Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35310) > Сторінка 254 з 589
| Фото | Назва | Виробник | Інформація |
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MC08XS6421EK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP Packaging: Tray Features: Slew Rate Controlled Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 8mOhm, 21mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 1:1 Supplier Device Package: 32-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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OM5569/NT312D,699 | NXP USA Inc. |
 Description: DEMO BOARD NTAG I2CPackaging: Box For Use With/Related Products: NT3H1101 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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OM13073,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC43S37 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+, Cortex®-M4F Utilized IC / Part: LPC43S37 Platform: LPCXpresso™ |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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OM13082UL | NXP USA Inc. |
Description: SHIELD BOARD LPC GEN PURPOSE |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||
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MC08XSF421EK | NXP USA Inc. |
Description: IC SWITCH HIGH SIDE 32SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC10XS6200EK | NXP USA Inc. |
Description: IC PWR SWITCH HIGH SIDE 32HSOP Packaging: Tube Features: Status Flag Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 9A Supplier Device Package: 32-HSOP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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MC10XS6225EK | NXP USA Inc. |
Description: IC PWR SWITCH HIGH SIDE 32HSOP Packaging: Tube Features: Status Flag Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm, 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 3.8A, 9A Supplier Device Package: 32-HSOP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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MC10XS6325EK | NXP USA Inc. |
Description: IC PWR SWITCH HIGH SIDE 32HSOP Packaging: Tube Features: Status Flag Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 3 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm, 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 3.8A, 9A Supplier Device Package: 32-HSOP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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MC10XSD200BFK | NXP USA Inc. | Description: IC PWR SWITCH HIGH SIDE 23PQFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC16XSD200BFK | NXP USA Inc. | Description: IC PWR SWITCH HIGH SIDE 23PQFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC25XS6300EK | NXP USA Inc. |
Description: IC PWR SWITCH HIGH SIDE 32HSOP Packaging: Tube Features: Status Flag Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 3.8A Supplier Device Package: 32-HSOP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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MCIMX535DVV2C2 | NXP USA Inc. |
Description: IC MPU I.MX53 1.2GHZ 529FBGA Packaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MK21FX512AVMC12 | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Active Number of I/O: 81 DigiKey Programmable: Not Verified |
на замовлення 113 шт: термін постачання 21-31 дні (днів) |
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MK22FN1M0AVLH12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 662 шт: термін постачання 21-31 дні (днів) |
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MK22FN1M0AVLK12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 80FQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 56 DigiKey Programmable: Not Verified |
на замовлення 480 шт: термін постачання 21-31 дні (днів) |
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MK22FN1M0AVLL12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 33x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
на замовлення 161 шт: термін постачання 21-31 дні (днів) |
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MK22FN1M0AVLQ12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
на замовлення 600 шт: термін постачання 21-31 дні (днів) |
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MK22FN1M0AVMC12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MK22FN512VMP12 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 979 шт: термін постачання 21-31 дні (днів) |
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MK22FX512AVLH12 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 157 шт: термін постачання 21-31 дні (днів) |
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MK22FX512AVLK12 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 80FQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 56 DigiKey Programmable: Not Verified |
на замовлення 288 шт: термін постачання 21-31 дні (днів) |
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MK22FX512AVLL12 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 33x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
на замовлення 720 шт: термін постачання 21-31 дні (днів) |
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MK22FX512AVLQ12 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
на замовлення 331 шт: термін постачання 21-31 дні (днів) |
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MK22FX512AVMC12 | NXP USA Inc. | Description: IC MCU 32B 512KB FLASH 121MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MK22FX512AVMD12 | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 144MAPBGA Packaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Part Status: Active Number of I/O: 100 DigiKey Programmable: Not Verified |
на замовлення 178 шт: термін постачання 21-31 дні (днів) |
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MKE02Z16VFM4 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Verified |
на замовлення 16808 шт: термін постачання 21-31 дні (днів) |
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MKE02Z32VFM4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 1950 шт: термін постачання 21-31 дні (днів) |
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MKE02Z64VFM4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 758 шт: термін постачання 21-31 дні (днів) |
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A2I25D012GNR1 | NXP USA Inc. |
Description: IC AMP CDMA 2.3-2.69GHZ TO270WBG Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.69GHz RF Type: W-CDMA Voltage - Supply: 26V ~ 32V Gain: 33dB Current - Supply: 110mA P1dB: 12dBm Test Frequency: 2.3GHz Supplier Device Package: TO-270WBG-15 Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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A2I25D012NR1 | NXP USA Inc. |
Description: IC AMP CDMA 2.3-2.69GHZ TO270WB Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.69GHz RF Type: W-CDMA Voltage - Supply: 26V ~ 32V Gain: 35dB Current - Supply: 110mA P1dB: 12dBm Test Frequency: 2.3GHz Supplier Device Package: TO-270WB-15 Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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A2T07D160W04SR3 | NXP USA Inc. |
