Продукція > TRENZ ELECTRONIC GMBH > Всі товари виробника TRENZ ELECTRONIC GMBH (602) > Сторінка 9 з 11
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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TE0817-02-7AI81-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0817-02-7DI81-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0818-01-6BE21-A | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Flash Size: 128MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0818-02-6BE81-A | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E Flash Size: 128MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0818-02-9GI81-A | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I Flash Size: 128MB |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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TE0818-02-BBE81-A | Trenz Electronic GmbH |
Description: ULTRASOM+ MPSOC MODULE WITH AMD Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E Flash Size: 128MB |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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TE0820-02-02CG-1EA | Trenz Electronic GmbH |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0820-03-04EV-1EA | Trenz Electronic GmbH |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0820-03-4DE21FA | Trenz Electronic GmbH | Description: IC MODULE 2GB 128MB |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||
TE0820-04-2BI21M | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I Flash Size: 128MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
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TE0820-04-4DE21FA | Trenz Electronic GmbH |
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товару немає в наявності |
В кошику од. на суму грн. | ||
TE0820-04-4DE21MA | Trenz Electronic GmbH | Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2AE21MA | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2AE81MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2AI21MA | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2AI81MA | Trenz Electronic GmbH |
![]() Packaging: Bulk Part Status: Active Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784I Flash Size: 128MB |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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TE0820-05-2BE21MA | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2BE21MAJ | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2BE21ML | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2BE81MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2BE81ML | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2BI21MA | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2BI21ML | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Part Status: Active Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2BI81MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-2BI81ML | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-3AE21MA | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-3AE81MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-3BE21MA | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-3BE21ML | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
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TE0820-05-3BE81ML | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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TE0820-05-4AE21MA | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-4AE81MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-4DE21MA | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0820-05-4DI81MA | Trenz Electronic GMBH | TE0820-05-4DI81MA |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0821-01-2AE31PA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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TE0821-01-3BI21MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: 2 x 160 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0823-01-3PIU1F | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Flash Size: 128MB Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0823-01-3PIU1FA | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Flash Size: 128MB Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0823-01-3PIU1MA | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0823-01-3PIU1ML | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Flash Size: 128MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0835-02-MXE21-A | Trenz Electronic GmbH |
Description: RFSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm) Speed: 1.3GHz RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Flash Size: 128MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0835-02-TXE21-A | Trenz Electronic GmbH |
Description: RFSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm) Speed: 1.3GHz RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E Co-Processor: ARM® Cortex®-A53 Flash Size: 512MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
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TE0835-03-TXE81-A | Trenz Electronic GmbH |
![]() Packaging: Bulk |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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TE0841-02-035-1C | Trenz Electronic GmbH |
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товару немає в наявності |
В кошику од. на суму грн. | |||
TE0841-02-035-1I | Trenz Electronic GmbH |
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товару немає в наявності |
В кошику од. на суму грн. | |||
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TE0841-02-035-2I | Trenz Electronic GmbH |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0841-02-040-1C | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 70°C Module/Board Type: MCU, FPGA Core Processor: Kintex UltraScale KU40 Flash Size: 64MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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TE0841-02-040-1I | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 512MB Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Core Processor: Kintex UltraScale KU40 Flash Size: 32MB |
товару немає в наявності |
В кошику од. на суму грн. | ||
TE0841-02-31C21-A | Trenz Electronic GmbH |
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товару немає в наявності |
В кошику од. на суму грн. | |||
TE0841-02-31I21-A | Trenz Electronic GmbH |
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товару немає в наявності |
В кошику од. на суму грн. | |||
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TE0841-02-32I21-A | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: Kintex UltraScale KU035 Flash Size: 64MB Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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TE0841-02-41C21-A | Trenz Electronic GmbH |
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товару немає в наявності |
В кошику од. на суму грн. | |||
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TE0841-02-41I21-A | Trenz Electronic GmbH |
![]() Packaging: Bulk Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) RAM Size: 2GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MCU, FPGA Core Processor: Kintex UltraScale KU40 Flash Size: 64MB Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
TE0841-02-41I21-L | Trenz Electronic GmbH |
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товару немає в наявності |
В кошику од. на суму грн. | |||
TE0865-02-ABI21MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I Flash Size: 256MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0865-02-ABI81MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL Packaging: Bulk Connector Type: B2B Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) RAM Size: 4GB Operating Temperature: -40°C ~ 85°C Module/Board Type: FPGA Core Processor: Zynq UltraScale+ ZU11EG-1I Flash Size: 128MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0865-02-DGE23MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E Flash Size: 256MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0865-02-DGE93MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL Packaging: Bulk Connector Type: B2B Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) RAM Size: 8GB Operating Temperature: 0°C ~ 85°C Module/Board Type: FPGA Core Processor: Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E Flash Size: 256MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0865-02-FBE23MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E Flash Size: 256MB |
товару немає в наявності |
В кошику од. на суму грн. | |||
TE0865-02-FBE83MA | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL Packaging: Bulk Connector Type: B2B Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: FPGA Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E Flash Size: 256MB |
товару немає в наявності |
В кошику од. на суму грн. |
TE0818-01-6BE21-A |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
товару немає в наявності
В кошику
од. на суму грн.
