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LPC2131FBD64,151 LPC2131FBD64,151 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2132FBD64,151 LPC2132FBD64,151 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2134FBD64,151 LPC2134FBD64,151 NXP USA Inc. LPC213x.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2194JBD64,151 LPC2194JBD64,151 NXP USA Inc. LPC2194.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Bag
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 46
DigiKey Programmable: Not Verified
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LPC2220FBD144,551 LPC2220FBD144,551 NXP USA Inc. LPC2210_2220.pdf Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 76
DigiKey Programmable: Not Verified
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
1+963.78 грн
10+730.32 грн
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LPC2290FBD144,551 LPC2290FBD144,551 NXP USA Inc. LPC2290.pdf Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Bag
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 76
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LPC2294JBD144,551 LPC2294JBD144,551 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Bag
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 112
DigiKey Programmable: Not Verified
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NE5234D,518 NE5234D,518 NXP USA Inc. ne5234_sa5234_3.pdf Description: IC OPAMP GP 4 CIRCUIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-SO
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
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PCA8565TS/1,118 PCA8565TS/1,118 NXP USA Inc. PCA8565.pdf Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 1.2µA ~ 5µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+76.13 грн
Мінімальне замовлення: 2500
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PCA9510D,118 PCA9510D,118 NXP USA Inc. PCA95(10,11).pdf Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9511D,118 PCA9511D,118 NXP USA Inc. PCA95(10,11).pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9512D,118 PCA9512D,118 NXP USA Inc. PCA9512.pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9512DP,118 PCA9512DP,118 NXP USA Inc. PCA9512.pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9513D,118 PCA9513D,118 NXP USA Inc. PCA95(13,14).pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9513DP,118 PCA9513DP,118 NXP USA Inc. PCA95(13,14).pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9514D,118 PCA9514D,118 NXP USA Inc. PCA95(13,14).pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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CBT3125PW/G-T CBT3125PW/G-T NXP USA Inc. CBT3125.pdf Description: IC BUS SWITCH 1 X 1:1 14TSSOP
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GTL2002DP,118 GTL2002DP,118 NXP USA Inc. GTL2002.pdf Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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GTL2006PW,118 GTL2006PW,118 NXP USA Inc. GTL2006.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 13
Input Signal: GTL
Number of Circuits: 1
на замовлення 1045 шт:
термін постачання 21-31 дні (днів)
3+143.69 грн
10+102.06 грн
25+92.90 грн
100+77.77 грн
250+73.27 грн
500+70.56 грн
1000+67.21 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
GTL2007PW,118 GTL2007PW,118 NXP USA Inc. GTL2007.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Number of Circuits: 1
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LM75AD/G-T LM75AD/G-T NXP USA Inc. LM75A.pdf Description: IC I2C TEMP SNSR/WATCHDOG 8-SOIC
Packaging: Cut Tape (CT)
Part Status: Obsolete
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NE5234D,518 NE5234D,518 NXP USA Inc. ne5234_sa5234_3.pdf Description: IC OPAMP GP 4 CIRCUIT 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-SO
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
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PCA8565TS/1,118 PCA8565TS/1,118 NXP USA Inc. PCA8565.pdf Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 1.2µA ~ 5µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3855 шт:
термін постачання 21-31 дні (днів)
3+149.25 грн
10+105.96 грн
25+96.57 грн
100+80.94 грн
250+76.31 грн
500+73.52 грн
1000+70.05 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PCA9510D,118 PCA9510D,118 NXP USA Inc. PCA95(10,11).pdf Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9511D,118 PCA9511D,118 NXP USA Inc. PCA95(10,11).pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9512D,118 PCA9512D,118 NXP USA Inc. PCA9512.pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9512DP,118 PCA9512DP,118 NXP USA Inc. PCA9512.pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9513D,118 PCA9513D,118 NXP USA Inc. PCA95(13,14).pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9513DP,118 PCA9513DP,118 NXP USA Inc. PCA95(13,14).pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9514D,118 PCA9514D,118 NXP USA Inc. PCA95(13,14).pdf Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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P89LPC901FD,112 P89LPC901FD,112 NXP USA Inc. P89LPC901_902_903.pdf Description: IC MCU 8BIT 1KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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P89LPC902FD,112 P89LPC902FD,112 NXP USA Inc. P89LPC901_902_903.pdf Description: IC MCU 8BIT 1KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 7.3728MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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P89LPC903FD,112 P89LPC903FD,112 NXP USA Inc. P89LPC901_902_903.pdf Description: IC MCU 8BIT 1KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 7.3728MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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P89LPC906FD,112 P89LPC906FD,112 NXP USA Inc. P89LPC906_907_908.pdf Description: IC MCU 8BIT 1KB FLASH 8SO