Description: FET RF 2CH 70V 803MHZ Packaging: Tape & Reel (TR) Package / Case: NI-780S-4L Mounting Type: Surface Mount Frequency: 803MHz Configuration: Dual Power - Output: 30W Gain: 21.5dB Technology: LDMOS Supplier Device Package: NI-780S-4L Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 450 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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A2T07H310-24SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230-4LS2L Mounting Type: Chassis Mount Frequency: 880MHz Configuration: Dual Power - Output: 47W Gain: 18.6dB Technology: LDMOS Supplier Device Package: NI-1230-4LS2L Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 700 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| A2T18H100-25SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-4S4 Mounting Type: Chassis Mount Frequency: 1.81GHz Configuration: Dual Power - Output: 18W Gain: 18.1dB Technology: LDMOS Supplier Device Package: NI-780-4S4 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 230 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| A2T21H100-25SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS Packaging: Tape & Reel (TR) Configuration: N-Channel Technology: MOSFET (Metal Oxide) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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AFT05MS004NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 7.5V SOT89A Packaging: Tape & Reel (TR) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 4.9W Gain: 20.9dB Technology: LDMOS Supplier Device Package: SOT-89A Part Status: Active Voltage - Rated: 30 V Voltage - Test: 7.5 V Current - Test: 100 mA |
на замовлення 13000 шт: термін постачання 21-31 дні (днів) |
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| AFT09S200W02GNR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2G Mounting Type: Chassis Mount Frequency: 960MHz Power - Output: 56W Gain: 19.2dB Technology: LDMOS Supplier Device Package: OM-780-2 Gull Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.4 A |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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AFT09S200W02NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 56W Gain: 19.2dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.4 A |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| AFT09S200W02SR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 4W PLD Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| AFT21S240-12SR3 | NXP USA Inc. |
Description: FET RF 65V 2.17GHZ NI780S-2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| AFT26P100-4WGSR3 | NXP USA Inc. |
Description: RF MOSFET 2.6GHZ 100W NI780S-6 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| B4420NXE7QQMD | NXP USA Inc. |
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA Packaging: Box Package / Case: 1020-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e6500 Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Supplier Device Package: 1020-FCPBGA (33x33) Ethernet: 1/2.5Gbps (4) USB: USB 2.0 (1) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Additional Interfaces: I2C, MMC/SD, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| B4860NXE7QUMD | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 1020FCPBGA Packaging: Box Package / Case: 1020-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e6500 Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Supplier Device Package: 1020-FCPBGA (33x33) Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
 |
FXLN8362QR1 | NXP USA Inc. |
Description: ACCELEROMETER 4-16G ANALOG 12QFN Packaging: Tape & Reel (TR) Features: Selectable Scale Package / Case: 12-VQFN Exposed Pad Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±4g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.1kHz (X,Y), 600Hz (Z) Supplier Device Package: 12-QFN (3x3) Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
FXTH8705026T1 | NXP USA Inc. |
Description: IC SENSOR MULTICHIP Z-AXIS 24QFN Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
FXTH8705116T1 | NXP USA Inc. |
Description: IC SENSOR MULTICHIP XZAXIS 24QFN Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
FXTH8709026T1 | NXP USA Inc. |
Description: IC SENSOR MULTICHIP Z-AXIS 24QFN Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
FXTH8709116T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Operating Temperature: -40°C ~ 125°C Sensor Type: Tire Pressure Monitoring (TPMS) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
FXTH8709126T1 | NXP USA Inc. |
Description: IC SENSOR MULTICHIP XZAXIS 24QFN Packaging: Tape & Reel (TR) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| KKL15Z128CAD4R | NXP USA Inc. | Description: IC MCU 32BIT 128KB FLASH 35WLCSP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| LS101MASE7DFA | NXP USA Inc. | Description: IC PROCESSOR DUAL CORE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| LS101MASE7EHA | NXP USA Inc. | Description: IC PROCESSOR DUAL CORE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| LS101MASN7DFA | NXP USA Inc. | Description: IC PROCESSOR DUAL CORE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| LS101MAXE7DFA | NXP USA Inc. | Description: IC PROCESSOR DUAL CORE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
 |
LS1024ASE7JLA | NXP USA Inc. |
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A9 Supplier Device Package: 625-FCPBGA (21x21) Ethernet: GbE (3) USB: USB 2.0 + PHY (1), USB 3.0 + PHY Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3 Security Features: Secure Boot, TrustZone® SATA: SATA 3Gbps (2) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
LS1024ASN7ELA | NXP USA Inc. |
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A9 Supplier Device Package: 625-FCPBGA (21x21) Ethernet: GbE (3) USB: USB 2.0 + PHY (1), USB 3.0 + PHY Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3 Security Features: Secure Boot, TrustZone® SATA: SATA 3Gbps (2) Part Status: Obsolete |
на замовлення 55 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
LS1024ASN7JLA | NXP USA Inc. |
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A9 Supplier Device Package: 625-FCPBGA (21x21) Ethernet: GbE (3) USB: USB 2.0 + PHY (1), USB 3.0 + PHY Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3 Security Features: Secure Boot, TrustZone® SATA: SATA 3Gbps (2) Part Status: Obsolete |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
| LS102MASN7BFA | NXP USA Inc. | Description: IC PROCESSOR DUAL CORE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
|
|
MC08XS6421EKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP Packaging: Tape & Reel (TR) Features: Slew Rate Controlled Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 4 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 8mOhm, 21mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 1:1 Supplier Device Package: 32-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MC10XS6325EKR2 | NXP USA Inc. |
Description: IC PWR SWITCH HIGH SIDE 32HSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MC10XSD200BFKR2 | NXP USA Inc. | Description: IC PWR SWITCH HIGH SIDE 23PQFN |
товару немає в наявності |
В кошику од. на суму грн. |
| MC08XS6421EK |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tray
Features: Slew Rate Controlled
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tray
Features: Slew Rate Controlled
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| OM5569/NT312D,699 |
|
Виробник: NXP USA Inc.
