| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| XCSU10P-1CMVA361I | AMD |
 Description: XQVP1052-1MSINFQI1369Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
| XCSU10P-1SBVB625E | AMD |
Description: XQVP1052-1MSIVFQF1760 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
| XCSU10P-2CMVA361E | AMD |
Description: XQVP1052-2HSINFQI1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
| XCSU10P-1CMVA529I | AMD |
Description: XQVP1052-1MSISBRJ1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
| XCSU10P-2CMVA361I | AMD |
Description: XQVP1052-2HSISBQJ1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
| XCSU10P-1SBVB625I | AMD |
Description: XQVP1052-1MSMSBRJ1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
| XCSU10P-2CMVA529E | AMD |
Description: XQVP1052-2HSIVFQF1760 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
| XCSU10P-2SBVB625E | AMD |
Description: XQVP1052-2LLISBQJ1369 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
 |
XC5VLX110T-1FF1738C4031 | AMD |
Description: IC FPGA 680 I/O 1738FCBGA Packaging: Bulk Package / Case: 1738-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 110592 Supplier Device Package: 1738-FCBGA (42.5x42.5) Number of LABs/CLBs: 8640 Total RAM Bits: 5455872 Number of I/O: 680 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XC3S250E-5VQG100C | AMD |
Description: IC FPGA 66 I/O 100VQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 100-VQFP (14x14) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 66 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. |
 |
XC3S250E-4CPG132C | AMD |
Description: IC FPGA 92 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 92 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 360 шт В кошику од. на суму грн. |
|
|
XC3S250E-4VQ100C | AMD |
Description: IC FPGA 66 I/O 100VQFP Packaging: Bulk Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 100-VQFP (14x14) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 66 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. |
|
|
XC3S250E-4CPG132I | AMD |
Description: IC FPGA 92 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 92 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 360 шт В кошику од. на суму грн. |
 |
XC3S250E-5TQG144C | AMD |
Description: IC FPGA 108 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 108 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. |
|
|
XC3S250E-4VQ100I | AMD |
Description: IC FPGA 66 I/O 100VQFP DigiKey Programmable: Not Verified Number of I/O: 66 Total RAM Bits: 221184 Number of LABs/CLBs: 612 Supplier Device Package: 100-VQFP (14x14) Number of Logic Elements/Cells: 5508 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount Package / Case: 100-TQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. |
|
|
XC3S250E-4TQ144C | AMD |
Description: IC FPGA 108 I/O 144TQFP Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Bulk Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Cells: 5508 DigiKey Programmable: Not Verified Number of I/O: 108 Total RAM Bits: 221184 Number of LABs/CLBs: 612 |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. |
 |
XC3S250E-4FTG256I | AMD |
Description: IC FPGA 172 I/O 256FTBGA DigiKey Programmable: Not Verified Number of I/O: 172 Total RAM Bits: 221184 Number of LABs/CLBs: 612 Supplier Device Package: 256-FTBGA (17x17) Number of Logic Elements/Cells: 5508 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. |
|
|
XC3S250E-4TQ144I | AMD |
Description: IC FPGA 108 I/O 144TQFP DigiKey Programmable: Not Verified Number of I/O: 108 Total RAM Bits: 221184 Number of LABs/CLBs: 612 Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Cells: 5508 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. |
|
|
XC3S250E-4CP132I | AMD |
Description: IC FPGA 92 I/O 132CSBGA DigiKey Programmable: Not Verified Number of I/O: 92 Total RAM Bits: 221184 Number of LABs/CLBs: 612 Supplier Device Package: 132-CSPBGA (8x8) Number of Logic Elements/Cells: 5508 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount Package / Case: 132-TFBGA, CSPBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 360 шт В кошику од. на суму грн. |
|
|
XC3S250E-5FTG256C | AMD |
Description: IC FPGA 172 I/O 256FTBGA DigiKey Programmable: Not Verified Number of I/O: 172 Total RAM Bits: 221184 Number of LABs/CLBs: 612 Supplier Device Package: 256-FTBGA (17x17) Number of Logic Elements/Cells: 5508 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. |
|
|
XC3S250E-4FT256C | AMD |
Description: IC FPGA 172 I/O 256FTBGA DigiKey Programmable: Not Verified Number of I/O: 172 Total RAM Bits: 221184 Number of LABs/CLBs: 612 Supplier Device Package: 256-FTBGA (17x17) Number of Logic Elements/Cells: 5508 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. |
|
|
XC3S250E-4FT256I | AMD |
Description: IC FPGA 172 I/O 256FTBGA DigiKey Programmable: Not Verified Number of I/O: 172 Total RAM Bits: 221184 Number of LABs/CLBs: 612 Supplier Device Package: 256-FTBGA (17x17) Number of Logic Elements/Cells: 5508 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. |
 |
XC3S250E-4PQG208I | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 158 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
|
|
XC3S250E-5PQG208C | AMD |
Description: IC FPGA 158 I/O 208QFP Number of LABs/CLBs: 612 Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Cells: 5508 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 158 Total RAM Bits: 221184 |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XC3S250E-4PQ208I | AMD |
Description: IC FPGA 158 I/O 208QFP DigiKey Programmable: Not Verified Number of I/O: 158 Total RAM Bits: 221184 Number of LABs/CLBs: 612 Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Cells: 5508 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
|
XC3S250E-5PQ208C | AMD |
Description: IC FPGA 158 I/O 208QFP Package / Case: 208-BFQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 158 Total RAM Bits: 221184 Number of LABs/CLBs: 612 Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Cells: 5508 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 250000 Mounting Type: Surface Mount |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XCZU65DR-1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. |
|
|
XCZU67DR-1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. |
|
|
XCZU65DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. |
|
|
