Продукція > TRENZ ELECTRONIC GMBH > Всі товари виробника TRENZ ELECTRONIC GMBH (544) > Сторінка 8 з 10
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||
|---|---|---|---|---|---|---|---|
 |
TE0808-04-15EG-1EE | Trenz Electronic GmbH |
 Description: IC MODULE ZYNQ USCALE 2GB 128MB |
товар відсутній |
|||
 |
TE0808-04-6BE21-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 4GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Flash Size: 128MB |
товар відсутній |
|||
| TE0808-04-6BE21-AK | Trenz Electronic GmbH |
Description: IC MOD SOM MPSOC 4GB ZU6EG Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Flash Size: 128MB |
товар відсутній |
||||
| TE0808-04-6BE21-L | Trenz Electronic GmbH |
Description: IC MOD SOM MPSOC 4GB XCZU6EG Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Flash Size: 128MB |
товар відсутній |
||||
| TE0808-04-9BE21-AS | Trenz Electronic GmbH |
Description: STARTER KIT TE0808-04-9 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
||||
| TE0808-04-9GI21-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 4GB 128MB |
товар відсутній |
||||
| TE0808-05-6BE21-A | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ Packaging: Bulk Connector Type: 4 x 160 Pin Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E Flash Size: 128MB |
товар відсутній |
||||
| TE0808-05-6BE21-AK | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU6EG-E Flash Size: 128MB |
товар відсутній |
||||
| TE0808-05-6BE21-L | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E Flash Size: 128MB |
товар відсутній |
||||
| TE0808-05-9BE21-A | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ |
товар відсутній |
||||
| TE0808-05-9GI21-AS | Trenz Electronic GmbH |
Description: STARTER KIT ZYNQ USCALE+ ZU9 FPG Packaging: Box For Use With/Related Products: TE0808, XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories Platform: TE0808 Zynq UltraScale+ MPSoC Carrier Starter Part Status: Active |
товар відсутній |
||||
| TE0808-05-BBE21-AZ | Trenz Electronic GmbH |
Description: MODULE MPSOC 2GB DDR4 Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: FPGA Core Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E Flash Size: 128MB Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
|||
| TE0813-01-2AE11-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E Flash Size: 128MB |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
|||
| TE0813-01-2BE11-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0813-01-3AE11-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0813-01-3BE11-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
 |
TE0813-01-4BE11-A | Trenz Electronic GmbH |
Description: MODULE MPSOC 4GB DDR4 Packaging: Box Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: FPGA Core Core Processor: Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E Flash Size: 128MB Part Status: Discontinued at Digi-Key |
товар відсутній |
|||
| TE0813-02-2AE81-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E Flash Size: 128MB |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
|
|||
| TE0813-02-2BE81-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Flash Size: 128MB |
товар відсутній |
||||
| TE0813-02-4BE81-A | Trenz Electronic GmbH |
Description: MODULE MPSOC 4GB DDR4 Packaging: Box Connector Type: BGA Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: FPGA Core Processor: Xilinx Zynq UltraScale+ ZU4EG Flash Size: 128MB |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
|||
| TE0817-01-4BE21-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E Flash Size: 128MB |
товар відсутній |
||||
| TE0817-01-7DE21-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0818-01-6BE21-A | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Flash Size: 128MB |
товар відсутній |
||||
| TE0818-02-6BE81-A | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E Flash Size: 128MB |
товар відсутній |
||||
| TE0818-02-9GI81-A | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I Flash Size: 128MB |
товар відсутній |
||||
| TE0818-02-BBE81-A | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH AMD Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E Flash Size: 128MB |
товар відсутній |
||||
 |
TE0820-02-02CG-1EA | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 1GB 128MB |
товар відсутній |
|||
|
|
TE0820-03-04EV-1EA | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB |
товар відсутній |
|||
 |
TE0820-03-4DE21FA | Trenz Electronic GmbH | Description: IC MODULE 2GB 128MB |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
|||
| TE0820-04-2BI21M | Trenz Electronic GmbH |
Description: MOD MPSOC 2GB DDR4 Packaging: Bulk Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I Flash Size: 128MB |
товар відсутній |
||||
 |
TE0820-04-4DE21FA | Trenz Electronic GmbH |
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND |
товар відсутній |
|||
| TE0820-04-4DE21MA | Trenz Electronic GmbH | Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND |
товар відсутній |
||||
| TE0820-05-2AE21MA | Trenz Electronic GmbH |
Description: MOD MPSOC ZU2CG-1E 2GB DDR4 IND Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-2AE81MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товар відсутній |
||||
| TE0820-05-2AI21MA | Trenz Electronic GmbH |
Description: MOD MPSOC ZU2CG-1I 2GB DDR4 IN Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I Flash Size: 128MB Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
|
|||
| TE0820-05-2AI81MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784I Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-2BE21MA | Trenz Electronic GmbH |
Description: MOD MPSOC 2GB DDR4 Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-2BE21MAJ | Trenz Electronic GmbH |
Description: MOD MPSOC 2GB DDR4 Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-2BE21ML | Trenz Electronic GmbH |
