Продукція > MICROCHIP TECHNOLOGY > Всі товари виробника MICROCHIP TECHNOLOGY (358188) > Сторінка 1922 з 5970

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JANTX1N827UR-1/TR Microchip Technology Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/159
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1N827UR-1/TR Microchip Technology Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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1N827AUR-1/TR Microchip Technology Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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1N827E3 1N827E3 Microchip Technology Description: TEMPERATURE COMPENSATED
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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1N827AUR-1e3 Microchip Technology Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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1N827AUR-1e3/TR Microchip Technology Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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1N827E3/TR 1N827E3/TR Microchip Technology Description: TEMPERATURE COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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JANTXV1N827-1/TR JANTXV1N827-1/TR Microchip Technology Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/159
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JANHCA1N827 JANHCA1N827 Microchip Technology 14809-military-qualified-die-chip Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/159
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JANTXV1N827UR-1 Microchip Technology 11037-lds-0220-1-datasheet Description: DIODE ZENER 6.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/159
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JANTXV1N827UR-1/TR Microchip Technology Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/159
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AC40T08A Microchip Technology AC40T08A-5.5-4-Lane-MIPI-720p-LCD-Display-Module-With-maXTouch-DS50003687.pdf Description: EVAL BOARD FOR MIC2289
Packaging: Bulk
Function: LCD Display
Type: Display
Contents: Board(s)
Utilized IC / Part: MIC2289
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+17491.24 грн
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JAN1N4485 JAN1N4485 Microchip Technology 1N4460-1N4496.1N6485-1N6491.pdf Description: DIODE ZENER 68V 1.5W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 250 nA @ 54.4 V
Qualification: MIL-PRF-19500/406
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ATMXT768E-ABR Microchip Technology MXT768EKM%20flyer%20-%20US%20-%20low%20res.pdf Description: IC SENSOR MAXTOUCH 768CH
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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ATMXT768E-ABR Microchip Technology MXT768EKM%20flyer%20-%20US%20-%20low%20res.pdf Description: IC SENSOR MAXTOUCH 768CH
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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ATMXT799TAT-I2C-PCB Microchip Technology Description: EVAL BOARD FOR MXT799TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT799TAT
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ATEVK-MXT799TAT-A Microchip Technology Description: EVAL BOARD FOR MXT799TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT799TAT
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ATEVK-MXT799TAT-C Microchip Technology 00001599H.pdf Description: EVAL BOARD FOR MXT799TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT799TAT
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TMIK036 Microchip Technology Description: MICROSD CLICK
Packaging: Bulk
Function: Micro SD
Type: Connectivity
Contents: Board(s)
Platform: mikroBUS™ Click™
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MX15KP78CA MX15KP78CA Microchip Technology 9460-rf01011-m15kp-rev-e Description: TVS DIODE 78VWM 126VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 119A
Voltage - Reverse Standoff (Typ): 78V
Supplier Device Package: Case 5A (DO-204AR)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 86.7V
Voltage - Clamping (Max) @ Ipp: 126V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MX5KP12A MX5KP12A Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 12VWM 19.9VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 251A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: Case 5A (DO-204AR)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC24FJ64GP205T-I/PT PIC24FJ64GP205T-I/PT Microchip Technology PIC24FJ64GP205-GU205-Family-Data-Sheet-DS30010221C.pdf Description: IC MCU 16BIT 64KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (22K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 14x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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PIC24FJ64GP205T-I/PT PIC24FJ64GP205T-I/PT Microchip Technology PIC24FJ64GP205-GU205-Family-Data-Sheet-DS30010221C.pdf Description: IC MCU 16BIT 64KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (22K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 14x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 1277 шт:
термін постачання 21-31 дні (днів)
3+148.26 грн
25+130.12 грн
100+118.30 грн
Мінімальне замовлення: 3
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M1.5KE130A/TR Microchip Technology Description: TVS DIODE 111VWM 179VC CASE-1
Packaging: Tape & Reel (TR)
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 8.4A
Voltage - Reverse Standoff (Typ): 111V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 124V
Voltage - Clamping (Max) @ Ipp: 179V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP16A M5KP16A Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 16VWM 26VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 192A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP16Ae3 M5KP16Ae3 Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 16VWM 26VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 192A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP16A/TR Microchip Technology Description: TVS 16V 5% 5000W UNI
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 192A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: P600
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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MA5KP16A MA5KP16A Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 16VWM 26VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 192A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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1N5931B 1N5931B Microchip Technology 10922-sa5-57-datasheet Description: DIODE ZENER 18V 1.25W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 12 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 13.7 V
