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LPC812M101JDH16FP LPC812M101JDH16FP NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 1991 шт:
термін постачання 21-31 дні (днів)
3+111.14 грн
10+62.46 грн
96+60.25 грн
192+54.48 грн
288+51.74 грн
576+49.02 грн
1056+46.83 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
LPC812M101JDH20FP LPC812M101JDH20FP NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 19055 шт:
термін постачання 21-31 дні (днів)
3+108.76 грн
10+83.10 грн
75+61.85 грн
150+57.72 грн
300+57.39 грн
525+56.34 грн
1050+53.55 грн
Мінімальне замовлення: 3
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BSS84AKT,115 BSS84AKT,115 NXP USA Inc. BSS84AKT.pdf Description: MOSFET P-CH 50V 150MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 150mA (Ta)
Rds On (Max) @ Id, Vgs: 7.5Ohm @ 100mA, 10V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 50 V
Gate Charge (Qg) (Max) @ Vgs: 0.35 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 36 pF @ 25 V
Qualification: AEC-Q101
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IP4238CZ10,115 IP4238CZ10,115 NXP USA Inc. Description: TVS DIODE 5.5VWM 7.3VC 10DFN
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IP4264CZ8-40-TTL,1 IP4264CZ8-40-TTL,1 NXP USA Inc. IP4264CZ8-10_20_40-TTL.pdf Description: FILTER RC(PI) ESD SMD
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IP4357CX17,135 NXP USA Inc. SD(HC)-Memory_Card_MMC_AN.pdf Description: TVS DIODE 17CSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
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NX3008NBKT,115 NX3008NBKT,115 NXP USA Inc. NX3008NBKT.pdf Description: MOSFET N-CH 30V 350MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
Qualification: AEC-Q101
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NX3008PBKT,115 NX3008PBKT,115 NXP USA Inc. Description: MOSFET P-CH 30V 200MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 200mA (Ta)
Rds On (Max) @ Id, Vgs: 4.1Ohm @ 200mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 46 pF @ 15 V
Qualification: AEC-Q101
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NX3020NAKT,115 NX3020NAKT,115 NXP USA Inc. Description: MOSFET N-CH 30V 180MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180mA (Ta)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Power Dissipation (Max): 230mW (Ta), 1.06W (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-75
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.44 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 13 pF @ 10 V
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PEMI1QFN/CK,315 PEMI1QFN/CK,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
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PEMI2QFN/WM,115 PEMI2QFN/WM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
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PEMI2STD/CP,115 PEMI2STD/CP,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/18.5PF SMD
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PEMI2STD/HG,115 PEMI2STD/HG,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/11PF SMD
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PEMI2STD/LT,115 PEMI2STD/LT,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/23PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
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PEMI2STD/WK,115 PEMI2STD/WK,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 2
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PEMI2STD/WM,115 PEMI2STD/WM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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PEMI4QFN/HR,132 PEMI4QFN/HR,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/21PF SMD
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PEMI4QFN/WG,132 PEMI4QFN/WG,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
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PEMI8QFN/LR,132 PEMI8QFN/LR,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/21PF SMD
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
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PEMI8QFN/WP,132 PEMI8QFN/WP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
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PMDPB28UN,115 PMDPB28UN,115 NXP USA Inc. PMDPB28UN.pdf Description: MOSFET 2N-CH 20V 4.6A 6HUSON
Packaging: Cut Tape (CT)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4.6A
Input Capacitance (Ciss) (Max) @ Vds: 265pF @ 10V
Rds On (Max) @ Id, Vgs: 37mOhm @ 4.6A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.7nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Part Status: Obsolete
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PMF63UN,115 PMF63UN,115 NXP USA Inc. PMF63UN.pdf Description: MOSFET N-CH 20V 1.8A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
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PMG45UN,115 PMG45UN,115 NXP USA Inc. PMG45UN_Rev_Nov_2012.pdf Description: MOSFET N-CH 20V 3A SOT363
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PMV90EN,215 PMV90EN,215 NXP USA Inc. PMV90EN.pdf Description: MOSFET N-CH 30V 1.9A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
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MKL16Z256VMP4 MKL16Z256VMP4 NXP USA Inc. KL16P64M48SF4.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MKL26Z256VMP4 MKL26Z256VMP4 NXP USA Inc. KL26P121M48SF4.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
на замовлення 640 шт:
термін постачання 21-31 дні (днів)
1+416.00 грн
10+310.38 грн
25+308.15 грн
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NXPMOSFET-DESIGNKIT NXPMOSFET-DESIGNKIT NXP USA Inc. Description: KIT DESIGN MOSFET LFPAK
Packaging: Box
Mounting Type: Surface Mount