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P89LPC907FD,112 P89LPC907FD,112 NXP USA Inc. P89LPC906_907_908.pdf Description: IC MCU 8BIT 1KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 7.3728MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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P89LPC908FD,112 P89LPC908FD,112 NXP USA Inc. P89LPC906_907_908.pdf Description: IC MCU 8BIT 1KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 7.3728MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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P89LPC9102FTK,115 P89LPC9102FTK,115 NXP USA Inc. P89LPC9102_9103_9107.pdf Description: IC MCU 8BIT 1KB FLASH 10HVSON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 10-HVSON (3x3)
Number of I/O: 8
DigiKey Programmable: Not Verified
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P89LPC9103FTK,115 P89LPC9103FTK,115 NXP USA Inc. P89LPC9102_9103_9107.pdf Description: IC MCU 8BIT 1KB FLASH 10HVSON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 10-HVSON (3x3)
Part Status: Obsolete
Number of I/O: 8
DigiKey Programmable: Not Verified
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P89LPC9107FDH,129 P89LPC9107FDH,129 NXP USA Inc. P89LPC9102_9103_9107.pdf Description: IC MCU 8BIT 1KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Verified
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P89LPC912FDH,129 P89LPC912FDH,129 NXP USA Inc. P89LPC912_913_914.pdf Description: IC MCU 8BIT 1KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: SPI
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Number of I/O: 12
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P89LPC913FDH,129 P89LPC913FDH,129 NXP USA Inc. P89LPC912_913_914.pdf Description: IC MCU 8BIT 1KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Verified
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P89LPC914FDH,129 P89LPC914FDH,129 NXP USA Inc. P89LPC912_913_914.pdf Description: IC MCU 8BIT 1KB FLASH 14TSSOP
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P89LPC916FDH,129 P89LPC916FDH,129 NXP USA Inc. P89LPC915_916_917.pdf Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Verified
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P89LPC924FDH,529 P89LPC924FDH,529 NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC925FDH,529 P89LPC925FDH,529 NXP USA Inc. UM10108.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC933FDH,529 P89LPC933FDH,529 NXP USA Inc. P89LPC933_934_935_936.pdf Description: IC MCU 8BIT 4KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC934FDH,529 P89LPC934FDH,529 NXP USA Inc. P89LPC933_934_935_936.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC936FDH,529 P89LPC936FDH,529 NXP USA Inc. P89LPC933_934_935_936.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC938FDH,529 P89LPC938FDH,529 NXP USA Inc. P89LPC938.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC952FBD,157 P89LPC952FBD,157 NXP USA Inc. P89LPC952_954.pdf Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC2220FET144/G,55 LPC2220FET144/G,55 NXP USA Inc. LPC2210_2220.pdf Description: IC MCU 16/32BIT ROMLESS 144TFBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 76
DigiKey Programmable: Not Verified
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BAP1321-02,115 BAP1321-02,115 NXP USA Inc. BAP1321-02_Rev_02_2008.pdf Description: RF DIODE PIN 60V 715MW SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
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BAP50-02,115 BAP50-02,115 NXP USA Inc. BAP50-02_N.pdf Description: RF DIODE PIN 50V 715MW SOD-523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD-523
Part Status: Obsolete
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
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BAP50-03,115 BAP50-03,115 NXP USA Inc. BAP50-03.pdf Description: RF DIODE PIN 50V 500MW SOD-323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD-323
Current - Max: 50 mA
Power Dissipation (Max): 500 mW
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BAP50-04W,115 BAP50-04W,115 NXP USA Inc. BAP50-04W.pdf Description: RF DIODE PIN 50V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 50 mA
Power Dissipation (Max): 240 mW
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BAP50-05,215 BAP50-05,215 NXP USA Inc. BAP50-05.pdf Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 50 mA
Power Dissipation (Max): 250 mW
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BAP50-05W,115 BAP50-05W,115 NXP USA Inc. BAP50-05W.pdf Description: RF DIODE PIN 50V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Current - Max: 50 mA
Power Dissipation (Max): 240 mW
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BAP51-02,115 BAP51-02,115 NXP USA Inc. BAP51-02.pdf Description: RF DIODE PIN 60V 715MW SOD-523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
3000+7.13 грн
6000+6.66 грн
9000+6.55 грн
Мінімальне замовлення: 3000
