Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15979) > Сторінка 131 з 267
| Фото | Назва | Виробник | Інформація |
Доступність |
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| 84-PRS11010-12 | Aries Electronics |
Description: ZIF 11X11 84PIN FOOTPRN 11010 Features: Closed Frame Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 40-6556-30 | Aries Electronics |
Description: 40 POS TEST SOCK RECEPT SOLDER Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Wire Wrap Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 16-822-90E | Aries Electronics |
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6 Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 108-PRS12024-12 | Aries Electronics |
Description: CONN SOCKET PGA ZIF GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 20-6513-10 | Aries Electronics |
Description: IC SOCK COLLET CT 20 PIN GOLD Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 32-8800-610C | Aries Electronics |
Description: CONN ELEVATOR SOCKET 32 PIN .600 Features: Closed Frame, Elevated Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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LCQT-TSOP40 | Aries Electronics |
Description: SOCKET ADAPTER TSOP TO 40DIPPackaging: Tube Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LCQT-TSOP40-1 | Aries Electronics |
Description: SOCKET ADAPTER TSOP TO 40DIPPackaging: Tube Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| 06-2503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 06-2503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SP200 | Aries Electronics |
Description: PLUG SHORTING INSULATED BLACKPackaging: Bulk Gender: Male Pins Contact Finish: Gold Color: Black Current Rating (Amps): 5A Pitch: 0.200" (5.08mm) Type: Closed Top, Grip Height: 0.480" (12.20mm) Number of Positions or Pins (Grid): 2 (1 x 2) Contact Finish Thickness: 10.0µin (0.25µm) Material Flammability Rating: UL94 V-0 Housing Material: Polyamide (PA46), Nylon 4/6 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| 181-PRS15006-12 | Aries Electronics |
Description: CONN SOCKET PGA ZIF GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 225-PRS15001-16 | Aries Electronics |
Description: CONN SOCKET PGA ZIF GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 200°C Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Bronze Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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08-2503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
на замовлення 121 шт: термін постачання 21-31 дні (днів) |
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| 08-2503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 08-2503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 08-2503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 20-555000-00 | Aries Electronics |
Description: SOCKET ADAPTER SSOP/SOWIC 20POS Packaging: Bulk Number of Pins: 20 Mounting Type: Surface Mount Convert From (Adapter End): SSOP Convert To (Adapter End): SOWIC Termination: Solder Pitch - Mating: 0.026" (0.65mm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Board Material: FR4 Epoxy Glass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 62-PRS21031-12 | Aries Electronics |
Description: SOCKET Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 62 Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-350003-10-P | Aries Electronics |
Description: ADAPTER BREAKOUT BOARDS Packaging: Bulk Size / Dimension: 0.700" L x 0.380" W (17.78mm x 9.65mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC, SOJ |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-350003-10 | Aries Electronics |
Description: ADAPTER BREAKOUT BOARDS Packaging: Bulk Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.300" (7.62mm) Board Thickness: 0.062" (1.57mm) Proto Board Type: SOIC to DIP Package Accepted: SOIC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-350003-11-RC | Aries Electronics |
Description: ADAPTER BREAKOUT BOARDS Packaging: Bulk Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.300" (7.62mm) Board Thickness: 0.062" (1.57mm) Proto Board Type: SOIC to DIP Package Accepted: SOIC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 40-600-20 | Aries Electronics |
Description: CONN HDR DIP POST 40POS TIN Packaging: Bulk Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 40 Pitch: 0.100" (2.54mm) Contact Type: Post Row Spacing: 0.600" (15.24mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 28-653000-11-RC-P | Aries Electronics |
Description: SOCKET ADAPTER Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 56-PGM09008-10 | Aries Electronics |
Description: SOCKET Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 56 Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 56-PGM09009-10 | Aries Electronics |
Description: SOCKET Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 56 Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 184-PRS15075-12 | Aries Electronics |
Description: SOCKET Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -65°C ~ 125°C Number of Positions or Pins (Grid): 184 Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 108-PGM12004-11H | Aries Electronics |
Description: SOCKET Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 108 Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-6501-30 | Aries Electronics |
Description: .6 WW SOCKET Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 208-PGM17059-10 | Aries Electronics |
Description: SOCKET Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 208 Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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ME-100 | Aries Electronics |
Headers & Wire Housings Economy Mini-Link |
на замовлення 20693 шт: термін постачання 21-30 дні (днів) |
