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FS32K144HFT0MMHT FS32K144HFT0MMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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MKW22D512VHA5 MKW22D512VHA5 NXP USA Inc. MKW2xDxxx.pdf Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Packaging: Tray
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART, USB
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1214 шт:
термін постачання 21-31 дні (днів)
1+576.17 грн
10+482.26 грн
25+456.99 грн
100+421.12 грн
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74AXP2G34GSH 74AXP2G34GSH NXP USA Inc. 74AXP2G34.pdf Description: IC BUFFER NON-INVERT 2.75V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Part Status: Active
на замовлення 4180 шт:
термін постачання 21-31 дні (днів)
2862+7.34 грн
Мінімальне замовлення: 2862
В кошику  од. на суму  грн.
LX2120XE72029B LX2120XE72029B NXP USA Inc. Description: SSL MATRIX CONTROLLER
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
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NCX2200GMAZ NCX2200GMAZ NXP USA Inc. NCX2200.pdf Description: IC COMPAR 1 GEN PUR SLP0603P2X3F
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Complementary, Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns (Typ)
Current - Quiescent (Max): 6µA (Typ)
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 68mA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
на замовлення 39422 шт:
термін постачання 21-31 дні (днів)
15+21.98 грн
21+14.59 грн
25+12.91 грн
100+10.43 грн
250+9.62 грн
500+9.14 грн
1000+8.59 грн
2500+8.18 грн
Мінімальне замовлення: 15
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1PS300/ZL115 NXP USA Inc. PHGLS24307-1.pdf?t.download=true&u=5oefqw Description: SIGNAL DIODE
Packaging: Bulk
Part Status: Active
на замовлення 167960 шт:
термін постачання 21-31 дні (днів)
8876+2.35 грн
Мінімальне замовлення: 8876
В кошику  од. на суму  грн.
BGE787B,112 BGE787B,112 NXP USA Inc. BGE787B_Rev4.pdf Description: IC VIDEO PUSH-PULL CTRLR SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Supplier Device Package: SOT115J
Part Status: Obsolete
на замовлення 198 шт:
термін постачання 21-31 дні (днів)
10+2402.64 грн
Мінімальне замовлення: 10
В кошику  од. на суму  грн.
MKW21D512VHA5 MKW21D512VHA5 NXP USA Inc. MKW2xDxxx.pdf Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Packaging: Tray
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
1+787.33 грн
10+658.39 грн
25+623.77 грн
100+540.83 грн
260+513.05 грн
520+494.29 грн
1040+468.80 грн
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MKW21D512VHA5R MKW21D512VHA5R NXP USA Inc. MKW2xDxxx.pdf Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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MCIMX6L8DVN10ABR MCIMX6L8DVN10ABR NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
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LD6806CX4/28P,315 LD6806CX4/28P,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.8V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
3328+6.72 грн
Мінімальне замовлення: 3328
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MC9S08DN60ACLH MC9S08DN60ACLH NXP USA Inc. FSCLS07395-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 316 шт:
термін постачання 21-31 дні (днів)
33+678.31 грн
Мінімальне замовлення: 33
В кошику  од. на суму  грн.
MC9S08DN60ACLF557 MC9S08DN60ACLF557 NXP USA Inc. MC9S08DN60AD.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
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MC9S08DN60ACLC MC9S08DN60ACLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
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MC68LK332GCAG16 MC68LK332GCAG16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 15
DigiKey Programmable: Not Verified
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SSL5031BTS/1X SSL5031BTS/1X NXP USA Inc. Description: IC LED DRIVER OFFL SC74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 160°C (TJ)
Applications: Lighting
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Part Status: Discontinued at Digi-Key
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74LVC32245AEC,557 74LVC32245AEC,557 NXP USA Inc. PHGLS23919-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
на замовлення 15535 шт:
термін постачання 21-31 дні (днів)
89+242.50 грн
Мінімальне замовлення: 89
В кошику  од. на суму  грн.
