Продукція > HARWIN INC. > Всі товари виробника HARWIN INC. (13149) > Сторінка 33 з 220
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| D01-9971742 | Harwin Inc. |
Description: CONN SOCKET SIP 17POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D01-9971842 | Harwin Inc. |
Description: CONN SOCKET SIP 18POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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D01-9971942 | Harwin Inc. |
Description: CONN SOCKET SIP 19POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 19 (1 x 19) Operating Temperature: -55°C ~ 125°C Type: SIP Mounting Type: Through Hole Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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D01-9972042 | Harwin Inc. |
Description: CONN SOCKET SIP 20POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
на замовлення 17050 шт: термін постачання 21-31 дні (днів) |
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| D01-9972142 | Harwin Inc. |
Description: CONN SOCKET SIP 21POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D01-9972242 | Harwin Inc. |
Description: CONN SOCKET SIP 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D01-9972342 | Harwin Inc. |
Description: CONN SOCKET SIP 23POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D01-9972442 | Harwin Inc. |
Description: CONN SOCKET SIP 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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D01-9972542 | Harwin Inc. |
Description: CONN SOCKET SIP 25POS GOLDMounting Type: Through Hole Packaging: Tube Contact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 25 (1 x 25) Operating Temperature: -55°C ~ 125°C Type: SIP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| D01-9972642 | Harwin Inc. |
Description: CONN SOCKET SIP 26POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D01-9972742 | Harwin Inc. |
Description: CONN SOCKET SIP 27POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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D01-9972842 | Harwin Inc. |
Description: CONN SOCKET SIP 28POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (1 x 28) Operating Temperature: -55°C ~ 125°C Type: SIP Mounting Type: Through Hole Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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D01-9972942 | Harwin Inc. |
Description: CONN SOCKET SIP 29POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 29 (1 x 29) Operating Temperature: -55°C ~ 125°C Type: SIP Mounting Type: Through Hole Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| D01-9973042 | Harwin Inc. |
Description: CONN SOCKET SIP 30POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D01-9973142 | Harwin Inc. |
Description: CONN SOCKET SIP 31POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0724-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0724-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0806-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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D0806-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 6POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| D0808-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 8POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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D0808-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 2115 шт: термін постачання 21-31 дні (днів) |
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| D0814-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 14POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0814-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 14POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0816-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 16POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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D0816-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 16POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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| D0818-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 18POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0818-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 18POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0820-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0820-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0822-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 22POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0822-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0824-01 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0824-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0828-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 28POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0832-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0836-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 36POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D0840-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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D0922-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 22POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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D0924-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| D0948-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 48POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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D2608-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 8POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Press-Fit Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
на замовлення 2340 шт: термін постачання 21-31 дні (днів) |
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| D2614-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 14POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D2616-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 16POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D2620-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 20POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D2624-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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D2628-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 28POS GOLDFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| D2632-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 32POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D2640-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 40POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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D2806-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 6POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Plastic Termination: Solder Number of Positions or Pins (Grid): 6 (2 x 3) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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D2822-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 22POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Plastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
на замовлення 70 шт: термін постачання 21-31 дні (днів) |
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D2832-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 32POS GOLDContact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Plastic Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) |
на замовлення 506 шт: термін постачання 21-31 дні (днів) |
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D2864-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 64POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Plastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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D2922-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 22POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Plastic Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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D2924-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 24POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Plastic Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
на замовлення 2517 шт: термін постачання 21-31 дні (днів) |
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D2928-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 28POS GOLDPart Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Plastic Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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D2948-42 | Harwin Inc. |