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ML-100 | Aries Electronics |
Headers & Wire Housings MINILINK MINI JUMPER |
на замовлення 802 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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ML-100S | Aries Electronics |
Headers & Wire Housings .10 JUMPER CLOSED Au |
на замовлення 352 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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20-680-191T | Aries Electronics |
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS |
на замовлення 100 шт: термін постачання 21-30 дні (днів) |
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| 14-675-190T | Aries Electronics |
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS |
на замовлення 1 шт: термін постачання 21-30 дні (днів) |
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20-680-191TC | Aries Electronics |
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| 14-675-191 | Aries Electronics |
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-675-191T | Aries Electronics |
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-675-190 | Aries Electronics |
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-675-191TC | Aries Electronics |
IC & Component Sockets |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 14-9625-11 | Aries Electronics |
IC & Component Sockets |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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16-350000-11-RC | Aries Electronics |
IC & Component Sockets SOIC 16-PIN DIP ADAPTER |
на замовлення 371 шт: термін постачання 21-30 дні (днів) |
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28-6554-11 | Aries Electronics |
IC & Component Sockets 28 PIN W/HANDLE |
на замовлення 42 шт: термін постачання 21-30 дні (днів) |
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08-3518-10 | Aries Electronics |
IC & Component Sockets 8P SOLDER TIN/GLD |
на замовлення 1372 шт: термін постачання 21-30 дні (днів) |
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40-6518-10 | Aries Electronics |
IC & Component Sockets 40P SOLDER TIN/GLD |
на замовлення 389 шт: термін постачання 21-30 дні (днів) |
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14-3518-10 | Aries Electronics |
IC & Component Sockets 14P SOLDER TIN/GLD |
на замовлення 396 шт: термін постачання 21-30 дні (днів) |
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10-4823-90C | Aries Electronics |
IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS |
на замовлення 118 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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14-350000-11-RC | Aries Electronics |
IC & Component Sockets SOIC DIP ADAPTER |
на замовлення 145 шт: термін постачання 21-30 дні (днів) |
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25-0513-10 | Aries Electronics |
IC & Component Sockets 25P SOLDER TAIL TIN |
на замовлення 71 шт: термін постачання 21-30 дні (днів) |
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20-350000-11-RC | Aries Electronics |
IC & Component Sockets SOIC DIP ADAPTER |
на замовлення 152 шт: термін постачання 21-30 дні (днів) |
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40-0518-10 | Aries Electronics |
IC & Component Sockets 40P LO-PRO STRIP TIN |
на замовлення 47 шт: термін постачання 21-30 дні (днів) |
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40-6554-10 | Aries Electronics |
IC & Component Sockets 40P TEST SOCKET TIN |
на замовлення 38 шт: термін постачання 21-30 дні (днів) |
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28-6554-10 | Aries Electronics |
IC & Component Sockets 28P TEST SOCKET TIN |
на замовлення 115 шт: термін постачання 21-30 дні (днів) |
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16-675-191 | Aries Electronics |
Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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16-0600-11 | Aries Electronics |
IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT |
на замовлення 294 шт: термін постачання 21-30 дні (днів) |
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16-810-90C | Aries Electronics |
IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS |
на замовлення 44 шт: термін постачання 21-30 дні (днів) |
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48-3552-11 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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1108800 | Aries Electronics |
IC & Component Sockets OSCILLATOR HALF 4PIN |
на замовлення 654 шт: термін постачання 21-30 дні (днів) |
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16-3518-10 | Aries Electronics |
IC & Component Sockets 16P SOLDER TIN/GLD |
на замовлення 2040 шт: термін постачання 21-30 дні (днів) |
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16-600-10 | Aries Electronics |
IC & Component Sockets 16P FORK DIP HDR |
на замовлення 268 шт: термін постачання 21-30 дні (днів) |
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| 84-PRS11010-12 |
Виробник: Aries Electronics
Description: ZIF 11X11 84PIN FOOTPRN 11010
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: ZIF 11X11 84PIN FOOTPRN 11010
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.
| 40-6556-30 |
Виробник: Aries Electronics
Description: 40 POS TEST SOCK RECEPT SOLDER
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 40 POS TEST SOCK RECEPT SOLDER
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 16-822-90E |
Виробник: Aries Electronics
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Description: 16 PIN RT ANGLE HORIZONTAL SOCKT
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: 105°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 108-PRS12024-12 |
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Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.
