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SAM9X72-I/4PB SAM9X72-I/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,LVDS,CAN-FD,BGA,I TEM
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X70-V/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,BGA,EXT TEMP
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X72-V/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,LVDS,CAN-FD,BGA,EXT T
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75-I/4PB SAM9X75-I/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,MIPI,LVDS,CAN-FD,BGA,
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75-V/4PB Microchip Technology SAM9X7-Series-Data-Sheet-DS60001813.pdf Description: ARM926 MPU,MIPI,LVDS,CAN-FD,BGA,
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAMA7G54-E/4HB Microchip Technology SAMA7G5-Series-Data-Sheet-DS60001765.pdf Description: CORTEX-A7 MPU, BGA, EXT. TEMP (T
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAM9X75D1G-I/4TB SAM9X75D1G-I/4TB Microchip Technology SAM9X75-SiP-Data-Sheet-DS60001827.pdf Description: ARM926 MPU, 1GBIT DDR3L,MIPI,LVD
Packaging: Tray
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75D2G-I/4TB SAM9X75D2G-I/4TB Microchip Technology SAM9X75-SiP-Data-Sheet-DS60001827.pdf Description: ARM926 MPU,2GBIT DDR3L,MIPI,LVDS
Packaging: Tray
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAMA7G54D1G-I/4UB SAMA7G54D1G-I/4UB Microchip Technology SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf Description: CORTEX-A7,MPU, 1GBIT DDR3,BGA,IN
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAMA7G54D2G-I/4UB SAMA7G54D2G-I/4UB Microchip Technology SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf Description: CORTEX-A7 MPU, 2GBIT DDR3, BGA,I
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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DSPIC33CK256MP305-I/PT DSPIC33CK256MP305-I/PT Microchip Technology dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf Description: IC MCU 16BIT 256KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 167 шт:
термін постачання 21-31 дні (днів)
1+333.25 грн
25+293.75 грн
100+266.45 грн
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DSPIC33CK256MP306-I/PT DSPIC33CK256MP306-I/PT Microchip Technology dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 287 шт:
термін постачання 21-31 дні (днів)
1+357.40 грн
25+315.17 грн
100+285.64 грн
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DSPIC33CK256MP306-I/MR DSPIC33CK256MP306-I/MR Microchip Technology dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf Description: IC MCU 16BIT 256KB FLASH 64QFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+354.18 грн
25+312.23 грн
100+283.42 грн
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2N2814 Microchip Technology Description: PNP TRANSISTOR
Packaging: Bulk
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PIC16F17146-E/6N PIC16F17146-E/6N Microchip Technology PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf Description: IC MCU 8BIT 28KB FLASH 20VFQFN
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (4x4)
Number of I/O: 17
на замовлення 627 шт:
термін постачання 21-31 дні (днів)
4+94.98 грн
25+83.41 грн
100+83.03 грн
Мінімальне замовлення: 4
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PIC16F17146-E/SS PIC16F17146-E/SS Microchip Technology PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf Description: IC MCU 8BIT 28KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
на замовлення 603 шт:
термін постачання 21-31 дні (днів)
4+99.81 грн
25+88.58 грн
100+83.96 грн
Мінімальне замовлення: 4
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PIC16F17146-E/SO PIC16F17146-E/SO Microchip Technology PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf Description: IC MCU 8BIT 28KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
на замовлення 532 шт:
термін постачання 21-31 дні (днів)
3+113.50 грн
25+100.37 грн
100+90.78 грн
Мінімальне замовлення: 3
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PIC16F17146-E/P PIC16F17146-E/P Microchip Technology PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf Description: IC MCU 8BIT 28KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 17
на замовлення 306 шт:
термін постачання 21-31 дні (днів)
2+198.02 грн
25+174.93 грн
100+158.69 грн
Мінімальне замовлення: 2
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MSMCJ100A MSMCJ100A Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 100VWM 162VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 9.3A
Voltage - Reverse Standoff (Typ): 100V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 111V
Voltage - Clamping (Max) @ Ipp: 162V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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APT1003RSFLLG/TR APT1003RSFLLG/TR Microchip Technology 5622-apt1003rbfll-apt1003rsfll-datasheet Description: MOSFET N-CH 1KV 4A D3PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4A (Tc)
Rds On (Max) @ Id, Vgs: 3Ohm @ 2A, 10V
Power Dissipation (Max): 139W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 34 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 694 pF @ 25 V
