Продукція > MICROCHIP TECHNOLOGY > Всі товари виробника MICROCHIP TECHNOLOGY (343124) > Сторінка 1923 з 5719
| Фото | Назва | Виробник | Інформація |
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ATMXT641TD-ABVA2 | Microchip Technology |
 Description: IC TOUCHSCREEN CTLR 100TQFPPackaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Interface: I2C, SPI Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V Resolution (Bits): 12 b Supplier Device Package: 100-TQFP (14x14) Voltage Reference: Internal Touchscreen: 2 Wire Capacitive Grade: Automotive Qualification: AEC-Q100 |
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| ATMXT641TD-ATRVA2 | Microchip Technology |
Description: 640NODE TS IC TQFP100 DFLL48 Packaging: Tape & Reel (TR) Package / Case: 100-TQFP Mounting Type: Surface Mount Interface: I2C, SPI Operating Temperature: -40°C ~ 85°C Supplier Device Package: 100-TQFP (14x14) Voltage Reference: Internal Touchscreen: 2 Wire Capacitive |
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ATMXT641TD-ABRVA2 | Microchip Technology |
Description: 640NODE TS IC TQFP100 DFLL48 Packaging: Tape & Reel (TR) Package / Case: 100-TQFP Mounting Type: Surface Mount Interface: I2C, SPI Operating Temperature: -40°C ~ 105°C Supplier Device Package: 100-TQFP (14x14) Voltage Reference: Internal Touchscreen: 2 Wire Capacitive |
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| ATMXT641TD-ATVA2 | Microchip Technology |
Description: 640NODE TS IC TQFP100 DFLL48 Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Interface: I2C, SPI Operating Temperature: -40°C ~ 85°C Supplier Device Package: 100-TQFP (14x14) Voltage Reference: Internal Touchscreen: 2 Wire Capacitive |
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1N5119/TR | Microchip Technology |
Description: DIODE ZENER 40V 5W E-AXIAL Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: E, Axial Mounting Type: Through Hole Voltage - Zener (Nom) (Vz): 40 V Impedance (Max) (Zzt): 14 Ohms Supplier Device Package: E, Axial Power - Max: 5 W |
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1N5119 | Microchip Technology |
Description: DIODE ZENER 40V 5W E-AXIAL Tolerance: ±5% Packaging: Bulk Package / Case: E, Axial Mounting Type: Through Hole Voltage - Zener (Nom) (Vz): 40 V Impedance (Max) (Zzt): 14 Ohms Supplier Device Package: E, Axial Power - Max: 5 W |
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| VCC1-B3F-10M0000000 | Microchip Technology |
Description: CMOS XO +3.3 VDC 15PF -40C TO +8 Packaging: Tape & Reel (TR) |
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| VCC4-B3F-10M0000000 | Microchip Technology |
Description: CMOS XO +3.3 VDC 15PF -40C TO +8 Packaging: Tape & Reel (TR) |
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MCP4017T-104E/LTY | Microchip Technology |
Description: IC DGT POT 100KOHM 128TAP SC70-6 Packaging: Tape & Reel (TR) Resistance (Ohms): 100k Tolerance: ±20% Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Memory Type: Volatile Interface: I2C Configuration: Rheostat Operating Temperature: -40°C ~ 125°C Number of Taps: 128 Voltage - Supply: 1.8V ~ 5.5V Taper: Linear Supplier Device Package: SC-70-6 Resistance - Wiper (Ohms) (Typ): 155 Temperature Coefficient (Typ): 150ppm/°C Number of Circuits: 1 |
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MCP4017T-502E/LTY | Microchip Technology |
Description: IC DGTL POT 5KOHM 128TAP SC70-6 Packaging: Tape & Reel (TR) Resistance (Ohms): 5k Tolerance: ±20% Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Memory Type: Volatile Interface: I2C Configuration: Rheostat Operating Temperature: -40°C ~ 125°C Number of Taps: 128 Voltage - Supply: 1.8V ~ 5.5V Taper: Linear Supplier Device Package: SC-70-6 Resistance - Wiper (Ohms) (Typ): 155 Temperature Coefficient (Typ): 150ppm/°C Number of Circuits: 1 |
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MCP4017T-103E/LTY | Microchip Technology |
Description: IC DGTL POT 10KOHM 128TAP SC70-6 Packaging: Tape & Reel (TR) Resistance (Ohms): 10k Tolerance: ±20% Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Memory Type: Volatile Interface: I2C Configuration: Rheostat Operating Temperature: -40°C ~ 125°C Number of Taps: 128 Voltage - Supply: 1.8V ~ 5.5V Taper: Linear Supplier Device Package: SC-70-6 Resistance - Wiper (Ohms) (Typ): 155 Temperature Coefficient (Typ): 150ppm/°C Number of Circuits: 1 |
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MCP4017T-503E/LTY | Microchip Technology |
Description: IC DGTL POT 50KOHM 128TAP SC70-6 Packaging: Tape & Reel (TR) Resistance (Ohms): 50k Tolerance: ±20% Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Memory Type: Volatile Interface: I2C Configuration: Rheostat Operating Temperature: -40°C ~ 125°C Number of Taps: 128 Voltage - Supply: 1.8V ~ 5.5V Taper: Linear Supplier Device Package: SC-70-6 Resistance - Wiper (Ohms) (Typ): 155 Temperature Coefficient (Typ): 150ppm/°C Number of Circuits: 1 |
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MCP4017T-103E/LTYVAO | Microchip Technology |
Description: IC DGTL POT 10KOHM 128TAP SC70-6 Packaging: Tape & Reel (TR) Resistance (Ohms): 10k Tolerance: ±20% Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Memory Type: Volatile Interface: I2C Configuration: Rheostat Operating Temperature: -40°C ~ 125°C Number of Taps: 128 Voltage - Supply: 1.8V ~ 5.5V Taper: Linear Supplier Device Package: SC-70-6 Resistance - Wiper (Ohms) (Typ): 155 Temperature Coefficient (Typ): 150ppm/°C Grade: Automotive Number of Circuits: 1 Qualification: AEC-Q100 |
