Продукція > INFINEON TECHNOLOGIES > Всі товари виробника INFINEON TECHNOLOGIES (123044) > Сторінка 85 з 2051
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| SIDC09D60F6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 30A WAFER |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | |
| SIDC10D120H6X1SA5 | Infineon Technologies |
Description: DIODE GP 1.2KV 15A WAFERCurrent - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 15 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 15A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC110D170H | Infineon Technologies |
Description: DIODE GEN PURP 1.7KV 200A WAFER |
товару немає в наявності |
Мінімальне замовлення: 31 шт В кошику од. на суму грн. | |
| SIDC11D60SIC3 | Infineon Technologies |
Description: DIODE SIL CARB 600V 4A WAFERCurrent - Reverse Leakage @ Vr: 200 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 4 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 175°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 4A Capacitance @ Vr, F: 150pF @ 1V, 1MHz Technology: SiC (Silicon Carbide) Schottky Reverse Recovery Time (trr): 0 ns Speed: No Recovery Time > 500mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 3459 шт В кошику од. на суму грн. | |
| SIDC14D120E6X1SA4 | Infineon Technologies |
Description: DIODE STD 1200V 15A SAWN ON FOILPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 15A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 1200 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 15 A Current - Reverse Leakage @ Vr: 27 µA @ 1200 V |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC14D120F6X1SA3 | Infineon Technologies |
Description: DIODE GP 1.2KV 15A WAFERCurrent - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 15 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 15A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC14D120H6X1SA1 | Infineon Technologies |
Description: DIODE STD 1200V 25A SAWN ON FOILPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 25A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 1200 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 25 A Current - Reverse Leakage @ Vr: 27 µA @ 1200 V |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC14D60C6 | Infineon Technologies |
Description: DIODE GP 600V 50A WAFERCurrent - Reverse Leakage @ Vr: 27 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 50 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -40°C ~ 175°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 50A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC14D60C6Y | Infineon Technologies |
Description: DIODE GP 600V 50A WAFERPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 50A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -40°C ~ 175°C Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 50 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC14D60E6X1SA1 | Infineon Technologies |
Description: DIODE STD 600V 30A SAWN ON FOILPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 30A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 30 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC14D60E6YX1SA1 | Infineon Technologies |
Description: DIODE GP 600V 30A WAFERPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 30A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 30 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC14D60F6X1SA2 | Infineon Technologies |
Description: DIODE STD 600V 45A SAWN ON FOILPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 45A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -40°C ~ 150°C Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 45 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
товару немає в наявності |
В кошику од. на суму грн. | |
|
SIDC161D170HX1SA2 | Infineon Technologies |
Description: DIODE STANDARD 1.7KV 300A SAWNPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 300A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 1700 V Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 300 A Current - Reverse Leakage @ Vr: 27 µA @ 1700 V Current Coupled to Voltage - Forward (Vf) (Max) @ If: 300 Voltage Coupled to Current - Reverse Leakage @ Vr: 1700 |
товару немає в наявності |
В кошику од. на суму грн. |
| SIDC16D60SIC3 | Infineon Technologies |
Description: DIODE SIL CARB 600V 5A WAFERCurrent - Reverse Leakage @ Vr: 200 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 5 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 175°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 5A Capacitance @ Vr, F: 170pF @ 1V, 1MHz Technology: SiC (Silicon Carbide) Schottky Reverse Recovery Time (trr): 0 ns Speed: No Recovery Time > 500mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk Voltage Coupled to Current - Reverse Leakage @ Vr: 600 Current Coupled to Voltage - Forward (Vf) (Max) @ If: 5 |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC19D60SIC3 | Infineon Technologies |
Description: DIODE SIL CARB 600V 6A WAFERCurrent - Reverse Leakage @ Vr: 200 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 6 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 175°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 6A Capacitance @ Vr, F: 300pF @ 1V, 1MHz Technology: SiC (Silicon Carbide) Schottky Reverse Recovery Time (trr): 0 ns Speed: No Recovery Time > 500mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC20D60C6 | Infineon Technologies |