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APT1003RSFLLG/TR APT1003RSFLLG/TR Microchip Technology 5622-apt1003rbfll-apt1003rsfll-datasheet Description: MOSFET N-CH 1KV 4A D3PAK
Packaging: Cut Tape (CT)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4A (Tc)
Rds On (Max) @ Id, Vgs: 3Ohm @ 2A, 10V
Power Dissipation (Max): 139W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 34 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 694 pF @ 25 V
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AT93C46-10TU-1.8-T AT93C46-10TU-1.8-T Microchip Technology AT93C46%2C56%2C66.pdf Description: IC EEPROM 1KBIT 3-WIRE 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 10ms
Memory Interface: 3-Wire Serial
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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MPLAD7.5KP16Ae3 MPLAD7.5KP16Ae3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD7.5KP16A MPLAD7.5KP16A Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD7.5KP16A/TR MPLAD7.5KP16A/TR Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE 16VWM 26VC MINI-PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD6.5KP16Ae3 Microchip Technology 129479-rf01083-datasheet Description: TVS DIODE 16VWM 26VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD6.5KP16A Microchip Technology 129479-rf01083-datasheet Description: TVS DIODE 16VWM 26VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP16Ae3 MAPLAD7.5KP16Ae3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP16A MAPLAD7.5KP16A Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD6.5KP16Ae3 MXLPLAD6.5KP16Ae3 Microchip Technology 129479-rf01083-datasheet Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD7.5KP16Ae3 MXLPLAD7.5KP16Ae3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD6.5KP16Ae3 MXPLAD6.5KP16Ae3 Microchip Technology 129479-rf01083-datasheet Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD7.5KP16Ae3 MXPLAD7.5KP16Ae3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD15KP16A/TR MPLAD15KP16A/TR Microchip Technology 9522-mplad15kp-datasheet Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 576A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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EV90J04A EV90J04A Microchip Technology KSZ8091-Daughter-Board-Information-Sheet-DS50003518.pdf Description: EVB-KSZ8091
Packaging: Box
Function: Ethernet
Type: Interface
Contents: Board(s)
Utilized IC / Part: KSZ8061
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+4598.72 грн
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M5KP43CA/TR Microchip Technology Description: TVS 43V 5% 5000W BI
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 72A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: P600
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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M5KP43CAE3/TR Microchip Technology Description: TVS 43V 5% 5000W BI
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 72A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: P600
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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MAPLAD6.5KP43CAe3 Microchip Technology 129479-rf01083-datasheet Description: TVS DIODE 43VWM 69.4VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD6.5KP43CA Microchip Technology 129479-rf01083-datasheet Description: TVS DIODE 43VWM 69.4VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP43CAe3 MAPLAD7.5KP43CAe3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 108A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP43CA MAPLAD7.5KP43CA Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 108A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD6.5KP43CAe3 MXLPLAD6.5KP43CAe3 Microchip Technology 129479-rf01083-datasheet Description: TVS DIODE 43VWM 69.4VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD7.5KP43CAe3 MXLPLAD7.5KP43CAe3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 108A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD6.5KP43CAe3 MXPLAD6.5KP43CAe3 Microchip Technology 129479-rf01083-datasheet Description: TVS DIODE 43VWM 69.4VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD7.5KP43CAe3 MXPLAD7.5KP43CAe3 Microchip Technology 132315-plad7-5kp-datasheet Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 108A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXL5KP43CA/TR Microchip Technology Description: TVS 43V 5% 5000W BI
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 72A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: P600
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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M15KP43CAE3/TR M15KP43CAE3/TR Microchip Technology Description: TVS 43V 5% 15000W BI
Packaging: Tape & Reel (TR)
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 215A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP43CA/TR M15KP43CA/TR Microchip Technology Description: TVS 43V 5% 15000W BI
Packaging: Tape & Reel (TR)
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 215A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32MZ2051W104132-I/NX Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: IC MCU
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Protocol: 802.11b/g/n