| 20-6513-10 |
Виробник: Aries Electronics
Description: IC SOCK COLLET CT 20 PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: IC SOCK COLLET CT 20 PIN GOLD
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 32-8800-610C |
Виробник: Aries Electronics
Description: CONN ELEVATOR SOCKET 32 PIN .600
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN ELEVATOR SOCKET 32 PIN .600
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| LCQT-TSOP40 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
товару немає в наявності
В кошику
од. на суму грн.
| LCQT-TSOP40-1 |
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Виробник: Aries Electronics
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: SOCKET ADAPTER TSOP TO 40DIP
Packaging: Tube
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
товару немає в наявності
В кошику
од. на суму грн.
| 06-2503-30 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 06-2503-31 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| SP200 |
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Виробник: Aries Electronics
Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
Description: PLUG SHORTING INSULATED BLACK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Color: Black
Current Rating (Amps): 5A
Pitch: 0.200" (5.08mm)
Type: Closed Top, Grip
Height: 0.480" (12.20mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 10.0µin (0.25µm)
Material Flammability Rating: UL94 V-0
Housing Material: Polyamide (PA46), Nylon 4/6
товару немає в наявності
В кошику
од. на суму грн.
| 181-PRS15006-12 |
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Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.
| 225-PRS15001-16 |
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Виробник: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.
| 08-2503-30 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
на замовлення 121 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 348.53 грн |
| 10+ | 285.16 грн |
| 25+ | 267.31 грн |
| 50+ | 238.85 грн |
| 100+ | 227.44 грн |
| 08-2503-20 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 08-2503-21 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 08-2503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 20-555000-00 |
Виробник: Aries Electronics
Description: SOCKET ADAPTER SSOP/SOWIC 20POS
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
Description: SOCKET ADAPTER SSOP/SOWIC 20POS
Packaging: Bulk
Number of Pins: 20
Mounting Type: Surface Mount
Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Termination: Solder
Pitch - Mating: 0.026" (0.65mm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Board Material: FR4 Epoxy Glass
товару немає в наявності
В кошику
од. на суму грн.
| 62-PRS21031-12 |
Виробник: Aries Electronics
Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 62
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 62
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.
| 14-350003-10-P |
Виробник: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 0.700" L x 0.380" W (17.78mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOJ
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 0.700" L x 0.380" W (17.78mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOJ
товару немає в наявності
В кошику
од. на суму грн.
| 14-350003-10 |
Виробник: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
товару немає в наявності
В кошику
од. на суму грн.
| 14-350003-11-RC |
Виробник: Aries Electronics
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
Description: ADAPTER BREAKOUT BOARDS
Packaging: Bulk
Size / Dimension: 14.000" L x 0.380" W (355.60mm x 9.65mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.300" (7.62mm)
Board Thickness: 0.062" (1.57mm)
Proto Board Type: SOIC to DIP
Package Accepted: SOIC
товару немає в наявності
В кошику
од. на суму грн.
| 40-600-20 |
Виробник: Aries Electronics
Description: CONN HDR DIP POST 40POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 40
Pitch: 0.100" (2.54mm)
Contact Type: Post
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
Description: CONN HDR DIP POST 40POS TIN
Packaging: Bulk
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 40
Pitch: 0.100" (2.54mm)
Contact Type: Post
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
| 56-PGM09008-10 |
Виробник: Aries Electronics
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 56-PGM09009-10 |
Виробник: Aries Electronics
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 56
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 184-PRS15075-12 |
Виробник: Aries Electronics
Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 184
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Number of Positions or Pins (Grid): 184
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.
| 108-PGM12004-11H |
Виробник: Aries Electronics
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 108
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 108
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| 14-6501-30 |
Виробник: Aries Electronics
Description: .6 WW SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: .6 WW SOCKET
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 208-PGM17059-10 |
Виробник: Aries Electronics
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 208
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: SOCKET
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 208
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| ME-100 |
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Виробник: Aries Electronics
Headers & Wire Housings Economy Mini-Link
Headers & Wire Housings Economy Mini-Link
на замовлення 20693 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 22+ | 16.77 грн |
| 31+ | 11.64 грн |
| 100+ | 8.42 грн |
| 500+ | 8.04 грн |
| 1000+ | 6.49 грн |
| 2000+ | 5.95 грн |
| 10000+ | 5.87 грн |
| ML-100 |
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Виробник: Aries Electronics
Headers & Wire Housings MINILINK MINI JUMPER
Headers & Wire Housings MINILINK MINI JUMPER
на замовлення 802 шт:
термін постачання 21-30 дні (днів)В кошику од. на суму грн.