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PIC32CZ2051CA70100-I/E5X | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 75 |
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В кошику од. на суму грн. | ||
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PIC32CZ2051CA70144-I/Z8X | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tray Package / Case: 144-TQFP Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 25x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 144-TQFP (20x20) Number of I/O: 114 |
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В кошику од. на суму грн. | ||
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PIC32CZ2051CA70100T-I/E5X | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tape & Reel (TR) Package / Case: 100-TQFP Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 75 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PIC32CZ2051CA70100T-V/E5X | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tape & Reel (TR) Package / Case: 100-TQFP Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 75 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PIC32CZ2051CA70100-V/E5X | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Grade: Automotive Number of I/O: 75 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PIC32CZ2051CA70144-V/Z8X | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tray Package / Case: 144-TQFP Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 25x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 144-TQFP (20x20) Grade: Automotive Number of I/O: 114 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||
| PIC32CZ2051CA70064T-I/XDB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 5x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 44 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70100-I/CQB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 75 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70144-V/XFB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tray Package / Case: 144-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 25x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 144-TQFP (20x20) Grade: Automotive Number of I/O: 114 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70064-V/XDB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 5x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Grade: Automotive Number of I/O: 44 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70144-V/B4B | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tray Package / Case: 144-TFBGA Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 25x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 144-TFBGA (10x10) Grade: Automotive Number of I/O: 114 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70100-V/XEB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Grade: Automotive Number of I/O: 75 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051MC70100T-I/XEB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tape & Reel (TR) Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 75 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70100T-I/XEB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tape & Reel (TR) Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 75 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051MC70064-I/XDB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 6x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 44 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70144-I/XFB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tray Package / Case: 144-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 25x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 144-TQFP (20x20) Number of I/O: 114 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70100T-I/CQB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tape & Reel (TR) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 75 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70064-I/XDB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 5x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 44 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051MC70100-I/XEB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 75 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70100-I/XEB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tray Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TQFP (14x14) Number of I/O: 75 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70144-V/XFB-SL3 | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tray Package / Case: 144-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 25x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 144-TQFP (20x20) Grade: Automotive Number of I/O: 114 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70100-V/CQB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 10x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 100-TFBGA (9x9) Grade: Automotive Number of I/O: 75 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70144T-I/B4B | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tape & Reel (TR) Package / Case: 144-TFBGA Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 25x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 144-TFBGA (10x10) Number of I/O: 114 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70144-I/XFB-SL3 | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tray Package / Case: 144-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 25x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 144-TQFP (20x20) Number of I/O: 114 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051MC70064T-I/XDB | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, E Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 6x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 64-TQFP (10x10) Number of I/O: 44 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| PIC32CZ2051CA70144-I/B4B | Microchip Technology |
