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ATMXT640U-DEV-PCB Microchip Technology Description: EVAL BOARD FOR MXT640U
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT640U
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ATEVK-MXT641TAT-A Microchip Technology maXTouch-T-brochure.pdf Description: EVAL BOARD FOR MXT641TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT641TAT
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ATEVK-MXT640U-A Microchip Technology Description: EVAL BOARD FOR MXT640U
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT640U
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ATMXT640T-CCU048 Microchip Technology maXTouch-T-brochure.pdf Description: IC SCREEN CNTRL TOUCH
Packaging: Tray
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
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ATMXT640U-CCUR001 ATMXT640U-CCUR001 Microchip Technology mXT640U_1v0_Datasheet_FX.pdf Description: IC TOUCHSCREEN CTLR SMD
Packaging: Tray
Package / Case: 88-UFBGA
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Resolution (Bits): 12 b
Supplier Device Package: 88-UFBGA (6x6)
Current - Supply: 0.25 µA
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ATMXT641TD-ABVA2 ATMXT641TD-ABVA2 Microchip Technology mXT641TD-A%20Touchscreen%20Controller%20Product%20Brief.pdf Description: IC TOUCHSCREEN CTLR 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V
Resolution (Bits): 12 b
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT641TD-ATRVA2 Microchip Technology Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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ATMXT641TD-ABRVA2 ATMXT641TD-ABRVA2 Microchip Technology Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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ATMXT641TD-ATVA2 Microchip Technology Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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1N5119/TR 1N5119/TR Microchip Technology Description: DIODE ZENER 40V 5W E-AXIAL
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
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1N5119 1N5119 Microchip Technology Description: DIODE ZENER 40V 5W E-AXIAL
Packaging: Bulk
Tolerance: ±5%
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
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VCC1-B3F-10M0000000 Microchip Technology VCC1-April-2020.pdf Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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VCC4-B3F-10M0000000 Microchip Technology VCC4A-CMOS-Crystal-Oscillator-DS20006749.pdf Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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MCP4017T-104E/LTY MCP4017T-104E/LTY Microchip Technology MCP4017-18-19-Data-Sheet-DS20002147.pdf Description: IC DGT POT 100KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 100k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-502E/LTY MCP4017T-502E/LTY Microchip Technology MCP4017-18-19-Data-Sheet-DS20002147.pdf Description: IC DGTL POT 5KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 5k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-103E/LTY MCP4017T-103E/LTY Microchip Technology MCP4017-18-19-Data-Sheet-DS20002147.pdf Description: IC DGTL POT 10KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 10k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-503E/LTY MCP4017T-503E/LTY Microchip Technology MCP4017-18-19-Data-Sheet-DS20002147.pdf Description: IC DGTL POT 50KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 50k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-103E/LTYVAO MCP4017T-103E/LTYVAO Microchip Technology MCP4017-18-19-Data-Sheet-DS20002147.pdf Description: IC DGTL POT 10KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 10k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
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PIC32CZ2051CA70100-I/E5X PIC32CZ2051CA70100-I/E5X Microchip Technology PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70144-I/Z8X PIC32CZ2051CA70144-I/Z8X Microchip Technology PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051CA70100T-I/E5X PIC32CZ2051CA70100T-I/E5X Microchip Technology PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100T-V/E5X PIC32CZ2051CA70100T-V/E5X Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100-V/E5X PIC32CZ2051CA70100-V/E5X Microchip Technology PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051CA70144-V/Z8X PIC32CZ2051CA70144-V/Z8X Microchip Technology PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70064T-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70100-I/CQB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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PIC32CZ2051CA70144-V/XFB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70064-V/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 44
Qualification: AEC-Q100
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PIC32CZ2051CA70144-V/B4B Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70100-V/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051MC70100T-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100T-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051MC70064-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/XFB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051CA70100T-I/CQB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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PIC32CZ2051CA70064-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051MC70100-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100-I/XEB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70144-V/XFB-SL3 Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70100-V/CQB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051CA70144T-I/B4B Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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PIC32CZ2051CA70144-I/XFB-SL3 Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051MC70064T-I/XDB Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/B4B Microchip Technology Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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MP6KE6.8A MP6KE6.8A Microchip Technology rf01007_rb.pdf Description: TVS DIODE 5.8VWM 10.5VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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2N2983 2N2983 Microchip Technology Description: TRANS PNP 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100µA, 500µA
