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BFQ67W,115 BFQ67W,115 NXP USA Inc. BFQ67W_Rev_Oct2010.pdf Description: RF TRANS NPN 10V 8GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 5V
Frequency - Transition: 8GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
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BFR31,215 BFR31,215 NXP USA Inc. BFR30%2C31.pdf Description: JFET N-CH 10MA SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 4pF @ 10V
Current Drain (Id) - Max: 10 mA
Supplier Device Package: SOT-23 (TO-236AB)
Drain to Source Voltage (Vdss): 25 V
Power - Max: 250 mW
Voltage - Cutoff (VGS off) @ Id: 2.5 V @ 0.5 nA
Current - Drain (Idss) @ Vds (Vgs=0): 1 mA @ 10 V
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BFR520T,115 BFR520T,115 NXP USA Inc. BFR520T_Rev_Oct2010.pdf Description: RF TRANS NPN 15V 9GHZ SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Supplier Device Package: SC-75
Part Status: Obsolete
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BFR93AW,115 BFR93AW,115 NXP USA Inc. BFR93AW_Rev_Oct2010.pdf Description: RF TRANS NPN 12V 5GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
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BGA2801,115 BGA2801,115 NXP USA Inc. BGA2801.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 23dB
Current - Supply: 14.3mA
Noise Figure: 3.9dB
P1dB: 0dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 2691 шт:
термін постачання 21-31 дні (днів)
10+34.54 грн
11+29.33 грн
25+26.49 грн
100+21.74 грн
250+19.07 грн
500+16.85 грн
1000+13.09 грн
Мінімальне замовлення: 10
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BGA2866,115 BGA2866,115 NXP USA Inc. BGA2866.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 24.3dB
Current - Supply: 17.4mA
Noise Figure: 3.9dB
P1dB: 3dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 10196 шт:
термін постачання 21-31 дні (днів)
14+22.76 грн
17+18.29 грн
25+17.23 грн
100+14.78 грн
250+13.94 грн
500+13.35 грн
1000+12.57 грн
Мінімальне замовлення: 14
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BLT81,115 BLT81,115 NXP USA Inc. BLT81.pdf Description: RF TRANS NPN 9.5V 900MHZ SC-73
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 8dB
Power - Max: 2W
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 9.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Frequency - Transition: 900MHz
Supplier Device Package: SC-73
Part Status: Obsolete
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PBR941B,215 PBR941B,215 NXP USA Inc. PBR941B.pdf Description: RF TRANS NPN 10V 9GHZ TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 360mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.5dB @ 1GHz
Supplier Device Package: SOT-23 (TO-236AB)
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PCF8564ACX9/B/1,02 NXP USA Inc. PCF8564A.pdf Description: IC RTC CLOCK/CALENDAR I2C DIE
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: Die
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PMBF4391,215 PMBF4391,215 NXP USA Inc. PMBF4391-4393.pdf Description: JFET N-CH 40V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: SOT-23 (TO-236AB)
Drain to Source Voltage (Vdss): 40 V
Power - Max: 250 mW
Resistance - RDS(On): 30 Ohms
Voltage - Cutoff (VGS off) @ Id: 4 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 50 mA @ 20 V
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PMBF4392,215 PMBF4392,215 NXP USA Inc. PMBF4391-4393.pdf Description: JFET N-CH 40V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Power - Max: 250 mW
Voltage - Cutoff (VGS off) @ Id: 2 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 25 mA @ 20 V
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PMBFJ175,215 PMBFJ175,215 NXP USA Inc. PMBFJ174_175_176_177_CNV.pdf Description: JFET P-CH 30V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 300 mW
Resistance - RDS(On): 125 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V
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PMBFJ309,215 PMBFJ309,215 NXP USA Inc. PMBFJ308_309_310.pdf Description: JFET N-CH 25V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Voltage - Breakdown (V(BR)GSS): 25 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 25 V
Power - Max: 250 mW
Resistance - RDS(On): 50 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 µA
Current - Drain (Idss) @ Vds (Vgs=0): 12 mA @ 10 V
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PMDPB65UP,115 PMDPB65UP,115 NXP USA Inc. PMDPB65UP.pdf Description: MOSFET 2P-CH 20V 3.5A 6HUSON
Packaging: Cut Tape (CT)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 P-Channel (Dual)
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 520mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 3.5A
Input Capacitance (Ciss) (Max) @ Vds: 380pF @ 10V
Rds On (Max) @ Id, Vgs: 70mOhm @ 1A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 6nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
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PMFPB6532UP,115 PMFPB6532UP,115 NXP USA Inc. PMFPB6532UP.pdf Description: MOSFET P-CH 20V 3.5A DFN2020-6
