part Status: Obsolete |
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MPC17510EJ | NXP USA Inc. |
Description: IC MOTOR DRIVER 4V-5.5V 24TSSOP Packaging: Tube Package / Case: 24-TSSOP (0.220", 5.60mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 1.2A Interface: Parallel Operating Temperature: -30°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 4V ~ 5.5V Applications: Battery Powered Technology: CMOS Voltage - Load: 2V ~ 15V Supplier Device Package: 24-TSSOP Motor Type - AC, DC: Brushed DC |
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MPC17510EJR2 | NXP USA Inc. |
Description: IC MOTOR DRIVER 4V-5.5V 24TSSOP Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.220", 5.60mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 1.2A Interface: Parallel Operating Temperature: -30°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 4V ~ 5.5V Applications: Battery Powered Technology: CMOS Voltage - Load: 2V ~ 15V Supplier Device Package: 24-TSSOP Motor Type - AC, DC: Brushed DC |
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MPC17511EP | NXP USA Inc. |
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN Packaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 1A Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 2.7V ~ 5.7V Applications: Battery Powered Technology: CMOS Voltage - Load: 2V ~ 6.8V Supplier Device Package: 24-QFN-EP (4x4) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
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MPC17511EPR2 | NXP USA Inc. |
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 1A Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 2.7V ~ 5.7V Applications: Battery Powered Technology: CMOS Voltage - Load: 2V ~ 6.8V Supplier Device Package: 24-QFN-EP (4x4) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
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MPC17533EVEL | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP Packaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 700mA Interface: Parallel Operating Temperature: -55°C ~ 150°C (TJ) Output Configuration: Half Bridge (4) Voltage - Supply: 2.7V ~ 5.7V Applications: Battery Powered Technology: CMOS Voltage - Load: 2V ~ 6.8V Supplier Device Package: 16-VMFP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
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MPC17550EV | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP Packaging: Tube Package / Case: 36-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 700mA Interface: Parallel Operating Temperature: -10°C ~ 150°C (TJ) Output Configuration: Half Bridge (8) Voltage - Supply: 2.5V ~ 5.5V Applications: Battery Powered Technology: Power MOSFET Voltage - Load: 1.6V ~ 5.5V Supplier Device Package: 36-VMFP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Part Status: Obsolete |
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MPC17C724EP | NXP USA Inc. |
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN Packaging: Tray Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 400mA Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (4) Voltage - Supply: 2.7V ~ 5.5V Applications: Camera Technology: Power MOSFET Voltage - Load: 2.7V ~ 5.5V Supplier Device Package: 16-QFN (3x3) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
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MPC184VFB | NXP USA Inc. |
Description: IC SECURITY PROCESSOR 252MAPBGA |
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MPC18730EPR2 | NXP USA Inc. |
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN Packaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -10°C ~ 65°C Voltage - Supply: 0.9V ~ 4.2V Applications: Handheld/Mobile Devices Current - Supply: 9mA Supplier Device Package: 64-QFN (9x9) Part Status: Obsolete |
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MPC5554MVR132 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 256 |
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MPC5554MVR132R2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Packaging: Tape & Reel (TR) Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Obsolete Number of I/O: 256 |
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MPC5554MZP132 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 256 DigiKey Programmable: Not Verified |
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MPC555LFMZP40R2 | NXP USA Inc. |
Description: IC MCU 32BIT 448KB FLASH 272BGA |
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MPC561MVR56 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 64 DigiKey Programmable: Not Verified |
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MPC561MZP56R2 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tape & Reel (TR) Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 64 DigiKey Programmable: Not Verified |
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MPC562MZP56R2 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tape & Reel (TR) Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 64 DigiKey Programmable: Not Verified |
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MPC562MZP66R2 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388BGA |
