Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (33870) > Сторінка 240 з 565
Фото | Назва | Виробник | Інформація |
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PCA9952TW/Q900,118 | NXP USA Inc. |
Description: IC LED DRV LIN PWM 57MA 28HTSSOP Packaging: Cut Tape (CT) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad Voltage - Output: 40V Mounting Type: Surface Mount Number of Outputs: 16 Type: Linear Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 57mA Internal Switch(s): Yes Supplier Device Package: 28-HTSSOP Dimming: PWM Voltage - Supply (Min): 3V Voltage - Supply (Max): 5.5V Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
на замовлення 13286 шт: термін постачання 21-31 дні (днів) |
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PCAL6416AEXX | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24XFBGA Features: POR Packaging: Cut Tape (CT) Package / Case: 24-XFBGA Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-XFBGA (2x2) Current - Output Source/Sink: 10mA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified |
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PCT2075DP,118 | NXP USA Inc. |
Description: SENSOR DIGITAL -55C-125C 8TSSOP Features: Output Switch, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 8-TSSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±2°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Active |
на замовлення 1354 шт: термін постачання 21-31 дні (днів) |
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PTN36242LBS,518 | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 2CH 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Delay Time: 0.4ns Number of Channels: 2 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: 0°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Applications: USB 3.0 Current - Supply: 225mA Supplier Device Package: 32-HVQFN (3x6) Signal Conditioning: Input Equalization, Output De-Emphasis |
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SC16IS741AIPWJ | NXP USA Inc. |
Description: IC UART SGL I2C BUS SPI 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Number of Channels: 1, UART Mounting Type: Surface Mount Voltage - Supply: 2.3V ~ 3.6V FIFO's: 64 Byte Protocol: RS232, RS485 Data Rate (Max): 5Mbps Supplier Device Package: 16-TSSOP With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With Modem Control: Yes Part Status: Active |
на замовлення 32749 шт: термін постачання 21-31 дні (днів) |
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SDIO101AIHRZ | NXP USA Inc. | Description: IC FLASH MEMORY CTRLR 60HXQFN |
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LPC11E37HFBD64/4QL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
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OM13062UL | NXP USA Inc. |
Description: LPCXPRESSO LPC11U37H EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Board Type: Evaluation Platform Utilized IC / Part: LPC11U37H Platform: LPCXpresso™ Part Status: Active |
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FRDM-FXS-MULTI-B | NXP USA Inc. |
Description: DEV KIT FOR XTRINSIC SENSOR BT Packaging: Box For Use With/Related Products: Kinetis, mbed-Enabled Development Accessory Type: Sensor Board |
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FRDM-FXS-9AXIS | NXP USA Inc. | Description: DEV KIT FOR 9AXIS XTRINSIC SNSR |
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OM13061UL | NXP USA Inc. |
Description: XPLORER LPC1837 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Accessories Core Processor: ARM® Cortex®-M3 Board Type: Evaluation Platform Utilized IC / Part: LPC1837 Platform: Xplorer Part Status: Obsolete |
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TWR-KW24D512 | NXP USA Inc. | Description: TOWER SYSTEM KIT |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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PCF8545ATT/AJ | NXP USA Inc. |
Description: IC DRVR 320 SEGMENT 56TSSOP Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I²C Configuration: 320 Segment Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Supplier Device Package: 56-TSSOP Current - Supply: 30 µA |
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PCF8545BTT/AJ | NXP USA Inc. |
Description: IC DRVR 320 SEGMENT 56TSSOP Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 320 Segment Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Supplier Device Package: 56-TSSOP Part Status: Obsolete Current - Supply: 30 µA |
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PCA8546ATT/AJ | NXP USA Inc. | Description: IC DRVR 176 SEGMENT 56TSSOP |
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PCA8546BTT/AJ | NXP USA Inc. | Description: IC DRVR 176 SEGMENT 56TSSOP |
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PCA8546ATT/AJ | NXP USA Inc. | Description: IC DRVR 176 SEGMENT 56TSSOP |
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PCA8546BTT/AJ | NXP USA Inc. | Description: IC DRVR 176 SEGMENT 56TSSOP |
