Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15970) > Сторінка 131 з 267
| Фото | Назва | Виробник | Інформація |
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LCQT-TSOP32 | Aries Electronics |
Description: SOCKET ADAPTER TSOP 32DIPPackaging: Tube Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| 84-PRS11010-12 | Aries Electronics |
Description: ZIF 11X11 84PIN FOOTPRN 11010 Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 40-6556-30 | Aries Electronics |
Description: 40 POS TEST SOCK RECEPT SOLDER Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Wire Wrap Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 16-822-90E | Aries Electronics |
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 108-PRS12024-12 | Aries Electronics |
Description: CONN SOCKET PGA ZIF GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 20-6513-10 | Aries Electronics |
Description: IC SOCK COLLET CT 20 PIN GOLD Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 32-8800-610C | Aries Electronics |
Description: CONN ELEVATOR SOCKET 32 PIN .600 Features: Closed Frame, Elevated Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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LCQT-TSOP40 | Aries Electronics |
Description: SOCKET ADAPTER TSOP TO 40DIPPackaging: Tube Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LCQT-TSOP40-1 | Aries Electronics |
Description: SOCKET ADAPTER TSOP TO 40DIPPackaging: Tube Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| 06-2503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 06-2503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SP200 | Aries Electronics |
Description: PLUG SHORTING INSULATED BLACKPackaging: Bulk Gender: Male Pins Contact Finish: Gold Color: Black Current Rating (Amps): 5A Pitch: 0.200" (5.08mm) Type: Closed Top, Grip Height: 0.480" (12.20mm) Number of Positions or Pins (Grid): 2 (1 x 2) Contact Finish Thickness: 10.0µin (0.25µm) Material Flammability Rating: UL94 V-0 Housing Material: Polyamide (PA46), Nylon 4/6 |
на замовлення 773 шт: термін постачання 21-31 дні (днів) |
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| 181-PRS15006-12 | Aries Electronics |
Description: CONN SOCKET PGA ZIF GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 225-PRS15001-16 | Aries Electronics |
Description: CONN SOCKET PGA ZIF GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 200°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Bronze Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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08-2503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
на замовлення 121 шт: термін постачання 21-31 дні (днів) |
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| 08-2503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 08-2503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 08-2503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 20-555000-00 | Aries Electronics |
Description: SOCKET ADAPTER SSOP/SOWIC 20POS Packaging: Bulk Number of Pins: 20 Mounting Type: Surface Mount Convert From (Adapter End): SSOP Convert To (Adapter End): SOWIC Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 62-PRS21031-12 | Aries Electronics |
Description: SOCKET Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 62 Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-350003-10-P | Aries Electronics |
Description: ADAPTER BREAKOUT BOARDS Packaging: Bulk Size / Dimension: 0.700" L x 0.380" W (17.78mm x 9.65mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC, SOJ |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-350003-10 | Aries Electronics |
Description: ADAPTER BREAKOUT BOARDS Packaging: Bulk Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.300" (7.62mm) Board Thickness: 0.062" (1.57mm) Proto Board Type: SOIC to DIP Package Accepted: SOIC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-350003-11-RC | Aries Electronics |
Description: ADAPTER BREAKOUT BOARDS Packaging: Bulk Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.300" (7.62mm) Board Thickness: 0.062" (1.57mm) Proto Board Type: SOIC to DIP Package Accepted: SOIC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 40-600-20 | Aries Electronics |
Description: CONN HDR DIP POST 40POS TIN Packaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 40 Pitch: 0.100" (2.54mm) Contact Type: Post Row Spacing: 0.600" (15.24mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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ME-100 | Aries Electronics |
Headers & Wire Housings Economy Mini-Link |
на замовлення 20693 шт: термін постачання 21-30 дні (днів) |
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ML-100 | Aries Electronics |
Headers & Wire Housings MINILINK MINI JUMPER |
на замовлення 802 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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ML-100S | Aries Electronics |
Headers & Wire Housings .10 JUMPER CLOSED Au |
на замовлення 352 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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20-680-191T | Aries Electronics |
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS |
на замовлення 100 шт: термін постачання 21-30 дні (днів) |
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| 14-675-190T | Aries Electronics |
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS |
на замовлення 1 шт: термін постачання 21-30 дні (днів) |
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20-680-191TC | Aries Electronics |
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| 14-675-191 | Aries Electronics |
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-675-191T | Aries Electronics |
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-675-190 | Aries Electronics |
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-675-191TC | Aries Electronics |
IC & Component Sockets |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-9625-11 | Aries Electronics |
IC & Component Sockets |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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16-350000-11-RC | Aries Electronics |
IC & Component Sockets SOIC 16-PIN DIP ADAPTER |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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28-6554-11 | Aries Electronics |
IC & Component Sockets 28 PIN W/HANDLE |
на замовлення 42 шт: термін постачання 21-30 дні (днів) |
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08-3518-10 | Aries Electronics |
IC & Component Sockets 8P SOLDER TIN/GLD |
на замовлення 1372 шт: термін постачання 21-30 дні (днів) |
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40-6518-10 | Aries Electronics |
IC & Component Sockets 40P SOLDER TIN/GLD |
на замовлення 197 шт: термін постачання 21-30 дні (днів) |
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14-3518-10 | Aries Electronics |
IC & Component Sockets 14P SOLDER TIN/GLD |
на замовлення 396 шт: термін постачання 21-30 дні (днів) |
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10-4823-90C | Aries Electronics |
IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS |
на замовлення 118 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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14-350000-11-RC | Aries Electronics |
IC & Component Sockets SOIC DIP ADAPTER |
на замовлення 145 шт: термін постачання 21-30 дні (днів) |
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25-0513-10 | Aries Electronics |
IC & Component Sockets 25P SOLDER TAIL TIN |
на замовлення 171 шт: термін постачання 21-30 дні (днів) |
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20-350000-11-RC | Aries Electronics |
IC & Component Sockets SOIC DIP ADAPTER |
на замовлення 152 шт: термін постачання 21-30 дні (днів) |
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40-0518-10 | Aries Electronics |
IC & Component Sockets 40P LO-PRO STRIP TIN |
на замовлення 216 шт: термін постачання 21-30 дні (днів) |
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40-6554-10 | Aries Electronics |
IC & Component Sockets 40P TEST SOCKET TIN |
на замовлення 166 шт: термін постачання 21-30 дні (днів) |
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28-6554-10 | Aries Electronics |
IC & Component Sockets 28P TEST SOCKET TIN |
на замовлення 43 шт: термін постачання 21-30 дні (днів) |
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16-675-191 | Aries Electronics |
Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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16-0600-11 | Aries Electronics |
IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT |
на замовлення 317 шт: термін постачання 21-30 дні (днів) |
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16-810-90C | Aries Electronics |
IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS |
на замовлення 44 шт: термін постачання 21-30 дні (днів) |
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48-3552-11 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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1108800 | Aries Electronics |
IC & Component Sockets OSCILLATOR HALF 4PIN |
на замовлення 654 шт: термін постачання 21-30 дні (днів) |
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16-3518-10 | Aries Electronics |
IC & Component Sockets 16P SOLDER TIN/GLD |
на замовлення 960 шт: термін постачання 21-30 дні (днів) |
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16-600-10 | Aries Electronics |
IC & Component Sockets 16P FORK DIP HDR |
на замовлення 278 шт: термін постачання 21-30 дні (днів) |
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24-350000-11-RC | Aries Electronics |
IC & Component Sockets SOIC DIP ADAPTER |
на замовлення 209 шт: термін постачання 21-30 дні (днів) |
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08-600-11 | Aries Electronics |
IC & Component Sockets 8P DIP FORK HDR GLD |
на замовлення 572 шт: термін постачання 21-30 дні (днів) |
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08-3518-00 | Aries Electronics |
IC & Component Sockets 8P SMD SCKT TIN/GOLD |
на замовлення 798 шт: термін постачання 21-30 дні (днів) |
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14-600-10 | Aries Electronics |
IC & Component Sockets 14P FORK DIP HDR |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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18-650-10 | Aries Electronics |
IC & Component Sockets 18P DIP CVR HT .270" MAX COMP HT .125" |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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20-3518-10 | Aries Electronics |
IC & Component Sockets 20P SOLDER TIN/GLD |
на замовлення 57 шт: термін постачання 21-30 дні (днів) |
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| LCQT-TSOP32 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER TSOP 32DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: SOCKET ADAPTER TSOP 32DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
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| 84-PRS11010-12 |
Виробник: Aries Electronics
Description: ZIF 11X11 84PIN FOOTPRN 11010
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: ZIF 11X11 84PIN FOOTPRN 11010
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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| 40-6556-30 |
Виробник: Aries Electronics
Description: 40 POS TEST SOCK RECEPT SOLDER
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 40 POS TEST SOCK RECEPT SOLDER
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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| 16-822-90E |
Виробник: Aries Electronics
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
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| 108-PRS12024-12 |
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Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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| 20-6513-10 |
Виробник: Aries Electronics
Description: IC SOCK COLLET CT 20 PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: IC SOCK COLLET CT 20 PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
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| 32-8800-610C |
Виробник: Aries Electronics
Description: CONN ELEVATOR SOCKET 32 PIN .600
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN ELEVATOR SOCKET 32 PIN .600
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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| LCQT-TSOP40 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
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| LCQT-TSOP40-1 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
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| 06-2503-30 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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| 06-2503-31 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
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| SP200 |
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Виробник: Aries Electronics
Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
на замовлення 773 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 291.87 грн |
| 10+ | 239.18 грн |
| 25+ | 224.18 грн |
| 50+ | 200.31 грн |
| 100+ | 190.76 грн |
| 250+ | 178.81 грн |
| 500+ | 167.49 грн |
| 181-PRS15006-12 |
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Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
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| 225-PRS15001-16 |
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Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
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| 08-2503-30 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
на замовлення 121 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 342.84 грн |
| 10+ | 280.50 грн |
| 25+ | 262.94 грн |
| 50+ | 234.95 грн |
| 100+ | 223.73 грн |
| 08-2503-20 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
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| 08-2503-21 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
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| 08-2503-31 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 20-555000-00 |
Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP/SOWIC 20POS
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP/SOWIC 20POS
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику
од. на суму грн.