TE0818-02-6BE81-A |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
товару немає в наявності
В кошику
од. на суму грн.
TE0818-02-9GI81-A |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH ZYNQ
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
Flash Size: 128MB
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 118894.76 грн |
TE0818-02-BBE81-A |
Виробник: Trenz Electronic GmbH
Description: ULTRASOM+ MPSOC MODULE WITH AMD
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
Flash Size: 128MB
Description: ULTRASOM+ MPSOC MODULE WITH AMD
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
Flash Size: 128MB
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 122304.80 грн |
TE0820-02-02CG-1EA |
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Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 1GB 128MB
Description: IC MODULE ZYNQ USCALE 1GB 128MB
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В кошику
од. на суму грн.
TE0820-03-04EV-1EA |
![]() |
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
товару немає в наявності
В кошику
од. на суму грн.
TE0820-03-4DE21FA |
Виробник: Trenz Electronic GmbH
Description: IC MODULE 2GB 128MB
Description: IC MODULE 2GB 128MB
на замовлення 9 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
TE0820-04-2BI21M |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Flash Size: 128MB
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Flash Size: 128MB
товару немає в наявності
В кошику
од. на суму грн.
TE0820-04-4DE21FA |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
товару немає в наявності
В кошику
од. на суму грн.
TE0820-04-4DE21MA |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-2AE21MA |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC ZU2CG-1E 2GB DDR4 IND
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC ZU2CG-1E 2GB DDR4 IND
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-2AI21MA |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC ZU2CG-1I 2GB DDR4 IN
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC ZU2CG-1I 2GB DDR4 IN
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-2AI81MA |
![]() |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Part Status: Active
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784I
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Part Status: Active
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784I
Flash Size: 128MB
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 31539.53 грн |
TE0820-05-2BE21MA |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-2BE21MAJ |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-2BE21ML |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-2BI21MA |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-2BI21ML |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-3AE21MA |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-3BE21MA |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-3BE21ML |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-3BE81ML |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 37804.14 грн |
TE0820-05-4AE21MA |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-4DE21MA |
![]() |
Виробник: Trenz Electronic GmbH
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MOD MPSOC ZU4EV-1E 2GB DDR4 IND
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0820-05-4DI81MA |
Виробник: Trenz Electronic GMBH
TE0820-05-4DI81MA
TE0820-05-4DI81MA
товару немає в наявності
В кошику
од. на суму грн.
TE0821-01-2AE31PA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 37357.69 грн |
TE0821-01-3BI21MA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 160 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: 2 x 160 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU3EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
товару немає в наявності
В кошику
од. на суму грн.
TE0823-01-3PIU1F |
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Виробник: Trenz Electronic GmbH
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Obsolete
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Obsolete
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В кошику
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TE0823-01-3PIU1FA |
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Виробник: Trenz Electronic GmbH
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Obsolete
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
TE0823-01-3PIU1MA |
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Виробник: Trenz Electronic GmbH
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Active
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0823-01-3PIU1ML |
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Виробник: Trenz Electronic GmbH
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Active
Description: ICOBOARD
Packaging: Bulk
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Flash Size: 128MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0835-02-MXE21-A |
Виробник: Trenz Electronic GmbH
Description: RFSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Speed: 1.3GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: RFSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Speed: 1.3GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
товару немає в наявності
В кошику
од. на суму грн.
TE0835-02-TXE21-A |
Виробник: Trenz Electronic GmbH
Description: RFSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Speed: 1.3GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53
Flash Size: 512MB
Description: RFSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.543" L x 2.559" W (90.00mm x 65.00mm)
Speed: 1.3GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU47DR-1FFVE1156E
Co-Processor: ARM® Cortex®-A53
Flash Size: 512MB
товару немає в наявності
В кошику
од. на суму грн.