Description: DIODE STD 600V 75A SAWN ON FOILPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 75A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -40°C ~ 175°C Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 75 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC23D120E6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 25A WAFER |
товару немає в наявності |
Мінімальне замовлення: 178 шт В кошику од. на суму грн. | |
| SIDC23D120F6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 25A WAFER |
товару немає в наявності |
Мінімальне замовлення: 178 шт В кошику од. на суму грн. | |
| SIDC23D120H6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 35A WAFER |
товару немає в наявності |
Мінімальне замовлення: 178 шт В кошику од. на суму грн. | |
| SIDC23D60E6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 50A WAFER |
товару немає в наявності |
Мінімальне замовлення: 178 шт В кошику од. на суму грн. | |
| SIDC23D60E6Y | Infineon Technologies |
Description: DIODE GEN PURP 600V 50A WAFER |
товару немає в наявності |
Мінімальне замовлення: 283 шт В кошику од. на суму грн. | |
| SIDC24D30SIC3 | Infineon Technologies |
Description: DIODE SIL CARB 300V 10A WAFERCurrent - Reverse Leakage @ Vr: 200 µA @ 300 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A Voltage - DC Reverse (Vr) (Max): 300 V Operating Temperature - Junction: -55°C ~ 175°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 10A Capacitance @ Vr, F: 600pF @ 1V, 1MHz Technology: SiC (Silicon Carbide) Schottky Reverse Recovery Time (trr): 0 ns Speed: No Recovery Time > 500mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC26D60C6 | Infineon Technologies |
Description: DIODE STD 600V 100A SAWN ON FOILPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 100A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -40°C ~ 175°C Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 100 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V Current Coupled to Voltage - Forward (Vf) (Max) @ If: 100 Voltage Coupled to Current - Reverse Leakage @ Vr: 600 |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC30D120E6X1SA2 | Infineon Technologies |
Description: DIODE GP 1.2KV 35A WAFERCurrent - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 35 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 35A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC30D120F6X1SA2 | Infineon Technologies |
Description: DIODE GP 1.2KV 35A WAFERMounting Type: Surface Mount Package / Case: Die Packaging: Bulk Current - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 35 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 35A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC30D120H6X1SA4 | Infineon Technologies |
Description: DIODE GP 1.2KV 50A WAFERCurrent - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 50 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 50A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC30D60E6X1SA1 | Infineon Technologies |
Description: DIODE STD 600V 75A SAWN ON FOILPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 75A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 75 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
товару немає в наявності |
В кошику од. на суму грн. | |
|
SIDC32D170HX1SA3 | Infineon Technologies |
Description: DIODE STD 1700V 50A SAWN ON FOILTechnology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk Current - Reverse Leakage @ Vr: 27 µA @ 1700 V Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 50 A Voltage - DC Reverse (Vr) (Max): 1700 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 50A |
товару немає в наявності |
В кошику од. на суму грн. |
| SIDC38D60C6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 150A WAFER |
товару немає в наявності |
Мінімальне замовлення: 106 шт В кошику од. на суму грн. | |
| SIDC42D120E6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 50A WAFER |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. | |
| SIDC42D120F6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 50A WAFER |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. | |
| SIDC42D120H6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 75A WAFER |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. | |
| SIDC42D170E6 | Infineon Technologies |
Description: DIODE GEN PURP 1.7KV 50A WAFER |
товару немає в наявності |
Мінімальне замовлення: 79 шт В кошику од. на суму грн. | |
| SIDC42D60E6X1SA1 | Infineon Technologies |
Description: DIODE STD 600V 100A SAWN ON FOILPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 100A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 100 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC46D170H | Infineon Technologies |
Description: DIODE GEN PURP 1.7KV 75A WAFER |
товару немає в наявності |
Мінімальне замовлення: 72 шт В кошику од. на суму грн. | |
| SIDC50D60C6X1SA1 | Infineon Technologies |