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LPC11U67JBD48E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
на замовлення 2027 шт: термін постачання 21-31 дні (днів) |
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LPC11U68JBD64E | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 64LQFP |
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LPC11U68JBD100E | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 100LQFP |
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OM13058UL | NXP USA Inc. |
Description: LPCXPRESSO LPC11U68 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: LPC11U68 Platform: LPCXpresso™ Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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TWR-K64F120M | NXP USA Inc. |
Description: TOWER SYSTEM K64 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: K64 Platform: Tower System Part Status: Active |
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TWR-13237 | NXP USA Inc. |
Description: KIT DEVELOPMENT MC13237CHT Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 (ZigBee®) Supplied Contents: Board(s) Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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TWR-13237-KIT | NXP USA Inc. |
Description: KIT DEVELOPMENT MC13237CHT Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 (ZigBee®) Supplied Contents: Board(s) Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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TWR-MC-FRDMKE02Z | NXP USA Inc. |
Description: TOWER MOD KE BD TWR-MC-LV3PH Packaging: Box For Use With/Related Products: Freescale Tower System Accessory Type: Interface Board Part Status: Active |
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13237ADC-BDM | NXP USA Inc. |
Description: KIT DEV MC13237CHT BDM Packaging: Bulk For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 (ZigBee®) Supplied Contents: Board(s) Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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ADAM20G1KIT | NXP USA Inc. |
Description: KIT EVAL ADAM 2.1GHZ Packaging: Bulk Type: Amplifier Supplied Contents: Board(s), Cable(s) Part Status: Active |
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BRKOUT-FXLN8361Q | NXP USA Inc. |
Description: BOARD BREAKOUT FXLN8361Q Packaging: Box Sensitivity: 229mV/g, 57.25mV/g Interface: Analog Voltage - Supply: 1.71V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: FXLN8361Q Supplied Contents: Board(s) Sensing Range: ±2g, 8g |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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BRKOUT-FXLN8371Q | NXP USA Inc. |
Description: BOARD BREAKOUT FXLN8371Q Packaging: Box Sensitivity: 229mV/g, 57.25mV/g Interface: Analog Voltage - Supply: 1.71V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: FXLN8371Q Supplied Contents: Board(s) Sensing Range: ±2g, 8g |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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BRKOUT-FXLS8471Q | NXP USA Inc. | Description: BOARD BREAKOUT FXLS8471Q |
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CWP-MCTB-S12ZV-N | NXP USA Inc. | Description: MOTOR CTRL TOOLBOX MC9S12ZVMX |
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DLD-MCTB-S12ZV-N | NXP USA Inc. | Description: DNLD MC9S12ZVMX CTRL TOOLBOX |
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DL-RAPPID577XKSW | NXP USA Inc. |
Description: DL PEX RAPPID SUITE V10 MPC577XK Packaging: Electronic Delivery For Use With/Related Products: MPC5xx Type: Integrated Development Environment (IDE) Applications: Programming Operating System: Windows Media Delivery Type: Electronically Delivered Part Status: Active |
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KITFXLC95000MAG | NXP USA Inc. |
Description: KIT XTRINSIC FXLC95000 Packaging: Bulk Sensitivity: 0.061mg/LSB, 0.122mg/LSB, 0.244mg/LSB Interface: I2C, Serial, SPI Voltage - Supply: 1.71V ~ 1.89V Sensor Type: Accelerometer, Temperature Utilized IC / Part: FXLC95000CL Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Sensing Range: ±2g, 4g, 8g Part Status: Active |
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S912XDG128F2CAAR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Not For New Designs Number of I/O: 59 DigiKey Programmable: Not Verified |
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S9S12VR48AF0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: 12V1 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
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AFT21H350W03SR6 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.11GHZ NI1230S Packaging: Tape & Reel (TR) Package / Case: NI-1230S Mounting Type: Chassis Mount Frequency: 2.11GHz Power - Output: 63W Gain: 16.4dB Technology: LDMOS Supplier Device Package: NI-1230S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 750 mA |