| 62-PRS21031-12 |
Виробник: Aries Electronics
Description: SOCKET
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 62
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: SOCKET
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 62
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.
| 14-350003-10-P |
Виробник: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 0.700" L x 0.380" W (17.78mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOJ
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 0.700" L x 0.380" W (17.78mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOJ
товару немає в наявності
В кошику
од. на суму грн.
| 14-350003-10 |
Виробник: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
товару немає в наявності
В кошику
од. на суму грн.
| 14-350003-11-RC |
Виробник: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
товару немає в наявності
В кошику
од. на суму грн.
| 40-600-20 |
Виробник: Aries Electronics
Description: CONN HDR DIP POST 40POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 40
Pitch: 0.100" (2.54mm)
Contact Type: Post
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
Description: CONN HDR DIP POST 40POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 40
Pitch: 0.100" (2.54mm)
Contact Type: Post
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| ME-100 |
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Виробник: Aries Electronics
Headers & Wire Housings Economy Mini-Link
Headers & Wire Housings Economy Mini-Link
на замовлення 20693 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 22+ | 16.49 грн |
| 31+ | 11.45 грн |
| 100+ | 8.28 грн |
| 500+ | 7.90 грн |
| 1000+ | 6.38 грн |
| 2000+ | 5.85 грн |
| 10000+ | 5.78 грн |
| ML-100 |
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Виробник: Aries Electronics
Headers & Wire Housings MINILINK MINI JUMPER
Headers & Wire Housings MINILINK MINI JUMPER
на замовлення 802 шт:
термін постачання 21-30 дні (днів)В кошику од. на суму грн.
| ML-100S |
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Виробник: Aries Electronics
Headers & Wire Housings .10 JUMPER CLOSED Au
Headers & Wire Housings .10 JUMPER CLOSED Au
на замовлення 352 шт:
термін постачання 21-30 дні (днів)В кошику од. на суму грн.
| 20-680-191T |
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Виробник: Aries Electronics
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
на замовлення 100 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 143.65 грн |
| 10+ | 136.35 грн |
| 100+ | 104.13 грн |
| 500+ | 85.89 грн |
| 1000+ | 82.09 грн |
| 2500+ | 79.04 грн |
| 5000+ | 76.76 грн |
| 14-675-190T |
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Виробник: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
на замовлення 1 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 191.53 грн |
| 10+ | 153.83 грн |
| 104+ | 129.21 грн |
| 520+ | 117.81 грн |
| 1014+ | 104.89 грн |
| 2522+ | 98.05 грн |
| 5018+ | 92.73 грн |
| 20-680-191TC |
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Виробник: Aries Electronics
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 14-675-191 |
![]() |
Виробник: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 14-675-191T |
![]() |
Виробник: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 14-675-190 |
![]() |
Виробник: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 14-675-191TC |
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Виробник: Aries Electronics
IC & Component Sockets
IC & Component Sockets
товару немає в наявності
В кошику
од. на суму грн.
| 14-9625-11 |
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Виробник: Aries Electronics
IC & Component Sockets
IC & Component Sockets
товару немає в наявності
В кошику
од. на суму грн.
| 16-350000-11-RC |
![]() |
Виробник: Aries Electronics
IC & Component Sockets SOIC 16-PIN DIP ADAPTER
IC & Component Sockets SOIC 16-PIN DIP ADAPTER
товару немає в наявності
В кошику
од. на суму грн.
| 28-6554-11 |
![]() |
Виробник: Aries Electronics
IC & Component Sockets 28 PIN W/HANDLE
IC & Component Sockets 28 PIN W/HANDLE
на замовлення 42 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1711.37 грн |
| 9+ | 1374.89 грн |
| 27+ | 1161.35 грн |
| 54+ | 1130.19 грн |
| 108+ | 1084.59 грн |
| 252+ | 1043.54 грн |
| 504+ | 1013.90 грн |
| 08-3518-10 |
![]() |
Виробник: Aries Electronics
IC & Component Sockets 8P SOLDER TIN/GLD
IC & Component Sockets 8P SOLDER TIN/GLD
на замовлення 1372 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 49+ | 53.82 грн |
| 98+ | 43.62 грн |
| 539+ | 34.20 грн |
| 1029+ | 31.01 грн |
| 40-6518-10 |
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Виробник: Aries Electronics
IC & Component Sockets 40P SOLDER TIN/GLD
IC & Component Sockets 40P SOLDER TIN/GLD
на замовлення 197 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 450.45 грн |
| 12+ | 351.37 грн |
| 24+ | 291.86 грн |
| 60+ | 277.42 грн |
| 108+ | 269.06 грн |
| 252+ | 256.14 грн |
| 504+ | 242.45 грн |
| 14-3518-10 |
![]() |
Виробник: Aries Electronics
IC & Component Sockets 14P SOLDER TIN/GLD
IC & Component Sockets 14P SOLDER TIN/GLD
на замовлення 396 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 135.67 грн |
| 10+ | 86.18 грн |
| 112+ | 61.26 грн |
| 504+ | 58.45 грн |
| 1008+ | 55.48 грн |
| 2520+ | 51.00 грн |
| 10-4823-90C |
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Виробник: Aries Electronics
IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS
IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS
на замовлення 118 шт:
термін постачання 21-30 дні (днів)В кошику од. на суму грн.
| 14-350000-11-RC |
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Виробник: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
IC & Component Sockets SOIC DIP ADAPTER
на замовлення 145 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1517.18 грн |
| 10+ | 1271.75 грн |
| 25+ | 1036.70 грн |
| 50+ | 987.30 грн |
| 100+ | 940.18 грн |
| 250+ | 867.97 грн |
| 462+ | 846.69 грн |
| 25-0513-10 |
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Виробник: Aries Electronics
IC & Component Sockets 25P SOLDER TAIL TIN
IC & Component Sockets 25P SOLDER TAIL TIN
на замовлення 171 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 279.32 грн |
| 10+ | 229.88 грн |
| 25+ | 197.61 грн |
| 100+ | 170.25 грн |
| 250+ | 168.73 грн |
| 500+ | 153.53 грн |
| 1000+ | 146.69 грн |
| 20-350000-11-RC |
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Виробник: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
IC & Component Sockets SOIC DIP ADAPTER
на замовлення 152 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1931.28 грн |
| 19+ | 1471.03 грн |
| 57+ | 1241.16 грн |
| 114+ | 1183.39 грн |
| 266+ | 1115.75 грн |
| 513+ | 1102.07 грн |
| 40-0518-10 |
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Виробник: Aries Electronics
IC & Component Sockets 40P LO-PRO STRIP TIN
IC & Component Sockets 40P LO-PRO STRIP TIN
на замовлення 216 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 285.52 грн |
| 10+ | 238.62 грн |
| 100+ | 176.33 грн |
| 500+ | 157.33 грн |
| 1000+ | 149.73 грн |
| 2500+ | 148.97 грн |
| 40-6554-10 |
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Виробник: Aries Electronics
IC & Component Sockets 40P TEST SOCKET TIN
IC & Component Sockets 40P TEST SOCKET TIN
на замовлення 166 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1235.20 грн |
| 7+ | 1009.53 грн |
| 28+ | 836.05 грн |
| 56+ | 795.77 грн |
| 105+ | 761.57 грн |
| 252+ | 716.72 грн |
| 504+ | 682.52 грн |
| 28-6554-10 |
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Виробник: Aries Electronics
IC & Component Sockets 28P TEST SOCKET TIN
IC & Component Sockets 28P TEST SOCKET TIN
на замовлення 43 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 966.53 грн |
| 9+ | 776.16 грн |
| 27+ | 655.92 грн |
| 54+ | 624.76 грн |
| 108+ | 595.12 грн |
| 252+ | 560.15 грн |
| 504+ | 534.31 грн |
| 16-675-191 |
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Виробник: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 16-0600-11 |