Description: CM7, 2048KB FLASH, 512KB SRAM, T Packaging: Tray Package / Case: 144-TFBGA Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 2MB (2M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7F Data Converters: A/D 25x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 144-TFBGA (10x10) Number of I/O: 114 |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
MP6KE6.8A | Microchip Technology |
Description: TVS DIODE 5.8VWM 10.5VC T18 Packaging: Bulk Package / Case: T-18, Axial Mounting Type: Through Hole Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 57A Voltage - Reverse Standoff (Typ): 5.8V Supplier Device Package: T-18 Unidirectional Channels: 1 Voltage - Breakdown (Min): 6.45V Voltage - Clamping (Max) @ Ipp: 10.5V Power - Peak Pulse: 600W Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500 |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
2N2983 | Microchip Technology |
Description: TRANS PNP 80V 3A TO-5AA Packaging: Bulk Package / Case: TO-205AA, TO-5-3 Metal Can Mounting Type: Through Hole Transistor Type: PNP Vce Saturation (Max) @ Ib, Ic: 600mV @ 100µA, 500µA Supplier Device Package: TO-5AA Current - Collector (Ic) (Max): 3 A Voltage - Collector Emitter Breakdown (Max): 80 V Power - Max: 5 W |
товару немає в наявності |
В кошику од. на суму грн. | ||
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2N2985 | Microchip Technology |
Description: TRANS NPN 80V 3A TO-5AA Packaging: Bulk Package / Case: TO-205AA, TO-5-3 Metal Can Mounting Type: Through Hole Transistor Type: NPN Supplier Device Package: TO-5AA Current - Collector (Ic) (Max): 3 A Voltage - Collector Emitter Breakdown (Max): 80 V Power - Max: 5 W |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
1N2982A | Microchip Technology |
Description: DIODE ZENER 18V 10W DO213AA Tolerance: ±5% Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Chassis, Stud Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 18 V Impedance (Max) (Zzt): 4 Ohms Supplier Device Package: DO-213AA Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1N2987RB | Microchip Technology |
Description: DIODE ZENER 25V 10W DO4 Tolerance: ±5% Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Stud Mount Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 25 V Impedance (Max) (Zzt): 6 Ohms Supplier Device Package: DO-4 (DO-203AA) Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1N2980B | Microchip Technology |
Description: DIODE ZENER 16V 10W DO213AA Tolerance: ±5% Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Chassis, Stud Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 16 V Impedance (Max) (Zzt): 4 Ohms Supplier Device Package: DO-213AA Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1N2980A | Microchip Technology |
Description: DIODE ZENER 16V 10W DO213AA Tolerance: ±5% Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Chassis, Stud Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 16 V Impedance (Max) (Zzt): 4 Ohms Supplier Device Package: DO-213AA Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1N2985A | Microchip Technology |
Description: DIODE ZENER 22V 10W DO213AA Tolerance: ±5% Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Chassis, Stud Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 22 V Impedance (Max) (Zzt): 5 Ohms Supplier Device Package: DO-213AA Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
| 1N2989A | Microchip Technology |
Description: DIODE ZENER Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
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1N2984B | Microchip Technology |
Description: DIODE ZENER 20V 10W DO213AA Packaging: Bulk Tolerance: ±5% Package / Case: DO-203AA, DO-4, Stud Mounting Type: Chassis, Stud Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 20 V Impedance (Max) (Zzt): 4 Ohms Supplier Device Package: DO-213AA Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 15.2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1N2980RB | Microchip Technology |
Description: DIODE ZENER 16V 10W DO213AA Tolerance: ±5% Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Chassis, Stud Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 16 V Impedance (Max) (Zzt): 4 Ohms Supplier Device Package: DO-213AA Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1N2986B | Microchip Technology |
Description: DIODE ZENER 24V 10W DO213AA Tolerance: ±5% Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Chassis, Stud Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 5 Ohms Supplier Device Package: DO-213AA Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1N2986RB | Microchip Technology |