Quantity: 180 Pieces (18 Values - 10 Each)
Kit Type: MOSFETs
Part Status: Obsolete
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OM13054UL OM13054UL NXP USA Inc. OM13054_Web.pdf Description: BOARD EVAL LPC-LINK2
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s)
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NT2H1611F0DTLH NT2H1611F0DTLH NXP USA Inc. Description: NFC TYPE2 TAG IC 144/888 BYTES
Packaging: Tube
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Standards: ISO 14443, NFC
Supplier Device Package: 4-HXSON (2x1.5)
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AFT09H310-03SR6 AFT09H310-03SR6 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 56W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 680 mA
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AFT09H310-04GSR6 NXP USA Inc. Description: RF MOSFET 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 920MHz
Configuration: N-Channel
Power - Output: 56W
Gain: 17.9dB
Technology: MOSFET (Metal Oxide)
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 680 mA
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AFT09MP055GNR1 AFT09MP055GNR1 NXP USA Inc. AFT09MP055N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 1W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 550 mA
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AFT09MP055NR1 AFT09MP055NR1 NXP USA Inc. AFT09MP055N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 1W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 550 mA
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AFT09MS007NT1 AFT09MS007NT1 NXP USA Inc. AFT09MS007N.pdf Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
1000+169.19 грн
2000+159.18 грн
3000+157.31 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
AFT18H356-24SR6 AFT18H356-24SR6 NXP USA Inc. Description: FET RF 2CH 65V 1.88GHZ NI1230-4
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Power - Output: 63W
Gain: 15dB
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
товару немає в наявності
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AFT26H160-4S4R3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI880X-4
Packaging: Tape & Reel (TR)
Package / Case: NI-880X-4L4S-8
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 32W
Gain: 14.9dB
Technology: LDMOS
Supplier Device Package: NI-880X-4L4S-8
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
товару немає в наявності
В кошику  од. на суму  грн.
MC10XS3412JHFKR2 MC10XS3412JHFKR2 NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 12mOhm
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
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MC34903CP5EKR2 MC34903CP5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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В кошику  од. на суму  грн.
MC34903CS3EKR2 MC34903CS3EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
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В кошику  од. на суму  грн.
MC34903CS5EKR2 MC34903CS5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
товару немає в наявності
В кошику  од. на суму  грн.
MC34904C5EKR2 MC34904C5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34905CS3EKR2 MC34905CS3EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
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MC34905CS5EKR2 MC34905CS5EKR2 NXP USA Inc. MC34903%2C4%2C5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2mA
Supplier Device Package: 32-SOIC-EP
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MC56F8025VLDR MC56F8025VLDR NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
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MCIMX6D4AVT10ADR MCIMX6D4AVT10ADR NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6D5EYM10ADR MCIMX6D5EYM10ADR NXP USA Inc. IMX6DQCEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
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MCIMX6D6AVT08ADR MCIMX6D6AVT08ADR NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
товару немає в наявності
В кошику  од. на суму  грн.
MCIMX6D6AVT10ADR MCIMX6D6AVT10ADR NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+4268.70 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MCIMX6Q4AVT08ADR MCIMX6Q4AVT08ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
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В кошику  од. на суму  грн.
MCIMX6Q5EYM10ADR MCIMX6Q5EYM10ADR NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+4506.29 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MCIMX6Q6AVT08ADR MCIMX6Q6AVT08ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 852MHZ 624FCBGA
товару немає в наявності
В кошику  од. на суму  грн.
MCIMX6S1AVM08ACR MCIMX6S1AVM08ACR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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В кошику  од. на суму  грн.
MCIMX6S4AVM08ACR MCIMX6S4AVM08ACR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
товару немає в наявності
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MCIMX6S5DVM10ACR MCIMX6S5DVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
500+1667.79 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MCIMX6S5EVM10ACR MCIMX6S5EVM10ACR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+1924.94 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MCIMX6S6AVM08ACR MCIMX6S6AVM08ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
товару немає в наявності
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MCIMX6U5EVM10ACR MCIMX6U5EVM10ACR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+2384.90 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MCIMX6U6AVM08ACR MCIMX6U6AVM08ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
товару немає в наявності
В кошику  од. на суму  грн.