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AFT21H350W04GSR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230S-4 GW Mounting Type: Chassis Mount Frequency: 2.11GHz Power - Output: 63W Gain: 16.4dB Technology: LDMOS Supplier Device Package: NI-1230S-4 GULL Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 750 mA |
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AFT23S160W02GSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780GS-2L Mounting Type: Surface Mount Frequency: 2.4GHz Power - Output: 45W Gain: 17.9dB Technology: LDMOS Supplier Device Package: NI-780GS-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.1 A |
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AFT23S160W02SR3 | NXP USA Inc. | Description: FET RF 65V 2.4GHZ NI780S-2 |
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AFT26H200W03SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Mounting Type: Chassis Mount Frequency: 2.5GHz Power - Output: 45W Gain: 14.1dB Technology: LDMOS Supplier Device Package: NI-1230-4S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 500 mA |
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AFT27S006NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V PLD-1.5W Packaging: Tape & Reel (TR) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 28.8dBm Gain: 22dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 70 mA |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MC06XS4200BFKR2 | NXP USA Inc. | Description: IC PWR SWITCH N-CHAN 1:1 23PQFN |
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MC10XS3535JHFKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN Features: Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm (Max), 35mOhm (Max) Voltage - Load: 7V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Ratio - Input:Output: 1:6 Supplier Device Package: 24-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Part Status: Obsolete |
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MC10XS4200BAFKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 23-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm (Max) Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 6A Ratio - Input:Output: 1:1 Supplier Device Package: 23-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO |
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MC10XS4200BFKR2 | NXP USA Inc. | Description: IC PWR SWITCH N-CHAN 1:1 23PQFN |
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MC20XS4200BAFKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 23-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 20mOhm (Max) Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 3A Ratio - Input:Output: 1:1 Supplier Device Package: 23-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO |
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MC20XS4200BFKR2 | NXP USA Inc. | Description: IC PWR SWITCH N-CHAN 1:1 23PQFN |
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MC56F84550VLFR | NXP USA Inc. | Description: IC MCU 32BIT 96KB FLASH 48LQFP |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MC9S08PA16VLCR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
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MC9S08PA16VTJR | NXP USA Inc. | Description: IC MCU 8BIT 16KB FLASH 20TSSOP |
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MC9S08PA32VLDR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44LQFP Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Not For New Designs Number of I/O: 37 |
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MC9S08PA4VTGR | NXP USA Inc. | Description: IC MCU 8BIT 4KB FLASH 16TSSOP |
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MC9S08PA4VWJR | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20SOIC Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-SOIC Part Status: Not For New Designs Number of I/O: 18 |
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MC9S08PA60VLDR | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 44LQFP Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 37 DigiKey Programmable: Not Verified |
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MC9S08PA8VTGR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 14 DigiKey Programmable: Not Verified |
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MC9S08PA8VWJR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20SOIC Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-SOIC Part Status: Not For New Designs Number of I/O: 18 DigiKey Programmable: Not Verified |
товар відсутній |
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MK10DN128VLF5R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 16x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 33 DigiKey Programmable: Not Verified |
товар відсутній |
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MK24FN1M0VDC12R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 121XFBGA Packaging: Tape & Reel (TR) Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 37x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Part Status: Active Number of I/O: 83 DigiKey Programmable: Not Verified |
товар відсутній |
PCA9952TW/Q900,118 |
Виробник: NXP USA Inc.
Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): Yes
Supplier Device Package: 28-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): Yes
Supplier Device Package: 28-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 13286 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 301.82 грн |
10+ | 260.75 грн |
25+ | 246.56 грн |
100+ | 200.52 грн |
250+ | 190.24 грн |
500+ | 170.7 грн |
1000+ | 141.61 грн |
PCAL6416AEXX |
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24XFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-XFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-XFBGA (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24XFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-XFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-XFBGA (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
PCT2075DP,118 |
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
на замовлення 1354 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 58.51 грн |
10+ | 42.94 грн |
25+ | 36.99 грн |
50+ | 33.49 грн |
100+ | 28.52 грн |
500+ | 24.8 грн |
1000+ | 21.34 грн |
PTN36242LBS,518 |
Виробник: NXP USA Inc.
Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Delay Time: 0.4ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 225mA
Supplier Device Package: 32-HVQFN (3x6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Delay Time: 0.4ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 225mA
Supplier Device Package: 32-HVQFN (3x6)
Signal Conditioning: Input Equalization, Output De-Emphasis
товар відсутній
SC16IS741AIPWJ |
Виробник: NXP USA Inc.
Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.3V ~ 3.6V
FIFO's: 64 Byte
Protocol: RS232, RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 16-TSSOP
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With Modem Control: Yes
Part Status: Active
Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.3V ~ 3.6V
FIFO's: 64 Byte
Protocol: RS232, RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 16-TSSOP
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With Modem Control: Yes
Part Status: Active
на замовлення 32749 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 154.83 грн |
10+ | 133.98 грн |
25+ | 126.7 грн |
100+ | 103.03 грн |
250+ | 97.75 грн |
500+ | 93.03 грн |
LPC11E37HFBD64/4QL |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
товар відсутній
OM13062UL |
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Part Status: Active
товар відсутній
FRDM-FXS-MULTI-B |
Виробник: NXP USA Inc.
Description: DEV KIT FOR XTRINSIC SENSOR BT
Packaging: Box
For Use With/Related Products: Kinetis, mbed-Enabled Development
Accessory Type: Sensor Board
Description: DEV KIT FOR XTRINSIC SENSOR BT
Packaging: Box
For Use With/Related Products: Kinetis, mbed-Enabled Development
Accessory Type: Sensor Board
товар відсутній
OM13061UL |
Виробник: NXP USA Inc.
Description: XPLORER LPC1837 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1837
Platform: Xplorer
Part Status: Obsolete
Description: XPLORER LPC1837 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1837
Platform: Xplorer
Part Status: Obsolete
товар відсутній
TWR-KW24D512 |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM KIT
Description: TOWER SYSTEM KIT
на замовлення 26 шт:
термін постачання 21-31 дні (днів)PCF8545ATT/AJ |
Виробник: NXP USA Inc.
Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Current - Supply: 30 µA
Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Current - Supply: 30 µA
товар відсутній
PCF8545BTT/AJ |
Виробник: NXP USA Inc.
Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 30 µA
Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 30 µA
товар відсутній
LPC11U67JBD48E |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 2027 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 476.63 грн |
10+ | 360.45 грн |
80+ | 298.39 грн |
1000+ | 244.24 грн |
OM13058UL |
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC11U68 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U68
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC11U68 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U68
Platform: LPCXpresso™
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1931.5 грн |
TWR-K64F120M |
Виробник: NXP USA Inc.
Description: TOWER SYSTEM K64 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K64
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM K64 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K64
Platform: Tower System
Part Status: Active
товар відсутній
TWR-13237 |
Виробник: NXP USA Inc.
Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 14734.17 грн |
TWR-13237-KIT |
Виробник: NXP USA Inc.
Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 23451.94 грн |
TWR-MC-FRDMKE02Z |
Виробник: NXP USA Inc.
Description: TOWER MOD KE BD TWR-MC-LV3PH
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Part Status: Active
Description: TOWER MOD KE BD TWR-MC-LV3PH
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Part Status: Active
товар відсутній
13237ADC-BDM |
Виробник: NXP USA Inc.
