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MPC7410HX450LE MPC7410HX450LE NXP USA Inc. MPC7410.pdf Description: IC MPU MPC74XX 450MHZ 360FCCBGA
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MPC7410HX500LE MPC7410HX500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360CBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-CBGA (25x25)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
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MPC7410THX400LE MPC7410THX400LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 400MHZ 360CBGA
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-CBGA (25x25)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC G4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
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MPC7410THX500LE MPC7410THX500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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MPC823ZQ66B2T MPC823ZQ66B2T NXP USA Inc. MPC823TS.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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MPC8245TZU300D MPC8245TZU300D NXP USA Inc. MPC8245T_Series.pdf Description: IC MPU MPC82XX 300MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
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MPC8245TZU333D MPC8245TZU333D NXP USA Inc. MPC8245T_Series.pdf Description: IC MPU MPC82XX 333MHZ 352TBGA
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
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MPC8247ZQMIBA MPC8247ZQMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ PBGA516
Package / Case: 516-BBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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mpc8250aczqihbc mpc8250aczqihbc NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 200MHZ PBGA516
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Ethernet: 10/100Mbps (3)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8255ACZUMIBB MPC8255ACZUMIBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8264ACZUMIBB MPC8264ACZUMIBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8265ACVVMIBC MPC8265ACVVMIBC NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
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MPC8265ACZUMHBC MPC8265ACZUMHBC NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8265ACZUMIBC MPC8265ACZUMIBC NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Graphics Acceleration: No
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MPC8265AVVPJDC MPC8265AVVPJDC NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 300MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8265AZUPJDC MPC8265AZUPJDC NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 300MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8270CZQMIBA MPC8270CZQMIBA NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 333MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+9969.44 грн
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MPC8270CZUQLDA MPC8270CZUQLDA NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8270CZUUPEA MPC8270CZUUPEA NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8271CZQMIBA MPC8271CZQMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ 516BGA
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MPC8272CZQMIBA MPC8272CZQMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8272CZQPIEA MPC8272CZQPIEA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8272CZQTIEA MPC8272CZQTIEA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 400MHZ PBGA516
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
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MPC8272ZQMIBA MPC8272ZQMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ 516BGA
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MPC8272ZQPIEA MPC8272ZQPIEA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8272ZQTIEA MPC8272ZQTIEA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 400MHZ 516BGA
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MPC8280CZUQLDA MPC8280CZUQLDA NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8280CZUUPEA MPC8280CZUUPEA NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8280ZUQLDA MPC8280ZUQLDA NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8343CVRADD MPC8343CVRADD NXP USA Inc. MPC8343%28E%29_Man.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343CVRAGD MPC8343CVRAGD NXP USA Inc. MPC8343%28E%29_Man.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343CZQADD MPC8343CZQADD NXP USA Inc. MPC8343%28E%29_Man.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343EVRADD MPC8343EVRADD NXP USA Inc. MPC8343%28E%29_Man.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343EZQAGD MPC8343EZQAGD NXP USA Inc. MPC8343%28E%29_Man.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343VRADD MPC8343VRADD NXP USA Inc. MPC8343%28E%29_Man.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343VRAGD MPC8343VRAGD NXP USA Inc. MPC8343%28E%29_Man.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8347VRADD MPC8347VRADD NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, I2C, PCI, SPI
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MPC8347VRAGD MPC8347VRAGD NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC850CVR50BU MPC850CVR50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Speed: 50MHz
Mounting Type: Surface Mount
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Package / Case: 256-BBGA
Packaging: Tray
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MPC850CVR50BUR2 MPC850CVR50BUR2 NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
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MPC850CVR66BU MPC850CVR66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850CZQ50BU MPC850CZQ50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850CZQ50BUR2 MPC850CZQ50BUR2 NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tape & Reel (TR)
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MPC850DECVR50BU MPC850DECVR50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DECVR66BU MPC850DECVR66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DECZQ50BU MPC850DECZQ50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
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MPC850DECZQ66BU MPC850DECZQ66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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MPC850DEVR66BU MPC850DEVR66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DEVR66BUR2 MPC850DEVR66BUR2 NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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MPC850DEZQ50BU MPC850DEZQ50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
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MPC850DEZQ50BUR2 MPC850DEZQ50BUR2 NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tape & Reel (TR)
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
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MPC850DEZQ66BU MPC850DEZQ66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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MPC850DEZQ80BU MPC850DEZQ80BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 80MHZ 256BGA
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MPC850DSLCVR50BU MPC850DSLCVR50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DSLCZQ50BU MPC850DSLCZQ50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DSLVR50BU MPC850DSLVR50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DSLZQ50BU MPC850DSLZQ50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850SRCVR50BU MPC850SRCVR50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
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MPC850SRCZQ50BU MPC850SRCZQ50BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 50MHZ 256BGA
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MPC850SRCZQ66BU MPC850SRCZQ66BU NXP USA Inc. MPC850%20PowerQUICC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
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MPC7410HX450LE MPC7410.pdf
MPC7410HX450LE
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 450MHZ 360FCCBGA
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MPC7410HX500LE DS_568_MPC7410.pdf
MPC7410HX500LE
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-CBGA (25x25)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