Description: MOD MPSOC 2GB DDR4 Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-2BE81MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товар відсутній |
||||
| TE0820-05-2BE81ML | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товар відсутній |
||||
| TE0820-05-2BI21MA | Trenz Electronic GmbH |
Description: MOD MPSOC 2GB DDR4 Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-2BI21ML | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-3AE21MA | Trenz Electronic GmbH |
Description: MOD MPSOC 2GB DDR4 Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-3BE21MA | Trenz Electronic GmbH |
Description: MOD MPSOC 2GB DDR4 Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-3BE21ML | Trenz Electronic GmbH |
Description: MOD MPSOC 2GB DDR4 Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-3BE81ML | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
|
|||
| TE0820-05-4AE21MA | Trenz Electronic GmbH |
Description: MOD MPSOC 2GB DDR4 Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0820-05-4DE21MA | Trenz Electronic GmbH |
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0821-01-2AE31PA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB |
товар відсутній |
||||
| TE0821-01-3BI21MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: 2 x 160 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB |
товар відсутній |
||||
| TE0823-01-3PIU1F | Trenz Electronic GmbH |
Description: ICOBOARD Packaging: Bulk Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Flash Size: 128MB Part Status: Obsolete |
товар відсутній |
||||
| TE0823-01-3PIU1FA | Trenz Electronic GmbH |
Description: ICOBOARD Packaging: Bulk Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Flash Size: 128MB Part Status: Obsolete |
товар відсутній |
||||
| TE0823-01-3PIU1MA | Trenz Electronic GmbH |
Description: ICOBOARD Packaging: Bulk Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0823-01-3PIU1ML | Trenz Electronic GmbH |
Description: ICOBOARD Packaging: Bulk Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Flash Size: 128MB Part Status: Active |
товар відсутній |
||||
| TE0835-02-MXE21-A | Trenz Electronic GmbH |
Description: RFSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm) Speed: 1.3GHz RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB |
товар відсутній |
||||
| TE0835-02-TXE21-A | Trenz Electronic GmbH |
Description: RFSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm) Speed: 1.3GHz RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E Co-Processor: ARM® Cortex®-A53 Flash Size: 512MB |
товар відсутній |
||||
| TE0841-02-035-1C | Trenz Electronic GmbH |
Description: SOM USCALE 2GB DDR4 |
товар відсутній |
||||
| TE0841-02-035-1I | Trenz Electronic GmbH |
Description: SOM USCALE 2GB DDR4 |
товар відсутній |
||||
 |
TE0841-02-035-2I | Trenz Electronic GmbH |
Description: IC MODULE USCALE 2GB 64MB |
товар відсутній |
| TE0808-04-15EG-1EE |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
товар відсутній
| TE0808-04-6BE21-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
товар відсутній
| TE0808-04-6BE21-AK |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD SOM MPSOC 4GB ZU6EG
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
Description: IC MOD SOM MPSOC 4GB ZU6EG
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
товар відсутній
| TE0808-04-6BE21-L |
|
Виробник: Trenz Electronic GmbH
Description: IC MOD SOM MPSOC 4GB XCZU6EG
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
Description: IC MOD SOM MPSOC 4GB XCZU6EG
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
товар відсутній
| TE0808-04-9BE21-AS |
|
Виробник: Trenz Electronic GmbH
Description: STARTER KIT TE0808-04-9
Description: STARTER KIT TE0808-04-9
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| TE0808-04-9GI21-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Description: IC MODULE ZYNQ USCALE 4GB 128MB
товар відсутній
| TE0808-05-6BE21-A |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: 4 x 160 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: 4 x 160 Pin
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E
Flash Size: 128MB
товар відсутній
| TE0808-05-6BE21-AK |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU6EG-E
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU6EG-E
Flash Size: 128MB
товар відсутній
| TE0808-05-6BE21-L |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU6EG-1FFVC900E
Flash Size: 128MB
товар відсутній
| TE0808-05-9BE21-A |
|
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
товар відсутній
| TE0808-05-9GI21-AS |
|
Виробник: Trenz Electronic GmbH
Description: STARTER KIT ZYNQ USCALE+ ZU9 FPG
Packaging: Box
For Use With/Related Products: TE0808, XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories
Platform: TE0808 Zynq UltraScale+ MPSoC Carrier Starter
Part Status: Active
Description: STARTER KIT ZYNQ USCALE+ ZU9 FPG
Packaging: Box
For Use With/Related Products: TE0808, XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories
Platform: TE0808 Zynq UltraScale+ MPSoC Carrier Starter
Part Status: Active
товар відсутній
| TE0808-05-BBE21-AZ |
|
Виробник: Trenz Electronic GmbH
Description: MODULE MPSOC 2GB DDR4
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MODULE MPSOC 2GB DDR4
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 151009.77 грн |
| TE0813-01-2AE11-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 17002.33 грн |
| TE0813-01-2BE11-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0813-01-3AE11-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0813-01-3BE11-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0813-01-4BE11-A |
|
Виробник: Trenz Electronic GmbH
Description: MODULE MPSOC 4GB DDR4
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E
Flash Size: 128MB
Part Status: Discontinued at Digi-Key
Description: MODULE MPSOC 4GB DDR4