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MPC563MVR56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Packaging: Tape & Reel (TR) Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC563MVR66R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Packaging: Tape & Reel (TR) Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC563MZP56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Packaging: Tape & Reel (TR) Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC563MZP66R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA |
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MPC564MVR56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Packaging: Tape & Reel (TR) Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Obsolete Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC564MZP56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Packaging: Tape & Reel (TR) Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Obsolete Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC564MZP66R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA |
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MPC565MZP56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 388BGA |
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MPC603RRX200TC | NXP USA Inc. |
Description: IC MPU MPC6XX 200MHZ 255FCCBGA Packaging: Tray Package / Case: 255-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 255-FCCBGA (21x21) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MPC603RRX266TC | NXP USA Inc. |
Description: IC MPU MPC6XX 266MHZ 255FCCBGA Packaging: Tray Package / Case: 255-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 255-FCCBGA (21x21) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MPC7410HX450LE | NXP USA Inc. |
Description: IC MPU MPC74XX 450MHZ 360FCCBGA |
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MPC7410HX500LE | NXP USA Inc. |
Description: IC MPU MPC74XX 500MHZ 360CBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 360-CBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
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MPC7410THX400LE | NXP USA Inc. |
Description: IC MPU MPC74XX 400MHZ 360FCCBGA |
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MPC7410THX500LE | NXP USA Inc. |
Description: IC MPU MPC74XX 500MHZ 360CBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 360-CBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Obsolete |
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MPC823ZQ66B2T | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
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MPC8245TZU300D | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ 352TBGA |
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MPC8247ZQMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
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mpc8250aczqihbc | NXP USA Inc. |
Description: IC MPU MPC82XX 200MHZ 516BGA Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Obsolete |
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MPC8255ACZUMIBB | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Obsolete |
товар відсутній |
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MPC8265ACVVMIBC | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
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MPC8265ACZUMIBC | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Obsolete |
товар відсутній |
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MPC8265AVVPJDC | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ 480TBGA |
товар відсутній |
| MHW9236N |
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Виробник: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 255 mA
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 255 mA
товар відсутній
| MMC2114CFCAG33 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M210
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 67
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M210
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 67
DigiKey Programmable: Not Verified
товар відсутній
| MMG3003NT1 |
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Виробник: NXP USA Inc.
Description: IC AMP CELL 40MHZ-3.6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 40MHz ~ 3.6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 6.2V
Gain: 20dB
Current - Supply: 180mA
Noise Figure: 4dB
P1dB: 24dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Description: IC AMP CELL 40MHZ-3.6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 40MHz ~ 3.6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 6.2V
Gain: 20dB
Current - Supply: 180mA
Noise Figure: 4dB
P1dB: 24dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
товар відсутній
| MMG3005NT1 |
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Виробник: NXP USA Inc.
Description: IC AMP CELL 800MHZ-2.2GHZ 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 800MHz ~ 2.2GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 15dB
Current - Supply: 480mA
Noise Figure: 5dB
P1dB: 30dBm
Test Frequency: 2.14GHz
Supplier Device Package: 16-PQFN (5x5)
Description: IC AMP CELL 800MHZ-2.2GHZ 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 800MHz ~ 2.2GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 15dB
Current - Supply: 480mA
Noise Figure: 5dB
P1dB: 30dBm
Test Frequency: 2.14GHz
Supplier Device Package: 16-PQFN (5x5)
товар відсутній
| MMG3008NT1 |
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Виробник: NXP USA Inc.