| ML-100S |
![]() |
Виробник: Aries Electronics
Headers & Wire Housings .10 JUMPER CLOSED Au
Headers & Wire Housings .10 JUMPER CLOSED Au
на замовлення 352 шт:
термін постачання 21-30 дні (днів)В кошику од. на суму грн.
| 20-680-191T |
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Виробник: Aries Electronics
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
на замовлення 100 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 146.03 грн |
| 10+ | 138.61 грн |
| 100+ | 105.85 грн |
| 500+ | 87.31 грн |
| 1000+ | 83.45 грн |
| 2500+ | 80.36 грн |
| 5000+ | 78.04 грн |
| 14-675-190T |
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Виробник: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
на замовлення 1 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 194.71 грн |
| 10+ | 156.39 грн |
| 104+ | 131.35 грн |
| 520+ | 119.76 грн |
| 1014+ | 106.63 грн |
| 2522+ | 99.67 грн |
| 5018+ | 94.26 грн |
| 20-680-191TC |
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Виробник: Aries Electronics
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
Headers & Wire Housings PROGRAM HEADER/COVER 20 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 14-675-191 |
![]() |
Виробник: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 14-675-191T |
![]() |
Виробник: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 14-675-190 |
![]() |
Виробник: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 14 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 14-675-191TC |
![]() |
Виробник: Aries Electronics
IC & Component Sockets
IC & Component Sockets
товару немає в наявності
В кошику
од. на суму грн.
| 14-9625-11 |
![]() |
Виробник: Aries Electronics
IC & Component Sockets
IC & Component Sockets
товару немає в наявності
В кошику
од. на суму грн.
| 16-350000-11-RC |
![]() |
Виробник: Aries Electronics
IC & Component Sockets SOIC 16-PIN DIP ADAPTER
IC & Component Sockets SOIC 16-PIN DIP ADAPTER
на замовлення 371 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2371.68 грн |
| 10+ | 1986.81 грн |
| 24+ | 1649.63 грн |
| 48+ | 1596.31 грн |
| 120+ | 1543.00 грн |
| 264+ | 1458.01 грн |
| 504+ | 1415.51 грн |
| 28-6554-11 |
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Виробник: Aries Electronics
IC & Component Sockets 28 PIN W/HANDLE
IC & Component Sockets 28 PIN W/HANDLE
на замовлення 42 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1739.77 грн |
| 9+ | 1397.70 грн |
| 27+ | 1180.62 грн |
| 54+ | 1148.94 грн |
| 108+ | 1147.40 грн |
| 08-3518-10 |
![]() |
Виробник: Aries Electronics
IC & Component Sockets 8P SOLDER TIN/GLD
IC & Component Sockets 8P SOLDER TIN/GLD
на замовлення 1372 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 49+ | 54.72 грн |
| 98+ | 44.34 грн |
| 539+ | 34.77 грн |
| 1029+ | 31.52 грн |
| 40-6518-10 |
![]() |
Виробник: Aries Electronics
IC & Component Sockets 40P SOLDER TIN/GLD
IC & Component Sockets 40P SOLDER TIN/GLD
на замовлення 389 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 429.08 грн |
| 12+ | 374.97 грн |
| 24+ | 296.70 грн |
| 60+ | 282.02 грн |
| 108+ | 273.52 грн |
| 14-3518-10 |
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Виробник: Aries Electronics
IC & Component Sockets 14P SOLDER TIN/GLD
IC & Component Sockets 14P SOLDER TIN/GLD
на замовлення 396 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 137.92 грн |
| 10+ | 87.61 грн |
| 112+ | 62.28 грн |
| 504+ | 59.42 грн |
| 1008+ | 56.40 грн |
| 2520+ | 51.85 грн |
| 10-4823-90C |
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Виробник: Aries Electronics
IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS
IC & Component Sockets VERTISOCKETS HORIZ COLLET 10 PINS
на замовлення 118 шт:
термін постачання 21-30 дні (днів)В кошику од. на суму грн.