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MPC7410THX400LE DS_568_MPC7410.pdf
MPC7410THX400LE
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 400MHZ 360CBGA
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-CBGA (25x25)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC G4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
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MPC7410THX500LE DS_568_MPC7410.pdf
MPC7410THX500LE
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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MPC823ZQ66B2T MPC823TS.pdf
MPC823ZQ66B2T
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
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MPC8245TZU300D MPC8245T_Series.pdf
MPC8245TZU300D
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
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MPC8245TZU333D MPC8245T_Series.pdf
MPC8245TZU333D
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 352TBGA
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
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MPC8247ZQMIBA MPC8272EC.pdf
MPC8247ZQMIBA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Package / Case: 516-BBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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mpc8250aczqihbc MPC8250.pdf
mpc8250aczqihbc
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ PBGA516
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Ethernet: 10/100Mbps (3)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8255ACZUMIBB MPC8260A.pdf
MPC8255ACZUMIBB
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8264ACZUMIBB MPC8260A.pdf
MPC8264ACZUMIBB
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8265ACVVMIBC MPC8260A.pdf
MPC8265ACVVMIBC
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
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MPC8265ACZUMHBC MPC8260A.pdf
MPC8265ACZUMHBC
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8265ACZUMIBC MPC8260A.pdf
MPC8265ACZUMIBC
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Graphics Acceleration: No
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MPC8265AVVPJDC MPC8260A.pdf
MPC8265AVVPJDC
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8265AZUPJDC MPC8260A.pdf
MPC8265AZUPJDC
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8270CZQMIBA MPC8280EC.pdf
MPC8270CZQMIBA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+9969.44 грн
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MPC8270CZUQLDA MPC8280EC.pdf
MPC8270CZUQLDA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8270CZUUPEA MPC8280EC.pdf
MPC8270CZUUPEA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8271CZQMIBA MPC8272EC.pdf
MPC8271CZQMIBA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 516BGA
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MPC8272CZQMIBA MPC8272EC.pdf
MPC8272CZQMIBA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8272CZQPIEA MPC8272EC.pdf
MPC8272CZQPIEA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8272CZQTIEA MPC8272EC.pdf
MPC8272CZQTIEA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
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MPC8272ZQMIBA MPC8272EC.pdf
MPC8272ZQMIBA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 516BGA
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MPC8272ZQPIEA MPC8272EC.pdf
MPC8272ZQPIEA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8272ZQTIEA MPC8272EC.pdf
MPC8272ZQTIEA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ 516BGA
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MPC8280CZUQLDA MPC8280EC.pdf
MPC8280CZUQLDA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8280CZUUPEA MPC8280EC.pdf
MPC8280CZUUPEA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8280ZUQLDA MPC8280EC.pdf
MPC8280ZUQLDA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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MPC8343CVRADD MPC8343%28E%29_Man.pdf
MPC8343CVRADD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343CVRAGD MPC8343%28E%29_Man.pdf
MPC8343CVRAGD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343CZQADD MPC8343%28E%29_Man.pdf
MPC8343CZQADD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343EVRADD MPC8343%28E%29_Man.pdf
MPC8343EVRADD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343EZQAGD MPC8343%28E%29_Man.pdf
MPC8343EZQAGD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343VRADD MPC8343%28E%29_Man.pdf
MPC8343VRADD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8343VRAGD MPC8343%28E%29_Man.pdf
MPC8343VRAGD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8347VRADD MPC8347EEC.pdf
MPC8347VRADD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, I2C, PCI, SPI
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MPC8347VRAGD MPC8347EEC.pdf
MPC8347VRAGD
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC850CVR50BU MPC850%20PowerQUICC.pdf
MPC850CVR50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Speed: 50MHz
Mounting Type: Surface Mount
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Package / Case: 256-BBGA
Packaging: Tray
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MPC850CVR50BUR2 MPC850%20PowerQUICC.pdf
MPC850CVR50BUR2
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
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MPC850CVR66BU MPC850%20PowerQUICC.pdf
MPC850CVR66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850CZQ50BU MPC850%20PowerQUICC.pdf
MPC850CZQ50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850CZQ50BUR2 MPC850%20PowerQUICC.pdf
MPC850CZQ50BUR2
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tape & Reel (TR)
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MPC850DECVR50BU MPC850%20PowerQUICC.pdf
MPC850DECVR50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DECVR66BU MPC850%20PowerQUICC.pdf
MPC850DECVR66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DECZQ50BU MPC850%20PowerQUICC.pdf
MPC850DECZQ50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
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MPC850DECZQ66BU MPC850%20PowerQUICC.pdf
MPC850DECZQ66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
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MPC850DEVR66BU MPC850%20PowerQUICC.pdf
MPC850DEVR66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DEVR66BUR2 MPC850%20PowerQUICC.pdf
MPC850DEVR66BUR2
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
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MPC850DEZQ50BU MPC850%20PowerQUICC.pdf
MPC850DEZQ50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
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MPC850DEZQ50BUR2 MPC850%20PowerQUICC.pdf
MPC850DEZQ50BUR2
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tape & Reel (TR)
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
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MPC850DEZQ66BU MPC850%20PowerQUICC.pdf
MPC850DEZQ66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
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MPC850DEZQ80BU MPC850%20PowerQUICC.pdf
MPC850DEZQ80BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
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MPC850DSLCVR50BU MPC850%20PowerQUICC.pdf
MPC850DSLCVR50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DSLCZQ50BU MPC850%20PowerQUICC.pdf
MPC850DSLCZQ50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DSLVR50BU MPC850%20PowerQUICC.pdf
MPC850DSLVR50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850DSLZQ50BU MPC850%20PowerQUICC.pdf
MPC850DSLZQ50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10Mbps (1)
Supplier Device Package: 256-PBGA (23x23)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
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MPC850SRCVR50BU MPC850%20PowerQUICC.pdf
MPC850SRCVR50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
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MPC850SRCZQ50BU MPC850%20PowerQUICC.pdf
MPC850SRCZQ50BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
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В кошику  од. на суму  грн.
MPC850SRCZQ66BU MPC850%20PowerQUICC.pdf
MPC850SRCZQ66BU
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
товару немає в наявності
В кошику  од. на суму  грн.
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