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XC3S250E-5VQG100C XC3S250E-5VQG100C AMD ds312 Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 90 шт
В кошику  од. на суму  грн.
XC3S250E-4CPG132C XC3S250E-4CPG132C AMD ds312 Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 360 шт
В кошику  од. на суму  грн.
XC3S250E-4VQ100C XC3S250E-4VQ100C AMD ds312 Description: IC FPGA 66 I/O 100VQFP
Packaging: Bulk
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 90 шт
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XC3S250E-4CPG132I XC3S250E-4CPG132I AMD ds312 Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 360 шт
В кошику  од. на суму  грн.
XC3S250E-5TQG144C XC3S250E-5TQG144C AMD ds312 Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 60 шт
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XC3S250E-4VQ100I XC3S250E-4VQ100I AMD ds312 Description: IC FPGA 66 I/O 100VQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 90 шт
В кошику  од. на суму  грн.
XC3S250E-4TQ144C XC3S250E-4TQ144C AMD ds312 Description: IC FPGA 108 I/O 144TQFP
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 5508
DigiKey Programmable: Not Verified
Number of I/O: 108
Total RAM Bits: 221184
Number of LABs/CLBs: 612
товару немає в наявності
 Мінімальне замовлення: 60 шт
В кошику  од. на суму  грн.
XC3S250E-4FTG256I XC3S250E-4FTG256I AMD ds312 Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 90 шт
В кошику  од. на суму  грн.
XC3S250E-4TQ144I XC3S250E-4TQ144I AMD ds312 Description: IC FPGA 108 I/O 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 108
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 60 шт
В кошику  од. на суму  грн.
XC3S250E-4CP132I XC3S250E-4CP132I AMD ds312 Description: IC FPGA 92 I/O 132CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 92
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 132-CSPBGA (8x8)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 360 шт
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XC3S250E-5FTG256C XC3S250E-5FTG256C AMD ds312 Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 90 шт
В кошику  од. на суму  грн.
XC3S250E-4FT256C XC3S250E-4FT256C AMD ds312 Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 90 шт
В кошику  од. на суму  грн.
XC3S250E-4FT256I XC3S250E-4FT256I AMD ds312 Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 90 шт
В кошику  од. на суму  грн.
XC3S250E-4PQG208I XC3S250E-4PQG208I AMD ds312 Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
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XC3S250E-5PQG208C XC3S250E-5PQG208C AMD ds312 Description: IC FPGA 158 I/O 208QFP
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
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XC3S250E-4PQ208I XC3S250E-4PQ208I AMD ds312 Description: IC FPGA 158 I/O 208QFP
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
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XC3S250E-5PQ208C XC3S250E-5PQ208C AMD ds312 Description: IC FPGA 158 I/O 208QFP
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
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XCZU65DR-1FSVE1156I XCZU65DR-1FSVE1156I AMD Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU67DR-1FSVE1156I XCZU67DR-1FSVE1156I AMD Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU65DR-L1FSVE1156I XCZU65DR-L1FSVE1156I AMD Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU67DR-L1FSVE1156I XCZU67DR-L1FSVE1156I AMD Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU65DR-2FSVE1156I XCZU65DR-2FSVE1156I AMD Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU43DR-L1FSVE1156I XCZU43DR-L1FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU47DR-L1FSVE1156I XCZU47DR-L1FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU48DR-1FSVG1517E XCZU48DR-1FSVG1517E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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XCZU47DR-1FSVG1517I XCZU47DR-1FSVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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XCZU49DR-1FSVF1760E XCZU49DR-1FSVF1760E AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1760BGA
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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XCZU67DR-2FSVE1156I XCZU67DR-2FSVE1156I AMD Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU48DR-1FSVE1156I XCZU48DR-1FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU43DR-L1FSVG1517I XCZU43DR-L1FSVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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XCZU47DR-L1FSVG1517I XCZU47DR-L1FSVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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XCZU65DR-L2FSVE1156I XCZU65DR-L2FSVE1156I AMD Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU46DR-1FSVH1760I XCZU46DR-1FSVH1760I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1760BGA
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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XCZU67DR-L2FSVE1156I XCZU67DR-L2FSVE1156I AMD Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
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XCZU48DR-1FSVG1517I XCZU48DR-1FSVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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XC7A200T-L1FB676I XC7A200T-L1FB676I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Bulk
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XC7A200T-2FB676I XC7A200T-2FB676I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
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XC7A200T-L2SBG484E XC7A200T-L2SBG484E AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
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XC7A200T-L1FB484I XC7A200T-L1FB484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tube
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 Мінімальне замовлення: 60 шт
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XC7A200T-2FB484I XC7A200T-2FB484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tray
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XC7A200T-1SB484I XC7A200T-1SB484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA, FCBGA
Packaging: Tray
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XC7A200T-L2FFG1156E XC7A200T-L2FFG1156E AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 500 I/O 1156FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 500