Packaging: Box
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E
Flash Size: 128MB
Part Status: Discontinued at Digi-Key
товар відсутній
| TE0813-02-2AE81-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 24863.26 грн |
| TE0813-02-2BE81-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0813-02-4BE81-A |
Виробник: Trenz Electronic GmbH
Description: MODULE MPSOC 4GB DDR4
Packaging: Box
Connector Type: BGA
Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Xilinx Zynq UltraScale+ ZU4EG
Flash Size: 128MB
Description: MODULE MPSOC 4GB DDR4
Packaging: Box
Connector Type: BGA
Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Xilinx Zynq UltraScale+ ZU4EG
Flash Size: 128MB
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 38676.84 грн |
| TE0817-01-4BE21-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Flash Size: 128MB
товар відсутній
| TE0817-01-7DE21-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
Flash Size: 128MB
Part Status: Active
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0818-01-6BE21-A |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
товар відсутній
| TE0818-02-6BE81-A |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
товар відсутній
| TE0818-02-9GI81-A |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
Flash Size: 128MB
товар відсутній
| TE0818-02-BBE81-A |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH AMD
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH AMD
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
Flash Size: 128MB
товар відсутній
| TE0820-02-02CG-1EA |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 1GB 128MB
Description: IC MODULE ZYNQ USCALE 1GB 128MB
товар відсутній
| TE0820-03-04EV-1EA |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
товар відсутній
| TE0820-03-4DE21FA |
Виробник: Trenz Electronic GmbH
Description: IC MODULE 2GB 128MB
Description: IC MODULE 2GB 128MB
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| TE0820-04-2BI21M |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Flash Size: 128MB
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Flash Size: 128MB
товар відсутній
| TE0820-04-4DE21FA |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
товар відсутній
| TE0820-04-4DE21MA |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
товар відсутній
| TE0820-05-2AE21MA |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC ZU2CG-1E 2GB DDR4 IND
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC ZU2CG-1E 2GB DDR4 IND
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-2AE81MA |
товар відсутній
| TE0820-05-2AI21MA |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC ZU2CG-1I 2GB DDR4 IN
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC ZU2CG-1I 2GB DDR4 IN
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I
Flash Size: 128MB
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 28298.04 грн |
| TE0820-05-2AI81MA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784I
Flash Size: 128MB
Part Status: Active
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784I
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-2BE21MA |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-2BE21MAJ |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-2BE21ML |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-2BE81MA |
товар відсутній
| TE0820-05-2BE81ML |
товар відсутній
| TE0820-05-2BI21MA |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-2BI21ML |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Part Status: Active
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-3AE21MA |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-3BE21MA |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-3BE21ML |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-3BE81ML |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 35201.18 грн |
| TE0820-05-4AE21MA |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0820-05-4DE21MA |
|
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0821-01-2AE31PA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
товар відсутній
| TE0821-01-3BI21MA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 160 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 160 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
товар відсутній
| TE0823-01-3PIU1F |
|
Виробник: Trenz Electronic GmbH
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Obsolete
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Obsolete
товар відсутній
| TE0823-01-3PIU1FA |
|
Виробник: Trenz Electronic GmbH
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Obsolete
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Obsolete
товар відсутній
| TE0823-01-3PIU1MA |
|
Виробник: Trenz Electronic GmbH
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Active
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0823-01-3PIU1ML |
|
Виробник: Trenz Electronic GmbH
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Active
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0835-02-MXE21-A |
Виробник: Trenz Electronic GmbH
Description: RFSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Speed: 1.3GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: RFSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Speed: 1.3GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
товар відсутній
| TE0835-02-TXE21-A |
Виробник: Trenz Electronic GmbH
Description: RFSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Speed: 1.3GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53
Flash Size: 512MB
Description: RFSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Speed: 1.3GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53
Flash Size: 512MB
товар відсутній
| TE0841-02-035-2I |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE USCALE 2GB 64MB
Description: IC MODULE USCALE 2GB 64MB
товар відсутній