Current - Receiving: 73mA ~ 162mA
Data Rate (Max): 54Mbps
Current - Transmitting: 169mA ~ 359mA
Supplier Device Package: 132-VQFN (10x10)
GPIO: 62
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
на замовлення 168 шт:
термін постачання 21-31 дні (днів)
1+528.86 грн
25+462.79 грн
100+420.71 грн
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VSC7449YIH-02 VSC7449YIH-02 Microchip Technology VMDS-10498_VSC7442-02_VSC7444-02_VSC7448-02_VSC7449-02.pdf Description: IC TELECOM INTERFACE 672FCBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: JTAG, SerDes
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 0.95V ~ 1.05V
Current - Supply: 8.1A
Supplier Device Package: 672-FCBGA (27x27)
Number of Circuits: 1
Power (Watts): 13.3 W
на замовлення 33 шт:
термін постачання 21-31 дні (днів)
1+13184.39 грн
25+10578.39 грн
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BZV55C20 BZV55C20 Microchip Technology 8298-bzv55-c2v4-c75-datasheet Description: DIODE ZENER 20V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 14 V
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JANTXV1N5416 JANTXV1N5416 Microchip Technology 124360-lds-0231-datasheet Description: DIODE GEN PURP 100V 3A AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 100 V
Qualification: MIL-PRF-19500/411
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MIC2194BM MIC2194BM Microchip Technology MCRLS05891-1.pdf?t.download=true&u=5oefqw Description: 400 KHZ SO-8 BUCK CONTROL IC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 400kHz
Topology: Buck, Buck-Boost
Voltage - Supply (Vcc/Vdd): 2.9V ~ 14V
Supplier Device Package: 8-SOIC
Synchronous Rectifier: No
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 1
на замовлення 20969 шт:
термін постачання 21-31 дні (днів)
226+101.94 грн
Мінімальне замовлення: 226
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MIC2194YM-TR MIC2194YM-TR Microchip Technology mic2194.pdf Description: IC REG CTRLR BUCK/BUCK-BST 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 400kHz
Topology: Buck, Buck-Boost
Voltage - Supply (Vcc/Vdd): 2.9V ~ 14V
Supplier Device Package: 8-SOIC
Synchronous Rectifier: No
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 1
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1N3492R Microchip Technology 10463-msc1663-datasheet Description: DIODE STANDARD REV 100V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N3492 Microchip Technology S%2CR35PF.pdf Description: DIODE STANDARD 100V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N3070UR-1/TR 1N3070UR-1/TR Microchip Technology 5790-1n3070ur-1-datasheet Description: DIODE STD 175V 100MA DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 175 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
на замовлення 135 шт:
термін постачання 21-31 дні (днів)
135+479.58 грн
Мінімальне замовлення: 135
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1N3070UR-1/TR 1N3070UR-1/TR Microchip Technology 5790-1n3070ur-1-datasheet Description: DIODE STD 175V 100MA DO213AA
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 175 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
на замовлення 135 шт:
термін постачання 21-31 дні (днів)
1+516.78 грн
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1N3070UR 1N3070UR Microchip Technology 1N3070UR-1.pdf Description: DIODE GP 200V 100MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
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1N3070UR/TR Microchip Technology 5790-1n3070ur-1-datasheet Description: SIGNAL OR COMPUTER DIODE
Packaging: Tape & Reel (TR)
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SAM9X72-I/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
SAM9X72-I/4PB
Виробник: Microchip Technology
Description: ARM926 MPU,LVDS,CAN-FD,BGA,I TEM
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X70-V/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
Виробник: Microchip Technology
Description: ARM926 MPU,BGA,EXT TEMP
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X72-V/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
Виробник: Microchip Technology
Description: ARM926 MPU,LVDS,CAN-FD,BGA,EXT T
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75-I/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
SAM9X75-I/4PB
Виробник: Microchip Technology
Description: ARM926 MPU,MIPI,LVDS,CAN-FD,BGA,
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75-V/4PB SAM9X7-Series-Data-Sheet-DS60001813.pdf
Виробник: Microchip Technology
Description: ARM926 MPU,MIPI,LVDS,CAN-FD,BGA,
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 240-TFBGA (11x11)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAMA7G54-E/4HB SAMA7G5-Series-Data-Sheet-DS60001765.pdf
Виробник: Microchip Technology
Description: CORTEX-A7 MPU, BGA, EXT. TEMP (T
Packaging: Tray
Package / Case: 343-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 343-TFBGA (14x14)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAM9X75D1G-I/4TB SAM9X75-SiP-Data-Sheet-DS60001827.pdf
SAM9X75D1G-I/4TB
Виробник: Microchip Technology
Description: ARM926 MPU, 1GBIT DDR3L,MIPI,LVD
Packaging: Tray
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAM9X75D2G-I/4TB SAM9X75-SiP-Data-Sheet-DS60001827.pdf