XCZU67DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU65DR-2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU43DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU47DR-L1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XCZU48DR-1FSVG1517E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU47DR-1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XCZU49DR-1FSVF1760E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1760BGA Architecture: MCU, FPGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU67DR-2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Primary Attributes: Zynq® UltraScale+™ RFSoC Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU48DR-1FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU43DR-L1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU47DR-L1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU65DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Primary Attributes: Zynq® UltraScale+™ RFSoC Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XCZU46DR-1FSVH1760I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1760BGA Architecture: MCU, FPGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
|
XCZU67DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Primary Attributes: Zynq® UltraScale+™ RFSoC Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU48DR-1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XC7A200T-L1FB676I | AMD |
Description: IC FPGA 400 I/O 676FCBGA DigiKey Programmable: Not Verified Number of I/O: 400 Total RAM Bits: 13455360 Number of LABs/CLBs: 16825 Supplier Device Package: 676-FCBGA (27x27) Number of Logic Elements/Cells: 215360 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 676-BBGA, FCBGA Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XC7A200T-2FB676I | AMD |
Description: IC FPGA 400 I/O 676FCBGA DigiKey Programmable: Not Verified Number of I/O: 400 Total RAM Bits: 13455360 Number of LABs/CLBs: 16825 Supplier Device Package: 676-FCBGA (27x27) Number of Logic Elements/Cells: 215360 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 676-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XC7A200T-L2SBG484E | AMD |
Description: IC FPGA 285 I/O 484FCBGA Supplier Device Package: 484-FCBGA (19x19) Number of Logic Elements/Cells: 215360 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 484-FBGA, FCBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 285 Total RAM Bits: 13455360 Number of LABs/CLBs: 16825 |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XC7A200T-L1FB484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA DigiKey Programmable: Not Verified Number of I/O: 285 Total RAM Bits: 13455360 Number of LABs/CLBs: 16825 Supplier Device Package: 484-FCBGA (23x23) Number of Logic Elements/Cells: 215360 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 484-BBGA, FCBGA Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. |
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XC7A200T-2FB484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA DigiKey Programmable: Not Verified Number of I/O: 285 Total RAM Bits: 13455360 Number of LABs/CLBs: 16825 Supplier Device Package: 484-FCBGA (23x23) Number of Logic Elements/Cells: 215360 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 484-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XC7A200T-1SB484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA DigiKey Programmable: Not Verified Number of I/O: 285 Total RAM Bits: 13455360 Number of LABs/CLBs: 16825 Supplier Device Package: 484-FCBGA (19x19) Number of Logic Elements/Cells: 215360 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 484-FBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XC7A200T-L2FFG1156E | AMD |
Description: IC FPGA 500 I/O 1156FCBGA DigiKey Programmable: Not Verified Number of I/O: 500 Total RAM Bits: 13455360 Number of LABs/CLBs: 16825 Supplier Device Package: 1156-FCBGA (35x35) Number of Logic Elements/Cells: 215360 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XC7A200T-1FF1156I | AMD |
Description: IC FPGA 500 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 500 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XC7A200T-2SB484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XC7A200T-2FF1156I | AMD |
Description: IC FPGA 500 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 500 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XCZU65DR-1FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Primary Attributes: Zynq® UltraScale+™ RFSoC Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU67DR-1FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Primary Attributes: Zynq® UltraScale+™ RFSoC Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCZU65DR-L1FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Primary Attributes: Zynq® UltraScale+™ RFSoC Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
 |
XCV150-4BG256C | AMD |
Description: IC FPGA 180 I/O 256BGA Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 164674 Mounting Type: Surface Mount Package / Case: 256-BBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 180 Total RAM Bits: 49152 Number of LABs/CLBs: 864 Supplier Device Package: 256-PBGA (27x27) Number of Logic Elements/Cells: 3888 Voltage - Supply: 2.375V ~ 2.625V |
товару немає в наявності |
В кошику од. на суму грн. |
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XCV150-5BG256I | AMD |
Description: IC FPGA 180 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 164674 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 3888 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 864 Total RAM Bits: 49152 Number of I/O: 180 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
|
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XCV150-6BG256C | AMD |
Description: IC FPGA 180 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 164674 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 3888 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 864 Total RAM Bits: 49152 Number of I/O: 180 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
| XC5VLX110T-1FF1738C4031 |
|
Виробник: AMD
Description: IC FPGA 680 I/O 1738FCBGA
Packaging: Bulk
Package / Case: 1738-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1738-FCBGA (42.5x42.5)
Number of LABs/CLBs: 8640
Total RAM Bits: 5455872
Number of I/O: 680
DigiKey Programmable: Not Verified
Description: IC FPGA 680 I/O 1738FCBGA
Packaging: Bulk
Package / Case: 1738-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1738-FCBGA (42.5x42.5)
Number of LABs/CLBs: 8640
Total RAM Bits: 5455872
Number of I/O: 680
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC3S250E-5VQG100C |
|
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4CPG132C |
|
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 360 шт
В кошику
од. на суму грн.
