| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
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XCVE1752-1MSINSVG1369 | AMD |
 Description: IC VERSAL AI-CORE FPGA 1369BGAPackaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVE1752-1LSEVSVA2197 | AMD |
Description: IC VERSAL AI-EDGE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 400MHz, 1GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVE1752-1MSIVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVE1752-2MSEVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVE1752-1LSINSVG1369 | AMD |
Description: IC VERSAL AI-EDGE FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA, FCBGA Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-FCBGA (35x35) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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CK-U1-ZCU1285-G | AMD |
Description: KIT ZUP RFSOC ZCU1285 Platform: Zynq UltraScale+ RFSoC ZCU1285 Utilized IC / Part: XCZU39DR Contents: Board(s), Cable(s), Power Supply, Accessories Type: FPGA + MCU/MPU SoC Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU7EV-2FBVB900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 900-BBGA, FCBGA Packaging: Tray Architecture: MCU, FPGA Supplier Device Package: 900-FCBGA (31x31) Peripherals: DMA, WDT |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XCZU3EG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Architecture: MCU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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XCZU4EV-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Architecture: MCU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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XCZU5EV-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Architecture: MCU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XCZU4EG-2SFVE784I | AMD |
Description: FPGA MPSOC QUAD A53 784BGA Architecture: MPU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU4EV-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Architecture: MCU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 784-BFBGA, FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU5EG-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Architecture: MCU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCZU5EV-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Architecture: MCU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU7EV-1FBVB900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 900-BBGA, FCBGA Packaging: Tray Architecture: MCU, FPGA Supplier Device Package: 900-FCBGA (31x31) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU5EG-2SFVE784I | AMD |
Description: FPGA MPSOC QUAD A53 784BGA Architecture: MPU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU5EV-2SFVE784I | AMD |
Description: FPGA MPSOC QUADA53 H264/5 784BGA Architecture: MPU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU7EV-1FBVB900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Architecture: MCU, FPGA Supplier Device Package: 900-FCBGA (31x31) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 900-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU9EG-1FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 900-BBGA, FCBGA Packaging: Tray Architecture: MCU, FPGA Supplier Device Package: 900-FCBGA (31x31) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU9EG-2FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Architecture: MCU, FPGA Supplier Device Package: 900-FCBGA (31x31) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 900-BBGA, FCBGA Packaging: Tray |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XC3S400-4PQG208C | AMD |
Description: IC FPGA 141 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 141 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC3S1200E-4FGG320I | AMD |
Description: IC FPGA 250 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 1200000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 19512 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 2168 Total RAM Bits: 516096 Number of I/O: 250 DigiKey Programmable: Not Verified |
на замовлення 304 шт: термін постачання 21-31 дні (днів) |
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XC3S2000-4FGG456C | AMD |
Description: IC FPGA 333 I/O 456FBGA Packaging: Tray Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 2000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 46080 Supplier Device Package: 456-FBGA (23x23) Number of LABs/CLBs: 5120 Total RAM Bits: 737280 Number of I/O: 333 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC3S2000-4FGG676C | AMD |
Description: IC FPGA 489 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 2000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 46080 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 5120 Total RAM Bits: 737280 Number of I/O: 489 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | ||
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XC3S2000-4FG456C | AMD |
Description: IC FPGA 333 I/O 456FBGA Packaging: Bulk Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 2000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 46080 Supplier Device Package: 456-FBGA (23x23) Number of LABs/CLBs: 5120 Total RAM Bits: 737280 Number of I/O: 333 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
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XC3S2000-4FGG676I | AMD |
Description: IC FPGA 489 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 2000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 46080 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 5120 Total RAM Bits: 737280 Number of I/O: 489 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | ||
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XC3S2000-4FG456I | AMD |
Description: IC FPGA 333 I/O 456FBGA Packaging: Bulk Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 2000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 46080 Supplier Device Package: 456-FBGA (23x23) Number of LABs/CLBs: 5120 Total RAM Bits: 737280 Number of I/O: 333 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
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XC3S2000-4FG676C | AMD |
Description: IC FPGA 489 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 2000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 46080 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 5120 Total RAM Bits: 737280 Number of I/O: 489 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | ||
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XC3S2000-4FG676I | AMD |
Description: IC FPGA 489 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 2000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 46080 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 5120 Total RAM Bits: 737280 Number of I/O: 489 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | ||
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XC3S2000-4FG900I | AMD |