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PMFPB6545UP,115 PMFPB6545UP,115 NXP USA Inc. PMFPB6545UP.pdf Description: MOSFET P-CH 20V 3.5A SOT1118
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PRF947,115 PRF947,115 NXP USA Inc. PRF947.pdf Description: RF TRANS NPN 10V 8.5GHZ SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V
Frequency - Transition: 8.5GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
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TL431BMSDT,215 TL431BMSDT,215 NXP USA Inc. TL431_Family.pdf Description: IC VREF SHUNT ADJ 0.5% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±0.5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Grade: Automotive
Qualification: AEC-Q100
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TL431BSDT,215 TL431BSDT,215 NXP USA Inc. TL431_Family.pdf Description: IC VREF SHUNT ADJ 0.5% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±0.5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Grade: Automotive
Qualification: AEC-Q100
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BGA7127,118 BGA7127,118 NXP USA Inc. BGA7127.pdf Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
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PTN3392BS/F2,518 PTN3392BS/F2,518 NXP USA Inc. PTN3392.pdf Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
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SA616DK/03,118 SA616DK/03,118 NXP USA Inc. SA616.pdf Description: IC MIXR 150MHZ RSSI EQUIP 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: RSSI Equipped
Noise Figure: 6.8dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
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BGA7127,118 BGA7127,118 NXP USA Inc. BGA7127.pdf Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
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PTN3392BS/F2,518 PTN3392BS/F2,518 NXP USA Inc. PTN3392.pdf Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
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BUK764R3-40B,118 BUK764R3-40B,118 NXP USA Inc. BUK764R3-40B.pdf Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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PX1011BI-EL1/G,518 PX1011BI-EL1/G,518 NXP USA Inc. PX1011B.pdf Description: IC INTFACE SPECIALIZED 81LFBGA
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TFF1003HN/N1,115 TFF1003HN/N1,115 NXP USA Inc. TFF1003HN.pdf Description: IC FREQUENCY GEN TX/TXRX 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 13.05GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: No
Part Status: Obsolete
Number of Circuits: 1
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OM13008,598 OM13008,598 NXP USA Inc. LPC122X.pdf Description: LPCXPRESSO LPC122 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC122
Platform: LPCXpresso™
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MRFE6VP5600HR5 MRFE6VP5600HR5 NXP USA Inc. MRFE6VP5600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MRFE6VP5600HR5 MRFE6VP5600HR5 NXP USA Inc. MRFE6VP5600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
1+15543.23 грн
10+12777.94 грн
25+12231.41 грн
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MPC8313E-RDBC MPC8313E-RDBC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
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P1013PSE2EFA P1013PSE2EFA NXP USA Inc. QP1022FS.pdf Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
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P1022COME-DS-PB NXP USA Inc. WBNR_FTF10_NET_F0430.pdf Description: P1022 EVAL BRD
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P2010NXE2HFC P2010NXE2HFC NXP USA Inc. QP20XXFS.pdf Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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P2020NXE2KFC P2020NXE2KFC NXP USA Inc. QP20XXFS.pdf Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
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P4080COME-DS-PB NXP USA Inc. Description: P4080 EVAL BRD
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MC33897CTEF MC33897CTEF NXP USA Inc. MC33897.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
на замовлення 4584 шт:
термін постачання 21-31 дні (днів)
2+244.13 грн
10+177.18 грн
55+152.76 грн
110+136.76 грн
275+129.79 грн
550+125.59 грн
1045+120.36 грн
2530+116.83 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MC33972ATEK MC33972ATEK NXP USA Inc. Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
товару немає в наявності
В кошику  од. на суму  грн.
MC33975ATEK MC33975ATEK NXP USA Inc. MC33975.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
MC33975TEK MC33975TEK NXP USA Inc. Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
на замовлення 125 шт:
термін постачання 21-31 дні (днів)
1+562.82 грн
10+418.54 грн
42+373.50 грн
В кошику  од. на суму  грн.
MC56F8245VLD MC56F8245VLD NXP USA Inc. MC56F82XXFS.pdf Description: IC MCU 16BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
на замовлення 717 шт:
термін постачання 21-31 дні (днів)
1+901.93 грн
10+682.50 грн
160+565.03 грн
В кошику  од. на суму  грн.
