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14-003.5-181B Aries Electronics 11019-pin-staked-flex-jumpers.pdf Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Length: 3.50" (88.90mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
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14-003-181B Aries Electronics 11019-pin-staked-flex-jumpers.pdf Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
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14-004-181B Aries Electronics 11019-pin-staked-flex-jumpers.pdf Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Part Status: Active
Pitch: 0.100" (2.54mm)
Length: 4.00" (101.60mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
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16-002.5-182D Aries Electronics 11019-pin-staked-flex-jumpers.pdf Description: PIN-STAKED FLEX JUMPER 16POS
Packaging: Bulk
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 2.50" (63.50mm)
Contact Termination: Receptacle to Solder Tab
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16-002-182D Aries Electronics 11019-pin-staked-flex-jumpers.pdf Description: PIN-STAKED FLEX JUMPER 16POS
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 2.00" (50.80mm)
Contact Termination: Receptacle to Solder Tab
Packaging: Bulk
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16-003-182D Aries Electronics 11019-pin-staked-flex-jumpers.pdf Description: PIN-STAKED FLEX JUMPER 16POS
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Receptacle to Solder Tab
Packaging: Bulk
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20-003-181B Aries Electronics 11019-pin-staked-flex-jumpers.pdf Description: PIN-STAKED FLEX JUMPER 20POS
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
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30-002.5-181A Aries Electronics 11019-pin-staked-flex-jumpers.pdf Description: PIN-STAKED FLEX JUMPER 30POS
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30-002-181A Aries Electronics 11019-pin-staked-flex-jumpers.pdf Description: PIN-STAKED FLEX JUMPER 30POS
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32-003-181B Aries Electronics 11019-pin-staked-flex-jumpers.pdf Description: PIN-STAKED FLEX JUMPER 32POS
Number of Positions: 32
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
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08-3511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
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08-3511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
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08-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
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08-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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10-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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14-6511-10 14-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
1+331.55 грн
10+271.65 грн
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14-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
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16-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
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16-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
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14-3511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
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В кошику  од. на суму  грн.
14-3511-10WR Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
14-3511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
14-3511-11WR Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
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18-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
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16-3511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
16-3511-10WR Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
16-3511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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В кошику  од. на суму  грн.
16-6511-11WR Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
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18-3511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
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18-3511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
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24-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 24POS TIN
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24-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
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20-3511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
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20-3511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
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20-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
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20-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
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28-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 28POS TIN
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28-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
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32-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 32POS TIN
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32-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
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34-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 34POS TIN
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34-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 34POS GOLD
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36-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 36POS TIN
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36-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 36POS GOLD
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38-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 38POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 38 (2 x 19)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
38-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 38POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 38 (2 x 19)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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40-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 40POS TIN
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40-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
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48-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 48POS TIN
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48-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
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08-2511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
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08-2511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
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10-2511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
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22-4511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 22POS TIN
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22-4511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
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22-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 22POS TIN
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22-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 22POS GOLD
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30-6511-10 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 30POS TIN
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30-6511-11 Aries Electronics 12004-dip-test-socket.pdf Description: CONN IC DIP SOCKET 30POS GOLD
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08-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
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14-003.5-181B 11019-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Length: 3.50" (88.90mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
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14-003-181B 11019-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
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14-004-181B 11019-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 14POS
Number of Positions: 14
Part Status: Active
Pitch: 0.100" (2.54mm)
Length: 4.00" (101.60mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
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16-002.5-182D 11019-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 16POS
Packaging: Bulk
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 2.50" (63.50mm)
Contact Termination: Receptacle to Solder Tab
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16-002-182D 11019-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 16POS
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 2.00" (50.80mm)
Contact Termination: Receptacle to Solder Tab
Packaging: Bulk
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16-003-182D 11019-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 16POS
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Receptacle to Solder Tab
Packaging: Bulk
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20-003-181B 11019-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 20POS
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
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30-002.5-181A 11019-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 30POS
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30-002-181A 11019-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 30POS
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32-003-181B 11019-pin-staked-flex-jumpers.pdf
Виробник: Aries Electronics
Description: PIN-STAKED FLEX JUMPER 32POS
Number of Positions: 32
Pitch: 0.100" (2.54mm)
Length: 3.00" (76.20mm)
Contact Termination: Solder Tab to Solder Tab
Packaging: Bulk
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08-3511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
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08-3511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
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08-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
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В кошику  од. на суму  грн.
08-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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10-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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14-6511-10 12004-dip-test-socket.pdf
14-6511-10
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+331.55 грн
10+271.65 грн
В кошику  од. на суму  грн.
14-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
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В кошику  од. на суму  грн.
16-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
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В кошику  од. на суму  грн.
16-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
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В кошику  од. на суму  грн.
14-3511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
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В кошику  од. на суму  грн.
14-3511-10WR 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
14-3511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
14-3511-11WR 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
товару немає в наявності
В кошику  од. на суму  грн.
18-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
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В кошику  од. на суму  грн.
16-3511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
16-3511-10WR 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
16-3511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
16-6511-11WR 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
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В кошику  од. на суму  грн.
18-3511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
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В кошику  од. на суму  грн.
18-3511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
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В кошику  од. на суму  грн.
24-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS TIN
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В кошику  од. на суму  грн.
24-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
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В кошику  од. на суму  грн.
20-3511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
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В кошику  од. на суму  грн.
20-3511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
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В кошику  од. на суму  грн.
20-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
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В кошику  од. на суму  грн.
20-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
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В кошику  од. на суму  грн.
28-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS TIN
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В кошику  од. на суму  грн.
28-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
В кошику  од. на суму  грн.
32-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS TIN
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В кошику  од. на суму  грн.
32-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
34-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
34-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
36-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
36-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
38-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 38 (2 x 19)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
38-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 38 (2 x 19)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
40-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
40-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
48-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
48-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
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08-2511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
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08-2511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
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10-2511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
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22-4511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS TIN
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22-4511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
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22-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS TIN
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В кошику  од. на суму  грн.
22-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
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30-6511-10 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS TIN
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В кошику  од. на суму  грн.
30-6511-11 12004-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
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08-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
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