Description: IC FPGA 565 I/O 900FBGA Packaging: Bulk Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 2000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 46080 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 5120 Total RAM Bits: 737280 Number of I/O: 565 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
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XC3S700AN-5FGG484C | AMD |
Description: IC FPGA 372 I/O 484FBGA DigiKey Programmable: Not Verified Number of I/O: 372 Total RAM Bits: 368640 Number of LABs/CLBs: 1472 Supplier Device Package: 484-FBGA (23x23) Number of Logic Elements/Cells: 13248 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 700000 Mounting Type: Surface Mount Package / Case: 484-BBGA Packaging: Tray |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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XC3S400A-4FT256C | AMD |
Description: IC FPGA 195 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 195 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
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XC3S400-4FT256C | AMD |
Description: IC FPGA 173 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 173 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
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XC3S400A-5FGG320C | AMD |
Description: IC FPGA 251 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 251 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||
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XC3S400A-4FGG400I | AMD |
Description: IC FPGA 311 I/O 400FBGA Packaging: Tray Package / Case: 400-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 400-FBGA (21x21) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 311 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
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XC3S400AN-4FT256I | AMD |
Description: IC FPGA 195 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 195 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 4 шт В кошику од. на суму грн. | ||
|
|
XC3S400-4FT256I | AMD |
Description: IC FPGA 173 I/O 256FTBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 173 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
|
|
XC3S400-5FT256C | AMD |
Description: IC FPGA 173 I/O 256FTBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 173 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
|
|
XC3S400A-4FG320I | AMD |
Description: IC FPGA 251 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 251 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||
|
|
XC3S400A-5FGG400C | AMD |
Description: IC FPGA 311 I/O 400FBGA Packaging: Tray Package / Case: 400-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 400-FBGA (21x21) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 311 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400A-4FG400C | AMD |
Description: IC FPGA 311 I/O 400FBGA Packaging: Tray Package / Case: 400-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 400-FBGA (21x21) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 311 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400-4FGG320C | AMD |
Description: IC FPGA 221 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 221 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||
|
|
XC3S400AN-4FGG400I | AMD |
Description: IC FPGA 311 I/O 400FBGA Packaging: Tray Package / Case: 400-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 400-FBGA (21x21) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 311 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400AN-5FGG400C | AMD |
Description: IC FPGA 311 I/O 400FBGA Packaging: Tray Package / Case: 400-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 400-FBGA (21x21) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 311 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400AN-4FG400C | AMD |
Description: IC FPGA 311 I/O 400FBGA Packaging: Tray Package / Case: 400-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 400-FBGA (21x21) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 311 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400A-4FG400I | AMD |
Description: IC FPGA 311 I/O 400FBGA Packaging: Tray Package / Case: 400-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 400-FBGA (21x21) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 311 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400-5FGG320C | AMD |
Description: IC FPGA 221 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 221 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||
|
|
XC3S400-4FGG320I | AMD |
Description: IC FPGA 221 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 221 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||
|
|
XC3S400-4FG320C | AMD |
Description: IC FPGA 221 I/O 320FBGA Packaging: Bulk Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 221 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||
|
|
XC3S400AN-4FG400I | AMD |
Description: IC FPGA 311 I/O 400FBGA Packaging: Tray Package / Case: 400-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 400-FBGA (21x21) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Number of I/O: 311 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400-4FG320I | AMD |
Description: IC FPGA 221 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 221 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||
|
|
XC3S400-5FG320C | AMD |
Description: IC FPGA 221 I/O 320FBGA Packaging: Bulk Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 221 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||
|
|
XC3S400-5FGG456C | AMD |
Description: IC FPGA 264 I/O 456FBGA Packaging: Tray Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 456-FBGA (23x23) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 264 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400-4FGG456I | AMD |
Description: IC FPGA 264 I/O 456FBGA Packaging: Tray Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 456-FBGA (23x23) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 264 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400-4FG456C | AMD |
Description: IC FPGA 264 I/O 456FBGA Packaging: Bulk Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 456-FBGA (23x23) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 264 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400-4FG456I | AMD |
Description: IC FPGA 264 I/O 456FBGA Packaging: Bulk Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 456-FBGA (23x23) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 264 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S400-5FG456C | AMD |
Description: IC FPGA 264 I/O 456FBGA Packaging: Bulk Package / Case: 456-BBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 456-FBGA (23x23) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Number of I/O: 264 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC2VP30-5FG676C | AMD |