SPC5602BK0CLH4 SPC5602BK0CLH4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
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SPC5602BK0CLH4R SPC5602BK0CLH4R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
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SPC5602BF2VLH4 SPC5602BF2VLH4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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MC9S08DN32ACLH MC9S08DN32ACLH NXP USA Inc. MC9S08DN60AD.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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MC9S12GC128CFUE MC9S12GC128CFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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74LV244DB653 NXP USA Inc. Description: BUS DRIVER, LV/LV-A/LVX/H SERIES
Packaging: Bulk
Part Status: Active
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SPC5745BK1VMH2 SPC5745BK1VMH2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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SPC5745BK1VMH2R SPC5745BK1VMH2R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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74LVC1G80GN,132 74LVC1G80GN,132 NXP USA Inc. PHGLS25117-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 200 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 400 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (0.9x1)
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
на замовлення 3193 шт:
термін постачання 21-31 дні (днів)
3193+7.32 грн
Мінімальне замовлення: 3193
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FS32K144UAT0VMHR FS32K144UAT0VMHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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FS32K146HFT0MMHT FS32K146HFT0MMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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MKE12Z256VLF7 MKE12Z256VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)
1+314.77 грн
10+231.23 грн
25+213.31 грн
80+184.19 грн
230+182.94 грн
В кошику  од. на суму  грн.
T1023RDB-PC T1023RDB-PC NXP USA Inc. T1023RDBFS.pdf Description: T1013/T1023 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e5500
Board Type: Evaluation Platform
Utilized IC / Part: T1013, T1023
Part Status: Obsolete
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MF1PH4101DUF/02V NXP USA Inc. Description: MIFAREA PLUS EV1
Packaging: Bulk
Part Status: Last Time Buy
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MF1PH4101DA6/02J NXP USA Inc. Description: MIFAREA PLUS EV1
Packaging: Tape & Reel (TR)
Part Status: Last Time Buy
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MF1PH4101DA4/02J NXP USA Inc. Description: MIFAREA PLUS EV1
Packaging: Tape & Reel (TR)
Part Status: Last Time Buy
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В кошику  од. на суму  грн.
MF1PH4101DUD/02V NXP USA Inc. Description: MIFAREA PLUS EV1
Packaging: Bulk
Part Status: Last Time Buy
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MC34981ABHFK MC34981ABHFK NXP USA Inc. MC34981ABHFK.pdf Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: PWM
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm (Max)
Voltage - Load: 6V ~ 27V
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Over Temperature
Part Status: Obsolete
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UJA1161ATK/0Z UJA1161ATK/0Z NXP USA Inc. UJA1161A.pdf Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 30 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 5934 шт:
термін постачання 21-31 дні (днів)
2+213.51 грн
10+153.37 грн
25+140.33 грн
100+118.30 грн
250+111.91 грн
500+108.06 грн
1000+103.17 грн
2500+99.88 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
SVF331R3K2CKU2R NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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SVF331R3K2CKU2 SVF331R3K2CKU2 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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MMRF5018HS-450 NXP USA Inc. MMRF5018HS.pdf Description: RF MOSFET NI400
Packaging: Tray
Package / Case: NI-400S-2SA
Mounting Type: Surface Mount
Frequency: 1MHz ~ 2.7GHz
Power - Output: 125W
Gain: 17.3dB
Supplier Device Package: NI-400S-2SA
Part Status: Active
Voltage - Rated: 125 V
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PXLS84722AESR2 NXP USA Inc. Description: 2 AXIS MED/MED YZ
Packaging: Tape & Reel (TR)
Part Status: Active
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В кошику  од. на суму  грн.
SAF7758HV/N207WY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Part Status: Active
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В кошику  од. на суму  грн.
MPF7100BVBA3ES MPF7100BVBA3ES NXP USA Inc. Description: PF7100 PMIC I.MX8DXP/DX
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
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MPF7100BVMA4ES MPF7100BVMA4ES NXP USA Inc. Description: PF7100 PMIC I.MX8DXP/DX
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
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В кошику  од. на суму  грн.
MC9S08DN60AMLF MC9S08DN60AMLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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FS32R274KBK2MMM557 NXP USA Inc. PHGL-S-A0003567802-1.pdf?t.download=true&u=5oefqw Description: POWER ARCHITECTURE E200Z4 32 BIT
Packaging: Bulk
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Part Status: Active
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В кошику  од. на суму  грн.
FS32R274KBK2MMM FS32R274KBK2MMM NXP USA Inc. S32R274.pdf Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Bulk
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Obsolete
на замовлення 661 шт:
термін постачання 21-31 дні (днів)
8+2943.64 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
SC28L194A1A,529 SC28L194A1A,529 NXP USA Inc. SC28L194.pdf Description: IC UART QUAD 68PLCC
Packaging: Tube
Features: Internal Oscillator, Timer/Counter
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 3.3V, 5V
FIFO's: 16 Byte
Supplier Device Package: 68-PLCC (24.18x24.18)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
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MC33PF8201A0ES MC33PF8201A0ES NXP USA Inc. PF8101_PF8201.pdf Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
1+748.86 грн
10+562.84 грн
25+523.17 грн
80+455.67 грн
260+429.90 грн
В кошику  од. на суму  грн.