Description: DIODE STD 600V 200A SAWN ON FOILCurrent - Reverse Leakage @ Vr: 27 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 200 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -40°C ~ 175°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 200A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC53D120H6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 100A WAFER |
товару немає в наявності |
Мінімальне замовлення: 76 шт В кошику од. на суму грн. | |
| SIDC56D120E6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 75A WAFER |
товару немає в наявності |
Мінімальне замовлення: 72 шт В кошику од. на суму грн. | |
| SIDC56D120F6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 75A WAFER |
товару немає в наявності |
Мінімальне замовлення: 72 шт В кошику од. на суму грн. | |
| SIDC56D170E6 | Infineon Technologies |
Description: DIODE GEN PURP 1.7KV 75A WAFER |
товару немає в наявності |
Мінімальне замовлення: 59 шт В кошику од. на суму грн. | |
| SIDC56D60E6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 150A WAFER |
товару немає в наявності |
Мінімальне замовлення: 72 шт В кошику од. на суму грн. | |
| SIDC59D170H | Infineon Technologies |
Description: DIODE GEN PURP 1.7KV 100A WAFER |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |
| SIDC73D170E6 | Infineon Technologies |
Description: DIODE GEN PURP 1.7KV 100A WAFER |
товару немає в наявності |
Мінімальне замовлення: 46 шт В кошику од. на суму грн. | |
| SIDC78D170H | Infineon Technologies |
Description: DIODE GEN PURP 1.7KV 150A WAFER |
товару немає в наявності |
Мінімальне замовлення: 43 шт В кошику од. на суму грн. | |
| SIDC81D120E6X1SA4 | Infineon Technologies |
Description: DIODE GP 1.2KV 100A WAFERCurrent - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 100 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 100A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC81D120F6X1SA1 | Infineon Technologies |
Description: DIODE GP 1.2KV 100A WAFERCurrent - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 100 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 100A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC81D120H6X1SA2 | Infineon Technologies |
Description: DIODE GP 1.2KV 150A WAFERCurrent - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 150 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 150A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIDC81D60E6X1SA3 | Infineon Technologies |
Description: DIODE GP 600V 200A WAFERSupplier Device Package: Sawn on foil Current - Average Rectified (Io): 200A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk Current - Reverse Leakage @ Vr: 27 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Obsolete Operating Temperature - Junction: -55°C ~ 150°C |
товару немає в наявності |
В кошику од. на суму грн. | |
|
SIDC85D170HX1SA2 | Infineon Technologies |
Description: DIODE STANDARD 1.7KV 150A SAWNPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 150A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 1700 V Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 150 A Current - Reverse Leakage @ Vr: 27 µA @ 1700 V |
товару немає в наявності |
В кошику од. на суму грн. |
| SIPC06N60C3 | Infineon Technologies |
Description: MOSFET COOL MOS 600V SAWED WAFERPackaging: Bulk Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIPC26N80C3 | Infineon Technologies |
Description: MOSFET COOL MOS 600V SAWED WAFERPackaging: Bulk Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIPC69N50C3X1SA2 | Infineon Technologies |
Description: MOSFET COOL MOS SAWED WAFERPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| SIPC69N60CFD | Infineon Technologies | Description: MOSFET COOL MOS SAWED WAFER |
товару немає в наявності |
В кошику од. на суму грн. | |
|
SLB9635TT12XUMA3 | Infineon Technologies |
Description: IC SECURITY TPM I2C 28TSSOPPackaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: LPC Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3.3V Applications: Trusted Platform Module (TPM) Core Processor: 16-Bit Supplier Device Package: PG-TSSOP-28 Part Status: Obsolete Number of I/O: 2 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. |
| SLE 4428 C | Infineon Technologies |
Description: IC EEPROM 1KBYTE M2.2 PKG |
товару немає в наявності |
Мінімальне замовлення: 795 шт В кошику од. на суму грн. | |
| SLE 4428 M2.2 | Infineon Technologies |
Description: IC EEPROM 1KBYTE M2.2 PKG |
товару немає в наявності |
Мінімальне замовлення: 650 шт В кошику од. на суму грн. | |
| SLE 4432 C | Infineon Technologies |
Description: IC EEPROM 256BYTE CHIP |
товару немає в наявності |
В кошику од. на суму грн. | |
| SLE 4432 M3.2 | Infineon Technologies |
Description: IC EEPROM 256BYTE M3.2 PKG |
товару немає в наявності |
В кошику од. на суму грн. | |
| SLE 55R04 MCC2 | Infineon Technologies |
Description: IC EEPROM 770BYTE MCC2-2 |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | |
| SLE 55R04 P-MCC2-2-1 | Infineon Technologies |
Description: IC EEPROM 770BYTE MCC2-2 |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. |
| SIDC09D60F6 |
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Виробник: Infineon Technologies
Description: DIODE GEN PURP 600V 30A WAFER
Description: DIODE GEN PURP 600V 30A WAFER
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
од. на суму грн.