SAM9X75D2G-I/4TB
Виробник: Microchip Technology
Description: ARM926 MPU,2GBIT DDR3L,MIPI,LVDS
Packaging: Tray
Package / Case: 243-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 243-TFBGA (16x16)
Ethernet: 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI/DSI
Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG
Additional Interfaces: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
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SAMA7G54D1G-I/4UB SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf
SAMA7G54D1G-I/4UB
Виробник: Microchip Technology
Description: CORTEX-A7,MPU, 1GBIT DDR3,BGA,IN
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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SAMA7G54D2G-I/4UB SAMA7G5-SIP-Series-Data-Sheet-DS50003577.pdf
SAMA7G54D2G-I/4UB
Виробник: Microchip Technology
Description: CORTEX-A7 MPU, 2GBIT DDR3, BGA,I
Packaging: Tray
Package / Case: 427-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.35V
Supplier Device Package: 427-TFBGA (21x18)
Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1)
USB: USB (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Additional Interfaces: EBI, I2C, SPI
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DSPIC33CK256MP305-I/PT dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf
DSPIC33CK256MP305-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 19x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 167 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+333.25 грн
25+293.75 грн
100+266.45 грн
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DSPIC33CK256MP306-I/PT dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf
DSPIC33CK256MP306-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 287 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+357.40 грн
25+315.17 грн
100+285.64 грн
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DSPIC33CK256MP306-I/MR dsPIC33CK512MP608-Family-Data-Sheet-DS70005452B.pdf
DSPIC33CK256MP306-I/MR
Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64QFN
Packaging: Tube
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 100MIPs
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 20x12b SAR; D/A 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control, POR, PWM, QEI, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+354.18 грн
25+312.23 грн
100+283.42 грн
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2N2814
Виробник: Microchip Technology
Description: PNP TRANSISTOR
Packaging: Bulk
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PIC16F17146-E/6N PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf
PIC16F17146-E/6N
Виробник: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 20VFQFN
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (4x4)
Number of I/O: 17
на замовлення 627 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+94.98 грн
25+83.41 грн
100+83.03 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F17146-E/SS PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf
PIC16F17146-E/SS
Виробник: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SSOP
Number of I/O: 17
на замовлення 603 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+99.81 грн
25+88.58 грн
100+83.96 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PIC16F17146-E/SO PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf
PIC16F17146-E/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
на замовлення 532 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+113.50 грн
25+100.37 грн
100+90.78 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PIC16F17146-E/P PIC16F17126-46-Microcontrollers-Data-Sheet-DS40002343.pdf
PIC16F17146-E/P
Виробник: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 41x12b SAR; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-PDIP
Number of I/O: 17
на замовлення 306 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+198.02 грн
25+174.93 грн
100+158.69 грн
Мінімальне замовлення: 2
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MSMCJ100A 10561-msmc-datasheet
MSMCJ100A
Виробник: Microchip Technology
Description: TVS DIODE 100VWM 162VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 9.3A
Voltage - Reverse Standoff (Typ): 100V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 111V
Voltage - Clamping (Max) @ Ipp: 162V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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APT1003RSFLLG/TR 5622-apt1003rbfll-apt1003rsfll-datasheet
APT1003RSFLLG/TR
Виробник: Microchip Technology
Description: MOSFET N-CH 1KV 4A D3PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4A (Tc)
Rds On (Max) @ Id, Vgs: 3Ohm @ 2A, 10V
Power Dissipation (Max): 139W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 34 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 694 pF @ 25 V
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APT1003RSFLLG/TR 5622-apt1003rbfll-apt1003rsfll-datasheet
APT1003RSFLLG/TR
Виробник: Microchip Technology
Description: MOSFET N-CH 1KV 4A D3PAK
Packaging: Cut Tape (CT)
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4A (Tc)
Rds On (Max) @ Id, Vgs: 3Ohm @ 2A, 10V
Power Dissipation (Max): 139W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 34 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 694 pF @ 25 V