MK20DX256VLK7R MK20DX256VLK7R NXP USA Inc. K20P81M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 29x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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MK60DN256VLL10R MK60DN256VLL10R NXP USA Inc. K60P100M100SF2V2.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
LPC812M101JDH16FP LPC81XM.pdf
LPC812M101JDH16FP
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 1991 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+111.14 грн
10+62.46 грн
96+60.25 грн
192+54.48 грн
288+51.74 грн
576+49.02 грн
1056+46.83 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
LPC812M101JDH20FP LPC81XM.pdf
LPC812M101JDH20FP
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 19055 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+108.76 грн
10+83.10 грн
75+61.85 грн
150+57.72 грн
300+57.39 грн
525+56.34 грн
1050+53.55 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
BSS84AKT,115 BSS84AKT.pdf
BSS84AKT,115
Виробник: NXP USA Inc.
Description: MOSFET P-CH 50V 150MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 150mA (Ta)
Rds On (Max) @ Id, Vgs: 7.5Ohm @ 100mA, 10V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 50 V
Gate Charge (Qg) (Max) @ Vgs: 0.35 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 36 pF @ 25 V
Qualification: AEC-Q101
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IP4238CZ10,115
IP4238CZ10,115
Виробник: NXP USA Inc.
Description: TVS DIODE 5.5VWM 7.3VC 10DFN
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IP4264CZ8-40-TTL,1 IP4264CZ8-10_20_40-TTL.pdf
IP4264CZ8-40-TTL,1
Виробник: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
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IP4357CX17,135 SD(HC)-Memory_Card_MMC_AN.pdf
Виробник: NXP USA Inc.
Description: TVS DIODE 17CSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
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NX3008NBKT,115 NX3008NBKT.pdf
NX3008NBKT,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 350MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
Qualification: AEC-Q101
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NX3008PBKT,115
NX3008PBKT,115
Виробник: NXP USA Inc.
Description: MOSFET P-CH 30V 200MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 200mA (Ta)
Rds On (Max) @ Id, Vgs: 4.1Ohm @ 200mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 46 pF @ 15 V
Qualification: AEC-Q101
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NX3020NAKT,115
NX3020NAKT,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 180MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180mA (Ta)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Power Dissipation (Max): 230mW (Ta), 1.06W (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-75
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.44 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 13 pF @ 10 V
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PEMI1QFN/CK,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/CK,315
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
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PEMI2QFN/WM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/WM,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
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PEMI2STD/CP,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/CP,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/18.5PF SMD
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PEMI2STD/HG,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/HG,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/11PF SMD
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PEMI2STD/LT,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/LT,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
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PEMI2STD/WK,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/WK,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 2
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PEMI2STD/WM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/WM,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
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PEMI4QFN/HR,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/HR,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/21PF SMD
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PEMI4QFN/WG,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/WG,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
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PEMI8QFN/LR,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/LR,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/21PF SMD
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
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PEMI8QFN/WP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/WP,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
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PMDPB28UN,115 PMDPB28UN.pdf
PMDPB28UN,115
Виробник: NXP USA Inc.
Description: MOSFET 2N-CH 20V 4.6A 6HUSON
Packaging: Cut Tape (CT)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4.6A
Input Capacitance (Ciss) (Max) @ Vds: 265pF @ 10V
Rds On (Max) @ Id, Vgs: 37mOhm @ 4.6A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.7nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Part Status: Obsolete
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PMF63UN,115 PMF63UN.pdf
PMF63UN,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 20V 1.8A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
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PMG45UN,115 PMG45UN_Rev_Nov_2012.pdf
PMG45UN,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 20V 3A SOT363
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PMV90EN,215 PMV90EN.pdf
PMV90EN,215
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 1.9A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
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MKL16Z256VMP4 KL16P64M48SF4.pdf
MKL16Z256VMP4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MKL26Z256VMP4 KL26P121M48SF4.pdf
MKL26Z256VMP4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
на замовлення 640 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+416.00 грн
10+310.38 грн
25+308.15 грн
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NXPMOSFET-DESIGNKIT
NXPMOSFET-DESIGNKIT
Виробник: NXP USA Inc.
Description: KIT DESIGN MOSFET LFPAK
Packaging: Box
Mounting Type: Surface Mount
Quantity: 180 Pieces (18 Values - 10 Each)
Kit Type: MOSFETs
Part Status: Obsolete
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OM13054UL OM13054_Web.pdf
OM13054UL
Виробник: NXP USA Inc.
