| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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116-83-424-41-007101 | Preci-Dip |
 Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-424-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-424-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-424-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-424-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-424-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-424-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-428-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-432-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-610-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-624-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-628-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-628-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-628-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-628-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. |
 |
116-83-628-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. |
| 116-83-424-41-007101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-424-41-008101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-424-41-009101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-424-41-011101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-424-41-012101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-424-41-013101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-424-41-018101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-002101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-004101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-006101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-007101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-008101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-009101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-011101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-012101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-013101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-428-41-018101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-002101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-004101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-006101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-007101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-008101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-009101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-011101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-012101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-013101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-432-41-018101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-002101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-004101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-006101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-007101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-008101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-009101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-011101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-012101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-013101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-610-41-018101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-002101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-004101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-006101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-007101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-008101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-009101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-011101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-012101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-013101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-624-41-018101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-628-41-001101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-628-41-002101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-628-41-003101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-628-41-004101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 116-83-628-41-006101 |
|
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.