MC56F8246VLF MC56F8246VLF NXP USA Inc. MC56F825X.pdf Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC56F8247MLH MC56F8247MLH NXP USA Inc. MC56F825XPB.pdf Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
MC56F8257MLH MC56F8257MLH NXP USA Inc. MC56F825XPB.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
MC56F8257VLH MC56F8257VLH NXP USA Inc. MC56F82XXFS.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 1458 шт:
термін постачання 21-31 дні (днів)
1+1027.53 грн
10+791.05 грн
80+668.09 грн
800+623.13 грн
В кошику  од. на суму  грн.
MPC17511EV NXP USA Inc. MPC17511.pdf Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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KMC8144TVT1000B KMC8144TVT1000B NXP USA Inc. MSC8144.pdf Description: IC DSP 783FCBGA
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В кошику  од. на суму  грн.
KMC8144TVT800A KMC8144TVT800A NXP USA Inc. MSC8144.pdf Description: IC DSP 783FCBGA
товару немає в наявності
В кошику  од. на суму  грн.
KMC8144TVT800B KMC8144TVT800B NXP USA Inc. MSC8144.pdf Description: IC DSP 783FCBGA
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KMC8144VT1000A KMC8144VT1000A NXP USA Inc. MSC8144.pdf Description: IC DSP 783FCBGA
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В кошику  од. на суму  грн.
KMC8144TVT1000A KMC8144TVT1000A NXP USA Inc. MSC8144.pdf Description: IC DSP 783FCBGA
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В кошику  од. на суму  грн.
MC13892BJVL MC13892BJVL NXP USA Inc. MC13892.pdf Description: IC PMU I.MX51/37/35/27 186MAPBGA
товару немає в наявності
В кошику  од. на суму  грн.
MCIMX250DJM4A MCIMX250DJM4A NXP USA Inc. Description: IC MPU I.MX25 400MAPBGA
товару немає в наявності
В кошику  од. на суму  грн.
MCIMX286DVM4B MCIMX286DVM4B NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 760 шт:
термін постачання 21-31 дні (днів)
1+1202.58 грн
10+988.72 грн
В кошику  од. на суму  грн.
MCIMX534AVV8B MCIMX534AVV8B NXP USA Inc. IMX53AEC.pdf Description: IC MPU I.MX53 800MHZ 529TEBGA
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MCIMX535DVV1B MCIMX535DVV1B NXP USA Inc. MCIMX53xD_Rev1.pdf Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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MCIMX536AVV8B MCIMX536AVV8B NXP USA Inc. MCIMX53xA_Rev1.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Obsolete
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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В кошику  од. на суму  грн.
MCIMX537CVV8B MCIMX537CVV8B NXP USA Inc. IMX53IEC.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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MC13892AJVL MC13892AJVL NXP USA Inc. MC13892.pdf Description: IC PMU I.MX51/37/35/27 186MAPBGA
товару немає в наявності
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MPC8306CVMABDCA MPC8306CVMABDCA NXP USA Inc. MPC8306EC.pdf Description: IC MPU MPC83XX 133MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
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BFQ67W,115 BFQ67W_Rev_Oct2010.pdf
BFQ67W,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 8GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 5V
Frequency - Transition: 8GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
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В кошику  од. на суму  грн.
BFR31,215 BFR30%2C31.pdf
BFR31,215
Виробник: NXP USA Inc.
Description: JFET N-CH 10MA SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 4pF @ 10V
Current Drain (Id) - Max: 10 mA
Supplier Device Package: SOT-23 (TO-236AB)
Drain to Source Voltage (Vdss): 25 V
Power - Max: 250 mW
Voltage - Cutoff (VGS off) @ Id: 2.5 V @ 0.5 nA
Current - Drain (Idss) @ Vds (Vgs=0): 1 mA @ 10 V
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BFR520T,115 BFR520T_Rev_Oct2010.pdf
BFR520T,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Supplier Device Package: SC-75
Part Status: Obsolete
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BFR93AW,115 BFR93AW_Rev_Oct2010.pdf
BFR93AW,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 5GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
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BGA2801,115 BGA2801.pdf
BGA2801,115
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 23dB
Current - Supply: 14.3mA
Noise Figure: 3.9dB
P1dB: 0dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 2691 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+34.54 грн
11+29.33 грн
25+26.49 грн
100+21.74 грн
250+19.07 грн
500+16.85 грн
1000+13.09 грн
Мінімальне замовлення: 10
В кошику  од. на суму  грн.