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ATMEGA8535-16JU ATMEGA8535-16JU Microchip Technology doc2502.pdf description Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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ATMEGA8535-16JC ATMEGA8535-16JC Microchip Technology 2502S.pdf Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA8535-16JI ATMEGA8535-16JI Microchip Technology 2502S.pdf Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA8535-16JUR ATMEGA8535-16JUR Microchip Technology doc2502.pdf Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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MIC5237-3.3BU MIC5237-3.3BU Microchip Technology MIC5237-500mA-Low-Dropout-Regulator-DS20006095A.pdf Description: IC REG LINEAR 3.3V 500MA TO263-3
Packaging: Tube
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: TO-263-3
Voltage - Output (Min/Fixed): 3.3V
PSRR: 75dB (120Hz)
Voltage Dropout (Max): 0.7V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
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APL602L-1 Microchip Technology Description: MOSFET LINEAR 600 V 49 A TO-264
Packaging: Bulk
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 49A (Tc)
Rds On (Max) @ Id, Vgs: 125mOhm @ 24.5A, 12V
Power Dissipation (Max): 730W (Tc)
Vgs(th) (Max) @ Id: 4V @ 2.5mA
Supplier Device Package: TO-264 [L]
Drive Voltage (Max Rds On, Min Rds On): 12V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 9000 pF @ 25 V
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JAN1N3033B-1 JAN1N3033B-1 Microchip Technology 125225-lds-0285-datasheet Description: DIODE ZENER 36V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 50 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 27.4 V
Qualification: MIL-PRF-19500/115
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1N4688 1N4688 Microchip Technology 5827-1n4678-4717-datasheet Description: DIODE ZENER 4.7V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.7 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 3 V
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JANTXV1N6172 Microchip Technology 127853-1n6138-1n6173a-tvs-diode-series-datasheet Description: TVS DIODE 136.8VWM 257.99V AXIAL
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.8A
Voltage - Reverse Standoff (Typ): 136.8V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 162.45V
Voltage - Clamping (Max) @ Ipp: 257.99V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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1N457 1N457 Microchip Technology 1N457A-1N459A.pdf Description: DIODE GEN PURP 60V 150MA DO35
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Standard
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 60 V
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1N457A 1N457A Microchip Technology 8832-lds-0023-datasheet Description: DIODE GEN PURP 70V 150MA DO35
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Standard
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 70 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 1 µA @ 70 V
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1N4575AUR-1/TR 1N4575AUR-1/TR Microchip Technology 1N4565AUR-1-1N4584AYR-1_CDLL4565-CDLL4584A.pdf Description: TEMPERATURE COMPENSATED
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Impedance (Max) (Zzt): 50 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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AVR64DU28T-I/SS AVR64DU28T-I/SS Microchip Technology AVR64DU-28-32-Prelim-DataSheet-DS40002548.pdf Description: 64KB, 8KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 21
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AVR64DU28T-I/SS AVR64DU28T-I/SS Microchip Technology AVR64DU-28-32-Prelim-DataSheet-DS40002548.pdf Description: 64KB, 8KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 21
на замовлення 2094 шт:
термін постачання 21-31 дні (днів)
3+114.11 грн
25+101.06 грн
100+97.87 грн
Мінімальне замовлення: 3
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SAM9X70-I/4PB SAM9X70-I/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,BGA,I TEMP,TRAY
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X72-I/4PB SAM9X72-I/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,LVDS,CAN-FD,BGA,I TEM
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X70-V/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,BGA,EXT TEMP
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X72-V/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,LVDS,CAN-FD,BGA,EXT T
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75-I/4PB SAM9X75-I/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,MIPI,LVDS,CAN-FD,BGA,
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75-V/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,MIPI,LVDS,CAN-FD,BGA,
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAMA7G54-E/4HB Microchip Technology SAMA7G5-Series-Data-Sheet-DS60001765.pdf Description: CORTEX-A7 MPU, BGA, EXT. TEMP (T
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAM9X75D1G-I/4TB SAM9X75D1G-I/4TB Microchip Technology SAM9X75-SiP-Data-Sheet-DS60001827.pdf Description: ARM926 MPU, 1GBIT DDR3L,MIPI,LVD
Packaging: Tray
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75D2G-I/4TB SAM9X75D2G-I/4TB Microchip Technology SAM9X75-SiP-Data-Sheet-DS60001827.pdf Description: ARM926 MPU,2GBIT DDR3L,MIPI,LVDS
Packaging: Tray
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAMA7G54D1G-I/4UB SAMA7G54D1G-I/4UB Microchip Technology SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf Description: CORTEX-A7,MPU, 1GBIT DDR3,BGA,IN
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAMA7G54D2G-I/4UB SAMA7G54D2G-I/4UB Microchip Technology SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf Description: CORTEX-A7 MPU, 2GBIT DDR3, BGA,I
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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DSPIC33CK256MP305-I/PT DSPIC33CK256MP305-I/PT Microchip Technology dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf Description: IC MCU 16BIT 256KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 167 шт:
термін постачання 21-31 дні (днів)
1+321.37 грн
25+283.27 грн
100+256.95 грн
В кошику  од. на суму  грн.
