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74LVC541APW/AUJ 74LVC541APW/AUJ NXP USA Inc. 74LVC541A.pdf Description: IC BUF NON-INVERT 3.6V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
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74LVC573APW/AUJ 74LVC573APW/AUJ NXP USA Inc. 74LVC573A.pdf Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 3.4ns
Supplier Device Package: 20-TSSOP
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74LVC574APW/AUJ 74LVC574APW/AUJ NXP USA Inc. 74LVC574A.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF
Number of Bits per Element: 8
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74LVC623AD-Q100J 74LVC623AD-Q100J NXP USA Inc. Description: IC TXRX NON-INVERT 3.6V 20SO
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74LVC623APW-Q100J 74LVC623APW-Q100J NXP USA Inc. Description: IC TXRX NON-INVERT 3.6V 20TSSOP
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74LVC74AD/AUJ 74LVC74AD/AUJ NXP USA Inc. 74LVC74A.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF
Number of Bits per Element: 1
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74LVC74APW/AUJ 74LVC74APW/AUJ NXP USA Inc. 74LVC74A.pdf Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 1
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74LVC86APW/AUJ 74LVC86APW/AUJ NXP USA Inc. PHGLS23393-1.pdf?t.download=true&u=5oefqw Description: IC GATE XOR 4CH 2-INP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 10 µA
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74LVCH244APW/AUJ 74LVCH244APW/AUJ NXP USA Inc. 74LVC_LVCH244A.pdf Description: IC BUFF NON-INVERT 3.6V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
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74LVCH245APW/AUJ 74LVCH245APW/AUJ NXP USA Inc. 74LVC_LVCH245A.pdf Description: IC TXRX NON-INVERT 3.6V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
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74LVCU04APW/AUJ 74LVCU04APW/AUJ NXP USA Inc. 74LVCU04A.pdf Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 10 µA
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74LVC332BQX 74LVC332BQX NXP USA Inc. 74LVC332.pdf Description: IC GATE OR 3CH 3-INP 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 10 µA
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74LV74D/AUJ 74LV74D/AUJ NXP USA Inc. 74LV74.pdf Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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74LVC00AD/AUJ 74LVC00AD/AUJ NXP USA Inc. 74LVC00A.pdf Description: IC GATE NAND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 10 µA
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74LVC00APW/AUJ 74LVC00APW/AUJ NXP USA Inc. 74LVC00A.pdf Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 10 µA
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74LVC02APW/AUJ 74LVC02APW/AUJ NXP USA Inc. 74LVC02A.pdf Description: IC GATE NOR 4CH 2-INP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.4ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 10 µA
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MKE02Z64VQH2 MKE02Z64VQH2 NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 64KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
на замовлення 111 шт:
термін постачання 21-31 дні (днів)
1+440.31 грн
10+285.34 грн
25+249.44 грн
80+201.50 грн
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MKE02Z64VLD2 MKE02Z64VLD2 NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MKE02Z64VLC2 MKE02Z64VLC2 NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
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PCU9956ATWY PCU9956ATWY NXP USA Inc. PCU9956A.pdf Description: IC LED DRV LIN PWM 65MA 38HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 24
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 65mA
Internal Switch(s): Yes
Supplier Device Package: 38-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
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TJA1044T,118 TJA1044T,118 NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
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TJA1057T,118 TJA1057T,118 NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
2500+32.59 грн
5000+30.61 грн
Мінімальне замовлення: 2500
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PTN3393BSY PTN3393BSY NXP USA Inc. PTN3393.pdf Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Last Time Buy
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PTN36242LBS,518 PTN36242LBS,518 NXP USA Inc. PTN36242L.pdf Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Delay Time: 0.4ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 225mA
Supplier Device Package: 32-HVQFN (3x6)
Signal Conditioning: Input Equalization, Output De-Emphasis
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TFF11101HN/N1,118 TFF11101HN/N1,118 NXP USA Inc. TFF11101HN.pdf Description: IC FREQUENCY GENERATOR 24HVQFN
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TFF11139HN/N1,118 TFF11139HN/N1,118 NXP USA Inc. TFF11139HN.pdf Description: IC FREQUENCY GENERATOR 24HVQFN
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NX3DV42GU10X NX3DV42GU10X NXP USA Inc. NX3DV42.pdf Description: IC USB 2.0 SWITCH HS 10XQFN
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.3x1.6)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)
4000+20.75 грн
Мінімальне замовлення: 4000
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PCA9570GMH PCA9570GMH NXP USA Inc. PCA9570.pdf Description: IC XPNDR 100KHZ I2C SMBUS 8XQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 8-XFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 4
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 100 kHz
Interrupt Output: No
Supplier Device Package: 8-XQFN (1.6x1.6)
Current - Output Source/Sink: 4mA
Part Status: Active
DigiKey Programmable: Not Verified
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NX3L1G3157GM-Q100X NX3L1G3157GM-Q100X NXP USA Inc. Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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PCAL6416AEXX NXP USA Inc. Description: IC XPND 400KHZ I2C SMBUS 24XFBGA
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-XFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-XFBGA (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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OM12004/000E NXP USA Inc. Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
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OM12004/100E NXP USA Inc. Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
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HEF4894BT/Q100,118 HEF4894BT/Q100,118 NXP USA Inc. HEF4894B_Q100.pdf Description: IC SHIFT REGISTER 12STAGE 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 20-SO
Part Status: Active
Number of Bits per Element: 12
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NX3DV221TKX NX3DV221TKX NXP USA Inc. NX3DV221.pdf Description: IC USB 2.0 SWITCH HS 10HVSON
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
на замовлення 5600 шт:
термін постачання 21-31 дні (днів)
1400+21.54 грн
2800+20.11 грн
4200+19.79 грн
Мінімальне замовлення: 1400
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NX3L4053HR-Q100X NX3L4053HR-Q100X NXP USA Inc. NX3L4053-Q100.pdf Description: IC SWITCH SPDTX3 800MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 3
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SDIO101AIHRZ SDIO101AIHRZ NXP USA Inc. SDIO101A.pdf Description: IC FLASH MEMORY CTRLR 60HXQFN
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TFF11092HN/N1X TFF11092HN/N1X NXP USA Inc. TFF11092HN.pdf Description: IC FREQUENCY GENERATOR 24HVQFN
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TFF11101HN/N1X TFF11101HN/N1X NXP USA Inc. TFF11101HN.pdf Description: IC FREQUENCY GENERATOR 24HVQFN
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TFF11139HN/N1X TFF11139HN/N1X NXP USA Inc. TFF11139HN.pdf Description: IC FREQUENCY GENERATOR 24HVQFN
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TFF11145HN/N1X TFF11145HN/N1X NXP USA Inc. TFF11145HN.pdf Description: IC FREQUENCY GENERATOR 24HVQFN
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OM12030/100,551 NXP USA Inc. Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Mounting Type: Surface Mount
RF Type: Cellular
Part Status: Active
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LPC4370FET256E LPC4370FET256E NXP USA Inc. LPC4370.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
1+1149.92 грн
10+887.06 грн
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LPC43S30FET256E LPC43S30FET256E NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
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LPC43S50FET256,551 LPC43S50FET256,551 NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
на замовлення 73 шт:
термін постачання 21-31 дні (днів)
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OM12004/0020000,55 NXP USA Inc. Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
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OM12004/1000000,55 NXP USA Inc. Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
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OM12030/100,557 NXP USA Inc. Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Mounting Type: Surface Mount
RF Type: Cellular
Part Status: Active
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EM783-MC3E EM783-MC3E NXP USA Inc. 75017322.pdf Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-MC6E EM783-MC6E NXP USA Inc. 75017322.pdf Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-SCE EM783-SCE NXP USA Inc. 75017322.pdf Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-SPE EM783-SPE NXP USA Inc. 75017322.pdf Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-TPE EM783-TPE NXP USA Inc. 75017322.pdf Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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LPC4370FET100E LPC4370FET100E NXP USA Inc. LPC4370.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Discontinued at Digi-Key
Number of I/O: 49
DigiKey Programmable: Not Verified
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HEF4051BT/AUJ HEF4051BT/AUJ NXP USA Inc. HEF4051B.pdf Description: IC MUX 8:1 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 1
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HEF4052BT/AUJ HEF4052BT/AUJ NXP USA Inc. HEF4052B.pdf Description: IC SWITCH SP4T X 2 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Switch Circuit: SP4T
Multiplexer/Demultiplexer Circuit: 4:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 2
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HEF4053BT/AUJ HEF4053BT/AUJ NXP USA Inc. HEF4053B.pdf Description: IC SWITCH SPDT X 3 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 3
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HEF4069UBT/AUJ HEF4069UBT/AUJ NXP USA Inc. HEF4069UB.pdf Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
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HEF4081BT/AUJ HEF4081BT/AUJ NXP USA Inc. HEF4081B.pdf Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 1 µA
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HEF4528BT/AUJ HEF4528BT/AUJ NXP USA Inc. HEF4528B.pdf Description: IC MULTIVIBRATOR 35NS 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 85°C
Propagation Delay: 35 ns
Independent Circuits: 2
Current - Output High, Low: 3mA, 3mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Part Status: Active
Voltage - Supply: 3 V ~ 15 V
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N74F38D-Q100J N74F38D-Q100J NXP USA Inc. Description: IC GATE NAND OP COL 4CH 2IN 14SO
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74LVC541APW/AUJ 74LVC541A.pdf
74LVC541APW/AUJ
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
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74LVC573APW/AUJ 74LVC573A.pdf
74LVC573APW/AUJ
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 3.4ns
Supplier Device Package: 20-TSSOP
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74LVC574APW/AUJ 74LVC574A.pdf
74LVC574APW/AUJ
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF
Number of Bits per Element: 8
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74LVC623AD-Q100J
74LVC623AD-Q100J
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20SO
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74LVC623APW-Q100J
74LVC623APW-Q100J
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20TSSOP
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74LVC74AD/AUJ 74LVC74A.pdf
74LVC74AD/AUJ
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF
Number of Bits per Element: 1
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74LVC74APW/AUJ 74LVC74A.pdf
74LVC74APW/AUJ
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 14-TSSOP
Max Propagation Delay @ V, Max CL: 5.2ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 1
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74LVC86APW/AUJ PHGLS23393-1.pdf?t.download=true&u=5oefqw
74LVC86APW/AUJ
Виробник: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 10 µA
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74LVCH244APW/AUJ 74LVC_LVCH244A.pdf
74LVCH244APW/AUJ
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
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74LVCH245APW/AUJ 74LVC_LVCH245A.pdf
74LVCH245APW/AUJ
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-TSSOP
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74LVCU04APW/AUJ 74LVCU04A.pdf
74LVCU04APW/AUJ
Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 10 µA
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74LVC332BQX 74LVC332.pdf
74LVC332BQX
Виробник: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 10 µA
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74LV74D/AUJ 74LV74.pdf
74LV74D/AUJ
Виробник: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 12mA, 12mA
Trigger Type: Positive Edge
Clock Frequency: 110 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Number of Bits per Element: 1
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74LVC00AD/AUJ 74LVC00A.pdf
74LVC00AD/AUJ
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 10 µA
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74LVC00APW/AUJ 74LVC00A.pdf
74LVC00APW/AUJ
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.3ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 10 µA
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74LVC02APW/AUJ 74LVC02A.pdf
74LVC02APW/AUJ
Виробник: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.08V ~ 2V
Input Logic Level - Low: 0.12V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.4ns @ 3.3V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 10 µA
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MKE02Z64VQH2 MKE02P64M20SF0.pdf
MKE02Z64VQH2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
на замовлення 111 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+440.31 грн
10+285.34 грн
25+249.44 грн
80+201.50 грн
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MKE02Z64VLD2 MKE02P64M20SF0.pdf
MKE02Z64VLD2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MKE02Z64VLC2 MKE02P64M20SF0.pdf
MKE02Z64VLC2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
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PCU9956ATWY PCU9956A.pdf
PCU9956ATWY
Виробник: NXP USA Inc.
Description: IC LED DRV LIN PWM 65MA 38HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 24
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 65mA
Internal Switch(s): Yes
Supplier Device Package: 38-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
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TJA1044T,118 TJA1044.pdf
TJA1044T,118
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
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TJA1057T,118 TJA1057.pdf
TJA1057T,118
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+32.59 грн
5000+30.61 грн
Мінімальне замовлення: 2500
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PTN3393BSY PTN3393.pdf
PTN3393BSY
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Last Time Buy
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PTN36242LBS,518 PTN36242L.pdf
PTN36242LBS,518
Виробник: NXP USA Inc.
Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Delay Time: 0.4ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 225mA
Supplier Device Package: 32-HVQFN (3x6)
Signal Conditioning: Input Equalization, Output De-Emphasis
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TFF11101HN/N1,118 TFF11101HN.pdf
TFF11101HN/N1,118
Виробник: NXP USA Inc.
Description: IC FREQUENCY GENERATOR 24HVQFN
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TFF11139HN/N1,118 TFF11139HN.pdf
TFF11139HN/N1,118
Виробник: NXP USA Inc.
Description: IC FREQUENCY GENERATOR 24HVQFN
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NX3DV42GU10X NX3DV42.pdf
NX3DV42GU10X
Виробник: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10XQFN
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.3x1.6)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
на замовлення 24000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+20.75 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
PCA9570GMH PCA9570.pdf
PCA9570GMH
Виробник: NXP USA Inc.
Description: IC XPNDR 100KHZ I2C SMBUS 8XQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 8-XFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 4
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 100 kHz
Interrupt Output: No
Supplier Device Package: 8-XQFN (1.6x1.6)
Current - Output Source/Sink: 4mA
Part Status: Active
DigiKey Programmable: Not Verified
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NX3L1G3157GM-Q100X
NX3L1G3157GM-Q100X
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
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PCAL6416AEXX
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24XFBGA
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-XFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-XFBGA (2x2)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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OM12004/000E
Виробник: NXP USA Inc.
Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
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OM12004/100E
Виробник: NXP USA Inc.
Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
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HEF4894BT/Q100,118 HEF4894B_Q100.pdf
HEF4894BT/Q100,118
Виробник: NXP USA Inc.
Description: IC SHIFT REGISTER 12STAGE 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 20-SO
Part Status: Active
Number of Bits per Element: 12
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NX3DV221TKX NX3DV221.pdf
NX3DV221TKX
Виробник: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10HVSON
Packaging: Tape & Reel (TR)
Features: Bi-Directional
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
на замовлення 5600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1400+21.54 грн
2800+20.11 грн
4200+19.79 грн
Мінімальне замовлення: 1400
В кошику  од. на суму  грн.
NX3L4053HR-Q100X NX3L4053-Q100.pdf
NX3L4053HR-Q100X
Виробник: NXP USA Inc.
Description: IC SWITCH SPDTX3 800MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 3
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SDIO101AIHRZ SDIO101A.pdf
SDIO101AIHRZ
Виробник: NXP USA Inc.
Description: IC FLASH MEMORY CTRLR 60HXQFN
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TFF11092HN/N1X TFF11092HN.pdf
TFF11092HN/N1X
Виробник: NXP USA Inc.
Description: IC FREQUENCY GENERATOR 24HVQFN
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TFF11101HN/N1X TFF11101HN.pdf
TFF11101HN/N1X
Виробник: NXP USA Inc.
Description: IC FREQUENCY GENERATOR 24HVQFN
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TFF11139HN/N1X TFF11139HN.pdf
TFF11139HN/N1X
Виробник: NXP USA Inc.
Description: IC FREQUENCY GENERATOR 24HVQFN
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TFF11145HN/N1X TFF11145HN.pdf
TFF11145HN/N1X
Виробник: NXP USA Inc.
Description: IC FREQUENCY GENERATOR 24HVQFN
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OM12030/100,551
Виробник: NXP USA Inc.
Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Mounting Type: Surface Mount
RF Type: Cellular
Part Status: Active
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LPC4370FET256E LPC4370.pdf
LPC4370FET256E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1149.92 грн
10+887.06 грн
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LPC43S30FET256E LPC43S50_30_20.pdf
LPC43S30FET256E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
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LPC43S50FET256,551 LPC43S50_30_20.pdf
LPC43S50FET256,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
на замовлення 73 шт:
термін постачання 21-31 дні (днів)
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OM12004/0020000,55
Виробник: NXP USA Inc.
Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
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OM12004/1000000,55
Виробник: NXP USA Inc.
Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
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OM12030/100,557
Виробник: NXP USA Inc.
Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Mounting Type: Surface Mount
RF Type: Cellular
Part Status: Active
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EM783-MC3E 75017322.pdf
EM783-MC3E
Виробник: NXP USA Inc.
Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-MC6E 75017322.pdf
EM783-MC6E
Виробник: NXP USA Inc.
Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-SCE 75017322.pdf
EM783-SCE
Виробник: NXP USA Inc.
Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-SPE 75017322.pdf
EM783-SPE
Виробник: NXP USA Inc.
Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-TPE 75017322.pdf
EM783-TPE
Виробник: NXP USA Inc.
Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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LPC4370FET100E LPC4370.pdf
LPC4370FET100E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Discontinued at Digi-Key
Number of I/O: 49
DigiKey Programmable: Not Verified
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HEF4051BT/AUJ HEF4051B.pdf
HEF4051BT/AUJ
Виробник: NXP USA Inc.
Description: IC MUX 8:1 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 1
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HEF4052BT/AUJ HEF4052B.pdf
HEF4052BT/AUJ
Виробник: NXP USA Inc.
Description: IC SWITCH SP4T X 2 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Switch Circuit: SP4T
Multiplexer/Demultiplexer Circuit: 4:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 2
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HEF4053BT/AUJ HEF4053B.pdf
HEF4053BT/AUJ
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 3 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 3
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HEF4069UBT/AUJ HEF4069UB.pdf
HEF4069UBT/AUJ
Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
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HEF4081BT/AUJ HEF4081B.pdf
HEF4081BT/AUJ
Виробник: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 1 µA
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HEF4528BT/AUJ HEF4528B.pdf
HEF4528BT/AUJ
Виробник: NXP USA Inc.
Description: IC MULTIVIBRATOR 35NS 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 85°C
Propagation Delay: 35 ns
Independent Circuits: 2
Current - Output High, Low: 3mA, 3mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Part Status: Active
Voltage - Supply: 3 V ~ 15 V
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N74F38D-Q100J
N74F38D-Q100J
Виробник: NXP USA Inc.
Description: IC GATE NAND OP COL 4CH 2IN 14SO
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