| 14-350000-11-RC |
![]() |
Виробник: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
IC & Component Sockets SOIC DIP ADAPTER
на замовлення 145 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1542.36 грн |
| 10+ | 1292.85 грн |
| 25+ | 1053.91 грн |
| 50+ | 1003.68 грн |
| 100+ | 955.78 грн |
| 250+ | 882.38 грн |
| 462+ | 860.74 грн |
| 25-0513-10 |
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Виробник: Aries Electronics
IC & Component Sockets 25P SOLDER TAIL TIN
IC & Component Sockets 25P SOLDER TAIL TIN
на замовлення 71 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 365.08 грн |
| 10+ | 327.88 грн |
| 25+ | 269.66 грн |
| 50+ | 263.48 грн |
| 100+ | 251.11 грн |
| 250+ | 219.44 грн |
| 500+ | 210.94 грн |
| 20-350000-11-RC |
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Виробник: Aries Electronics
IC & Component Sockets SOIC DIP ADAPTER
IC & Component Sockets SOIC DIP ADAPTER
на замовлення 152 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1963.33 грн |
| 19+ | 1495.44 грн |
| 57+ | 1261.75 грн |
| 114+ | 1203.03 грн |
| 266+ | 1134.26 грн |
| 513+ | 1120.36 грн |
| 40-0518-10 |
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Виробник: Aries Electronics
IC & Component Sockets 40P LO-PRO STRIP TIN
IC & Component Sockets 40P LO-PRO STRIP TIN
на замовлення 47 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 342.55 грн |
| 10+ | 287.00 грн |
| 100+ | 211.71 грн |
| 500+ | 188.53 грн |
| 1000+ | 180.03 грн |
| 2500+ | 176.17 грн |
| 40-6554-10 |
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Виробник: Aries Electronics
IC & Component Sockets 40P TEST SOCKET TIN
IC & Component Sockets 40P TEST SOCKET TIN
на замовлення 38 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1567.60 грн |
| 7+ | 1339.94 грн |
| 28+ | 1104.13 грн |
| 56+ | 1087.90 грн |
| 105+ | 960.41 грн |
| 252+ | 895.51 грн |
| 504+ | 876.20 грн |
| 28-6554-10 |
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Виробник: Aries Electronics
IC & Component Sockets 28P TEST SOCKET TIN
IC & Component Sockets 28P TEST SOCKET TIN
на замовлення 115 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1179.08 грн |
| 9+ | 1006.74 грн |
| 27+ | 830.61 грн |
| 54+ | 818.25 грн |
| 108+ | 722.44 грн |
| 252+ | 673.76 грн |
| 504+ | 659.08 грн |
| 16-675-191 |
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Виробник: Aries Electronics
Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS
Headers & Wire Housings DIP PROGRAM HEADERS 16 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 16-0600-11 |
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Виробник: Aries Electronics
IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT
IC & Component Sockets STRIP LINE 16 PINS COINED CONTACT
на замовлення 294 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 397.53 грн |
| 10+ | 263.90 грн |
| 50+ | 192.39 грн |
| 250+ | 177.71 грн |
| 500+ | 176.17 грн |
| 16-810-90C |
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Виробник: Aries Electronics
IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS
IC & Component Sockets VERTISOCKETS VERT COLLET 16 PINS
на замовлення 44 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1061.89 грн |
| 10+ | 948.98 грн |
| 25+ | 761.07 грн |
| 100+ | 621.22 грн |
| 250+ | 575.63 грн |
| 500+ | 554.77 грн |
| 1000+ | 533.13 грн |
| 48-3552-11 |
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Виробник: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
товару немає в наявності
В кошику
од. на суму грн.
| 1108800 |
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Виробник: Aries Electronics
IC & Component Sockets OSCILLATOR HALF 4PIN
IC & Component Sockets OSCILLATOR HALF 4PIN
на замовлення 654 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 71.39 грн |
| 10+ | 58.73 грн |
| 25+ | 43.50 грн |
| 98+ | 41.03 грн |
| 294+ | 38.79 грн |
| 539+ | 37.01 грн |
| 1029+ | 35.39 грн |
| 16-3518-10 |
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Виробник: Aries Electronics
IC & Component Sockets 16P SOLDER TIN/GLD
IC & Component Sockets 16P SOLDER TIN/GLD
на замовлення 2040 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 24+ | 124.40 грн |
| 48+ | 119.96 грн |
| 120+ | 99.67 грн |
| 264+ | 89.63 грн |
| 504+ | 83.45 грн |
| 1008+ | 71.78 грн |
| 2520+ | 67.76 грн |
| 16-600-10 |
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Виробник: Aries Electronics
IC & Component Sockets 16P FORK DIP HDR
IC & Component Sockets 16P FORK DIP HDR
на замовлення 268 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 231.67 грн |
| 10+ | 207.92 грн |
| 23+ | 170.76 грн |
| 46+ | 166.89 грн |
| 115+ | 159.17 грн |
| 253+ | 139.08 грн |
| 506+ | 135.22 грн |

