Description: BOARD EVAL LPC-LINK2
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s)
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NT2H1611F0DTLH
NT2H1611F0DTLH
Виробник: NXP USA Inc.
Description: NFC TYPE2 TAG IC 144/888 BYTES
Packaging: Tube
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Standards: ISO 14443, NFC
Supplier Device Package: 4-HXSON (2x1.5)
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AFT09H310-03SR6
AFT09H310-03SR6
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 56W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 680 mA
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AFT09H310-04GSR6
Виробник: NXP USA Inc.
Description: RF MOSFET 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 920MHz
Configuration: N-Channel
Power - Output: 56W
Gain: 17.9dB
Technology: MOSFET (Metal Oxide)
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 680 mA
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AFT09MP055GNR1 AFT09MP055N.pdf
AFT09MP055GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 1W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 550 mA
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AFT09MP055NR1 AFT09MP055N.pdf
AFT09MP055NR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 1W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 550 mA
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AFT09MS007NT1 AFT09MS007N.pdf
AFT09MS007NT1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+169.19 грн
2000+159.18 грн
3000+157.31 грн
Мінімальне замовлення: 1000
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AFT18H356-24SR6
AFT18H356-24SR6
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 1.88GHZ NI1230-4
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Power - Output: 63W
Gain: 15dB
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
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AFT26H160-4S4R3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880X-4
Packaging: Tape & Reel (TR)
Package / Case: NI-880X-4L4S-8
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 32W
Gain: 14.9dB
Technology: LDMOS
Supplier Device Package: NI-880X-4L4S-8
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
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MC10XS3412JHFKR2
MC10XS3412JHFKR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 12mOhm
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
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MC34903CP5EKR2 MC34903,4,5.pdf
MC34903CP5EKR2
Виробник: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34903CS3EKR2 MC34903,4,5.pdf
MC34903CS3EKR2
Виробник: NXP USA Inc.
Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
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MC34903CS5EKR2 MC34903,4,5.pdf
MC34903CS5EKR2
Виробник: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34904C5EKR2 MC34903,4,5.pdf
MC34904C5EKR2
Виробник: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34905CS3EKR2 MC34903,4,5.pdf
MC34905CS3EKR2
Виробник: NXP USA Inc.
Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
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MC34905CS5EKR2 MC34903%2C4%2C5.pdf
MC34905CS5EKR2
Виробник: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2mA
Supplier Device Package: 32-SOIC-EP
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MC56F8025VLDR
MC56F8025VLDR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
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MCIMX6D4AVT10ADR IMX6DQIEC.pdf
MCIMX6D4AVT10ADR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6D5EYM10ADR IMX6DQCEC.pdf
MCIMX6D5EYM10ADR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
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MCIMX6D6AVT08ADR IMX6DQIEC.pdf
MCIMX6D6AVT08ADR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6D6AVT10ADR IMX6DQIEC.pdf
MCIMX6D6AVT10ADR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+4268.70 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MCIMX6Q4AVT08ADR IMX6DQAEC.pdf
MCIMX6Q4AVT08ADR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
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MCIMX6Q5EYM10ADR IMX6DQIEC.pdf
MCIMX6Q5EYM10ADR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+4506.29 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MCIMX6Q6AVT08ADR IMX6DQAEC.pdf
MCIMX6Q6AVT08ADR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
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MCIMX6S1AVM08ACR IMX6SDLCEC.pdf
MCIMX6S1AVM08ACR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S4AVM08ACR IMX6SDLCEC.pdf
MCIMX6S4AVM08ACR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S5DVM10ACR IMX6SDLAEC.pdf
MCIMX6S5DVM10ACR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+1667.79 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MCIMX6S5EVM10ACR IMX6SDLCEC.pdf
MCIMX6S5EVM10ACR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+1924.94 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MCIMX6S6AVM08ACR IMX6SDLAEC.pdf
MCIMX6S6AVM08ACR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
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MCIMX6U5EVM10ACR IMX6SDLCEC.pdf
MCIMX6U5EVM10ACR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
500+2384.90 грн
Мінімальне замовлення: 500
В кошику  од. на суму  грн.
MCIMX6U6AVM08ACR IMX6SDLAEC.pdf
MCIMX6U6AVM08ACR
Виробник: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MK20DX256VLK7R K20P81M72SF1.pdf
MK20DX256VLK7R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 29x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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MK60DN256VLL10R K60P100M100SF2V2.pdf
MK60DN256VLL10R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
товару немає в наявності
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