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AT93C46-10TU-1.8-T AT93C46%2C56%2C66.pdf
AT93C46-10TU-1.8-T
Виробник: Microchip Technology
Description: IC EEPROM 1KBIT 3-WIRE 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Technology: EEPROM
Clock Frequency: 2 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 10ms
Memory Interface: 3-Wire Serial
Memory Organization: 128 x 8, 64 x 16
DigiKey Programmable: Not Verified
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MPLAD7.5KP16Ae3 132315-plad7-5kp-datasheet
MPLAD7.5KP16Ae3
Виробник: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD7.5KP16A 132315-plad7-5kp-datasheet
MPLAD7.5KP16A
Виробник: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD7.5KP16A/TR 132315-plad7-5kp-datasheet
MPLAD7.5KP16A/TR
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC MINI-PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD6.5KP16Ae3 129479-rf01083-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD6.5KP16A 129479-rf01083-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP16Ae3 132315-plad7-5kp-datasheet
MAPLAD7.5KP16Ae3
Виробник: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP16A 132315-plad7-5kp-datasheet
MAPLAD7.5KP16A
Виробник: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD6.5KP16Ae3 129479-rf01083-datasheet
MXLPLAD6.5KP16Ae3
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD7.5KP16Ae3 132315-plad7-5kp-datasheet
MXLPLAD7.5KP16Ae3
Виробник: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD6.5KP16Ae3 129479-rf01083-datasheet
MXPLAD6.5KP16Ae3
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD7.5KP16Ae3 132315-plad7-5kp-datasheet
MXPLAD7.5KP16Ae3
Виробник: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 288A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: Mini-PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD15KP16A/TR 9522-mplad15kp-datasheet
MPLAD15KP16A/TR
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 576A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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EV90J04A KSZ8091-Daughter-Board-Information-Sheet-DS50003518.pdf
EV90J04A
Виробник: Microchip Technology
Description: EVB-KSZ8091
Packaging: Box
Function: Ethernet
Type: Interface
Contents: Board(s)
Utilized IC / Part: KSZ8061
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4598.72 грн
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M5KP43CA/TR
Виробник: Microchip Technology
Description: TVS 43V 5% 5000W BI
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 72A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: P600
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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M5KP43CAE3/TR
Виробник: Microchip Technology
Description: TVS 43V 5% 5000W BI
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 72A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: P600
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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MAPLAD6.5KP43CAe3 129479-rf01083-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 43VWM 69.4VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD6.5KP43CA 129479-rf01083-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 43VWM 69.4VC MINI-PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP43CAe3 132315-plad7-5kp-datasheet
MAPLAD7.5KP43CAe3
Виробник: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 108A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD7.5KP43CA 132315-plad7-5kp-datasheet
MAPLAD7.5KP43CA
Виробник: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 108A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD6.5KP43CAe3 129479-rf01083-datasheet
MXLPLAD6.5KP43CAe3
Виробник: Microchip Technology
Description: TVS DIODE 43VWM 69.4VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD7.5KP43CAe3 132315-plad7-5kp-datasheet
MXLPLAD7.5KP43CAe3
Виробник: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 108A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD6.5KP43CAe3 129479-rf01083-datasheet
MXPLAD6.5KP43CAe3
Виробник: Microchip Technology
Description: TVS DIODE 43VWM 69.4VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 93A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 6500W (6.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD7.5KP43CAe3 132315-plad7-5kp-datasheet
MXPLAD7.5KP43CAe3
Виробник: Microchip Technology
Description: TVS DIODE
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 108A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: Mini-PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 7500W (7.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXL5KP43CA/TR
Виробник: Microchip Technology
Description: TVS 43V 5% 5000W BI
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 72A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: P600
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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M15KP43CAE3/TR
M15KP43CAE3/TR
Виробник: Microchip Technology
Description: TVS 43V 5% 15000W BI
Packaging: Tape & Reel (TR)
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 215A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M15KP43CA/TR
