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UJA1136AHW/3/0Y NXP USA Inc. UJA113X_SER.pdf Description: UJA1136AHW/3/0Y
Packaging: Bulk
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PVF60NS151CMK50 PVF60NS151CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MCU 32BIT ROMLESS 364BGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Data Converters: A/D 12bit SAR; D/A 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Supplier Device Package: 364-LFBGA (17x17)
DigiKey Programmable: Not Verified
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PVF61NS151CMK50 PVF61NS151CMK50 NXP USA Inc. VF6xx_VF5xx_VF3xx.pdf Description: IC MCU 32BIT ROMLESS 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-A5/M4
Data Converters: A/D 12bit SAR; D/A 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Supplier Device Package: 364-LFBGA (17x17)
DigiKey Programmable: Not Verified
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MC33771CTA1AE MC33771CTA1AE NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
1+1088.67 грн
10+833.36 грн
25+779.45 грн
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MCXC244VFT MCXC244VFT NXP USA Inc. MCXC24XP64M48SF2.pdf Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
2+234.88 грн
10+191.42 грн
25+183.83 грн
100+159.02 грн
250+155.21 грн
500+143.96 грн
1300+126.30 грн
Мінімальне замовлення: 2
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2PA1774Q,115 2PA1774Q,115 NXP USA Inc. 2PA1774_DS_Rev05.pdf Description: TRANS PNP 50V 0.15A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 150 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
на замовлення 21655 шт:
термін постачання 21-31 дні (днів)
13172+1.52 грн
Мінімальне замовлення: 13172
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MGD3162AM550EKR2 MGD3162AM550EKR2 NXP USA Inc. SDS_GD3162.pdf Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
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MGD3162AM550EKR2 MGD3162AM550EKR2 NXP USA Inc. SDS_GD3162.pdf Description: GATE DRIVER
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
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MGD3162AM550EKT MGD3162AM550EKT NXP USA Inc. SDS_GD3162.pdf Description: GATE DRIVER
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
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P3T1108UK-ARD NXP USA Inc. Description: P3T1108UK-ARD
Packaging: Bulk
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FRDM-STBA-A8961 FRDM-STBA-A8961 NXP USA Inc. FRDM-STBA-A8961.pdf Description: FRDM-STBA-A8961
Packaging: Bulk
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+1665.56 грн
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S912ZVC19AMLF S912ZVC19AMLF NXP USA Inc. Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)
1+527.44 грн
10+442.75 грн
25+410.45 грн
100+352.92 грн
250+337.11 грн
500+326.99 грн
1250+311.05 грн
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KITFS24SKTFDMEVM KITFS24SKTFDMEVM NXP USA Inc. getting-started-with-the-kitfs24sktfdmevm-evaluation-board:GS-KITFS24SKTFDMEVM Description: Programming Socket Board
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS2400
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Supply
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+35109.50 грн
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LPC1345FHN33,551 LPC1345FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC4330FBD144Y LPC4330FBD144Y NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
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A3G26H502W17SR3 NXP USA Inc. Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S2S
Mounting Type: Chassis Mount
Frequency: 2.496GHz ~ 2.69GHz
Configuration: 2 N-Channel
Power - Output: 80W
Gain: 13.1dB
Technology: GaN
Supplier Device Package: NI-780-4S2S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 370 mA
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MPC860DTCZQ50D4 MPC860DTCZQ50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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C9KEAZ128AMLHR NXP USA Inc. Description: IC MCU
Packaging: Bulk
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TEA2376AT/1J TEA2376AT/1J NXP USA Inc. TEA2376AT.pdf Description: IC PFC CTRLR 25KHZ-300KHZ 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
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MX8-DSI-OLED1 MX8-DSI-OLED1 NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: MIPI-DSI 1080P OLED DISPLAY
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
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S912ZVML12F3WKHR S912ZVML12F3WKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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88MW322-A0-NXUE/AZ 88MW322-A0-NXUE/AZ NXP USA Inc. 88MW320-88W322.pdf Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
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MC33FS6516CAER2 MC33FS6516CAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6516CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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S9S12G48BMLCR S9S12G48BMLCR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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S9S12G48BMLC S9S12G48BMLC NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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S9S12G96ACLF S9S12G96ACLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G96AVLFR S9S12G96AVLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G96AVLF S9S12G96AVLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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IW624HN/A0ZMCSMP NXP USA Inc. Description: IW624HN/A0ZMCSMP
Packaging: Bulk
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LFVBSK77CZZA NXP USA Inc. Description: QORIVVA MPC5777C 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
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S9S12GN48AMLFR S9S12GN48AMLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G64ACLF S9S12G64ACLF NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S912ZVCA19F1WKH S912ZVCA19F1WKH NXP USA Inc. Description: S12Z, 64LQFP-EP, 192K FLASH
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
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S9S12G48J0CLH S9S12G48J0CLH NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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LFVBSK77CZZ1A NXP USA Inc. Description: QORIVVA MPC5777C 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
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LFBGARBY2AO NXP USA Inc. Description: SURFACE MOUNT PGA SOCKET FOR 437
Packaging: Bulk
Module/Board Type: Socket Module - PGA
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C9KEAZ128AMLH C9KEAZ128AMLH NXP USA Inc. Description: C9KEAZ128AMLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 71
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NCF2951MTT/T0E08AJ NXP USA Inc. KeylessEntry%2CGo_Leaflet_Apr2012.pdf Description: IC PASS ENTRY 125KHZ
Packaging: Tape & Reel (TR)
Frequency: 125kHz
Interface: SPI
Type: Passive Entry/Start
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K32W041AY K32W041AY NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
1+374.98 грн
10+312.05 грн
25+295.13 грн
100+255.15 грн
250+242.07 грн
500+232.84 грн
1000+220.46 грн
В кошику  од. на суму  грн.
K32W041AMY K32W041AMY NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 3930 шт:
термін постачання 21-31 дні (днів)
1+429.37 грн
10+357.76 грн
25+338.46 грн
100+292.76 грн
250+277.85 грн
500+267.32 грн
1000+253.18 грн
В кошику  од. на суму  грн.
S912ZVMAL1F0WLFR S912ZVMAL1F0WLFR NXP USA Inc. Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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SPC5603BAMLH6R NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
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SPC5603BAMLH6 NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
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TJA1028TK/5V0/20AZ TJA1028TK/5V0/20AZ NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1100 шт:
термін постачання 21-31 дні (днів)
423+53.97 грн
Мінімальне замовлення: 423
В кошику  од. на суму  грн.
MK22FX512VMC12R MK22FX512VMC12R NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
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MK22FX512VMC12 MK22FX512VMC12 NXP USA Inc. K22P121M120SF5.pdf Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
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TEA1999DB1546 NXP USA Inc. TEA1999TS.pdf Description: TEA1999DB1546
Packaging: Box
DigiKey Programmable: Not Verified
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S32G234MSBK0VUCT S32G234MSBK0VUCT NXP USA Inc. S32G2.pdf Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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S32G234MSBK0VUCR NXP USA Inc. Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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MCXA142VFM MCXA142VFM NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 48MHZ SGL CORE 64KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
на замовлення 485 шт:
термін постачання 21-31 дні (днів)
2+243.12 грн
10+146.82 грн
25+135.58 грн
100+120.91 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MCXA142VFT MCXA142VFT NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 48MHZ SGL CORE 64KB QFN48
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 41
на замовлення 254 шт:
термін постачання 21-31 дні (днів)
2+309.05 грн
10+232.37 грн
80+190.40 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MCXA152VFM MCXA152VFM NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 96MHZ SGL CORE 64KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
2+262.90 грн
10+162.53 грн
490+162.15 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MCXA152VFT MCXA152VFT NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 96MHZ SGL CORE 64KB QFN48
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 41
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
1+413.71 грн
10+310.85 грн
80+254.64 грн
В кошику  од. на суму  грн.
SPC5517EBMLQ66R SPC5517EBMLQ66R NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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A5M34TG140TC-EVB NXP USA Inc. TSCEVBFS.pdf Description: A5M34TG140TC RF REFERENCE CIRCUI
Packaging: Bulk
For Use With/Related Products: A5M34TG140-TC
Frequency: 3.3GHz ~ 3.67GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: A5M34TG140-TC
Supplied Contents: Board(s)
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PCA9421UK-EVM NXP USA Inc. UM11987.pdf Description: EVAL BOARD FOR PCA9421
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9421
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
1+16646.56 грн
В кошику  од. на суму  грн.
MPF5020CMMACES MPF5020CMMACES NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 280 шт:
термін постачання 21-31 дні (днів)
1+416.18 грн
10+306.81 грн
25+283.41 грн
100+241.83 грн
В кошику  од. на суму  грн.
MC33FS6527KAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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QN9090THN/001Y QN9090THN/001Y NXP USA Inc. QN9090(T)QN9030(T).pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
1+416.18 грн
10+357.68 грн
25+321.89 грн
100+275.23 грн
250+248.37 грн
500+222.87 грн
1000+184.88 грн
В кошику  од. на суму  грн.
UJA1136AHW/3/0Y UJA113X_SER.pdf
Виробник: NXP USA Inc.
Description: UJA1136AHW/3/0Y
Packaging: Bulk
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PVF60NS151CMK50 VYBRIDFSERIESEC.pdf
PVF60NS151CMK50
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364BGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Data Converters: A/D 12bit SAR; D/A 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Supplier Device Package: 364-LFBGA (17x17)
DigiKey Programmable: Not Verified
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PVF61NS151CMK50 VF6xx_VF5xx_VF3xx.pdf
PVF61NS151CMK50
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-A5/M4
Data Converters: A/D 12bit SAR; D/A 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Supplier Device Package: 364-LFBGA (17x17)
DigiKey Programmable: Not Verified
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MC33771CTA1AE MC33771C.pdf
MC33771CTA1AE
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1088.67 грн
10+833.36 грн
25+779.45 грн
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MCXC244VFT MCXC24XP64M48SF2.pdf
MCXC244VFT
Виробник: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+234.88 грн
10+191.42 грн
25+183.83 грн
100+159.02 грн
250+155.21 грн
500+143.96 грн
1300+126.30 грн
Мінімальне замовлення: 2
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2PA1774Q,115 2PA1774_DS_Rev05.pdf
2PA1774Q,115
Виробник: NXP USA Inc.
Description: TRANS PNP 50V 0.15A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 150 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
на замовлення 21655 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
13172+1.52 грн
Мінімальне замовлення: 13172
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MGD3162AM550EKR2 SDS_GD3162.pdf
MGD3162AM550EKR2
Виробник: NXP USA Inc.
Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
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MGD3162AM550EKR2 SDS_GD3162.pdf
MGD3162AM550EKR2
Виробник: NXP USA Inc.
Description: GATE DRIVER
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
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MGD3162AM550EKT SDS_GD3162.pdf
MGD3162AM550EKT
Виробник: NXP USA Inc.
Description: GATE DRIVER
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
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P3T1108UK-ARD
Виробник: NXP USA Inc.
Description: P3T1108UK-ARD
Packaging: Bulk
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FRDM-STBA-A8961 FRDM-STBA-A8961.pdf
FRDM-STBA-A8961
Виробник: NXP USA Inc.
Description: FRDM-STBA-A8961
Packaging: Bulk
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1665.56 грн
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S912ZVC19AMLF
S912ZVC19AMLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+527.44 грн
10+442.75 грн
25+410.45 грн
100+352.92 грн
250+337.11 грн
500+326.99 грн
1250+311.05 грн
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KITFS24SKTFDMEVM getting-started-with-the-kitfs24sktfdmevm-evaluation-board:GS-KITFS24SKTFDMEVM
KITFS24SKTFDMEVM
Виробник: NXP USA Inc.
Description: Programming Socket Board
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS2400
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Supply
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+35109.50 грн
В кошику  од. на суму  грн.
LPC1345FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1345FHN33,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC4330FBD144Y LPC4350_30_20_10.pdf
LPC4330FBD144Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
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A3G26H502W17SR3
Виробник: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S2S
Mounting Type: Chassis Mount
Frequency: 2.496GHz ~ 2.69GHz
Configuration: 2 N-Channel
Power - Output: 80W
Gain: 13.1dB
Technology: GaN
Supplier Device Package: NI-780-4S2S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 370 mA
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MPC860DTCZQ50D4 MPC860EC.pdf
MPC860DTCZQ50D4
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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C9KEAZ128AMLHR
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
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TEA2376AT/1J TEA2376AT.pdf
TEA2376AT/1J
Виробник: NXP USA Inc.
Description: IC PFC CTRLR 25KHZ-300KHZ 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
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MX8-DSI-OLED1 i.MX8M_Mini_Appl_Processor.pdf
MX8-DSI-OLED1
Виробник: NXP USA Inc.
Description: MIPI-DSI 1080P OLED DISPLAY
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
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S912ZVML12F3WKHR S12ZVMFS.pdf
S912ZVML12F3WKHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
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88MW322-A0-NXUE/AZ 88MW320-88W322.pdf
88MW322-A0-NXUE/AZ
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
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MC33FS6516CAER2 FS6500-FS4500-ASILD.pdf
MC33FS6516CAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6516CAE FS6500-FS4500SDS-ASILB.pdf
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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S9S12G48BMLCR S12G%20Family%20Fact%20Sheet.pdf
S9S12G48BMLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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S9S12G48BMLC S12G%20Family%20Fact%20Sheet.pdf
S9S12G48BMLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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S9S12G96ACLF
S9S12G96ACLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G96AVLFR
S9S12G96AVLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G96AVLF
S9S12G96AVLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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IW624HN/A0ZMCSMP
Виробник: NXP USA Inc.
Description: IW624HN/A0ZMCSMP
Packaging: Bulk
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LFVBSK77CZZA
Виробник: NXP USA Inc.