Description: DIODE ZENER 24V 10W DO213AA Tolerance: ±5% Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Chassis, Stud Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 5 Ohms Supplier Device Package: DO-213AA Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1N2982RB | Microchip Technology |
Description: DIODE ZENER 18V 10W DO213AA Tolerance: ±5% Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Chassis, Stud Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 18 V Impedance (Max) (Zzt): 4 Ohms Supplier Device Package: DO-213AA Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1N2985RB | Microchip Technology |
Description: DIODE ZENER 22V 10W DO213AA Tolerance: ±5% Packaging: Bulk Package / Case: DO-203AA, DO-4, Stud Mounting Type: Chassis, Stud Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 22 V Impedance (Max) (Zzt): 5 Ohms Supplier Device Package: DO-213AA Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V |
товару немає в наявності |
В кошику од. на суму грн. | ||
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JANTX1N2986B | Microchip Technology |
Description: DIODE ZENER 24V 10W DO213AA Packaging: Bulk Tolerance: ±5% Package / Case: DO-203AA, DO-4, Stud Mounting Type: Stud Mount Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 5 Ohms Supplier Device Package: DO-213AA (DO-4) Grade: Military Power - Max: 10 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V Qualification: MIL-PRF-19500/124 |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
MSMCJ90A | Microchip Technology |
Description: TVS DIODE 90VWM 146VC DO214AB Packaging: Bulk Package / Case: DO-214AB, SMC Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 10.3A Voltage - Reverse Standoff (Typ): 90V Supplier Device Package: DO-214AB (SMCJ) Unidirectional Channels: 1 Voltage - Breakdown (Min): 100V Voltage - Clamping (Max) @ Ipp: 146V Power - Peak Pulse: 1500W (1.5kW) Power Line Protection: No Grade: Military Qualification: MIL-PRF-19500 |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
DSC1101CM1-010.0000T | Microchip Technology |
Description: MEMS OSC., LOW JITTER, 10MHZ, LV Packaging: Tape & Reel (TR) Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -55°C ~ 125°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 95µA Supplier Device Package: 6-VDFN (3.2x2.5) Height - Seated (Max): 0.035" (0.90mm) Frequency: 10 MHz Base Resonator: MEMS |
товару немає в наявності |
В кошику од. на суму грн. | ||
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DSC1101CM1-010.0000 | Microchip Technology |
Description: MEMS OSC., LOW JITTER, 10MHZ, LV Packaging: Tube Package / Case: 6-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -55°C ~ 125°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 95µA Supplier Device Package: 6-VDFN (3.2x2.5) Height - Seated (Max): 0.035" (0.90mm) Frequency: 10 MHz Base Resonator: MEMS |
товару немає в наявності |
В кошику од. на суму грн. | ||
| SW006024-2 | Microchip Technology |
Description: MPLAB XC-DSC PRO COMPILER Packaging: Electronic Delivery For Use With/Related Products: dsPIC Type: License Applications: Programming Utilized IC / Part: dsPIC Operating System: Linux, macOS, Windows |
товару немає в наявності |
В кошику од. на суму грн. | |||
| SW006024-2N | Microchip Technology |
Description: MPLAB XC-DSC PRO COMPILER (NETWO Packaging: Electronic Delivery For Use With/Related Products: dsPIC Type: License Applications: Programming Utilized IC / Part: dsPIC Operating System: Linux, macOS, Windows |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| ATMXT641TD-ABVA2 |
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Виробник: Microchip Technology
Description: IC TOUCHSCREEN CTLR 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V
Resolution (Bits): 12 b
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
Description: IC TOUCHSCREEN CTLR 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.47V, 3.14V ~ 3.47V
Resolution (Bits): 12 b
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| ATMXT641TD-ATRVA2 |
Виробник: Microchip Technology
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
товару немає в наявності
В кошику
од. на суму грн.
| ATMXT641TD-ABRVA2 |
Виробник: Microchip Technology
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
товару немає в наявності
В кошику
од. на суму грн.
| ATMXT641TD-ATVA2 |
Виробник: Microchip Technology
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
Description: 640NODE TS IC TQFP100 DFLL48
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: 100-TQFP (14x14)
Voltage Reference: Internal
Touchscreen: 2 Wire Capacitive
товару немає в наявності
В кошику
од. на суму грн.
| 1N5119/TR |
Виробник: Microchip Technology
Description: DIODE ZENER 40V 5W E-AXIAL
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
Description: DIODE ZENER 40V 5W E-AXIAL
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
товару немає в наявності
В кошику
од. на суму грн.
| 1N5119 |
Виробник: Microchip Technology
Description: DIODE ZENER 40V 5W E-AXIAL
Tolerance: ±5%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
Description: DIODE ZENER 40V 5W E-AXIAL
Tolerance: ±5%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Voltage - Zener (Nom) (Vz): 40 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: E, Axial
Power - Max: 5 W
товару немає в наявності
В кошику
од. на суму грн.