| SIDC10D120H6X1SA5 |
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Виробник: Infineon Technologies
Description: DIODE GP 1.2KV 15A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 15 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 15A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 1.2KV 15A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 15 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 15A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC110D170H |
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Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.7KV 200A WAFER
Description: DIODE GEN PURP 1.7KV 200A WAFER
товару немає в наявності
Мінімальне замовлення: 31 шт
В кошику
од. на суму грн.
| SIDC11D60SIC3 |
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Виробник: Infineon Technologies
Description: DIODE SIL CARB 600V 4A WAFER
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 4 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 4A
Capacitance @ Vr, F: 150pF @ 1V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE SIL CARB 600V 4A WAFER
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 4 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 4A
Capacitance @ Vr, F: 150pF @ 1V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 3459 шт
В кошику
од. на суму грн.
| SIDC14D120E6X1SA4 |
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Виробник: Infineon Technologies
Description: DIODE STD 1200V 15A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 15A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 15 A
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Description: DIODE STD 1200V 15A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 15A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 15 A
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
товару немає в наявності
В кошику
од. на суму грн.
| SIDC14D120F6X1SA3 |
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Виробник: Infineon Technologies
Description: DIODE GP 1.2KV 15A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 15 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 15A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 1.2KV 15A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 15 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 15A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC14D120H6X1SA1 |
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Виробник: Infineon Technologies
Description: DIODE STD 1200V 25A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 25A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 25 A
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Description: DIODE STD 1200V 25A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 25A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 25 A
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
товару немає в наявності
В кошику
од. на суму грн.
| SIDC14D60C6 |
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Виробник: Infineon Technologies
Description: DIODE GP 600V 50A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 50 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 50A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 600V 50A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 50 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 50A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC14D60C6Y |
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Виробник: Infineon Technologies
Description: DIODE GP 600V 50A WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 50A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 50 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Description: DIODE GP 600V 50A WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 50A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 50 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
товару немає в наявності
В кошику
од. на суму грн.
| SIDC14D60E6X1SA1 |
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Виробник: Infineon Technologies
Description: DIODE STD 600V 30A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 30A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 30 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Description: DIODE STD 600V 30A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 30A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 30 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
товару немає в наявності
В кошику
од. на суму грн.
| SIDC14D60E6YX1SA1 |
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Виробник: Infineon Technologies
Description: DIODE GP 600V 30A WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 30A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 30 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Description: DIODE GP 600V 30A WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 30A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 30 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
товару немає в наявності
В кошику
од. на суму грн.
| SIDC14D60F6X1SA2 |
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Виробник: Infineon Technologies
Description: DIODE STD 600V 45A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 45A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 45 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Description: DIODE STD 600V 45A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 45A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 45 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
товару немає в наявності
В кошику
од. на суму грн.
| SIDC161D170HX1SA2 |
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Виробник: Infineon Technologies
Description: DIODE STANDARD 1.7KV 300A SAWN
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 300A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 300 A
Current - Reverse Leakage @ Vr: 27 µA @ 1700 V
Current Coupled to Voltage - Forward (Vf) (Max) @ If: 300
Voltage Coupled to Current - Reverse Leakage @ Vr: 1700
Description: DIODE STANDARD 1.7KV 300A SAWN
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 300A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 300 A
Current - Reverse Leakage @ Vr: 27 µA @ 1700 V
Current Coupled to Voltage - Forward (Vf) (Max) @ If: 300
Voltage Coupled to Current - Reverse Leakage @ Vr: 1700
товару немає в наявності
В кошику
од. на суму грн.
| SIDC16D60SIC3 |
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Виробник: Infineon Technologies
Description: DIODE SIL CARB 600V 5A WAFER
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 5 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 5A
Capacitance @ Vr, F: 170pF @ 1V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Voltage Coupled to Current - Reverse Leakage @ Vr: 600
Current Coupled to Voltage - Forward (Vf) (Max) @ If: 5
Description: DIODE SIL CARB 600V 5A WAFER
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 5 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 5A
Capacitance @ Vr, F: 170pF @ 1V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Voltage Coupled to Current - Reverse Leakage @ Vr: 600
Current Coupled to Voltage - Forward (Vf) (Max) @ If: 5
товару немає в наявності
В кошику
од. на суму грн.