DSPIC33CK256MP306-I/PT DSPIC33CK256MP306-I/PT Microchip Technology dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 287 шт:
термін постачання 21-31 дні (днів)
1+344.66 грн
25+303.93 грн
100+275.45 грн
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DSPIC33CK256MP306-I/MR DSPIC33CK256MP306-I/MR Microchip Technology dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf Description: IC MCU 16BIT 256KB FLASH 64QFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+341.55 грн
25+301.09 грн
100+273.32 грн
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2N2814 Microchip Technology Description: PNP TRANSISTOR
Packaging: Bulk
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PIC16F17146-E/6N PIC16F17146-E/6N Microchip Technology PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf Description: IC MCU 8BIT 28KB FLASH 20VFQFN
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (4x4)
Number of I/O: 17
на замовлення 627 шт:
термін постачання 21-31 дні (днів)
4+91.60 грн
25+80.43 грн
100+80.07 грн
Мінімальне замовлення: 4
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PIC16F17146-E/SS PIC16F17146-E/SS Microchip Technology PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf Description: IC MCU 8BIT 28KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
на замовлення 603 шт:
термін постачання 21-31 дні (днів)
4+96.26 грн
25+85.42 грн
100+80.96 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
JANTX1N827UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/159
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1N827UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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1N827AUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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1N827E3
1N827E3
Виробник: Microchip Technology
Description: TEMPERATURE COMPENSATED
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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1N827AUR-1e3
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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1N827AUR-1e3/TR
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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1N827E3/TR
1N827E3/TR
Виробник: Microchip Technology
Description: TEMPERATURE COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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JANTXV1N827-1/TR
JANTXV1N827-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/159
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JANHCA1N827 14809-military-qualified-die-chip
JANHCA1N827
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/159
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JANTXV1N827UR-1 11037-lds-0220-1-datasheet
Виробник: Microchip Technology
Description: DIODE ZENER 6.2V 500MW DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/159
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JANTXV1N827UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER TEMP COMPENSATED
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
Qualification: MIL-PRF-19500/159
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AC40T08A AC40T08A-5.5-4-Lane-MIPI-720p-LCD-Display-Module-With-maXTouch-DS50003687.pdf
Виробник: Microchip Technology
Description: EVAL BOARD FOR MIC2289
Packaging: Bulk
Function: LCD Display
Type: Display
Contents: Board(s)
Utilized IC / Part: MIC2289
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+17491.24 грн
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JAN1N4485 1N4460-1N4496.1N6485-1N6491.pdf
JAN1N4485
Виробник: Microchip Technology
Description: DIODE ZENER 68V 1.5W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
Current - Reverse Leakage @ Vr: 250 nA @ 54.4 V
Qualification: MIL-PRF-19500/406
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ATMXT768E-ABR MXT768EKM%20flyer%20-%20US%20-%20low%20res.pdf
Виробник: Microchip Technology
Description: IC SENSOR MAXTOUCH 768CH
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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ATMXT768E-ABR MXT768EKM%20flyer%20-%20US%20-%20low%20res.pdf
Виробник: Microchip Technology
Description: IC SENSOR MAXTOUCH 768CH
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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ATMXT799TAT-I2C-PCB
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT799TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT799TAT
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ATEVK-MXT799TAT-A
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT799TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT799TAT
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ATEVK-MXT799TAT-C 00001599H.pdf
Виробник: Microchip Technology
Description: EVAL BOARD FOR MXT799TAT
Packaging: Bulk
Function: Touch Screen Controller
Type: Interface
Contents: Board(s)
Utilized IC / Part: mXT799TAT
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TMIK036
Виробник: Microchip Technology
Description: MICROSD CLICK
Packaging: Bulk
Function: Micro SD
Type: Connectivity
Contents: Board(s)
Platform: mikroBUS™ Click™
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MX15KP78CA 9460-rf01011-m15kp-rev-e
MX15KP78CA
Виробник: Microchip Technology
Description: TVS DIODE 78VWM 126VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 119A
Voltage - Reverse Standoff (Typ): 78V
Supplier Device Package: Case 5A (DO-204AR)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 86.7V
Voltage - Clamping (Max) @ Ipp: 126V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MX5KP12A 9461-m5kp-pdf