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XC7A200T-1FF1156I XC7A200T-1FF1156I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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XC7A200T-2SB484I XC7A200T-2SB484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-2FF1156I XC7A200T-2FF1156I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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XCZU65DR-1FFVE1156I XCZU65DR-1FFVE1156I AMD Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU67DR-1FFVE1156I XCZU67DR-1FFVE1156I AMD Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU65DR-L1FFVE1156I XCZU65DR-L1FFVE1156I AMD Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCV150-4BG256C XCV150-4BG256C AMD Virtex_2.5_V.pdf Description: IC FPGA 180 I/O 256BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 164674
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 180
Total RAM Bits: 49152
Number of LABs/CLBs: 864
Supplier Device Package: 256-PBGA (27x27)
Number of Logic Elements/Cells: 3888
Voltage - Supply: 2.375V ~ 2.625V
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XCV150-5BG256I XCV150-5BG256I AMD Virtex_2.5_V.pdf Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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XCV150-6BG256C XCV150-6BG256C AMD Virtex_2.5_V.pdf Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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XCZU4EV-2FBVB900I XCZU4EV-2FBVB900I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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XC7S100-2FGGA676C XC7S100-2FGGA676C AMD Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
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XC7A75T-2FGG676I XC7A75T-2FGG676I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 300
DigiKey Programmable: Not Verified
на замовлення 105 шт:
термін постачання 21-31 дні (днів)
1+15929.00 грн
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A-V80-P64G-PQ-G A-V80-P64G-PQ-G AMD Summary Description: BD V80 DCAB ALVEO QSFP56/4 PCIE
Power (Watts): 190W
Packaging: Box
Memory Size: 32GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 819GB/s
Cooling Type: Heat Sink
LUTs: 2600K
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
1+722940.80 грн
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XC3S1500-4FG320C XC3S1500-4FG320C AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Number of I/O: 221
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 84 шт
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XCVE1752-1MSENSVG1369 XCVE1752-1MSENSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-1MSEVSVA2197 XCVE1752-1MSEVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
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XCVE1752-1LSENSVG1369 XCVE1752-1LSENSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-2MSENSVG1369 XCVE1752-2MSENSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XC3S250E-5VQG100C ds312
XC3S250E-5VQG100C
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
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XC3S250E-4CPG132C ds312
XC3S250E-4CPG132C
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 360 шт
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XC3S250E-4VQ100C ds312
XC3S250E-4VQ100C
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
Packaging: Bulk
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
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XC3S250E-4CPG132I ds312
XC3S250E-4CPG132I
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 92
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 360 шт
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XC3S250E-5TQG144C ds312
XC3S250E-5TQG144C
Виробник: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
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XC3S250E-4VQ100I ds312
XC3S250E-4VQ100I
Виробник: AMD
Description: IC FPGA 66 I/O 100VQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику  од. на суму  грн.
XC3S250E-4TQ144C ds312
XC3S250E-4TQ144C
Виробник: AMD
Description: IC FPGA 108 I/O 144TQFP
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 5508
DigiKey Programmable: Not Verified
Number of I/O: 108
Total RAM Bits: 221184
Number of LABs/CLBs: 612
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Мінімальне замовлення: 60 шт
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XC3S250E-4FTG256I ds312
XC3S250E-4FTG256I
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
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XC3S250E-4TQ144I ds312
XC3S250E-4TQ144I
Виробник: AMD
Description: IC FPGA 108 I/O 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 108
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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Мінімальне замовлення: 60 шт
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XC3S250E-4CP132I ds312
XC3S250E-4CP132I
Виробник: AMD
Description: IC FPGA 92 I/O 132CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 92
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 132-CSPBGA (8x8)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 132-TFBGA, CSPBGA
Packaging: Tray
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Мінімальне замовлення: 360 шт
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XC3S250E-5FTG256C ds312
XC3S250E-5FTG256C
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
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XC3S250E-4FT256C ds312
XC3S250E-4FT256C
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
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XC3S250E-4FT256I ds312
XC3S250E-4FT256I
Виробник: AMD
Description: IC FPGA 172 I/O 256FTBGA
DigiKey Programmable: Not Verified
Number of I/O: 172
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 256-FTBGA (17x17)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
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XC3S250E-4PQG208I ds312
XC3S250E-4PQG208I
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
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XC3S250E-5PQG208C ds312
XC3S250E-5PQG208C
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
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XC3S250E-4PQ208I ds312
XC3S250E-4PQ208I
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
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XC3S250E-5PQ208C ds312
XC3S250E-5PQ208C
Виробник: AMD
Description: IC FPGA 158 I/O 208QFP
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 158
Total RAM Bits: 221184
Number of LABs/CLBs: 612
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 5508
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 250000
Mounting Type: Surface Mount
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XCZU65DR-1FSVE1156I
XCZU65DR-1FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU67DR-1FSVE1156I
XCZU67DR-1FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU65DR-L1FSVE1156I
XCZU65DR-L1FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU67DR-L1FSVE1156I
XCZU67DR-L1FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU65DR-2FSVE1156I