TE0835-03-TXE81-A |
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на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 677303.26 грн |
TE0841-02-035-1C |
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Виробник: Trenz Electronic GmbH
Description: SOM USCALE 2GB DDR4
Description: SOM USCALE 2GB DDR4
товару немає в наявності
В кошику
од. на суму грн.
TE0841-02-035-1I |
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Виробник: Trenz Electronic GmbH
Description: SOM USCALE 2GB DDR4
Description: SOM USCALE 2GB DDR4
товару немає в наявності
В кошику
од. на суму грн.
TE0841-02-035-2I |
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Виробник: Trenz Electronic GmbH
Description: IC MODULE USCALE 2GB 64MB
Description: IC MODULE USCALE 2GB 64MB
товару немає в наявності
В кошику
од. на суму грн.
TE0841-02-040-1C |
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Виробник: Trenz Electronic GmbH
Description: IC MODULE USCALE 2GB 64MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MCU, FPGA
Core Processor: Kintex UltraScale KU40
Flash Size: 64MB
Description: IC MODULE USCALE 2GB 64MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MCU, FPGA
Core Processor: Kintex UltraScale KU40
Flash Size: 64MB
товару немає в наявності
В кошику
од. на суму грн.
TE0841-02-040-1I |
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Виробник: Trenz Electronic GmbH
Description: IC MODULE USCALE 512MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Kintex UltraScale KU40
Flash Size: 32MB
Description: IC MODULE USCALE 512MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 512MB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA Core
Core Processor: Kintex UltraScale KU40
Flash Size: 32MB
товару немає в наявності
В кошику
од. на суму грн.
TE0841-02-31C21-A |
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Виробник: Trenz Electronic GmbH
Description: IC MODULE
Description: IC MODULE
товару немає в наявності
В кошику
од. на суму грн.
TE0841-02-31I21-A |
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Виробник: Trenz Electronic GmbH
Description: IC MODULE
Description: IC MODULE
товару немає в наявності
В кошику
од. на суму грн.
TE0841-02-32I21-A |
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Виробник: Trenz Electronic GmbH
Description: IC MODULE USCALE 2GB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: Kintex UltraScale KU035
Flash Size: 64MB
Part Status: Active
Description: IC MODULE USCALE 2GB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: Kintex UltraScale KU035
Flash Size: 64MB
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 123874.93 грн |
TE0841-02-41C21-A |
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Виробник: Trenz Electronic GmbH
Description: IC MODULE USCALE 2GB
Description: IC MODULE USCALE 2GB
товару немає в наявності
В кошику
од. на суму грн.
TE0841-02-41I21-A |
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Виробник: Trenz Electronic GmbH
Description: MOD SOM USCALE 2GB DDR4
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: Kintex UltraScale KU40
Flash Size: 64MB
Part Status: Active
Description: MOD SOM USCALE 2GB DDR4
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: Kintex UltraScale KU40
Flash Size: 64MB
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
TE0841-02-41I21-L |
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Виробник: Trenz Electronic GmbH
Description: IC MODULE
Description: IC MODULE
товару немає в наявності
В кошику
од. на суму грн.
TE0865-02-ABI21MA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I
Flash Size: 256MB
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU11EG-1FFVC1760I
Flash Size: 256MB
товару немає в наявності
В кошику
од. на суму грн.
TE0865-02-ABI81MA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Zynq UltraScale+ ZU11EG-1I
Flash Size: 128MB
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Zynq UltraScale+ ZU11EG-1I
Flash Size: 128MB
товару немає в наявності
В кошику
од. на суму грн.
TE0865-02-DGE23MA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E
Flash Size: 256MB
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E
Flash Size: 256MB
товару немає в наявності
В кошику
од. на суму грн.
TE0865-02-DGE93MA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 8GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E
Flash Size: 256MB
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 8GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E
Flash Size: 256MB
товару немає в наявності
В кошику
од. на суму грн.
TE0865-02-FBE23MA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E
Flash Size: 256MB
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E
Flash Size: 256MB
товару немає в наявності
В кошику
од. на суму грн.
TE0865-02-FBE83MA |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E
Flash Size: 256MB
Description: MPSOC MODULE WITH ZYNQ ULTRASCAL
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 3.937" L x 2.953" W (100.00mm x 75.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: FPGA
Core Processor: Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E
Flash Size: 256MB
товару немає в наявності
В кошику
од. на суму грн.