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 18.5dB
Current - Supply: 38mA
Noise Figure: 4dB
P1dB: 15dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Obsolete
Description: IC AMP CELLULAR 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 18.5dB
Current - Supply: 38mA
Noise Figure: 4dB
P1dB: 15dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Obsolete
товар відсутній
| MP3H6115A6U |
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Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
товар відсутній
| MP3H6115AC6T1 |
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Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
товар відсутній
| MP3H6115AC6U | |
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Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Description: SENSOR 16.68PSIA 0.13" 2.8V SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.12 V ~ 2.8 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
товар відсутній
| MPC17510EJ |
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Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 4V-5.5V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.220", 5.60mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1.2A
Interface: Parallel
Operating Temperature: -30°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 4V ~ 5.5V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 15V
Supplier Device Package: 24-TSSOP
Motor Type - AC, DC: Brushed DC
Description: IC MOTOR DRIVER 4V-5.5V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.220", 5.60mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1.2A
Interface: Parallel
Operating Temperature: -30°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 4V ~ 5.5V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 15V
Supplier Device Package: 24-TSSOP
Motor Type - AC, DC: Brushed DC
товар відсутній
| MPC17510EJR2 |
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Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 4V-5.5V 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.220", 5.60mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1.2A
Interface: Parallel
Operating Temperature: -30°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 4V ~ 5.5V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 15V
Supplier Device Package: 24-TSSOP
Motor Type - AC, DC: Brushed DC
Description: IC MOTOR DRIVER 4V-5.5V 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.220", 5.60mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1.2A
Interface: Parallel
Operating Temperature: -30°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 4V ~ 5.5V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 15V
Supplier Device Package: 24-TSSOP
Motor Type - AC, DC: Brushed DC
товар відсутній
| MPC17511EP |
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Виробник: NXP USA Inc.
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 24-QFN-EP (4x4)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 24-QFN-EP (4x4)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
товар відсутній
| MPC17511EPR2 |
|
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 24-QFN-EP (4x4)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 24-QFN-EP (4x4)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
товар відсутній
| MPC17533EVEL |
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Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
товар відсутній
| MPC17550EV |
|
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP
Packaging: Tube
Package / Case: 36-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -10°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 1.6V ~ 5.5V
Supplier Device Package: 36-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP
Packaging: Tube
Package / Case: 36-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -10°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 1.6V ~ 5.5V
Supplier Device Package: 36-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
товар відсутній
| MPC17C724EP |
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Виробник: NXP USA Inc.
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Packaging: Tray
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 400mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Camera
Technology: Power MOSFET
Voltage - Load: 2.7V ~ 5.5V
Supplier Device Package: 16-QFN (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Packaging: Tray
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 400mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Camera
Technology: Power MOSFET
Voltage - Load: 2.7V ~ 5.5V
Supplier Device Package: 16-QFN (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
товар відсутній
| MPC18730EPR2 |
|
Виробник: NXP USA Inc.
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -10°C ~ 65°C
Voltage - Supply: 0.9V ~ 4.2V
Applications: Handheld/Mobile Devices
Current - Supply: 9mA
Supplier Device Package: 64-QFN (9x9)
Part Status: Obsolete
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -10°C ~ 65°C
Voltage - Supply: 0.9V ~ 4.2V
Applications: Handheld/Mobile Devices
Current - Supply: 9mA
Supplier Device Package: 64-QFN (9x9)
Part Status: Obsolete
товар відсутній
| MPC5554MVR132 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
товар відсутній
| MPC5554MVR132R2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 256
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 256
товар відсутній
| MPC5554MZP132 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
DigiKey Programmable: Not Verified
товар відсутній
| MPC561MVR56 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
| MPC561MZP56R2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
| MPC562MZP56R2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
| MPC563MVR56R2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 56
DigiKey Programmable: Not Verified
товар відсутній
| MPC563MVR66R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
товар відсутній
| MPC563MZP56R2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
товар відсутній
| MPC564MVR56R2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 56
DigiKey Programmable: Not Verified
товар відсутній
| MPC564MZP56R2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 56
DigiKey Programmable: Not Verified
товар відсутній
| MPC603RRX200TC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
| MPC603RRX266TC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
| MPC7410HX500LE |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товар відсутній
| MPC7410THX500LE |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPC8247ZQMIBA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
товар відсутній
| mpc8250aczqihbc |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 516BGA
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC82XX 200MHZ 516BGA
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPC8255ACZUMIBB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| MPC8265ACVVMIBC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
товар відсутній
| MPC8265ACZUMIBC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній