| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
|
116-83-632-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 637 шт В кошику од. на суму грн. |
|
116-83-636-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 110 шт В кошику од. на суму грн. |
| 116-83-636-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 132 шт В кошику од. на суму грн. | |
|
116-83-636-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 660 шт В кошику од. на суму грн. |
|
116-83-636-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 154 шт В кошику од. на суму грн. |
|
116-83-636-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 704 шт В кошику од. на суму грн. |
|
116-83-636-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 143 шт В кошику од. на суму грн. |
|
116-83-636-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 132 шт В кошику од. на суму грн. |
|
116-83-636-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 121 шт В кошику од. на суму грн. |
|
116-83-636-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 110 шт В кошику од. на суму грн. |
|
116-83-636-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 572 шт В кошику од. на суму грн. |
|
116-83-636-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 66 шт В кошику од. на суму грн. |
|
116-83-636-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 660 шт В кошику од. на суму грн. |
|
116-83-640-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. |
|
116-83-640-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 120 шт В кошику од. на суму грн. |
|
116-83-640-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 150 шт В кошику од. на суму грн. |
|
116-83-640-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 140 шт В кошику од. на суму грн. |
|
116-83-640-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. |
|
116-83-640-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 120 шт В кошику од. на суму грн. |
|
116-83-640-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 120 шт В кошику од. на суму грн. |
|
116-83-640-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 110 шт В кошику од. на суму грн. |
|
116-83-640-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDContact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. |
|
116-83-640-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 130 шт В кошику од. на суму грн. |
|
116-83-640-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. |
|
116-83-640-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 40POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 150 шт В кошику од. на суму грн. |
|
116-83-642-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 42 (2 x 21) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. |
|
116-83-642-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 110 шт В кошику од. на суму грн. |
|
116-83-642-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 140 шт В кошику од. на суму грн. |
|
116-83-642-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 140 шт В кошику од. на суму грн. |
|
116-83-642-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 150 шт В кошику од. на суму грн. |
|
116-83-642-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 120 шт В кошику од. на суму грн. |
|
116-83-642-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 110 шт В кошику од. на суму грн. |
|
116-83-642-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 110 шт В кошику од. на суму грн. |
| 116-83-642-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | |
|
116-83-642-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 130 шт В кошику од. на суму грн. |
|
116-83-642-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. |
|
116-83-642-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 42POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 150 шт В кошику од. на суму грн. |
|
116-83-648-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 88 шт В кошику од. на суму грн. |
|
116-83-648-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. |
|
116-83-648-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 120 шт В кошику од. на суму грн. |
|
116-83-648-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 112 шт В кошику од. на суму грн. |
|
116-83-648-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 136 шт В кошику од. на суму грн. |
|
116-83-648-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 104 шт В кошику од. на суму грн. |
|
116-83-648-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. |
|
116-83-648-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. |
|
116-83-648-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 80 шт В кошику од. на суму грн. |
|
116-83-648-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 48 (2 x 24) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 112 шт В кошику од. на суму грн. |
|
116-83-648-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 48 шт В кошику од. на суму грн. |
|
116-83-648-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 48POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 48 (2 x 24) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 128 шт В кошику од. на суму грн. |
|
116-83-650-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 80 шт В кошику од. на суму грн. |
|
116-83-650-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. |
|
116-83-650-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 50 (2 x 25) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 392 шт В кошику од. на суму грн. |
|
116-83-650-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 112 шт В кошику од. на суму грн. |
|
116-83-650-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLDContact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 50 (2 x 25) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 392 шт В кошику од. на суму грн. |
|
116-83-650-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. |
|
116-83-650-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. |
|
116-83-650-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 88 шт В кошику од. на суму грн. |
|
116-83-650-41-011101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 72 шт В кошику од. на суму грн. |
|
116-83-650-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLDMounting Type: Through Hole Features: Elevated, Open Frame Packaging: Bulk Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 50 (2 x 25) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing |
товару немає в наявності |
Мінімальне замовлення: 392 шт В кошику од. на суму грн. |
|
116-83-650-41-013101 | Preci-Dip |
Description: CONN IC DIP SOCKET 50POS GOLD |
товару немає в наявності |
Мінімальне замовлення: 48 шт В кошику од. на суму грн. |
| 116-83-632-41-018101 |
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Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 637 шт
В кошику
од. на суму грн.
| 116-83-636-41-001101 |
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Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 110 шт
В кошику
од. на суму грн.
| 116-83-636-41-002101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 132 шт
В кошику
од. на суму грн.
| 116-83-636-41-003101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 660 шт
В кошику
од. на суму грн.
| 116-83-636-41-004101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 154 шт
В кошику
од. на суму грн.
| 116-83-636-41-006101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 704 шт
В кошику
од. на суму грн.