FS32K146HAT0VLLR FS32K146HAT0VLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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RD33771-48VEVM NXP USA Inc. UM11300.pdf Description: RD33771-48VEVM
Packaging: Box
Function: CANbus
Type: Power Management
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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LD6836CX4/14P,315 LD6836CX4/14P,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 1.4V 300MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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PDTC144ET/DG/B4215 PDTC144ET/DG/B4215 NXP USA Inc. PDTC144E_SER.pdf Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SOT23-3 (TO-236)
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Grade: Automotive
Qualification: AEC-Q101
на замовлення 57000 шт:
термін постачання 21-31 дні (днів)
15000+1.44 грн
Мінімальне замовлення: 15000
В кошику  од. на суму  грн.
BZB84-B4V7215 BZB84-B4V7215 NXP USA Inc. BZB84_SER.pdf Description: NOW NEXPERIA BZB84-B4V3 - ZENER
Packaging: Bulk
Part Status: Active
товару немає в наявності
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MCIMX6Y0DVM05AA MCIMX6Y0DVM05AA NXP USA Inc. Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: I2C, SPI, UART
Part Status: Active
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74ABT126D,602 74ABT126D,602 NXP USA Inc. 74ABT126.pdf Description: IC BUFF NON-INVERT 5.5V 14SO
Packaging: Bulk
Part Status: Active
на замовлення 13409 шт:
термін постачання 21-31 дні (днів)
1379+15.79 грн
Мінімальне замовлення: 1379
В кошику  од. на суму  грн.
74ABT126D,623 74ABT126D,623 NXP USA Inc. 74ABT126.pdf Description: IC BUFF NON-INVERT 5.5V 14SO
Packaging: Bulk
Part Status: Active
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
1563+13.63 грн
Мінімальне замовлення: 1563
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MCIMX6G3CVM05AA MCIMX6G3CVM05AA NXP USA Inc. MCIMX6GxCzzzzzA.pdf Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Obsolete
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SPC5747CSK0AMKU6 SPC5747CSK0AMKU6 NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SP5747CSK0AMKU6R SP5747CSK0AMKU6R NXP USA Inc. Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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LS2088ARDB-PC NXP USA Inc. LS2088ARDBFS.pdf Description: LS2088A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Board Type: Evaluation Platform
Utilized IC / Part: LS2088A
Part Status: Active
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FS32K144HFT0MMHT S32K1xx.pdf
FS32K144HFT0MMHT
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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MKW22D512VHA5 MKW2xDxxx.pdf
MKW22D512VHA5
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Packaging: Tray
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART, USB
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1214 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+576.17 грн
10+482.26 грн
25+456.99 грн
100+421.12 грн
В кошику  од. на суму  грн.
74AXP2G34GSH 74AXP2G34.pdf
74AXP2G34GSH
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 2.75V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Part Status: Active
на замовлення 4180 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2862+7.34 грн
Мінімальне замовлення: 2862
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LX2120XE72029B
LX2120XE72029B
Виробник: NXP USA Inc.
Description: SSL MATRIX CONTROLLER
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
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NCX2200GMAZ NCX2200.pdf
NCX2200GMAZ
Виробник: NXP USA Inc.
Description: IC COMPAR 1 GEN PUR SLP0603P2X3F
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Complementary, Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns (Typ)
Current - Quiescent (Max): 6µA (Typ)
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 68mA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
на замовлення 39422 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
15+21.98 грн
21+14.59 грн
25+12.91 грн
100+10.43 грн
250+9.62 грн
500+9.14 грн
1000+8.59 грн
2500+8.18 грн
Мінімальне замовлення: 15
В кошику  од. на суму  грн.
1PS300/ZL115 PHGLS24307-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: SIGNAL DIODE
Packaging: Bulk
Part Status: Active
на замовлення 167960 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8876+2.35 грн
Мінімальне замовлення: 8876
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BGE787B,112 BGE787B_Rev4.pdf
BGE787B,112
Виробник: NXP USA Inc.
Description: IC VIDEO PUSH-PULL CTRLR SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Supplier Device Package: SOT115J
Part Status: Obsolete
на замовлення 198 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+2402.64 грн
Мінімальне замовлення: 10
В кошику  од. на суму  грн.