MX5KP12A
Виробник: Microchip Technology
Description: TVS DIODE 12VWM 19.9VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 251A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: Case 5A (DO-204AR)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC24FJ64GP205T-I/PT PIC24FJ64GP205-GU205-Family-Data-Sheet-DS30010221C.pdf
PIC24FJ64GP205T-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (22K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 14x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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PIC24FJ64GP205T-I/PT PIC24FJ64GP205-GU205-Family-Data-Sheet-DS30010221C.pdf
PIC24FJ64GP205T-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 64KB FLASH 48TQFP
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (22K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 14x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 1277 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+148.26 грн
25+130.12 грн
100+118.30 грн
Мінімальне замовлення: 3
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M1.5KE130A/TR
Виробник: Microchip Technology
Description: TVS DIODE 111VWM 179VC CASE-1
Packaging: Tape & Reel (TR)
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 8.4A
Voltage - Reverse Standoff (Typ): 111V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 124V
Voltage - Clamping (Max) @ Ipp: 179V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP16A 9461-m5kp-pdf
M5KP16A
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 192A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP16Ae3 9461-m5kp-pdf
M5KP16Ae3
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 192A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP16A/TR
Виробник: Microchip Technology
Description: TVS 16V 5% 5000W UNI
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 192A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: P600
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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MA5KP16A 9461-m5kp-pdf
MA5KP16A
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 192A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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1N5931B 10922-sa5-57-datasheet
1N5931B
Виробник: Microchip Technology
Description: DIODE ZENER 18V 1.25W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 12 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1.25 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 13.7 V
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ATMEGA8535-16JU description doc2502.pdf
ATMEGA8535-16JU
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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ATMEGA8535-16JC 2502S.pdf
ATMEGA8535-16JC
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA8535-16JI 2502S.pdf
ATMEGA8535-16JI
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA8535-16JUR doc2502.pdf
ATMEGA8535-16JUR
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Verified
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MIC5237-3.3BU MIC5237-500mA-Low-Dropout-Regulator-DS20006095A.pdf
MIC5237-3.3BU
Виробник: Microchip Technology
Description: IC REG LINEAR 3.3V 500MA TO263-3
Packaging: Tube
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: TO-263-3
Voltage - Output (Min/Fixed): 3.3V
PSRR: 75dB (120Hz)
Voltage Dropout (Max): 0.7V @ 500mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
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APL602L-1
Виробник: Microchip Technology
Description: MOSFET LINEAR 600 V 49 A TO-264
Packaging: Bulk
Package / Case: TO-264-3, TO-264AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 49A (Tc)
Rds On (Max) @ Id, Vgs: 125mOhm @ 24.5A, 12V
Power Dissipation (Max): 730W (Tc)
Vgs(th) (Max) @ Id: 4V @ 2.5mA
Supplier Device Package: TO-264 [L]
Drive Voltage (Max Rds On, Min Rds On): 12V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 9000 pF @ 25 V
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JAN1N3033B-1 125225-lds-0285-datasheet
JAN1N3033B-1
Виробник: Microchip Technology
Description: DIODE ZENER 36V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Voltage - Zener (Nom) (Vz): 36 V
Impedance (Max) (Zzt): 50 Ohms
Supplier Device Package: DO-204AL (DO-41)
Grade: Military
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 27.4 V
Qualification: MIL-PRF-19500/115
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1N4688 5827-1n4678-4717-datasheet
1N4688
Виробник: Microchip Technology
Description: DIODE ZENER 4.7V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 4.7 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 3 V
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JANTXV1N6172 127853-1n6138-1n6173a-tvs-diode-series-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 136.8VWM 257.99V AXIAL
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.8A
Voltage - Reverse Standoff (Typ): 136.8V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 162.45V
Voltage - Clamping (Max) @ Ipp: 257.99V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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1N457 1N457A-1N459A.pdf
1N457
Виробник: Microchip Technology
Description: DIODE GEN PURP 60V 150MA DO35
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Standard
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 60 V
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1N457A 8832-lds-0023-datasheet
1N457A
Виробник: Microchip Technology
Description: DIODE GEN PURP 70V 150MA DO35
