| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
 |
XC7A15T-L2CSG324E | AMD |
 Description: IC FPGA 210 I/O 324CSBGAPackaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 210 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 126 шт В кошику од. на суму грн. | ||
 |
XC7A15T-3CSG325E | AMD |
Description: IC FPGA 150 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 150 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 126 шт В кошику од. на суму грн. | ||
 |
XC7A15T-3FGG484E | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 250 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
| XCSU10P-L1CMVA361I | AMD |
Description: XQVP1052-2MLINFQI1369 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 9 шт В кошику од. на суму грн. | |||
| XCSU10P-L1CMVA529I | AMD |
Description: XQVP1052-2MLISBQJ1369 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 8 шт В кошику од. на суму грн. | |||
| XCSU10P-L1SBVB625I | AMD |
Description: XQVP1052-2MLIVFQF1760 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 7 шт В кошику од. на суму грн. | |||
| XCSU10P-2CMVA529I | AMD |
Description: XQVP1052-2LLINFQI1369 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 7 шт В кошику од. на суму грн. | |||
| XCSU10P-2SBVB625I | AMD |
Description: XQVP1052-2LLIVFQF1760 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 7 шт В кошику од. на суму грн. | |||
| XCSU100P-L1CMVB529I | AMD |
Description: XQVP1052-1LSINFQI1369 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | |||
| XCSU100P-L1SBVC529I | AMD |
Description: XQVP1052-1LSIVFQF1760 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | |||
| XCSU100P-L1SBVG784I | AMD |
Description: XQVP1052-1MLISBQJ1369 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | |||
| XCSU100P-2SBVG784E | AMD |
Description: XQVP1052-1LLISBQJ1369 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | |||
| XCSU100P-L1SBVF784I | AMD |
Description: XQVP1052-1MLINFQI1369 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | |||
| XCSU100P-2SBVF784I | AMD |
Description: XQVP1052-1LLINFQI1369 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | |||
| XCSU100P-2SBVG784I | AMD |
Description: XQVP1052-1LLIVFQF1760 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | |||
| XCSU150P-1SBVA1024E | AMD |
Description: XQVP1052-2MSISBRJ1369 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | |||
| XCSU100P-L1SBVA1024I | AMD |
Description: XQVP1052-1LSISBRJ1369 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | |||
| XCSU150P-1SBVA1024I | AMD |
Description: XQVP1052-2MSIVFQF1760 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU150P-1FSVG1156E | AMD |
Description: XQVP1052-2MSINFQI1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU100P-L1FSVG1156I | AMD |
Description: XQVP1052-1LSISBQJ1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU150P-1FSVG1156I | AMD |
Description: XQVP1052-2MSISBQJ1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU10P-1CMVA361E | AMD |
Description: XQVP1052-1MLIVFQF1760 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU10P-1CMVA529E | AMD |
Description: XQVP1052-1MSISBQJ1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU10P-1CMVA361I | AMD |
Description: XQVP1052-1MSINFQI1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU10P-1SBVB625E | AMD |
Description: XQVP1052-1MSIVFQF1760 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU10P-2CMVA361E | AMD |
Description: XQVP1052-2HSINFQI1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU10P-1CMVA529I | AMD |
Description: XQVP1052-1MSISBRJ1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU10P-2CMVA361I | AMD |
Description: XQVP1052-2HSISBQJ1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU10P-1SBVB625I | AMD |
Description: XQVP1052-1MSMSBRJ1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCSU10P-2CMVA529E | AMD |
Description: XQVP1052-2HSIVFQF1760 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
XCSU10P-2SBVB625E | AMD |
Description: IC FPGA 304 I/O 625-BGA/FCBGA Packaging: Tray |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
|
||
 |
XC5VLX110T-1FF1738C4031 | AMD |
Description: IC FPGA 680 I/O 1738FCBGA Packaging: Bulk Package / Case: 1738-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 110592 Supplier Device Package: 1738-FCBGA (42.5x42.5) Number of LABs/CLBs: 8640 Total RAM Bits: 5455872 Number of I/O: 680 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XC3S250E-5VQG100C | AMD |
Description: IC FPGA 66 I/O 100VQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 100-VQFP (14x14) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 66 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
 |
XC3S250E-4CPG132C | AMD |
Description: IC FPGA 92 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 92 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 360 шт В кошику од. на суму грн. | ||
|
|
XC3S250E-4VQ100C | AMD |
Description: IC FPGA 66 I/O 100VQFP Packaging: Bulk Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 100-VQFP (14x14) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 66 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
|
|
XC3S250E-4CPG132I | AMD |
Description: IC FPGA 92 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 92 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 360 шт В кошику од. на суму грн. | ||
 |
XC3S250E-5TQG144C | AMD |
Description: IC FPGA 108 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 108 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S250E-4VQ100I | AMD |
Description: IC FPGA 66 I/O 100VQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 100-VQFP (14x14) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 66 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
|
|
XC3S250E-4TQ144C | AMD |
Description: IC FPGA 108 I/O 144TQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 108 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