BGA2866,115 BGA2866.pdf
BGA2866,115
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 24.3dB
Current - Supply: 17.4mA
Noise Figure: 3.9dB
P1dB: 3dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 10196 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
14+22.76 грн
17+18.29 грн
25+17.23 грн
100+14.78 грн
250+13.94 грн
500+13.35 грн
1000+12.57 грн
Мінімальне замовлення: 14
В кошику  од. на суму  грн.
BLT81,115 BLT81.pdf
BLT81,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 9.5V 900MHZ SC-73
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 8dB
Power - Max: 2W
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 9.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Frequency - Transition: 900MHz
Supplier Device Package: SC-73
Part Status: Obsolete
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PBR941B,215 PBR941B.pdf
PBR941B,215
Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 9GHZ TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 360mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.5dB @ 1GHz
Supplier Device Package: SOT-23 (TO-236AB)
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PCF8564ACX9/B/1,02 PCF8564A.pdf
Виробник: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C DIE
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: Die
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PMBF4391,215 PMBF4391-4393.pdf
PMBF4391,215
Виробник: NXP USA Inc.
Description: JFET N-CH 40V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: SOT-23 (TO-236AB)
Drain to Source Voltage (Vdss): 40 V
Power - Max: 250 mW
Resistance - RDS(On): 30 Ohms
Voltage - Cutoff (VGS off) @ Id: 4 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 50 mA @ 20 V
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PMBF4392,215 PMBF4391-4393.pdf
PMBF4392,215
Виробник: NXP USA Inc.
Description: JFET N-CH 40V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Power - Max: 250 mW
Voltage - Cutoff (VGS off) @ Id: 2 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 25 mA @ 20 V
товару немає в наявності
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PMBFJ175,215 PMBFJ174_175_176_177_CNV.pdf
PMBFJ175,215
Виробник: NXP USA Inc.
Description: JFET P-CH 30V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 300 mW
Resistance - RDS(On): 125 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V
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PMBFJ309,215 PMBFJ308_309_310.pdf
PMBFJ309,215
Виробник: NXP USA Inc.
Description: JFET N-CH 25V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Voltage - Breakdown (V(BR)GSS): 25 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 25 V
Power - Max: 250 mW
Resistance - RDS(On): 50 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 µA
Current - Drain (Idss) @ Vds (Vgs=0): 12 mA @ 10 V
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PMDPB65UP,115 PMDPB65UP.pdf
PMDPB65UP,115
Виробник: NXP USA Inc.
Description: MOSFET 2P-CH 20V 3.5A 6HUSON
Packaging: Cut Tape (CT)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 P-Channel (Dual)
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 520mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 3.5A
Input Capacitance (Ciss) (Max) @ Vds: 380pF @ 10V
Rds On (Max) @ Id, Vgs: 70mOhm @ 1A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 6nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
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PMFPB6532UP,115 PMFPB6532UP.pdf
PMFPB6532UP,115
Виробник: NXP USA Inc.
Description: MOSFET P-CH 20V 3.5A DFN2020-6
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PMFPB6545UP,115 PMFPB6545UP.pdf
PMFPB6545UP,115
Виробник: NXP USA Inc.
Description: MOSFET P-CH 20V 3.5A SOT1118
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PRF947,115 PRF947.pdf
PRF947,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 8.5GHZ SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V
Frequency - Transition: 8.5GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
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TL431BMSDT,215 TL431_Family.pdf
TL431BMSDT,215
Виробник: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.5% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±0.5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Grade: Automotive
Qualification: AEC-Q100
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TL431BSDT,215 TL431_Family.pdf
TL431BSDT,215
Виробник: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.5% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±0.5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Grade: Automotive
Qualification: AEC-Q100
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BGA7127,118 BGA7127.pdf
BGA7127,118
Виробник: NXP USA Inc.
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
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PTN3392BS/F2,518 PTN3392.pdf
PTN3392BS/F2,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
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SA616DK/03,118 SA616.pdf
SA616DK/03,118
Виробник: NXP USA Inc.
Description: IC MIXR 150MHZ RSSI EQUIP 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: RSSI Equipped
Noise Figure: 6.8dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
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BGA7127,118 BGA7127.pdf
BGA7127,118
Виробник: NXP USA Inc.
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
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PTN3392BS/F2,518 PTN3392.pdf
PTN3392BS/F2,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
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BUK764R3-40B,118 BUK764R3-40B.pdf
BUK764R3-40B,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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PX1011BI-EL1/G,518 PX1011B.pdf
PX1011BI-EL1/G,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 81LFBGA
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TFF1003HN/N1,115 TFF1003HN.pdf
TFF1003HN/N1,115
Виробник: NXP USA Inc.