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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2N2985 2N2985 Microchip Technology Description: TRANS NPN 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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1N2982A 1N2982A Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 18V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
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1N2987RB 1N2987RB Microchip Technology 1N2970B-1N3015B_1N3993A-1N3998A.pdf Description: DIODE ZENER 25V 10W DO4
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 25 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-4 (DO-203AA)
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2980B 1N2980B Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 16V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2980A 1N2980A Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 16V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2985A 1N2985A Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 22V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
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1N2989A Microchip Technology 1N2970B-1N3015B_1N3993A-1N3998A.pdf Description: DIODE ZENER
Packaging: Bulk
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1N2984B 1N2984B Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 20V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 15.2 V
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1N2980RB 1N2980RB Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 16V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2986B 1N2986B Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 24V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2986RB 1N2986RB Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 24V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2982RB 1N2982RB Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 18V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
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1N2985RB 1N2985RB Microchip Technology 8914-lds-0075-datasheet Description: DIODE ZENER 22V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
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JANTX1N2986B JANTX1N2986B Microchip Technology Description: DIODE ZENER 24V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA (DO-4)
Grade: Military
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
Qualification: MIL-PRF-19500/124
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ATMXT640U-DEV-PCB
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT640U
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT640U
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ATEVK-MXT641TAT-A maXTouch-T-brochure.pdf
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT641TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT641TAT
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ATEVK-MXT640U-A
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT640U
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT640U
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ATMXT640T-CCU048 maXTouch-T-brochure.pdf
Виробник: Microchip Technology
Description: IC SCREEN CNTRL TOUCH
Packaging: Tray
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
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ATMXT640U-CCUR001 mXT640U_1v0_Datasheet_FX.pdf
ATMXT640U-CCUR001
Виробник: Microchip Technology
Description: IC TOUCHSCREEN CTLR SMD
Packaging: Tray
Package / Case: 88-UFBGA
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Resolution (Bits): 12 b
Supplier Device Package: 88-UFBGA (6x6)
Current - Supply: 0.25 µA
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ATMXT641TD-ABVA2 mXT641TD-A%20Touchscreen%20Controller%20Product%20Brief.pdf
ATMXT641TD-ABVA2
Виробник: Microchip Technology
Description: IC TOUCHSCREEN CTLR 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V
Resolution (Bits): 12 b
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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ATMXT641TD-ATRVA2
Виробник: Microchip Technology
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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ATMXT641TD-ABRVA2
ATMXT641TD-ABRVA2
Виробник: Microchip Technology
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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ATMXT641TD-ATVA2
Виробник: Microchip Technology
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
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1N5119/TR
1N5119/TR
Виробник: Microchip Technology
Description: DIODE ZENER 40V 5W E-AXIAL
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
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1N5119
1N5119
Виробник: Microchip Technology
Description: DIODE ZENER 40V 5W E-AXIAL
Packaging: Bulk
Tolerance: ±5%
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
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VCC1-B3F-10M0000000 VCC1-April-2020.pdf
Виробник: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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VCC4-B3F-10M0000000 VCC4A-CMOS-Crystal-Oscillator-DS20006749.pdf
Виробник: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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MCP4017T-104E/LTY MCP4017-18-19-Data-Sheet-DS20002147.pdf
MCP4017T-104E/LTY
Виробник: Microchip Technology
Description: IC DGT POT 100KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 100k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-502E/LTY MCP4017-18-19-Data-Sheet-DS20002147.pdf
MCP4017T-502E/LTY
Виробник: Microchip Technology
Description: IC DGTL POT 5KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 5k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-103E/LTY MCP4017-18-19-Data-Sheet-DS20002147.pdf
MCP4017T-103E/LTY
Виробник: Microchip Technology
Description: IC DGTL POT 10KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 10k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-503E/LTY MCP4017-18-19-Data-Sheet-DS20002147.pdf
MCP4017T-503E/LTY
Виробник: Microchip Technology
Description: IC DGTL POT 50KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 50k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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MCP4017T-103E/LTYVAO MCP4017-18-19-Data-Sheet-DS20002147.pdf