Description: KIT DEV MC13237CHT BDM
Packaging: Bulk
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
Description: KIT DEV MC13237CHT BDM
Packaging: Bulk
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 33394.83 грн |
ADAM20G1KIT |
Виробник: NXP USA Inc.
Description: KIT EVAL ADAM 2.1GHZ
Packaging: Bulk
Type: Amplifier
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Description: KIT EVAL ADAM 2.1GHZ
Packaging: Bulk
Type: Amplifier
Supplied Contents: Board(s), Cable(s)
Part Status: Active
товар відсутній
BRKOUT-FXLN8361Q |
Виробник: NXP USA Inc.
Description: BOARD BREAKOUT FXLN8361Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8361Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
Description: BOARD BREAKOUT FXLN8361Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8361Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1027.47 грн |
BRKOUT-FXLN8371Q |
Виробник: NXP USA Inc.
Description: BOARD BREAKOUT FXLN8371Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8371Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
Description: BOARD BREAKOUT FXLN8371Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8371Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1064.57 грн |
DL-RAPPID577XKSW |
Виробник: NXP USA Inc.
Description: DL PEX RAPPID SUITE V10 MPC577XK
Packaging: Electronic Delivery
For Use With/Related Products: MPC5xx
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: DL PEX RAPPID SUITE V10 MPC577XK
Packaging: Electronic Delivery
For Use With/Related Products: MPC5xx
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній
KITFXLC95000MAG |
Виробник: NXP USA Inc.
Description: KIT XTRINSIC FXLC95000
Packaging: Bulk
Sensitivity: 0.061mg/LSB, 0.122mg/LSB, 0.244mg/LSB
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 1.89V
Sensor Type: Accelerometer, Temperature
Utilized IC / Part: FXLC95000CL
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Description: KIT XTRINSIC FXLC95000
Packaging: Bulk
Sensitivity: 0.061mg/LSB, 0.122mg/LSB, 0.244mg/LSB
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 1.89V
Sensor Type: Accelerometer, Temperature
Utilized IC / Part: FXLC95000CL
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Sensing Range: ±2g, 4g, 8g
Part Status: Active
товар відсутній
S912XDG128F2CAAR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
товар відсутній
S9S12VR48AF0MLFR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
AFT21H350W03SR6 |
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 2.11GHZ NI1230S
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 63W
Gain: 16.4dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 750 mA
Description: FET RF 2CH 65V 2.11GHZ NI1230S
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 63W
Gain: 16.4dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 750 mA
товар відсутній
AFT21H350W04GSR6 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 63W
Gain: 16.4dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 750 mA
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 63W
Gain: 16.4dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 750 mA
товар відсутній
AFT23S160W02GSR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.4GHz
Power - Output: 45W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-2L
Mounting Type: Surface Mount
Frequency: 2.4GHz
Power - Output: 45W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI-780GS-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
товар відсутній
AFT26H200W03SR6 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 45W
Gain: 14.1dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 45W
Gain: 14.1dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
товар відсутній
AFT27S006NT1 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1000+ | 486.5 грн |
MC10XS3535JHFKR2 |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Voltage - Load: 7V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:6
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Voltage - Load: 7V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:6
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Part Status: Obsolete
товар відсутній
MC10XS4200BAFKR2 |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max)
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
товар відсутній
MC20XS4200BAFKR2 |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 3A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
товар відсутній
MC56F84550VLFR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Description: IC MCU 32BIT 96KB FLASH 48LQFP
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)MC9S08PA16VLCR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
MC9S08PA32VLDR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 37
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 37
товар відсутній
MC9S08PA4VWJR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 18
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 18
товар відсутній
MC9S08PA60VLDR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
товар відсутній
MC9S08PA8VTGR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
товар відсутній
MC9S08PA8VWJR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Number of I/O: 18
DigiKey Programmable: Not Verified
товар відсутній
MK10DN128VLF5R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 33
DigiKey Programmable: Not Verified
товар відсутній
MK24FN1M0VDC12R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 121XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
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