XCZU65DR-2FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU43DR-L1FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU43DR-L1FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU47DR-L1FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU47DR-L1FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU48DR-1FSVG1517E ds889-zynq-usp-rfsoc-overview
XCZU48DR-1FSVG1517E
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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XCZU47DR-1FSVG1517I ds889-zynq-usp-rfsoc-overview
XCZU47DR-1FSVG1517I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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XCZU49DR-1FSVF1760E ds889-zynq-usp-rfsoc-overview
XCZU49DR-1FSVF1760E
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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XCZU67DR-2FSVE1156I
XCZU67DR-2FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU48DR-1FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU48DR-1FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU43DR-L1FSVG1517I ds889-zynq-usp-rfsoc-overview
XCZU43DR-L1FSVG1517I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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XCZU47DR-L1FSVG1517I ds889-zynq-usp-rfsoc-overview
XCZU47DR-L1FSVG1517I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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XCZU65DR-L2FSVE1156I
XCZU65DR-L2FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU46DR-1FSVH1760I ds889-zynq-usp-rfsoc-overview
XCZU46DR-1FSVH1760I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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XCZU67DR-L2FSVE1156I
XCZU67DR-L2FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
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XCZU48DR-1FSVG1517I ds889-zynq-usp-rfsoc-overview
XCZU48DR-1FSVG1517I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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XC7A200T-L1FB676I ds181_Artix_7_Data_Sheet
XC7A200T-L1FB676I
Виробник: AMD
Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Bulk
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XC7A200T-2FB676I ds181_Artix_7_Data_Sheet
XC7A200T-2FB676I
Виробник: AMD
Description: IC FPGA 400 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
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XC7A200T-L2SBG484E ds181_Artix_7_Data_Sheet
XC7A200T-L2SBG484E
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
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XC7A200T-L1FB484I ds181_Artix_7_Data_Sheet
XC7A200T-L1FB484I
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 60 шт
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XC7A200T-2FB484I ds181_Artix_7_Data_Sheet
XC7A200T-2FB484I
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tray
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XC7A200T-1SB484I ds181_Artix_7_Data_Sheet
XC7A200T-1SB484I
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 285
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA, FCBGA
Packaging: Tray
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XC7A200T-L2FFG1156E ds181_Artix_7_Data_Sheet
XC7A200T-L2FFG1156E
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 500
Total RAM Bits: 13455360
Number of LABs/CLBs: 16825
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 215360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XC7A200T-1FF1156I ds181_Artix_7_Data_Sheet
XC7A200T-1FF1156I
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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XC7A200T-2SB484I ds181_Artix_7_Data_Sheet
XC7A200T-2SB484I
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-2FF1156I ds181_Artix_7_Data_Sheet
XC7A200T-2FF1156I
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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XCZU65DR-1FFVE1156I
XCZU65DR-1FFVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU67DR-1FFVE1156I
XCZU67DR-1FFVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCZU65DR-L1FFVE1156I
XCZU65DR-L1FFVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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XCV150-4BG256C Virtex_2.5_V.pdf
XCV150-4BG256C
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 164674
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 180
Total RAM Bits: 49152
Number of LABs/CLBs: 864
Supplier Device Package: 256-PBGA (27x27)
Number of Logic Elements/Cells: 3888
Voltage - Supply: 2.375V ~ 2.625V
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XCV150-5BG256I Virtex_2.5_V.pdf
XCV150-5BG256I
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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XCV150-6BG256C Virtex_2.5_V.pdf
XCV150-6BG256C
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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XCZU4EV-2FBVB900I dfRkDKgzEvo5CsUiQJdEkg
XCZU4EV-2FBVB900I
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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XC7S100-2FGGA676C Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics
XC7S100-2FGGA676C
Виробник: AMD
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
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XC7A75T-2FGG676I ds181_Artix_7_Data_Sheet
XC7A75T-2FGG676I
Виробник: AMD
Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 300
DigiKey Programmable: Not Verified
на замовлення 105 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+15929.00 грн
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A-V80-P64G-PQ-G Summary
A-V80-P64G-PQ-G
Виробник: AMD
Description: BD V80 DCAB ALVEO QSFP56/4 PCIE
Power (Watts): 190W
Packaging: Box
Memory Size: 32GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 819GB/s
Cooling Type: Heat Sink
LUTs: 2600K
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+722940.80 грн
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XC3S1500-4FG320C ds099
XC3S1500-4FG320C
Виробник: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Number of I/O: 221
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 84 шт
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XCVE1752-1MSENSVG1369 ds950-versal-overview
XCVE1752-1MSENSVG1369
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-1MSEVSVA2197 ds950-versal-overview
XCVE1752-1MSEVSVA2197
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
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XCVE1752-1LSENSVG1369 ds950-versal-overview
XCVE1752-1LSENSVG1369
Виробник: AMD
Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-2MSENSVG1369 ds950-versal-overview
XCVE1752-2MSENSVG1369
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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