MCP4017T-103E/LTYVAO
Виробник: Microchip Technology
Description: IC DGTL POT 10KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 10k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
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PIC32CZ2051CA70100-I/E5X PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf
PIC32CZ2051CA70100-I/E5X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70144-I/Z8X PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf
PIC32CZ2051CA70144-I/Z8X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051CA70100T-I/E5X PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf
PIC32CZ2051CA70100T-I/E5X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100T-V/E5X
PIC32CZ2051CA70100T-V/E5X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100-V/E5X PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf
PIC32CZ2051CA70100-V/E5X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051CA70144-V/Z8X PIC32CZ-CA70-MC70-Family-Data-Sheet-DS60001825.pdf
PIC32CZ2051CA70144-V/Z8X
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70064T-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70100-I/CQB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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PIC32CZ2051CA70144-V/XFB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70064-V/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 44
Qualification: AEC-Q100
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PIC32CZ2051CA70144-V/B4B
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70100-V/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051MC70100T-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100T-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051MC70064-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/XFB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051CA70100T-I/CQB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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PIC32CZ2051CA70064-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051MC70100-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70100-I/XEB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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PIC32CZ2051CA70144-V/XFB-SL3
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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PIC32CZ2051CA70100-V/CQB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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PIC32CZ2051CA70144T-I/B4B
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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PIC32CZ2051CA70144-I/XFB-SL3
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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PIC32CZ2051MC70064T-I/XDB
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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PIC32CZ2051CA70144-I/B4B
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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MP6KE6.8A rf01007_rb.pdf
MP6KE6.8A
Виробник: Microchip Technology
Description: TVS DIODE 5.8VWM 10.5VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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2N2983
2N2983
Виробник: Microchip Technology
Description: TRANS PNP 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100µA, 500µA
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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2N2985
2N2985
Виробник: Microchip Technology
Description: TRANS NPN 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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1N2982A 8914-lds-0075-datasheet
1N2982A
Виробник: Microchip Technology
Description: DIODE ZENER 18V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
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1N2987RB 1N2970B-1N3015B_1N3993A-1N3998A.pdf
1N2987RB
Виробник: Microchip Technology
Description: DIODE ZENER 25V 10W DO4
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 25 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-4 (DO-203AA)
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2980B 8914-lds-0075-datasheet
1N2980B
Виробник: Microchip Technology
Description: DIODE ZENER 16V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2980A 8914-lds-0075-datasheet
1N2980A
Виробник: Microchip Technology
Description: DIODE ZENER 16V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2985A 8914-lds-0075-datasheet
1N2985A
Виробник: Microchip Technology
Description: DIODE ZENER 22V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
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1N2989A 1N2970B-1N3015B_1N3993A-1N3998A.pdf
Виробник: Microchip Technology
Description: DIODE ZENER
Packaging: Bulk
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1N2984B 8914-lds-0075-datasheet
1N2984B
Виробник: Microchip Technology
Description: DIODE ZENER 20V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 15.2 V
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1N2980RB 8914-lds-0075-datasheet
1N2980RB
Виробник: Microchip Technology
Description: DIODE ZENER 16V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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1N2986B 8914-lds-0075-datasheet
1N2986B
Виробник: Microchip Technology
Description: DIODE ZENER 24V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2986RB 8914-lds-0075-datasheet
1N2986RB
Виробник: Microchip Technology
Description: DIODE ZENER 24V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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1N2982RB 8914-lds-0075-datasheet
1N2982RB
Виробник: Microchip Technology
Description: DIODE ZENER 18V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
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1N2985RB 8914-lds-0075-datasheet
1N2985RB
Виробник: Microchip Technology
Description: DIODE ZENER 22V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
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JANTX1N2986B
JANTX1N2986B
Виробник: Microchip Technology
Description: DIODE ZENER 24V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA (DO-4)
Grade: Military
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
Qualification: MIL-PRF-19500/124
товару немає в наявності
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