| SIDC19D60SIC3 |
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Виробник: Infineon Technologies
Description: DIODE SIL CARB 600V 6A WAFER
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 6 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 6A
Capacitance @ Vr, F: 300pF @ 1V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE SIL CARB 600V 6A WAFER
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 6 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 6A
Capacitance @ Vr, F: 300pF @ 1V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC20D60C6 |
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Виробник: Infineon Technologies
Description: DIODE STD 600V 75A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 75A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 75 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Description: DIODE STD 600V 75A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 75A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 75 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
товару немає в наявності
В кошику
од. на суму грн.
| SIDC23D120E6 |
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Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 25A WAFER
Description: DIODE GEN PURP 1.2KV 25A WAFER
товару немає в наявності
Мінімальне замовлення: 178 шт
В кошику
од. на суму грн.
| SIDC23D120F6 |
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Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 25A WAFER
Description: DIODE GEN PURP 1.2KV 25A WAFER
товару немає в наявності
Мінімальне замовлення: 178 шт
В кошику
од. на суму грн.
| SIDC23D120H6 |
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Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 35A WAFER
Description: DIODE GEN PURP 1.2KV 35A WAFER
товару немає в наявності
Мінімальне замовлення: 178 шт
В кошику
од. на суму грн.
| SIDC23D60E6 |
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Виробник: Infineon Technologies
Description: DIODE GEN PURP 600V 50A WAFER
Description: DIODE GEN PURP 600V 50A WAFER
товару немає в наявності
Мінімальне замовлення: 178 шт
В кошику
од. на суму грн.
| SIDC23D60E6Y |
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Виробник: Infineon Technologies
Description: DIODE GEN PURP 600V 50A WAFER
Description: DIODE GEN PURP 600V 50A WAFER
товару немає в наявності
Мінімальне замовлення: 283 шт
В кошику
од. на суму грн.
| SIDC24D30SIC3 |
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Виробник: Infineon Technologies
Description: DIODE SIL CARB 300V 10A WAFER
Current - Reverse Leakage @ Vr: 200 µA @ 300 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Voltage - DC Reverse (Vr) (Max): 300 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 10A
Capacitance @ Vr, F: 600pF @ 1V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE SIL CARB 300V 10A WAFER
Current - Reverse Leakage @ Vr: 200 µA @ 300 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Voltage - DC Reverse (Vr) (Max): 300 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 10A
Capacitance @ Vr, F: 600pF @ 1V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC26D60C6 |
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Виробник: Infineon Technologies
Description: DIODE STD 600V 100A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 100A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 100 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Current Coupled to Voltage - Forward (Vf) (Max) @ If: 100
Voltage Coupled to Current - Reverse Leakage @ Vr: 600
Description: DIODE STD 600V 100A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 100A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 100 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Current Coupled to Voltage - Forward (Vf) (Max) @ If: 100
Voltage Coupled to Current - Reverse Leakage @ Vr: 600
товару немає в наявності
В кошику
од. на суму грн.
| SIDC30D120E6X1SA2 |
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Виробник: Infineon Technologies
Description: DIODE GP 1.2KV 35A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 35 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 35A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 1.2KV 35A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 35 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 35A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC30D120F6X1SA2 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GP 1.2KV 35A WAFER
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 35 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 35A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Description: DIODE GP 1.2KV 35A WAFER
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 35 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 35A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
товару немає в наявності
В кошику
од. на суму грн.
| SIDC30D120H6X1SA4 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GP 1.2KV 50A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 50 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 50A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 1.2KV 50A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 50 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 50A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC30D60E6X1SA1 |
![]() |
Виробник: Infineon Technologies
Description: DIODE STD 600V 75A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 75A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 75 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Description: DIODE STD 600V 75A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 75A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 75 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
товару немає в наявності
В кошику
од. на суму грн.