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Standard
Current - Average Rectified (Io): 150mA
Supplier Device Package: DO-204AH (DO-35)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 70 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 1 µA @ 70 V
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1N4575AUR-1/TR 1N4565AUR-1-1N4584AYR-1_CDLL4565-CDLL4584A.pdf
1N4575AUR-1/TR
Виробник: Microchip Technology
Description: TEMPERATURE COMPENSATED
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Impedance (Max) (Zzt): 50 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Current - Reverse Leakage @ Vr: 2 µA @ 3 V
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AVR64DU28T-I/SS AVR64DU-28-32-Prelim-DataSheet-DS40002548.pdf
AVR64DU28T-I/SS
Виробник: Microchip Technology
Description: 64KB, 8KB SRAM, 24MHZ, USB, 10B
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 21
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AVR64DU28T-I/SS AVR64DU-28-32-Prelim-DataSheet-DS40002548.pdf
AVR64DU28T-I/SS
Виробник: Microchip Technology
Description: 64KB, 8KB SRAM, 24MHZ, USB, 10B
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 17x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 21
на замовлення 2094 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+114.11 грн
25+101.06 грн
100+97.87 грн
Мінімальне замовлення: 3
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SAM9X70-I/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
SAM9X70-I/4PB
Виробник: Microchip Technology
Description: ARM926 MPU,BGA,I TEMP,TRAY
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X72-I/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
SAM9X72-I/4PB
Виробник: Microchip Technology
Description: ARM926 MPU,LVDS,CAN-FD,BGA,I TEM
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X70-V/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
Виробник: Microchip Technology
Description: ARM926 MPU,BGA,EXT TEMP
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X72-V/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
Виробник: Microchip Technology
Description: ARM926 MPU,LVDS,CAN-FD,BGA,EXT T
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75-I/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
SAM9X75-I/4PB
Виробник: Microchip Technology
Description: ARM926 MPU,MIPI,LVDS,CAN-FD,BGA,
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75-V/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
Виробник: Microchip Technology
Description: ARM926 MPU,MIPI,LVDS,CAN-FD,BGA,
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAMA7G54-E/4HB SAMA7G5-Series-Data-Sheet-DS60001765.pdf
Виробник: Microchip Technology
Description: CORTEX-A7 MPU, BGA, EXT. TEMP (T
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAM9X75D1G-I/4TB SAM9X75-SiP-Data-Sheet-DS60001827.pdf
SAM9X75D1G-I/4TB
Виробник: Microchip Technology
Description: ARM926 MPU, 1GBIT DDR3L,MIPI,LVD
Packaging: Tray
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75D2G-I/4TB SAM9X75-SiP-Data-Sheet-DS60001827.pdf
SAM9X75D2G-I/4TB
Виробник: Microchip Technology
Description: ARM926 MPU,2GBIT DDR3L,MIPI,LVDS
Packaging: Tray
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAMA7G54D1G-I/4UB SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf
SAMA7G54D1G-I/4UB
Виробник: Microchip Technology
Description: CORTEX-A7,MPU, 1GBIT DDR3,BGA,IN
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAMA7G54D2G-I/4UB SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf
SAMA7G54D2G-I/4UB
Виробник: Microchip Technology
Description: CORTEX-A7 MPU, 2GBIT DDR3, BGA,I
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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DSPIC33CK256MP305-I/PT dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf
DSPIC33CK256MP305-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 167 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+321.37 грн
25+283.27 грн
100+256.95 грн
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DSPIC33CK256MP306-I/PT dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf
DSPIC33CK256MP306-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 287 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+344.66 грн
25+303.93 грн
100+275.45 грн
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DSPIC33CK256MP306-I/MR dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf
DSPIC33CK256MP306-I/MR
Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64QFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+341.55 грн
25+301.09 грн
100+273.32 грн
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2N2814
Виробник: Microchip Technology
Description: PNP TRANSISTOR
Packaging: Bulk
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PIC16F17146-E/6N PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf
PIC16F17146-E/6N
Виробник: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 20VFQFN
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (4x4)
Number of I/O: 17
на замовлення 627 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+91.60 грн
25+80.43 грн
100+80.07 грн
Мінімальне замовлення: 4
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PIC16F17146-E/SS PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf
PIC16F17146-E/SS
Виробник: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
на замовлення 603 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+96.26 грн
25+85.42 грн
100+80.96 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
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