Description: IC FPGA 416 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 30816 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 3424 Total RAM Bits: 2506752 Number of I/O: 416 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EK-SCU35-G | AMD |
Description: EVAL KIT SPARTAN UP SCU35 Packaging: Box Type: FPGA + MCU/MPU SoC Contents: Board(s) Utilized IC / Part: XCSU35P |
на замовлення 166 шт: термін постачання 21-31 дні (днів) |
|
|||
| XCVH1582-1LSEVSVA3697 | AMD |
Description: XCVH1582-1LSEVSVA3697 Packaging: Bulk Package / Case: 3697-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ HBM FPGA, 3M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3697-FCBGA (57.5x57.5) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. |
| XCVE1752-1MSINSVG1369 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVE1752-1LSEVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AI-EDGE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Description: IC VERSAL AI-EDGE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVE1752-1MSIVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVE1752-2MSEVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVE1752-1LSINSVG1369 |
|
Виробник: AMD
Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| CK-U1-ZCU1285-G |
|
Виробник: AMD
Description: KIT ZUP RFSOC ZCU1285
Platform: Zynq UltraScale+ RFSoC ZCU1285
Utilized IC / Part: XCZU39DR
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
Packaging: Box
Description: KIT ZUP RFSOC ZCU1285
Platform: Zynq UltraScale+ RFSoC ZCU1285
Utilized IC / Part: XCZU39DR
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.
| XCZU7EV-2FBVB900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Description: IC SOC CORTEX-A53 900FCBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 308544.21 грн |
| XCZU3EG-2SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 60143.68 грн |
| XCZU4EV-1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 106374.67 грн |
| XCZU5EV-2SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 191236.37 грн |
| XCZU4EG-2SFVE784I |
Виробник: AMD
Description: FPGA MPSOC QUAD A53 784BGA
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: FPGA MPSOC QUAD A53 784BGA
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU4EV-2SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 784-BFBGA, FCBGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 784-BFBGA, FCBGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU5EG-1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 138011.06 грн |
| XCZU5EV-1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU7EV-1FBVB900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Description: IC SOC CORTEX-A53 900FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
товару немає в наявності
В кошику
од. на суму грн.
| XCZU5EG-2SFVE784I |
Виробник: AMD
Description: FPGA MPSOC QUAD A53 784BGA
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: FPGA MPSOC QUAD A53 784BGA
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU5EV-2SFVE784I |
Виробник: AMD
Description: FPGA MPSOC QUADA53 H264/5 784BGA
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: FPGA MPSOC QUADA53 H264/5 784BGA
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU7EV-1FBVB900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 900FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU9EG-1FFVC900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Description: IC SOC CORTEX-A53 900FCBGA
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
товару немає в наявності
В кошику
од. на суму грн.
| XCZU9EG-2FFVC900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 900FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 371446.58 грн |
| XC3S400-4PQG208C |
|
Виробник: AMD
Description: IC FPGA 141 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 141
DigiKey Programmable: Not Verified
Description: IC FPGA 141 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 141
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| XC3S1200E-4FGG320I |
|
Виробник: AMD
Description: IC FPGA 250 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 19512
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 2168
Total RAM Bits: 516096
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 19512
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 2168
Total RAM Bits: 516096
Number of I/O: 250
DigiKey Programmable: Not Verified
на замовлення 304 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 12268.34 грн |
| XC3S2000-4FGG456C |
|
Виробник: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| XC3S2000-4FGG676C |
|
Виробник: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| XC3S2000-4FG456C |
|
Виробник: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S2000-4FGG676I |
|
Виробник: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| XC3S2000-4FG456I |
|
Виробник: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S2000-4FG676C |
|
Виробник: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| XC3S2000-4FG676I |
|
Виробник: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| XC3S2000-4FG900I |
|
Виробник: AMD
Description: IC FPGA 565 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 565
DigiKey Programmable: Not Verified
Description: IC FPGA 565 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 565
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| XC3S700AN-5FGG484C |
|
Виробник: AMD
Description: IC FPGA 372 I/O 484FBGA
DigiKey Programmable: Not Verified
Number of I/O: 372
Total RAM Bits: 368640
Number of LABs/CLBs: 1472
Supplier Device Package: 484-FBGA (23x23)
Number of Logic Elements/Cells: 13248
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 700000
Mounting Type: Surface Mount
Package / Case: 484-BBGA
Packaging: Tray
Description: IC FPGA 372 I/O 484FBGA
DigiKey Programmable: Not Verified
Number of I/O: 372
Total RAM Bits: 368640
Number of LABs/CLBs: 1472
Supplier Device Package: 484-FBGA (23x23)
Number of Logic Elements/Cells: 13248
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 700000
Mounting Type: Surface Mount
Package / Case: 484-BBGA
Packaging: Tray
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10789.04 грн |
| XC3S400A-4FT256C |
|
Виробник: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 195
DigiKey Programmable: Not Verified
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 195
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S400-4FT256C |
|
Виробник: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S400A-5FGG320C |
|
Виробник: AMD
Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| XC3S400A-4FGG400I |
|
Виробник: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S400AN-4FT256I |
|
Виробник: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 195
DigiKey Programmable: Not Verified
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 195
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 4 шт
В кошику
од. на суму грн.