MKW21D512VHA5 MKW2xDxxx.pdf
MKW21D512VHA5
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Packaging: Tray
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+787.33 грн
10+658.39 грн
25+623.77 грн
100+540.83 грн
260+513.05 грн
520+494.29 грн
1040+468.80 грн
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MKW21D512VHA5R MKW2xDxxx.pdf
MKW21D512VHA5R
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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MCIMX6L8DVN10ABR IMX6SLCEC.pdf
MCIMX6L8DVN10ABR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
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LD6806CX4/28P,315 LD6806_Series.pdf
LD6806CX4/28P,315
Виробник: NXP USA Inc.
Description: IC REG LINEAR 2.8V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3328+6.72 грн
Мінімальне замовлення: 3328
В кошику  од. на суму  грн.
MC9S08DN60ACLH FSCLS07395-1.pdf?t.download=true&u=5oefqw
MC9S08DN60ACLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 316 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
33+678.31 грн
Мінімальне замовлення: 33
В кошику  од. на суму  грн.
MC9S08DN60ACLF557 MC9S08DN60AD.pdf
MC9S08DN60ACLF557
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
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MC9S08DN60ACLC MC9S08DN60.pdf
MC9S08DN60ACLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
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MC68LK332GCAG16 MC68332TS.pdf
MC68LK332GCAG16
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 15
DigiKey Programmable: Not Verified
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SSL5031BTS/1X
SSL5031BTS/1X
Виробник: NXP USA Inc.
Description: IC LED DRIVER OFFL SC74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 160°C (TJ)
Applications: Lighting
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Part Status: Discontinued at Digi-Key
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74LVC32245AEC,557 PHGLS23919-1.pdf?t.download=true&u=5oefqw
74LVC32245AEC,557
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
на замовлення 15535 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
89+242.50 грн
Мінімальне замовлення: 89
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SPC5602BK0CLH4
SPC5602BK0CLH4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
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SPC5602BK0CLH4R
SPC5602BK0CLH4R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
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SPC5602BF2VLH4
SPC5602BF2VLH4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
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MC9S08DN32ACLH MC9S08DN60AD.pdf
MC9S08DN32ACLH
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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MC9S12GC128CFUE MC9S12C128V1.pdf
MC9S12GC128CFUE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
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74LV244DB653
Виробник: NXP USA Inc.
Description: BUS DRIVER, LV/LV-A/LVX/H SERIES
Packaging: Bulk
Part Status: Active
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SPC5745BK1VMH2 MPC5746C.pdf
SPC5745BK1VMH2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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SPC5745BK1VMH2R MPC5746C.pdf
SPC5745BK1VMH2R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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74LVC1G80GN,132 PHGLS25117-1.pdf?t.download=true&u=5oefqw
74LVC1G80GN,132
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 200 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 400 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (0.9x1)
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
на замовлення 3193 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3193+7.32 грн
Мінімальне замовлення: 3193
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FS32K144UAT0VMHR S32K1xx.pdf
FS32K144UAT0VMHR
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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FS32K146HFT0MMHT S32K1xx.pdf
FS32K146HFT0MMHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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MKE12Z256VLF7 KE1xZP100M72SF1.pdf
MKE12Z256VLF7
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+314.77 грн
10+231.23 грн
25+213.31 грн
80+184.19 грн
230+182.94 грн
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T1023RDB-PC T1023RDBFS.pdf
T1023RDB-PC
Виробник: NXP USA Inc.
Description: T1013/T1023 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e5500
Board Type: Evaluation Platform
Utilized IC / Part: T1013, T1023
Part Status: Obsolete
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MF1PH4101DUF/02V
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV1
Packaging: Bulk
Part Status: Last Time Buy
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MF1PH4101DA6/02J
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV1
Packaging: Tape & Reel (TR)
Part Status: Last Time Buy
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MF1PH4101DA4/02J
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV1
Packaging: Tape & Reel (TR)
Part Status: Last Time Buy
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MF1PH4101DUD/02V
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV1
Packaging: Bulk
Part Status: Last Time Buy
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MC34981ABHFK MC34981ABHFK.pdf
MC34981ABHFK
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: PWM
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm (Max)
Voltage - Load: 6V ~ 27V
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Over Temperature
Part Status: Obsolete
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UJA1161ATK/0Z UJA1161A.pdf
UJA1161ATK/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 30 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 5934 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+213.51 грн
10+153.37 грн
25+140.33 грн
100+118.30 грн
250+111.91 грн
500+108.06 грн
1000+103.17 грн
2500+99.88 грн
Мінімальне замовлення: 2
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SVF331R3K2CKU2R VYBRIDRSERIESEC.pdf
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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SVF331R3K2CKU2 VYBRIDRSERIESEC.pdf
SVF331R3K2CKU2
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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MMRF5018HS-450 MMRF5018HS.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET NI400
Packaging: Tray
Package / Case: NI-400S-2SA
Mounting Type: Surface Mount
Frequency: 1MHz ~ 2.7GHz
Power - Output: 125W
Gain: 17.3dB
Supplier Device Package: NI-400S-2SA
Part Status: Active
Voltage - Rated: 125 V
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PXLS84722AESR2
Виробник: NXP USA Inc.