Description: QORIVVA MPC5777C 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
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S9S12GN48AMLFR
S9S12GN48AMLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G64ACLF
S9S12G64ACLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S912ZVCA19F1WKH
S912ZVCA19F1WKH
Виробник: NXP USA Inc.
Description: S12Z, 64LQFP-EP, 192K FLASH
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
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S9S12G48J0CLH
S9S12G48J0CLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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LFVBSK77CZZ1A
Виробник: NXP USA Inc.
Description: QORIVVA MPC5777C 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
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LFBGARBY2AO
Виробник: NXP USA Inc.
Description: SURFACE MOUNT PGA SOCKET FOR 437
Packaging: Bulk
Module/Board Type: Socket Module - PGA
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C9KEAZ128AMLH
C9KEAZ128AMLH
Виробник: NXP USA Inc.
Description: C9KEAZ128AMLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 71
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NCF2951MTT/T0E08AJ KeylessEntry%2CGo_Leaflet_Apr2012.pdf
Виробник: NXP USA Inc.
Description: IC PASS ENTRY 125KHZ
Packaging: Tape & Reel (TR)
Frequency: 125kHz
Interface: SPI
Type: Passive Entry/Start
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K32W041AY K32W041AM.pdf
K32W041AY
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+374.98 грн
10+312.05 грн
25+295.13 грн
100+255.15 грн
250+242.07 грн
500+232.84 грн
1000+220.46 грн
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K32W041AMY K32W041AM.pdf
K32W041AMY
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 3930 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+429.37 грн
10+357.76 грн
25+338.46 грн
100+292.76 грн
250+277.85 грн
500+267.32 грн
1000+253.18 грн
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S912ZVMAL1F0WLFR
S912ZVMAL1F0WLFR
Виробник: NXP USA Inc.
Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
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SPC5603BAMLH6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
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SPC5603BAMLH6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
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TJA1028TK/5V0/20AZ TJA1028.pdf
TJA1028TK/5V0/20AZ
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
423+53.97 грн
Мінімальне замовлення: 423
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MK22FX512VMC12R
MK22FX512VMC12R
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
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MK22FX512VMC12 K22P121M120SF5.pdf
MK22FX512VMC12
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
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TEA1999DB1546 TEA1999TS.pdf
Виробник: NXP USA Inc.
Description: TEA1999DB1546
Packaging: Box
DigiKey Programmable: Not Verified
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S32G234MSBK0VUCT S32G2.pdf
S32G234MSBK0VUCT
Виробник: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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S32G234MSBK0VUCR
Виробник: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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MCXA142VFM MCXAP64M96FS3.pdf
MCXA142VFM
Виробник: NXP USA Inc.
Description: IC MCX 48MHZ SGL CORE 64KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
на замовлення 485 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+243.12 грн
10+146.82 грн
25+135.58 грн
100+120.91 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MCXA142VFT MCXAP64M96FS3.pdf
MCXA142VFT
Виробник: NXP USA Inc.
Description: IC MCX 48MHZ SGL CORE 64KB QFN48
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 41
на замовлення 254 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+309.05 грн
10+232.37 грн
80+190.40 грн
Мінімальне замовлення: 2
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MCXA152VFM MCXAP64M96FS3.pdf
MCXA152VFM
Виробник: NXP USA Inc.
Description: IC MCX 96MHZ SGL CORE 64KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+262.90 грн
10+162.53 грн
490+162.15 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MCXA152VFT MCXAP64M96FS3.pdf
MCXA152VFT
Виробник: NXP USA Inc.
Description: IC MCX 96MHZ SGL CORE 64KB QFN48
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 41
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+413.71 грн
10+310.85 грн
80+254.64 грн
В кошику  од. на суму  грн.
SPC5517EBMLQ66R MPC5510PB.pdf
SPC5517EBMLQ66R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
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A5M34TG140TC-EVB TSCEVBFS.pdf
Виробник: NXP USA Inc.
Description: A5M34TG140TC RF REFERENCE CIRCUI
Packaging: Bulk
For Use With/Related Products: A5M34TG140-TC
Frequency: 3.3GHz ~ 3.67GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: A5M34TG140-TC
Supplied Contents: Board(s)
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PCA9421UK-EVM UM11987.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PCA9421
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9421
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+16646.56 грн
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MPF5020CMMACES PF5020.pdf
MPF5020CMMACES
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 280 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+416.18 грн
10+306.81 грн
25+283.41 грн
100+241.83 грн
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MC33FS6527KAE FS6500-FS4500SDS-ASILB.pdf
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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QN9090THN/001Y QN9090(T)QN9030(T).pdf
QN9090THN/001Y
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+416.18 грн
10+357.68 грн
25+321.89 грн
100+275.23 грн
250+248.37 грн
500+222.87 грн
1000+184.88 грн
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