| XC3S400-4FT256I |
|
Виробник: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S400-5FT256C |
|
Виробник: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 173
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S400A-4FG320I |
|
Виробник: AMD
Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
Description: IC FPGA 251 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 251
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| XC3S400A-5FGG400C |
|
Виробник: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S400A-4FG400C |
|
Виробник: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S400-4FGG320C |
|
Виробник: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| XC3S400AN-4FGG400I |
|
Виробник: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S400AN-5FGG400C |
|
Виробник: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S400AN-4FG400C |
|
Виробник: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S400A-4FG400I |
|
Виробник: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 60 шт
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| XC3S400-5FGG320C |
|
Виробник: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 84 шт
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од. на суму грн.
| XC3S400-4FGG320I |
|
Виробник: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 84 шт
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| XC3S400-4FG320C |
|
Виробник: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 84 шт
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од. на суму грн.
| XC3S400AN-4FG400I |
|
Виробник: AMD
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
Description: IC FPGA 311 I/O 400FBGA
Packaging: Tray
Package / Case: 400-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 400-FBGA (21x21)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Number of I/O: 311
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S400-4FG320I |
|
Виробник: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| XC3S400-5FG320C |
|
Виробник: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 221
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 84 шт
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од. на суму грн.
| XC3S400-5FGG456C |
|
Виробник: AMD
Description: IC FPGA 264 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Description: IC FPGA 264 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 60 шт
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од. на суму грн.
| XC3S400-4FGG456I |
|
Виробник: AMD
Description: IC FPGA 264 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Description: IC FPGA 264 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S400-4FG456C |
|
Виробник: AMD
Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 60 шт
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од. на суму грн.
| XC3S400-4FG456I |
|
Виробник: AMD
Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 60 шт
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од. на суму грн.
| XC3S400-5FG456C |
|
Виробник: AMD
Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
Description: IC FPGA 264 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 264
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
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од. на суму грн.
| XC2VP30-5FG676C |
|
Виробник: AMD
Description: IC FPGA 416 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 30816
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 3424
Total RAM Bits: 2506752
Number of I/O: 416
DigiKey Programmable: Not Verified
Description: IC FPGA 416 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 30816
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 3424
Total RAM Bits: 2506752
Number of I/O: 416
DigiKey Programmable: Not Verified
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од. на суму грн.
| EK-SCU35-G |
Виробник: AMD
Description: EVAL KIT SPARTAN UP SCU35
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: XCSU35P
Description: EVAL KIT SPARTAN UP SCU35
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: XCSU35P
на замовлення 166 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 18630.33 грн |
| XCVH1582-1LSEVSVA3697 |
Виробник: AMD
Description: XCVH1582-1LSEVSVA3697
Packaging: Bulk
Package / Case: 3697-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ HBM FPGA, 3M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3697-FCBGA (57.5x57.5)
Architecture: MPU, FPGA
Description: XCVH1582-1LSEVSVA3697
Packaging: Bulk
Package / Case: 3697-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ HBM FPGA, 3M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3697-FCBGA (57.5x57.5)
Architecture: MPU, FPGA
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