Description: 2 AXIS MED/MED YZ
Packaging: Tape & Reel (TR)
Part Status: Active
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SAF7758HV/N207WY
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Part Status: Active
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MPF7100BVBA3ES
MPF7100BVBA3ES
Виробник: NXP USA Inc.
Description: PF7100 PMIC I.MX8DXP/DX
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
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MPF7100BVMA4ES
MPF7100BVMA4ES
Виробник: NXP USA Inc.
Description: PF7100 PMIC I.MX8DXP/DX
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
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MC9S08DN60AMLF MC9S08DN60.pdf
MC9S08DN60AMLF
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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FS32R274KBK2MMM557 PHGL-S-A0003567802-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: POWER ARCHITECTURE E200Z4 32 BIT
Packaging: Bulk
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Part Status: Active
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FS32R274KBK2MMM S32R274.pdf
FS32R274KBK2MMM
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Bulk
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Obsolete
на замовлення 661 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+2943.64 грн
Мінімальне замовлення: 8
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SC28L194A1A,529 SC28L194.pdf
SC28L194A1A,529
Виробник: NXP USA Inc.
Description: IC UART QUAD 68PLCC
Packaging: Tube
Features: Internal Oscillator, Timer/Counter
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 3.3V, 5V
FIFO's: 16 Byte
Supplier Device Package: 68-PLCC (24.18x24.18)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
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MC33PF8201A0ES PF8101_PF8201.pdf
MC33PF8201A0ES
Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+748.86 грн
10+562.84 грн
25+523.17 грн
80+455.67 грн
260+429.90 грн
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FS32K146HAT0VLLR S32K1xx.pdf
FS32K146HAT0VLLR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
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RD33771-48VEVM UM11300.pdf
Виробник: NXP USA Inc.
Description: RD33771-48VEVM
Packaging: Box
Function: CANbus
Type: Power Management
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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LD6836CX4/14P,315 LD6836.pdf
LD6836CX4/14P,315
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.4V 300MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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PDTC144ET/DG/B4215 PDTC144E_SER.pdf
PDTC144ET/DG/B4215
Виробник: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SOT23-3 (TO-236)
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Grade: Automotive
Qualification: AEC-Q101
на замовлення 57000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
15000+1.44 грн
Мінімальне замовлення: 15000
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BZB84-B4V7215 BZB84_SER.pdf
BZB84-B4V7215
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB84-B4V3 - ZENER
Packaging: Bulk
Part Status: Active
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MCIMX6Y0DVM05AA
MCIMX6Y0DVM05AA
Виробник: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: I2C, SPI, UART
Part Status: Active
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74ABT126D,602 74ABT126.pdf
74ABT126D,602
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 14SO
Packaging: Bulk
Part Status: Active
на замовлення 13409 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1379+15.79 грн
Мінімальне замовлення: 1379
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74ABT126D,623 74ABT126.pdf
74ABT126D,623
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 14SO
Packaging: Bulk
Part Status: Active
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1563+13.63 грн
Мінімальне замовлення: 1563
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MCIMX6G3CVM05AA MCIMX6GxCzzzzzA.pdf
MCIMX6G3CVM05AA
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Obsolete
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SPC5747CSK0AMKU6
SPC5747CSK0AMKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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SP5747CSK0AMKU6R
SP5747CSK0AMKU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
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LS2088ARDB-PC LS2088ARDBFS.pdf
Виробник: NXP USA Inc.
Description: LS2088A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Board Type: Evaluation Platform
Utilized IC / Part: LS2088A
Part Status: Active
товару немає в наявності
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