| SIDC32D170HX1SA3 |
![]() |
Виробник: Infineon Technologies
Description: DIODE STD 1700V 50A SAWN ON FOIL
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Current - Reverse Leakage @ Vr: 27 µA @ 1700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 50 A
Voltage - DC Reverse (Vr) (Max): 1700 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 50A
Description: DIODE STD 1700V 50A SAWN ON FOIL
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Current - Reverse Leakage @ Vr: 27 µA @ 1700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 50 A
Voltage - DC Reverse (Vr) (Max): 1700 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 50A
товару немає в наявності
В кошику
од. на суму грн.
| SIDC38D60C6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 600V 150A WAFER
Description: DIODE GEN PURP 600V 150A WAFER
товару немає в наявності
Мінімальне замовлення: 106 шт
В кошику
од. на суму грн.
| SIDC42D120E6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 50A WAFER
Description: DIODE GEN PURP 1.2KV 50A WAFER
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| SIDC42D120F6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 50A WAFER
Description: DIODE GEN PURP 1.2KV 50A WAFER
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| SIDC42D120H6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 75A WAFER
Description: DIODE GEN PURP 1.2KV 75A WAFER
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| SIDC42D170E6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.7KV 50A WAFER
Description: DIODE GEN PURP 1.7KV 50A WAFER
товару немає в наявності
Мінімальне замовлення: 79 шт
В кошику
од. на суму грн.
| SIDC42D60E6X1SA1 |
![]() |
Виробник: Infineon Technologies
Description: DIODE STD 600V 100A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 100A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 100 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Description: DIODE STD 600V 100A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 100A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 100 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
товару немає в наявності
В кошику
од. на суму грн.
| SIDC46D170H |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.7KV 75A WAFER
Description: DIODE GEN PURP 1.7KV 75A WAFER
товару немає в наявності
Мінімальне замовлення: 72 шт
В кошику
од. на суму грн.
| SIDC50D60C6X1SA1 |
![]() |
Виробник: Infineon Technologies
Description: DIODE STD 600V 200A SAWN ON FOIL
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 200 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 200A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE STD 600V 200A SAWN ON FOIL
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 200 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 200A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC53D120H6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 100A WAFER
Description: DIODE GEN PURP 1.2KV 100A WAFER
товару немає в наявності
Мінімальне замовлення: 76 шт
В кошику
од. на суму грн.
| SIDC56D120E6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 75A WAFER
Description: DIODE GEN PURP 1.2KV 75A WAFER
товару немає в наявності
Мінімальне замовлення: 72 шт
В кошику
од. на суму грн.
| SIDC56D120F6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 75A WAFER
Description: DIODE GEN PURP 1.2KV 75A WAFER
товару немає в наявності
Мінімальне замовлення: 72 шт
В кошику
од. на суму грн.
| SIDC56D170E6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.7KV 75A WAFER
Description: DIODE GEN PURP 1.7KV 75A WAFER
товару немає в наявності
Мінімальне замовлення: 59 шт
В кошику
од. на суму грн.
| SIDC56D60E6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 600V 150A WAFER
Description: DIODE GEN PURP 600V 150A WAFER
товару немає в наявності
Мінімальне замовлення: 72 шт
В кошику
од. на суму грн.
| SIDC59D170H |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.7KV 100A WAFER
Description: DIODE GEN PURP 1.7KV 100A WAFER
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| SIDC73D170E6 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.7KV 100A WAFER
Description: DIODE GEN PURP 1.7KV 100A WAFER
товару немає в наявності
Мінімальне замовлення: 46 шт
В кошику
од. на суму грн.
| SIDC78D170H |
![]() |
Виробник: Infineon Technologies
Description: DIODE GEN PURP 1.7KV 150A WAFER
Description: DIODE GEN PURP 1.7KV 150A WAFER
товару немає в наявності
Мінімальне замовлення: 43 шт
В кошику
од. на суму грн.
| SIDC81D120E6X1SA4 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GP 1.2KV 100A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 100 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 100A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 1.2KV 100A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 100 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 100A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC81D120F6X1SA1 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GP 1.2KV 100A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 100 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 100A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 1.2KV 100A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 100 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 100A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC81D120H6X1SA2 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GP 1.2KV 150A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 150 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 150A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 1.2KV 150A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 150 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 150A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SIDC81D60E6X1SA3 |
![]() |
Виробник: Infineon Technologies
Description: DIODE GP 600V 200A WAFER
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 200A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Obsolete
Operating Temperature - Junction: -55°C ~ 150°C
Description: DIODE GP 600V 200A WAFER
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 200A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Obsolete
Operating Temperature - Junction: -55°C ~ 150°C
товару немає в наявності
В кошику
од. на суму грн.