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BAP51-03,115 BAP51-03,115 NXP USA Inc. BAP51-03.pdf Description: RF DIODE PIN 50V 500MW SOD-323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD-323
Part Status: Active
Current - Max: 50 mA
Power Dissipation (Max): 500 mW
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BAP51-05W,115 BAP51-05W,115 NXP USA Inc. BAP51-05W.pdf Description: RF DIODE PIN 50V 240MW SOT323-3
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LPC2131FBD64,151 LPC2131_32_34_36_38.pdf
LPC2131FBD64,151
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2132FBD64,151 LPC2131_32_34_36_38.pdf
LPC2132FBD64,151
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2134FBD64,151 LPC213x.pdf
LPC2134FBD64,151
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2194JBD64,151 LPC2194.pdf
LPC2194JBD64,151
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Bag
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 46
DigiKey Programmable: Not Verified
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LPC2220FBD144,551 LPC2210_2220.pdf
LPC2220FBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 76
DigiKey Programmable: Not Verified
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+963.78 грн
10+730.32 грн
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LPC2290FBD144,551 LPC2290.pdf
LPC2290FBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Bag
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 76
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LPC2294JBD144,551 LPC2292_2294.pdf
LPC2294JBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Bag
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 112
DigiKey Programmable: Not Verified
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NE5234D,518 ne5234_sa5234_3.pdf
NE5234D,518
Виробник: NXP USA Inc.
Description: IC OPAMP GP 4 CIRCUIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-SO
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
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PCA8565TS/1,118 PCA8565.pdf
PCA8565TS/1,118
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 1.2µA ~ 5µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+76.13 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
PCA9510D,118 PCA95(10,11).pdf
PCA9510D,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9511D,118 PCA95(10,11).pdf
PCA9511D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9512D,118 PCA9512.pdf
PCA9512D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9512DP,118 PCA9512.pdf
PCA9512DP,118
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9513D,118 PCA95(13,14).pdf
PCA9513D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9513DP,118 PCA95(13,14).pdf
PCA9513DP,118
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9514D,118 PCA95(13,14).pdf
PCA9514D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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CBT3125PW/G-T CBT3125.pdf
CBT3125PW/G-T
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 14TSSOP
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GTL2002DP,118 GTL2002.pdf
GTL2002DP,118
Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
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GTL2006PW,118 GTL2006.pdf
GTL2006PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 13
Input Signal: GTL
Number of Circuits: 1
на замовлення 1045 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+143.69 грн
10+102.06 грн
25+92.90 грн
100+77.77 грн
250+73.27 грн
500+70.56 грн
1000+67.21 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
GTL2007PW,118 GTL2007.pdf
GTL2007PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 12
Input Signal: GTL
Number of Circuits: 1
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LM75AD/G-T LM75A.pdf
LM75AD/G-T
Виробник: NXP USA Inc.
Description: IC I2C TEMP SNSR/WATCHDOG 8-SOIC
Packaging: Cut Tape (CT)
Part Status: Obsolete
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NE5234D,518 ne5234_sa5234_3.pdf
NE5234D,518
Виробник: NXP USA Inc.
Description: IC OPAMP GP 4 CIRCUIT 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-SO
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
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PCA8565TS/1,118 PCA8565.pdf
PCA8565TS/1,118
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 1.2µA ~ 5µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3855 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+149.25 грн
10+105.96 грн
25+96.57 грн
100+80.94 грн
250+76.31 грн
500+73.52 грн
1000+70.05 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
PCA9510D,118 PCA95(10,11).pdf
PCA9510D,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C HOTSWAP 1CH 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9511D,118 PCA95(10,11).pdf
PCA9511D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9512D,118 PCA9512.pdf
PCA9512D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9512DP,118 PCA9512.pdf
PCA9512DP,118
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 1.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9513D,118 PCA95(13,14).pdf
PCA9513D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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PCA9513DP,118 PCA95(13,14).pdf
PCA9513DP,118
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I²C - Hotswap
Current - Supply: 2.8mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 10 pF
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PCA9514D,118 PCA95(13,14).pdf
PCA9514D,118
Виробник: NXP USA Inc.
