Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15982) > Сторінка 60 з 267

Обрати Сторінку:   [  << Попередня Сторінка ]  1 26 52 55 56 57 58 59 60 61 62 63 64 65 78 104 130 156 182 208 234 260 267  [ Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
08-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
10-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
10-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
10-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
10-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
14-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
14-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
14-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
16-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
16-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
16-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
16-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
18-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
18-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
18-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
18-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
24-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
24-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
28-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
28-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 28POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
28-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
32-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
32-6501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
40-6501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
40-6501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
40-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-2501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
08-2501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-2501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
08-2501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-3501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
08-3501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-3501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
08-3501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-6501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
10-2501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
10-2501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
10-2501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
10-2501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
товару немає в наявності
В кошику  од. на суму  грн.
1109822 Aries Electronics 12005-dip-test-socket.pdf Description: 501 DIP TEST SCKT SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
14-3501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
14-3501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
14-3501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
14-3501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
14-3501-40 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
16-3501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
16-3501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
товару немає в наявності
В кошику  од. на суму  грн.
16-3501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
товару немає в наявності
В кошику  од. на суму  грн.
16-3501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
18-3501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
18-3501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
товару немає в наявності
В кошику  од. на суму  грн.
18-3501-30 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
товару немає в наявності
В кошику  од. на суму  грн.
18-3501-31 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
товару немає в наявності
В кошику  од. на суму  грн.
20-3501-20 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 20POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
20-3501-21 Aries Electronics 12005-dip-test-socket.pdf Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
10-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
10-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
10-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
10-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
14-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
14-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
14-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
16-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
16-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
16-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
16-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
18-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
18-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
18-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
18-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
24-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
24-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
24-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
28-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
28-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
28-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
32-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
32-6501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
32-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
40-6501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
40-6501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
40-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-2501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
08-2501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-2501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
08-2501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-3501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
08-3501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-3501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
08-3501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
08-6501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
10-2501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
10-2501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
10-2501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
10-2501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
товару немає в наявності
В кошику  од. на суму  грн.
1109822 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: 501 DIP TEST SCKT SOLDER TAIL
товару немає в наявності
В кошику  од. на суму  грн.
14-3501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
14-3501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
14-3501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
В кошику  од. на суму  грн.
14-3501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
14-3501-40 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 14POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
16-3501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
16-3501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
товару немає в наявності
В кошику  од. на суму  грн.
16-3501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS TIN
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
товару немає в наявності
В кошику  од. на суму  грн.
16-3501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 16POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
18-3501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
18-3501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
товару немає в наявності
В кошику  од. на суму  грн.
18-3501-30 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS TIN
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
товару немає в наявності
В кошику  од. на суму  грн.
18-3501-31 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 18POS GOLD
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
товару немає в наявності
В кошику  од. на суму  грн.
20-3501-20 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS TIN
товару немає в наявності
В кошику  од. на суму  грн.
20-3501-21 12005-dip-test-socket.pdf
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
Обрати Сторінку:   [  << Попередня Сторінка ]  1 26 52 55 56 57 58 59 60 61 62 63 64 65 78 104 130 156 182 208 234 260 267  [ Наступна Сторінка >> ]