| SIDC85D170HX1SA2 |
![]() |
Виробник: Infineon Technologies
Description: DIODE STANDARD 1.7KV 150A SAWN
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 150A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 150 A
Current - Reverse Leakage @ Vr: 27 µA @ 1700 V
Description: DIODE STANDARD 1.7KV 150A SAWN
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 150A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 150 A
Current - Reverse Leakage @ Vr: 27 µA @ 1700 V
товару немає в наявності
В кошику
од. на суму грн.
| SIPC06N60C3 |
![]() |
Виробник: Infineon Technologies
Description: MOSFET COOL MOS 600V SAWED WAFER
Packaging: Bulk
Part Status: Obsolete
Description: MOSFET COOL MOS 600V SAWED WAFER
Packaging: Bulk
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| SIPC26N80C3 |
![]() |
Виробник: Infineon Technologies
Description: MOSFET COOL MOS 600V SAWED WAFER
Packaging: Bulk
Part Status: Obsolete
Description: MOSFET COOL MOS 600V SAWED WAFER
Packaging: Bulk
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| SIPC69N50C3X1SA2 |
![]() |
Виробник: Infineon Technologies
Description: MOSFET COOL MOS SAWED WAFER
Packaging: Bulk
Part Status: Active
Description: MOSFET COOL MOS SAWED WAFER
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| SIPC69N60CFD |
Виробник: Infineon Technologies
Description: MOSFET COOL MOS SAWED WAFER
Description: MOSFET COOL MOS SAWED WAFER
товару немає в наявності
В кошику
од. на суму грн.
| SLB9635TT12XUMA3 |
![]() |
Виробник: Infineon Technologies
Description: IC SECURITY TPM I2C 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: LPC
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.3V
Applications: Trusted Platform Module (TPM)
Core Processor: 16-Bit
Supplier Device Package: PG-TSSOP-28
Part Status: Obsolete
Number of I/O: 2
DigiKey Programmable: Not Verified
Description: IC SECURITY TPM I2C 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: LPC
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.3V
Applications: Trusted Platform Module (TPM)
Core Processor: 16-Bit
Supplier Device Package: PG-TSSOP-28
Part Status: Obsolete
Number of I/O: 2
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3000 шт
В кошику
од. на суму грн.
| SLE 4428 C |
![]() |
Виробник: Infineon Technologies
Description: IC EEPROM 1KBYTE M2.2 PKG
Description: IC EEPROM 1KBYTE M2.2 PKG
товару немає в наявності
Мінімальне замовлення: 795 шт
В кошику
од. на суму грн.
| SLE 4428 M2.2 |
![]() |
Виробник: Infineon Technologies
Description: IC EEPROM 1KBYTE M2.2 PKG
Description: IC EEPROM 1KBYTE M2.2 PKG
товару немає в наявності
Мінімальне замовлення: 650 шт
В кошику
од. на суму грн.
| SLE 4432 C |
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Виробник: Infineon Technologies
Description: IC EEPROM 256BYTE CHIP
Description: IC EEPROM 256BYTE CHIP
товару немає в наявності
В кошику
од. на суму грн.
| SLE 4432 M3.2 |
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Виробник: Infineon Technologies
Description: IC EEPROM 256BYTE M3.2 PKG
Description: IC EEPROM 256BYTE M3.2 PKG
товару немає в наявності
В кошику
од. на суму грн.
| SLE 55R04 MCC2 |
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Виробник: Infineon Technologies
Description: IC EEPROM 770BYTE MCC2-2
Description: IC EEPROM 770BYTE MCC2-2
товару немає в наявності
Мінімальне замовлення: 3000 шт
В кошику
од. на суму грн.
| SLE 55R04 P-MCC2-2-1 |
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Виробник: Infineon Technologies
Description: IC EEPROM 770BYTE MCC2-2
Description: IC EEPROM 770BYTE MCC2-2
товару немає в наявності
Мінімальне замовлення: 3000 шт
В кошику
од. на суму грн.