| VCC1-B3F-10M0000000 |
|
Виробник: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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| VCC4-B3F-10M0000000 |
|
Виробник: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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| MCP4017T-104E/LTY |
|
Виробник: Microchip Technology
Description: IC DGT POT 100KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 100k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
Description: IC DGT POT 100KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 100k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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| MCP4017T-502E/LTY |
|
Виробник: Microchip Technology
Description: IC DGTL POT 5KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 5k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
Description: IC DGTL POT 5KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 5k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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| MCP4017T-103E/LTY |
|
Виробник: Microchip Technology
Description: IC DGTL POT 10KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 10k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
Description: IC DGTL POT 10KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 10k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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| MCP4017T-503E/LTY |
|
Виробник: Microchip Technology
Description: IC DGTL POT 50KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 50k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
Description: IC DGTL POT 50KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 50k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Number of Circuits: 1
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| MCP4017T-103E/LTYVAO |
|
Виробник: Microchip Technology
Description: IC DGTL POT 10KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 10k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Description: IC DGTL POT 10KOHM 128TAP SC70-6
Packaging: Tape & Reel (TR)
Resistance (Ohms): 10k
Tolerance: ±20%
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Memory Type: Volatile
Interface: I2C
Configuration: Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 128
Voltage - Supply: 1.8V ~ 5.5V
Taper: Linear
Supplier Device Package: SC-70-6
Resistance - Wiper (Ohms) (Typ): 155
Temperature Coefficient (Typ): 150ppm/°C
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
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| PIC32CZ2051CA70100-I/E5X |
|
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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| PIC32CZ2051CA70144-I/Z8X |
|
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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| PIC32CZ2051CA70100T-I/E5X |
|
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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| PIC32CZ2051CA70100T-V/E5X |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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| PIC32CZ2051CA70100-V/E5X |
|
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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| PIC32CZ2051CA70144-V/Z8X |
|
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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| PIC32CZ2051CA70064T-I/XDB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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| PIC32CZ2051CA70100-I/CQB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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| PIC32CZ2051CA70144-V/XFB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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| PIC32CZ2051CA70064-V/XDB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 44
Qualification: AEC-Q100
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 44
Qualification: AEC-Q100
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| PIC32CZ2051CA70144-V/B4B |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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| PIC32CZ2051CA70100-V/XEB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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| PIC32CZ2051MC70100T-I/XEB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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| PIC32CZ2051CA70100T-I/XEB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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| PIC32CZ2051MC70064-I/XDB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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| PIC32CZ2051CA70144-I/XFB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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| PIC32CZ2051CA70100T-I/CQB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
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од. на суму грн.
| PIC32CZ2051CA70064-I/XDB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 5x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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од. на суму грн.
| PIC32CZ2051MC70100-I/XEB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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В кошику
од. на суму грн.
| PIC32CZ2051CA70100-I/XEB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 75
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од. на суму грн.
| PIC32CZ2051CA70144-V/XFB-SL3 |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Grade: Automotive
Number of I/O: 114
Qualification: AEC-Q100
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од. на суму грн.