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Виробник: Aries Electronics
IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT
IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT
на замовлення 317 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 320.11 грн |
| 10+ | 287.56 грн |
| 100+ | 219.65 грн |
| 250+ | 198.37 грн |
| 500+ | 170.25 грн |
| 1000+ | 163.41 грн |
| 2500+ | 160.37 грн |
| 16-810-90C |
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Виробник: Aries Electronics
IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS
IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS
на замовлення 44 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1044.56 грн |
| 10+ | 933.49 грн |
| 25+ | 748.65 грн |
| 100+ | 611.08 грн |
| 250+ | 566.23 грн |
| 500+ | 545.71 грн |
| 1000+ | 524.43 грн |
| 48-3552-11 |
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Виробник: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 1108800 |
![]() |
Виробник: Aries Electronics
IC & Component Sockets OSCILLATOR HALF 4PIN
IC & Component Sockets OSCILLATOR HALF 4PIN
на замовлення 654 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 70.23 грн |
| 10+ | 57.77 грн |
| 25+ | 42.79 грн |
| 98+ | 40.36 грн |
| 294+ | 38.15 грн |
| 539+ | 36.41 грн |
| 1029+ | 34.81 грн |
| 16-3518-10 |
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Виробник: Aries Electronics
IC & Component Sockets 16P SOLDER TIN/GLD
IC & Component Sockets 16P SOLDER TIN/GLD
на замовлення 960 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 24+ | 83.88 грн |
| 120+ | 80.41 грн |
| 264+ | 64.22 грн |
| 504+ | 61.11 грн |
| 1008+ | 59.21 грн |
| 2520+ | 56.47 грн |
| 5016+ | 56.24 грн |
| 16-600-10 |
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Виробник: Aries Electronics
IC & Component Sockets 16P FORK DIP HDR
IC & Component Sockets 16P FORK DIP HDR
на замовлення 278 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 183.55 грн |
| 10+ | 145.97 грн |
| 115+ | 110.21 грн |
| 506+ | 100.33 грн |
| 1012+ | 95.77 грн |
| 5014+ | 86.65 грн |
| 24-350000-11-RC |
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Виробник: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
IC & Component Sockets SOIC DIP ADAPTER
на замовлення 209 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2081.13 грн |
| 10+ | 1748.98 грн |
| 25+ | 1459.29 грн |
| 48+ | 1398.49 грн |
| 112+ | 1344.52 грн |
| 256+ | 1306.52 грн |
| 08-600-11 |
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Виробник: Aries Electronics
IC & Component Sockets 8P DIP FORK HDR GLD
IC & Component Sockets 8P DIP FORK HDR GLD
на замовлення 572 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 44+ | 140.10 грн |
| 88+ | 118.00 грн |
| 528+ | 95.01 грн |
| 1012+ | 80.56 грн |
| 2508+ | 75.70 грн |
| 5016+ | 72.13 грн |
| 10032+ | 70.61 грн |
| 08-3518-00 |
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Виробник: Aries Electronics
IC & Component Sockets 8P SMD SCKT TIN/GOLD
IC & Component Sockets 8P SMD SCKT TIN/GOLD
на замовлення 798 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 140.99 грн |
| 10+ | 125.86 грн |
| 25+ | 99.57 грн |
| 50+ | 96.53 грн |
| 100+ | 93.49 грн |
| 250+ | 88.17 грн |
| 500+ | 84.37 грн |
| 14-600-10 |
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Виробник: Aries Electronics
IC & Component Sockets 14P FORK DIP HDR
IC & Component Sockets 14P FORK DIP HDR
товару немає в наявності
В кошику
од. на суму грн.
| 18-650-10 |
![]() |
Виробник: Aries Electronics
IC & Component Sockets 18P DIP CVR HT .270" MAX COMP HT .125"
IC & Component Sockets 18P DIP CVR HT .270" MAX COMP HT .125"
товару немає в наявності
В кошику
од. на суму грн.
| 20-3518-10 |
![]() |
Виробник: Aries Electronics
IC & Component Sockets 20P SOLDER TIN/GLD
IC & Component Sockets 20P SOLDER TIN/GLD
на замовлення 57 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 19+ | 92.22 грн |
| 57+ | 89.15 грн |
| 114+ | 75.17 грн |
| 266+ | 69.32 грн |
| 1007+ | 64.83 грн |
| 2508+ | 62.55 грн |




















