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116-83-310-41-018101 116-83-310-41-018101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-001101 116-83-312-41-001101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-002101 116-83-312-41-002101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-003101 116-83-312-41-003101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-004101 116-83-312-41-004101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-006101 116-83-312-41-006101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-007101 116-83-312-41-007101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-008101 116-83-312-41-008101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-009101 116-83-312-41-009101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-011101 116-83-312-41-011101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-012101 116-83-312-41-012101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-013101 116-83-312-41-013101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-018101 116-83-312-41-018101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 12POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-001101 116-83-314-41-001101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-002101 116-83-314-41-002101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-003101 116-83-314-41-003101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-004101 116-83-314-41-004101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-006101 116-83-314-41-006101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
на замовлення 2396 шт:
термін постачання 21-31 дні (днів)
2+173.49 грн
30+123.58 грн
120+109.29 грн
510+90.21 грн
1020+84.83 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
116-83-314-41-007101 116-83-314-41-007101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-008101 116-83-314-41-008101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-009101 116-83-314-41-009101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-011101 116-83-314-41-011101 Preci-Dip CATALOG-DILSOCKETS.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-012101 116-83-314-41-012101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-013101 116-83-314-41-013101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-018101 116-83-314-41-018101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-001101 116-83-316-41-001101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-002101 116-83-316-41-002101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-003101 116-83-316-41-003101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-004101 116-83-316-41-004101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-006101 116-83-316-41-006101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-007101 116-83-316-41-007101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-008101 116-83-316-41-008101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-009101 116-83-316-41-009101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-011101 116-83-316-41-011101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-012101 116-83-316-41-012101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-013101 116-83-316-41-013101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-018101 116-83-316-41-018101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-001101 116-83-318-41-001101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-002101 116-83-318-41-002101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-003101 116-83-318-41-003101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-004101 116-83-318-41-004101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-006101 116-83-318-41-006101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-007101 116-83-318-41-007101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-008101 116-83-318-41-008101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-009101 116-83-318-41-009101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-011101 116-83-318-41-011101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-012101 116-83-318-41-012101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-013101 116-83-318-41-013101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-018101 116-83-318-41-018101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-001101 116-83-320-41-001101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-002101 116-83-320-41-002101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-003101 116-83-320-41-003101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-004101 116-83-320-41-004101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-006101 116-83-320-41-006101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-007101 116-83-320-41-007101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-008101 116-83-320-41-008101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-009101 116-83-320-41-009101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-011101 116-83-320-41-011101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-012101 116-83-320-41-012101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-013101 116-83-320-41-013101 Preci-Dip Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101 Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-310-41-018101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-310-41-018101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-001101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-001101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-002101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-002101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-003101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-003101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-004101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-004101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-006101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-006101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-007101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-007101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-008101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-008101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-009101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-009101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-011101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-011101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-012101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-012101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-013101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-013101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-312-41-018101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-312-41-018101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-001101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-001101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-002101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-002101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-003101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-003101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-004101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-004101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-006101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-006101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
на замовлення 2396 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+173.49 грн
30+123.58 грн
120+109.29 грн
510+90.21 грн
1020+84.83 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
116-83-314-41-007101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-007101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-008101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-008101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-009101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-009101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-011101 CATALOG-DILSOCKETS.pdf
116-83-314-41-011101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-012101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-012101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-013101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-013101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-314-41-018101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-314-41-018101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-001101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-001101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-002101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-002101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-003101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-003101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-004101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-004101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-006101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-006101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-007101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-007101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-008101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-008101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-009101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-009101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-011101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-011101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-012101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-012101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-013101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-013101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-316-41-018101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-316-41-018101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-001101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-001101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-002101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-002101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-003101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-003101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-004101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-004101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-006101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-006101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-007101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-007101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-008101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-008101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-009101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-009101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-011101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-011101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-012101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-012101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-013101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-013101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
116-83-318-41-018101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-318-41-018101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-001101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-001101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-002101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-002101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-003101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-003101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-004101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-004101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-006101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-006101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-007101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-007101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-008101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-008101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-009101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-009101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-011101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-011101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-012101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-012101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
116-83-320-41-013101 Default.aspx?c=14&i=1009&p=259&pdf=1&dsku=116-PP-XXX-41-XXX101
116-83-320-41-013101
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
В кошику  од. на суму  грн.
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