Description: CONN IC DIP SOCKET 48POS GOLDFeatures: Open Frame Packaging: Tube Contact Material - Post: Brass Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Plastic Termination: Solder Number of Positions or Pins (Grid): 48 (2 x 24) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| D3080-01 | Harwin Inc. |
Description: 1MM SHORTING LINKContact Finish Thickness: 100.0µin (2.54µm) Number of Positions or Pins (Grid): 2 (1 x 2) Height: 0.359" (9.13mm) Type: Non-Insulated Pitch: 0.200" (5.08mm) Contact Finish: Tin Gender: Male Pins Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| D3081-01 | Harwin Inc. |
Description: 1MM SHORTING LINKPackaging: Bulk Part Status: Obsolete Contact Finish Thickness: 100.0µin (2.54µm) Number of Positions or Pins (Grid): 2 (1 x 2) Height: 0.359" (9.13mm) Type: Non-Insulated Current Rating (Amps): 10A Contact Finish: Tin Gender: Male Pins |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
|
D3081-05 | Harwin Inc. |
Description: 1MM SHORTING LINK GOLDPackaging: Bulk Gender: Male Pins Contact Finish: Gold Current Rating (Amps): 10A Type: Non-Insulated Height: 0.359" (9.13mm) Number of Positions or Pins (Grid): 2 (1 x 2) Contact Finish Thickness: FLASH Part Status: Active |
на замовлення 2647 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| D3082-01 | Harwin Inc. |
Description: 1MM SHORTING LINKPackaging: Bulk Gender: Male Pins Contact Finish: Tin Current Rating (Amps): 10A Pitch: 0.400" (10.16mm) Type: Non-Insulated Height: 0.359" (9.13mm) Number of Positions or Pins (Grid): 2 (1 x 2) Contact Finish Thickness: 100.0µin (2.54µm) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. |
| D01-9971742 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 17POS GOLD
Description: CONN SOCKET SIP 17POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D01-9971842 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 18POS GOLD
Description: CONN SOCKET SIP 18POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D01-9971942 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 19POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 19 (1 x 19)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Packaging: Tube
Description: CONN SOCKET SIP 19POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 19 (1 x 19)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| D01-9972042 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 20POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 20POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
на замовлення 17050 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 142.41 грн |
| 10+ | 116.34 грн |
| 300+ | 91.49 грн |
| 600+ | 81.76 грн |
| 1200+ | 77.86 грн |
| 5100+ | 70.31 грн |
| D01-9972142 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 21POS GOLD
Description: CONN SOCKET SIP 21POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D01-9972242 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 22POS GOLD
Description: CONN SOCKET SIP 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D01-9972342 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 23POS GOLD
Description: CONN SOCKET SIP 23POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D01-9972442 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 24POS GOLD
Description: CONN SOCKET SIP 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D01-9972542 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 25POS GOLD
Mounting Type: Through Hole
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Description: CONN SOCKET SIP 25POS GOLD
Mounting Type: Through Hole
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 25 (1 x 25)
Operating Temperature: -55°C ~ 125°C
Type: SIP
товару немає в наявності
В кошику
од. на суму грн.
| D01-9972642 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 26POS GOLD
Description: CONN SOCKET SIP 26POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D01-9972742 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 27POS GOLD
Description: CONN SOCKET SIP 27POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D01-9972842 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 28POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (1 x 28)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Packaging: Tube
Description: CONN SOCKET SIP 28POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (1 x 28)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| D01-9972942 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 29POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 29 (1 x 29)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Packaging: Tube
Description: CONN SOCKET SIP 29POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 29 (1 x 29)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| D01-9973042 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 30POS GOLD
Description: CONN SOCKET SIP 30POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D01-9973142 |
![]() |
Виробник: Harwin Inc.
Description: CONN SOCKET SIP 31POS GOLD
Description: CONN SOCKET SIP 31POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0724-01 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0724-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0806-01 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Obsolete
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| D0806-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| D0808-01 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Description: CONN IC DIP SOCKET 8POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0808-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 2115 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 155.07 грн |
| 10+ | 127.31 грн |
| 25+ | 119.31 грн |
| 52+ | 106.31 грн |
| 104+ | 101.24 грн |
| 260+ | 94.89 грн |
| 520+ | 88.88 грн |
| 1040+ | 84.64 грн |
| D0814-01 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0814-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0816-01 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0816-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 315.67 грн |
| 10+ | 276.17 грн |
| 25+ | 261.56 грн |
| 50+ | 239.76 грн |
| D0818-01 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0818-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0820-01 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0820-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0822-01 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| D0822-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0824-01 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0824-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0828-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 28POS GOLD
Description: CONN IC DIP SOCKET 28POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0832-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0836-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 36POS GOLD
Description: CONN IC DIP SOCKET 36POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0840-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0922-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 22POS GOLD
Description: CONN IC DIP SOCKET 22POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0924-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D0948-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 48POS GOLD
Description: CONN IC DIP SOCKET 48POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D2608-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Press-Fit
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Press-Fit
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
на замовлення 2340 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 189.09 грн |
| 10+ | 158.62 грн |
| 25+ | 151.82 грн |
| 50+ | 139.32 грн |
| 100+ | 132.99 грн |
| 250+ | 120.33 грн |
| 500+ | 109.01 грн |
| 1000+ | 93.44 грн |
| D2614-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D2616-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D2620-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D2624-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Description: CONN IC DIP SOCKET 24POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D2628-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
товару немає в наявності
В кошику
од. на суму грн.