 |
XC3S250E-4FTG256I | AMD |
Description: IC FPGA 172 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 172 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
|
|
XC3S250E-4TQ144I | AMD |
Description: IC FPGA 108 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 108 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
|
|
XC3S250E-4CP132I | AMD |
Description: IC FPGA 92 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 92 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 360 шт В кошику од. на суму грн. | ||
|
|
XC3S250E-5FTG256C | AMD |
Description: IC FPGA 172 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 172 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
|
|
XC3S250E-4FT256C | AMD |
Description: IC FPGA 172 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 172 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
|
|
XC3S250E-4FT256I | AMD |
Description: IC FPGA 172 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 172 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
 |
XC3S250E-4PQG208I | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 158 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XC3S250E-5PQG208C | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 158 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XC3S250E-4PQ208I | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 158 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XC3S250E-5PQ208C | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 158 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU65DR-1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU67DR-1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU65DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU67DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU65DR-2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU43DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU47DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU48DR-1FSVG1517E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU47DR-1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU49DR-1FSVF1760E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU67DR-2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. |
| XC7A15T-L2CSG324E |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 126 шт
В кошику
од. на суму грн.
| XC7A15T-3CSG325E |
|
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 150
DigiKey Programmable: Not Verified
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 150
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 126 шт
В кошику
од. на суму грн.
| XC7A15T-3FGG484E |
|
Виробник: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 250
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XCSU10P-2SBVB625E |
|
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3914.03 грн |
| XC5VLX110T-1FF1738C4031 |
|
Виробник: AMD
Description: IC FPGA 680 I/O 1738FCBGA
Packaging: Bulk
Package / Case: 1738-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1738-FCBGA (42.5x42.5)
Number of LABs/CLBs: 8640
Total RAM Bits: 5455872
Number of I/O: 680
DigiKey Programmable: Not Verified
Description: IC FPGA 680 I/O 1738FCBGA
Packaging: Bulk
Package / Case: 1738-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1738-FCBGA (42.5x42.5)
Number of LABs/CLBs: 8640
Total RAM Bits: 5455872
Number of I/O: 680
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC3S250E-5VQG100C |
|
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4CPG132C |
|
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 360 шт
В кошику
од. на суму грн.
| XC3S250E-4VQ100C |
|
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Bulk
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC FPGA 66 I/O 100VQFP
Packaging: Bulk
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4CPG132I |
|
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 360 шт
В кошику
од. на суму грн.
| XC3S250E-5TQG144C |
|
Виробник: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S250E-4VQ100I |
|
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4TQ144C |
|
Виробник: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC FPGA 108 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S250E-4FTG256I |
|
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4TQ144I |
|
Виробник: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S250E-4CP132I |
|
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 360 шт
В кошику
од. на суму грн.
| XC3S250E-5FTG256C |
|
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4FT256C |
|
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4FT256I |
|
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
Description: IC FPGA 172 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 172
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4PQG208I |
|
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC3S250E-5PQG208C |
|
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC3S250E-4PQ208I |
|
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC3S250E-5PQ208C |
|
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCZU65DR-1FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU67DR-1FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU65DR-L1FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU67DR-L1FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU65DR-2FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-L1FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU47DR-L1FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU48DR-1FSVG1517E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU47DR-1FSVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU49DR-1FSVF1760E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU67DR-2FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.