Description: IC FREQUENCY GEN TX/TXRX 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 13.05GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: No
Part Status: Obsolete
Number of Circuits: 1
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OM13008,598 LPC122X.pdf
OM13008,598
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC122 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC122
Platform: LPCXpresso™
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MRFE6VP5600HR5 MRFE6VP5600H.pdf
MRFE6VP5600HR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MRFE6VP5600HR5 MRFE6VP5600H.pdf
MRFE6VP5600HR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+15543.23 грн
10+12777.94 грн
25+12231.41 грн
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MPC8313E-RDBC MPC8313E_Hrdw_Spec.pdf
MPC8313E-RDBC
Виробник: NXP USA Inc.
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
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P1013PSE2EFA QP1022FS.pdf
P1013PSE2EFA
Виробник: NXP USA Inc.
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
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P1022COME-DS-PB WBNR_FTF10_NET_F0430.pdf
Виробник: NXP USA Inc.
Description: P1022 EVAL BRD
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P2010NXE2HFC QP20XXFS.pdf
P2010NXE2HFC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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P2020NXE2KFC QP20XXFS.pdf
P2020NXE2KFC
Виробник: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
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P4080COME-DS-PB
Виробник: NXP USA Inc.
Description: P4080 EVAL BRD
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MC33897CTEF MC33897.pdf
MC33897CTEF
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
на замовлення 4584 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+244.13 грн
10+177.18 грн
55+152.76 грн
110+136.76 грн
275+129.79 грн
550+125.59 грн
1045+120.36 грн
2530+116.83 грн
Мінімальне замовлення: 2
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MC33972ATEK
MC33972ATEK
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
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MC33975ATEK MC33975.pdf
MC33975ATEK
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
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MC33975TEK
MC33975TEK
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
на замовлення 125 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+562.82 грн
10+418.54 грн
42+373.50 грн
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MC56F8245VLD MC56F82XXFS.pdf
MC56F8245VLD
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
на замовлення 717 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+901.93 грн
10+682.50 грн
160+565.03 грн
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MC56F8246VLF MC56F825X.pdf
MC56F8246VLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC56F8247MLH MC56F825XPB.pdf
MC56F8247MLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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MC56F8257MLH MC56F825XPB.pdf
MC56F8257MLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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MC56F8257VLH MC56F82XXFS.pdf
MC56F8257VLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 1458 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1027.53 грн
10+791.05 грн
80+668.09 грн
800+623.13 грн
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MPC17511EV MPC17511.pdf
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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KMC8144TVT1000B MSC8144.pdf
KMC8144TVT1000B
Виробник: NXP USA Inc.
Description: IC DSP 783FCBGA
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KMC8144TVT800A MSC8144.pdf
KMC8144TVT800A
Виробник: NXP USA Inc.
Description: IC DSP 783FCBGA
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KMC8144TVT800B MSC8144.pdf
KMC8144TVT800B
Виробник: NXP USA Inc.
Description: IC DSP 783FCBGA
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KMC8144VT1000A MSC8144.pdf
KMC8144VT1000A
Виробник: NXP USA Inc.
Description: IC DSP 783FCBGA
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KMC8144TVT1000A MSC8144.pdf
KMC8144TVT1000A
Виробник: NXP USA Inc.
Description: IC DSP 783FCBGA
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MC13892BJVL MC13892.pdf
MC13892BJVL
Виробник: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 186MAPBGA
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MCIMX250DJM4A
MCIMX250DJM4A
Виробник: NXP USA Inc.
Description: IC MPU I.MX25 400MAPBGA
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MCIMX286DVM4B IMX28CEC.pdf
MCIMX286DVM4B
Виробник: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
на замовлення 760 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1202.58 грн
10+988.72 грн
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MCIMX534AVV8B IMX53AEC.pdf
MCIMX534AVV8B
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529TEBGA
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MCIMX535DVV1B MCIMX53xD_Rev1.pdf
MCIMX535DVV1B
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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MCIMX536AVV8B MCIMX53xA_Rev1.pdf
MCIMX536AVV8B
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Obsolete
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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MCIMX537CVV8B IMX53IEC.pdf
MCIMX537CVV8B
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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MC13892AJVL MC13892.pdf
MC13892AJVL
Виробник: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 186MAPBGA
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MPC8306CVMABDCA MPC8306EC.pdf
MPC8306CVMABDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 133MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
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