Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15970) > Сторінка 76 з 267
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 22-3503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-3503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-3503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-4503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-4503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-4503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-4503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-6503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-6503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-6503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 22-6503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-3503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-3503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-3503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-3503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-6503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-6503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-6503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 24-6503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 26-3503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 26 (2 x 13) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 26-3503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 26 (2 x 13) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 26-3503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 26 (2 x 13) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 26-3503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 26POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 26 (2 x 13) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-3503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-3503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-3503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-3503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-6503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-6503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-6503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 28-6503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-3503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-3503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-3503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-3503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-6503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 30 (2 x 15) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-6503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 30 (2 x 15) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-6503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 30 (2 x 15) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-6503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 30 (2 x 15) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-9503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-9503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-9503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 30-9503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-3503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-3503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-3503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-3503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-6503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-6503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-6503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-6503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-9503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-9503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-9503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 32-9503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 32POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. | |
| 34-3503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 34-3503-21 | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 34-3503-30 | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 34-3503-31 | Aries Electronics |
Description: CONN IC DIP SOCKET 34POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |
| 36-3503-20 | Aries Electronics |
Description: CONN IC DIP SOCKET 36POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Wire Wrap Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Phosphor Bronze |
товару немає в наявності |
В кошику од. на суму грн. |
| 22-3503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-3503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-3503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-4503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-4503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-4503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-4503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-6503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-6503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-6503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 22-6503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 24-3503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 24-3503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 24-3503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 24-3503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 24-6503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 24-6503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 24-6503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 24-6503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 26-3503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 26-3503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 26-3503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 26-3503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 28-3503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 28-3503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 28-3503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 28-3503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 28-6503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 28-6503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 28-6503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 28-6503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-3503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-3503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-3503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-3503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-6503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 30-6503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 30-6503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 30-6503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 30-9503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-9503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-9503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 30-9503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 30POS GOLD
Description: CONN IC DIP SOCKET 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 32-3503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 32-3503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 32-3503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 32-3503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 32-6503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 32-6503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 32-6503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 32-6503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 32-9503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 32-9503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 32-9503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 32-9503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
| 34-3503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Description: CONN IC DIP SOCKET 34POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 34-3503-21 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Description: CONN IC DIP SOCKET 34POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 34-3503-30 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Description: CONN IC DIP SOCKET 34POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 34-3503-31 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 34POS GOLD
Description: CONN IC DIP SOCKET 34POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 36-3503-20 |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
товару немає в наявності
В кошику
од. на суму грн.