M15KP43CA/TR
Виробник: Microchip Technology
Description: TVS 43V 5% 15000W BI
Packaging: Tape & Reel (TR)
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 215A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.7V
Power - Peak Pulse: 15000W (15kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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PIC32MZ2051W104132-I/NX PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
Виробник: Microchip Technology
Description: IC MCU
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 21.5dBm
Protocol: 802.11b/g/n
Current - Receiving: 73mA ~ 162mA
Data Rate (Max): 54Mbps
Current - Transmitting: 169mA ~ 359mA
Supplier Device Package: 132-VQFN (10x10)
GPIO: 62
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
на замовлення 168 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+528.86 грн
25+462.79 грн
100+420.71 грн
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VSC7449YIH-02 VMDS-10498_VSC7442-02_VSC7444-02_VSC7448-02_VSC7449-02.pdf
VSC7449YIH-02
Виробник: Microchip Technology
Description: IC TELECOM INTERFACE 672FCBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Function: Ethernet Switch
Interface: JTAG, SerDes
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 0.95V ~ 1.05V
Current - Supply: 8.1A
Supplier Device Package: 672-FCBGA (27x27)
Number of Circuits: 1
Power (Watts): 13.3 W
на замовлення 33 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+13184.39 грн
25+10578.39 грн
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BZV55C20 8298-bzv55-c2v4-c75-datasheet
BZV55C20
Виробник: Microchip Technology
Description: DIODE ZENER 20V DO213AA
Tolerance: ±6%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Supplier Device Package: DO-213AA
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 14 V
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JANTXV1N5416 124360-lds-0231-datasheet
JANTXV1N5416
Виробник: Microchip Technology
Description: DIODE GEN PURP 100V 3A AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 150 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Grade: Military
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 100 V
Qualification: MIL-PRF-19500/411
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MIC2194BM MCRLS05891-1.pdf?t.download=true&u=5oefqw
MIC2194BM
Виробник: Microchip Technology
Description: 400 KHZ SO-8 BUCK CONTROL IC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 400kHz
Topology: Buck, Buck-Boost
Voltage - Supply (Vcc/Vdd): 2.9V ~ 14V
Supplier Device Package: 8-SOIC
Synchronous Rectifier: No
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 1
на замовлення 20969 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
226+101.94 грн
Мінімальне замовлення: 226
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MIC2194YM-TR mic2194.pdf
MIC2194YM-TR
Виробник: Microchip Technology
Description: IC REG CTRLR BUCK/BUCK-BST 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down, Step-Up/Step-Down
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 400kHz
Topology: Buck, Buck-Boost
Voltage - Supply (Vcc/Vdd): 2.9V ~ 14V
Supplier Device Package: 8-SOIC
Synchronous Rectifier: No
Control Features: Enable
Output Phases: 1
Duty Cycle (Max): 100%
Clock Sync: No
Number of Outputs: 1
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1N3492R 10463-msc1663-datasheet
Виробник: Microchip Technology
Description: DIODE STANDARD REV 100V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N3492 S%2CR35PF.pdf
Виробник: Microchip Technology
Description: DIODE STANDARD 100V 35A DO21
Packaging: Bulk
Package / Case: DO-208AA
Mounting Type: Press Fit
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: DO-21
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 35 A
Current - Reverse Leakage @ Vr: 10 µA @ 100 V
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1N3070UR-1/TR 5790-1n3070ur-1-datasheet
1N3070UR-1/TR
Виробник: Microchip Technology
Description: DIODE STD 175V 100MA DO213AA
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 175 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
на замовлення 135 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
135+479.58 грн
Мінімальне замовлення: 135
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1N3070UR-1/TR 5790-1n3070ur-1-datasheet
1N3070UR-1/TR
Виробник: Microchip Technology
Description: DIODE STD 175V 100MA DO213AA
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 175 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
на замовлення 135 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+516.78 грн
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1N3070UR 1N3070UR-1.pdf
1N3070UR
Виробник: Microchip Technology
Description: DIODE GP 200V 100MA DO213AA
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Current - Average Rectified (Io): 100mA
Supplier Device Package: DO-213AA
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 175 V
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1N3070UR/TR 5790-1n3070ur-1-datasheet
Виробник: Microchip Technology
Description: SIGNAL OR COMPUTER DIODE
Packaging: Tape & Reel (TR)
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