| PIC32CZ2051CA70100-V/CQB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 100-TFBGA (9x9)
Grade: Automotive
Number of I/O: 75
Qualification: AEC-Q100
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| PIC32CZ2051CA70144T-I/B4B |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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| PIC32CZ2051CA70144-I/XFB-SL3 |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tray
Package / Case: 144-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 114
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| PIC32CZ2051MC70064T-I/XDB |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
Description: CM7, 2048KB FLASH, 512KB SRAM, E
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 44
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| PIC32CZ2051CA70144-I/B4B |
Виробник: Microchip Technology
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
Description: CM7, 2048KB FLASH, 512KB SRAM, T
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 25x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, SDHC, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, I2S, LVD, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-TFBGA (10x10)
Number of I/O: 114
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| MP6KE6.8A |
|
Виробник: Microchip Technology
Description: TVS DIODE 5.8VWM 10.5VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 5.8VWM 10.5VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57A
Voltage - Reverse Standoff (Typ): 5.8V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.45V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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| 2N2983 |
Виробник: Microchip Technology
Description: TRANS PNP 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100µA, 500µA
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
Description: TRANS PNP 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Vce Saturation (Max) @ Ib, Ic: 600mV @ 100µA, 500µA
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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| 2N2985 |
Виробник: Microchip Technology
Description: TRANS NPN 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
Description: TRANS NPN 80V 3A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 5 W
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| 1N2982A |
|
Виробник: Microchip Technology
Description: DIODE ZENER 18V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
Description: DIODE ZENER 18V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
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| 1N2987RB |
|
Виробник: Microchip Technology
Description: DIODE ZENER 25V 10W DO4
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 25 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-4 (DO-203AA)
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
Description: DIODE ZENER 25V 10W DO4
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 25 V
Impedance (Max) (Zzt): 6 Ohms
Supplier Device Package: DO-4 (DO-203AA)
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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| 1N2980B |
|
Виробник: Microchip Technology
Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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| 1N2980A |
|
Виробник: Microchip Technology
Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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| 1N2985A |
|
Виробник: Microchip Technology
Description: DIODE ZENER 22V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Description: DIODE ZENER 22V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
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| 1N2984B |
|
Виробник: Microchip Technology
Description: DIODE ZENER 20V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 15.2 V
Description: DIODE ZENER 20V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 15.2 V
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| 1N2980RB |
|
Виробник: Microchip Technology
Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
Description: DIODE ZENER 16V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 12.2 V
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| 1N2986B |
|
Виробник: Microchip Technology
Description: DIODE ZENER 24V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
Description: DIODE ZENER 24V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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| 1N2986RB |
|
Виробник: Microchip Technology
Description: DIODE ZENER 24V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
Description: DIODE ZENER 24V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
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| 1N2982RB |
|
Виробник: Microchip Technology
Description: DIODE ZENER 18V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
Description: DIODE ZENER 18V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 4 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 13.7 V
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| 1N2985RB |
|
Виробник: Microchip Technology
Description: DIODE ZENER 22V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
Description: DIODE ZENER 22V 10W DO213AA
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Chassis, Stud Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 16.7 V
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| JANTX1N2986B |
Виробник: Microchip Technology
Description: DIODE ZENER 24V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA (DO-4)
Grade: Military
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
Qualification: MIL-PRF-19500/124
Description: DIODE ZENER 24V 10W DO213AA
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: DO-213AA (DO-4)
Grade: Military
Power - Max: 10 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 2 A
Current - Reverse Leakage @ Vr: 10 µA @ 18.2 V
Qualification: MIL-PRF-19500/124
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| MSMCJ90A |
|
Виробник: Microchip Technology
Description: TVS DIODE 90VWM 146VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 10.3A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
Description: TVS DIODE 90VWM 146VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 10.3A
Voltage - Reverse Standoff (Typ): 90V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 100V
Voltage - Clamping (Max) @ Ipp: 146V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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| DSC1101CM1-010.0000T |
|
Виробник: Microchip Technology
Description: MEMS OSC., LOW JITTER, 10MHZ, LV
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 95µA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Description: MEMS OSC., LOW JITTER, 10MHZ, LV
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 95µA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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| DSC1101CM1-010.0000 |
|
Виробник: Microchip Technology
Description: MEMS OSC., LOW JITTER, 10MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 95µA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
Description: MEMS OSC., LOW JITTER, 10MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 95µA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10 MHz
Base Resonator: MEMS
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| SW006024-2 |
Виробник: Microchip Technology
Description: MPLAB XC-DSC PRO COMPILER
Packaging: Electronic Delivery
For Use With/Related Products: dsPIC
Type: License
Applications: Programming
Utilized IC / Part: dsPIC
Operating System: Linux, macOS, Windows
Description: MPLAB XC-DSC PRO COMPILER
Packaging: Electronic Delivery
For Use With/Related Products: dsPIC
Type: License
Applications: Programming
Utilized IC / Part: dsPIC
Operating System: Linux, macOS, Windows
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| SW006024-2N |
Виробник: Microchip Technology
Description: MPLAB XC-DSC PRO COMPILER (NETWO
Packaging: Electronic Delivery
For Use With/Related Products: dsPIC
Type: License
Applications: Programming
Utilized IC / Part: dsPIC
Operating System: Linux, macOS, Windows
Description: MPLAB XC-DSC PRO COMPILER (NETWO
Packaging: Electronic Delivery
For Use With/Related Products: dsPIC
Type: License
Applications: Programming
Utilized IC / Part: dsPIC
Operating System: Linux, macOS, Windows
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 115873.16 грн |