Description: IC BUFFER I2C/SMBUS HOTSWAP 8SO
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P89LPC901FD,112 P89LPC901_902_903.pdf
P89LPC901FD,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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P89LPC902FD,112 P89LPC901_902_903.pdf
P89LPC902FD,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 7.3728MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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P89LPC903FD,112 P89LPC901_902_903.pdf
P89LPC903FD,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 7.3728MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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P89LPC906FD,112 P89LPC906_907_908.pdf
P89LPC906FD,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 8SO
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P89LPC907FD,112 P89LPC906_907_908.pdf
P89LPC907FD,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 7.3728MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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P89LPC908FD,112 P89LPC906_907_908.pdf
P89LPC908FD,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 7.3728MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 6
DigiKey Programmable: Verified
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P89LPC9102FTK,115 P89LPC9102_9103_9107.pdf
P89LPC9102FTK,115
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 10HVSON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 10-HVSON (3x3)
Number of I/O: 8
DigiKey Programmable: Not Verified
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P89LPC9103FTK,115 P89LPC9102_9103_9107.pdf
P89LPC9103FTK,115
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 10HVSON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 10-HVSON (3x3)
Part Status: Obsolete
Number of I/O: 8
DigiKey Programmable: Not Verified
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P89LPC9107FDH,129 P89LPC9102_9103_9107.pdf
P89LPC9107FDH,129
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Verified
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P89LPC912FDH,129 P89LPC912_913_914.pdf
P89LPC912FDH,129
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: SPI
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Number of I/O: 12
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P89LPC913FDH,129 P89LPC912_913_914.pdf
P89LPC913FDH,129
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Number of I/O: 12
DigiKey Programmable: Verified
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P89LPC914FDH,129 P89LPC912_913_914.pdf
P89LPC914FDH,129
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 14TSSOP
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P89LPC916FDH,129 P89LPC915_916_917.pdf
P89LPC916FDH,129
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Verified
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P89LPC924FDH,529
P89LPC924FDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC925FDH,529 UM10108.pdf
P89LPC925FDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC933FDH,529 P89LPC933_934_935_936.pdf
P89LPC933FDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC934FDH,529 P89LPC933_934_935_936.pdf
P89LPC934FDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC936FDH,529 P89LPC933_934_935_936.pdf
P89LPC936FDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC938FDH,529 P89LPC938.pdf
P89LPC938FDH,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC952FBD,157 P89LPC952_954.pdf
P89LPC952FBD,157
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC2220FET144/G,55 LPC2210_2220.pdf
LPC2220FET144/G,55
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144TFBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 76
DigiKey Programmable: Not Verified
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BAP1321-02,115 BAP1321-02_Rev_02_2008.pdf
BAP1321-02,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 715MW SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 715 mW
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BAP50-02,115 BAP50-02_N.pdf
BAP50-02,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 715MW SOD-523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD-523
Part Status: Obsolete
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
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BAP50-03,115 BAP50-03.pdf
BAP50-03,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 500MW SOD-323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD-323
Current - Max: 50 mA
Power Dissipation (Max): 500 mW
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BAP50-04W,115 BAP50-04W.pdf
BAP50-04W,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 50 mA
Power Dissipation (Max): 240 mW
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BAP50-05,215 BAP50-05.pdf
BAP50-05,215
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 50 mA
Power Dissipation (Max): 250 mW
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BAP50-05W,115 BAP50-05W.pdf
BAP50-05W,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.5pF @ 5V, 1MHz
Resistance @ If, F: 5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Current - Max: 50 mA
Power Dissipation (Max): 240 mW
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BAP51-02,115 BAP51-02.pdf
BAP51-02,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 715MW SOD-523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Part Status: Active
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+7.13 грн
6000+6.66 грн
9000+6.55 грн
Мінімальне замовлення: 3000
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BAP51-03,115 BAP51-03.pdf
BAP51-03,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 500MW SOD-323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD-323
Part Status: Active
Current - Max: 50 mA
Power Dissipation (Max): 500 mW
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BAP51-05W,115 BAP51-05W.pdf
BAP51-05W,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SOT323-3
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