| D2632-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 32POS GOLD
Description: CONN IC DIP SOCKET 32POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D2640-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 40POS GOLD
Description: CONN IC DIP SOCKET 40POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| D2806-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 6POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 6POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 6 (2 x 3)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| D2822-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Plastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Plastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
на замовлення 70 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 164.56 грн |
| 18+ | 129.60 грн |
| 36+ | 123.38 грн |
| 54+ | 112.52 грн |
| D2832-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 32POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Description: CONN IC DIP SOCKET 32POS GOLD
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
на замовлення 506 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 238.14 грн |
| 12+ | 192.12 грн |
| 36+ | 177.79 грн |
| 60+ | 160.94 грн |
| 108+ | 154.39 грн |
| 252+ | 145.43 грн |
| 504+ | 136.22 грн |
| D2864-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Plastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 64POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Plastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Material - Post: Brass
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| D2922-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 22POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 22POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| D2924-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 24POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
на замовлення 2517 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 229.44 грн |
| 17+ | 181.19 грн |
| 34+ | 172.54 грн |
| 51+ | 157.34 грн |
| 102+ | 149.82 грн |
| 255+ | 140.44 грн |
| 510+ | 131.55 грн |
| 1003+ | 125.42 грн |
| 2516+ | 117.55 грн |
| D2928-42 |
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Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 28POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| D2948-42 |
![]() |
Виробник: Harwin Inc.
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Plastic
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
товару немає в наявності
В кошику
од. на суму грн.
| D3080-01 |
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Виробник: Harwin Inc.
Description: 1MM SHORTING LINK
Contact Finish Thickness: 100.0µin (2.54µm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Height: 0.359" (9.13mm)
Type: Non-Insulated
Pitch: 0.200" (5.08mm)
Contact Finish: Tin
Gender: Male Pins
Packaging: Bulk
Description: 1MM SHORTING LINK
Contact Finish Thickness: 100.0µin (2.54µm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Height: 0.359" (9.13mm)
Type: Non-Insulated
Pitch: 0.200" (5.08mm)
Contact Finish: Tin
Gender: Male Pins
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| D3081-01 |
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Виробник: Harwin Inc.
Description: 1MM SHORTING LINK
Packaging: Bulk
Part Status: Obsolete
Contact Finish Thickness: 100.0µin (2.54µm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Height: 0.359" (9.13mm)
Type: Non-Insulated
Current Rating (Amps): 10A
Contact Finish: Tin
Gender: Male Pins
Description: 1MM SHORTING LINK
Packaging: Bulk
Part Status: Obsolete
Contact Finish Thickness: 100.0µin (2.54µm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Height: 0.359" (9.13mm)
Type: Non-Insulated
Current Rating (Amps): 10A
Contact Finish: Tin
Gender: Male Pins
товару немає в наявності
В кошику
од. на суму грн.
| D3081-05 |
![]() |
Виробник: Harwin Inc.
Description: 1MM SHORTING LINK GOLD
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Current Rating (Amps): 10A
Type: Non-Insulated
Height: 0.359" (9.13mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: FLASH
Part Status: Active
Description: 1MM SHORTING LINK GOLD
Packaging: Bulk
Gender: Male Pins
Contact Finish: Gold
Current Rating (Amps): 10A
Type: Non-Insulated
Height: 0.359" (9.13mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: FLASH
Part Status: Active
на замовлення 2647 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 31.65 грн |
| 12+ | 25.75 грн |
| 25+ | 24.17 грн |
| 50+ | 21.59 грн |
| 100+ | 20.56 грн |
| 250+ | 19.27 грн |
| 500+ | 18.05 грн |
| 1000+ | 17.19 грн |
| 2500+ | 16.11 грн |
| D3082-01 |
![]() |
Виробник: Harwin Inc.
Description: 1MM SHORTING LINK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Tin
Current Rating (Amps): 10A
Pitch: 0.400" (10.16mm)
Type: Non-Insulated
Height: 0.359" (9.13mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 100.0µin (2.54µm)
Part Status: Obsolete
Description: 1MM SHORTING LINK
Packaging: Bulk
Gender: Male Pins
Contact Finish: Tin
Current Rating (Amps): 10A
Pitch: 0.400" (10.16mm)
Type: Non-Insulated
Height: 0.359" (9.13mm)
Number of Positions or Pins (Grid): 2 (1 x 2)
Contact Finish Thickness: 100.0µin (2.54µm)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.




