| 116-83-636-41-007101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 143 шт
В кошику
од. на суму грн.
| 116-83-636-41-008101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 132 шт
В кошику
од. на суму грн.
| 116-83-636-41-009101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 121 шт
В кошику
од. на суму грн.
| 116-83-636-41-011101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 110 шт
В кошику
од. на суму грн.
| 116-83-636-41-012101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 572 шт
В кошику
од. на суму грн.
| 116-83-636-41-013101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 66 шт
В кошику
од. на суму грн.
| 116-83-636-41-018101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
Мінімальне замовлення: 660 шт
В кошику
од. на суму грн.
| 116-83-640-41-001101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 116-83-640-41-002101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 120 шт
В кошику
од. на суму грн.
| 116-83-640-41-003101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 150 шт
В кошику
од. на суму грн.
| 116-83-640-41-004101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 140 шт
В кошику
од. на суму грн.
| 116-83-640-41-006101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| 116-83-640-41-007101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 120 шт
В кошику
од. на суму грн.
| 116-83-640-41-008101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 120 шт
В кошику
од. на суму грн.
| 116-83-640-41-009101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 110 шт
В кошику
од. на суму грн.
| 116-83-640-41-011101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| 116-83-640-41-012101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 130 шт
В кошику
од. на суму грн.
| 116-83-640-41-013101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-83-640-41-018101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 150 шт
В кошику
од. на суму грн.
| 116-83-642-41-001101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 42POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 42 (2 x 21)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 116-83-642-41-002101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 110 шт
В кошику
од. на суму грн.
| 116-83-642-41-003101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 140 шт
В кошику
од. на суму грн.
| 116-83-642-41-004101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
товару немає в наявності
Мінімальне замовлення: 140 шт
В кошику
од. на суму грн.
| 116-83-642-41-006101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 150 шт
В кошику
од. на суму грн.
| 116-83-642-41-007101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 120 шт
В кошику
од. на суму грн.
| 116-83-642-41-008101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 110 шт
В кошику
од. на суму грн.
| 116-83-642-41-009101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 110 шт
В кошику
од. на суму грн.
| 116-83-642-41-011101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| 116-83-642-41-012101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 130 шт
В кошику
од. на суму грн.
| 116-83-642-41-013101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Description: CONN IC DIP SOCKET 42POS GOLD
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-83-642-41-018101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 42POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 150 шт
В кошику
од. на суму грн.
| 116-83-648-41-001101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
Мінімальне замовлення: 88 шт
В кошику
од. на суму грн.
| 116-83-648-41-002101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| 116-83-648-41-003101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 120 шт
В кошику
од. на суму грн.
| 116-83-648-41-004101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
Мінімальне замовлення: 112 шт
В кошику
од. на суму грн.
| 116-83-648-41-006101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 136 шт
В кошику
од. на суму грн.
| 116-83-648-41-007101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 104 шт
В кошику
од. на суму грн.
| 116-83-648-41-008101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| 116-83-648-41-009101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| 116-83-648-41-011101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
Мінімальне замовлення: 80 шт
В кошику
од. на суму грн.
| 116-83-648-41-012101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 48POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 112 шт
В кошику
од. на суму грн.
| 116-83-648-41-013101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
Мінімальне замовлення: 48 шт
В кошику
од. на суму грн.
| 116-83-648-41-018101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 48POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 48POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 128 шт
В кошику
од. на суму грн.
| 116-83-650-41-001101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
Мінімальне замовлення: 80 шт
В кошику
од. на суму грн.
| 116-83-650-41-002101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| 116-83-650-41-003101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 50POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 392 шт
В кошику
од. на суму грн.
| 116-83-650-41-004101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
Мінімальне замовлення: 112 шт
В кошику
од. на суму грн.
| 116-83-650-41-006101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 50POS GOLD
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 392 шт
В кошику
од. на суму грн.
| 116-83-650-41-007101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| 116-83-650-41-008101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| 116-83-650-41-009101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
Мінімальне замовлення: 88 шт
В кошику
од. на суму грн.
| 116-83-650-41-011101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
Мінімальне замовлення: 72 шт
В кошику
од. на суму грн.
| 116-83-650-41-012101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Description: CONN IC DIP SOCKET 50POS GOLD
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 50 (2 x 25)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
товару немає в наявності
Мінімальне замовлення: 392 шт
В кошику
од. на суму грн.
| 116-83-650-41-013101 |
![]() |
Виробник: Preci-Dip
Description: CONN IC DIP SOCKET 50POS GOLD
Description: CONN IC DIP SOCKET 50POS GOLD
товару немає в наявності
Мінімальне замовлення: 48 шт
В кошику
од. на суму грн.




























