| XC3S250E-4VQ100C |
|
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Bulk
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC FPGA 66 I/O 100VQFP
Packaging: Bulk
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4CPG132I |
|
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 360 шт
В кошику
од. на суму грн.
| XC3S250E-5TQG144C |
|
Виробник: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S250E-4VQ100I |
|
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Description: IC FPGA 66 I/O 100VQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4TQ144C |
|
Виробник: AMD
Description: IC FPGA 108 I/O 144TQFP
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 5508
DigiKey Programmable: Not Verified
Number of I/O: 108
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Description: IC FPGA 108 I/O 144TQFP
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 5508
DigiKey Programmable: Not Verified
Number of I/O: 108
Total RAM Bits: 221184
Number of LABs/CLBs: 612
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S250E-4FTG256I |
|
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4TQ144I |
|
Виробник: AMD
Description: IC FPGA 108 I/O 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 108
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC FPGA 108 I/O 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 108
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC3S250E-4CP132I |
|
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 92
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 132-CSPBGA (8x8)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
Packaging: Tray
Description: IC FPGA 92 I/O 132CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 92
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 132-CSPBGA (8x8)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 360 шт
В кошику
од. на суму грн.
| XC3S250E-5FTG256C |
|
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC3S250E-4FT256C |
|
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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Мінімальне замовлення: 90 шт
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| XC3S250E-4FT256I |
|
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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Мінімальне замовлення: 90 шт
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| XC3S250E-4PQG208I |
|
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
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| XC3S250E-5PQG208C |
|
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
Description: IC FPGA 158 I/O 208QFP
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
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В кошику
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| XC3S250E-4PQ208I |
|
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
Description: IC FPGA 158 I/O 208QFP
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
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В кошику
од. на суму грн.
| XC3S250E-5PQ208C |
|
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Description: IC FPGA 158 I/O 208QFP
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
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од. на суму грн.
| XCZU65DR-1FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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| XCZU67DR-1FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU65DR-L1FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU67DR-L1FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU65DR-2FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU43DR-L1FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| XCZU47DR-L1FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU48DR-1FSVG1517E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU47DR-1FSVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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од. на суму грн.
| XCZU49DR-1FSVF1760E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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од. на суму грн.
| XCZU67DR-2FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU48DR-1FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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В кошику
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| XCZU43DR-L1FSVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU47DR-L1FSVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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| XCZU65DR-L2FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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| XCZU46DR-1FSVH1760I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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| XCZU67DR-L2FSVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
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| XCZU48DR-1FSVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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| XC7A200T-L1FB676I |
|
Виробник: AMD
Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Bulk
Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Bulk
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| XC7A200T-2FB676I |
|
Виробник: AMD
Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
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| XC7A200T-L2SBG484E |
|
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Description: IC FPGA 285 I/O 484FCBGA
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
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| XC7A200T-L1FB484I |
|
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tube
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tube
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Мінімальне замовлення: 60 шт
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| XC7A200T-2FB484I |
|
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tray
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| XC7A200T-1SB484I |
|
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA, FCBGA
Packaging: Tray
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA, FCBGA
Packaging: Tray
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| XC7A200T-L2FFG1156E |
|
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 500
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 500 I/O 1156FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 500
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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| XC7A200T-1FF1156I |
|
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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| XC7A200T-2SB484I |
|
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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| XC7A200T-2FF1156I |
|
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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| XCZU65DR-1FFVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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| XCZU67DR-1FFVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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В кошику
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| XCZU65DR-L1FFVE1156I |
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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| XCV150-4BG256C |
|
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 164674
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 180
Total RAM Bits: 49152
Number of LABs/CLBs: 864
Supplier Device Package: 256-PBGA (27x27)
Number of Logic Elements/Cells: 3888
Voltage - Supply: 2.375V ~ 2.625V
Description: IC FPGA 180 I/O 256BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 164674
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 180
Total RAM Bits: 49152
Number of LABs/CLBs: 864
Supplier Device Package: 256-PBGA (27x27)
Number of Logic Elements/Cells: 3888
Voltage - Supply: 2.375V ~ 2.625V
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| XCV150-5BG256I |
|
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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| XCV150-6BG256C |
|
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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