Description: DEMO BOARD NTAG I2C
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Description: DEMO BOARD NTAG I2C
Packaging: Box
For Use With/Related Products: NT3H1101
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| OM13073,598 |
|
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC43S37 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+, Cortex®-M4F
Utilized IC / Part: LPC43S37
Platform: LPCXpresso™
Description: LPCXPRESSO LPC43S37 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+, Cortex®-M4F
Utilized IC / Part: LPC43S37
Platform: LPCXpresso™
товару немає в наявності
В кошику
од. на суму грн.
| OM13082UL |
|
Виробник: NXP USA Inc.
Description: SHIELD BOARD LPC GEN PURPOSE
Description: SHIELD BOARD LPC GEN PURPOSE
на замовлення 1 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| MC08XSF421EK |
|
Виробник: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Description: IC SWITCH HIGH SIDE 32SOIC
товару немає в наявності
В кошику
од. на суму грн.
| MC10XS6200EK |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
на замовлення 14 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 611.31 грн |
| 10+ | 455.58 грн |
| MC10XS6225EK |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A, 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A, 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
на замовлення 42 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 577.44 грн |
| 10+ | 502.43 грн |
| 25+ | 479.08 грн |
| MC10XS6325EK |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A, 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A, 9A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 753.39 грн |
| 10+ | 655.01 грн |
| 25+ | 624.59 грн |
| MC10XSD200BFK |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Description: IC PWR SWITCH HIGH SIDE 23PQFN
товару немає в наявності
В кошику
од. на суму грн.
| MC16XSD200BFK |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Description: IC PWR SWITCH HIGH SIDE 23PQFN
товару немає в наявності
В кошику
од. на суму грн.
| MC25XS6300EK |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 3.8A
Supplier Device Package: 32-HSOP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 602.22 грн |
| 10+ | 447.70 грн |
| MCIMX535DVV2C2 |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 1.2GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 1.2GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
товару немає в наявності
В кошику
од. на суму грн.
| MK21FX512AVMC12 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
на замовлення 113 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1084.66 грн |
| 10+ | 826.52 грн |
| 25+ | 772.14 грн |
| 100+ | 668.45 грн |
| MK22FN1M0AVLH12 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 662 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 916.96 грн |
| 10+ | 698.44 грн |
| 25+ | 652.34 грн |
| 160+ | 560.38 грн |
| MK22FN1M0AVLK12 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
на замовлення 480 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1083.83 грн |
| 10+ | 837.18 грн |
| 96+ | 702.16 грн |
| 192+ | 629.49 грн |
| 288+ | 604.78 грн |
| MK22FN1M0AVLL12 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 161 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1249.87 грн |
| 10+ | 953.64 грн |
| 25+ | 891.14 грн |
| 90+ | 775.90 грн |
| MK22FN1M0AVLQ12 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
на замовлення 600 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1303.57 грн |
| 10+ | 828.19 грн |
| 60+ | 795.89 грн |
| 120+ | 716.26 грн |
| MK22FN1M0AVMC12 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MK22FN512VMP12 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 979 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 808.74 грн |
| 10+ | 486.68 грн |
| 25+ | 476.53 грн |
| 100+ | 434.26 грн |
| 250+ | 429.48 грн |
| MK22FX512AVLH12 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 157 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1052.44 грн |
| 10+ | 744.82 грн |
| 25+ | 700.00 грн |
| MK22FX512AVLK12 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
на замовлення 288 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 842.61 грн |
| 10+ | 640.13 грн |
| 96+ | 551.48 грн |
| 192+ | 510.86 грн |
| MK22FX512AVLL12 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 720 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1119.35 грн |
| 10+ | 850.38 грн |
| 25+ | 793.65 грн |
| 90+ | 689.91 грн |
| 270+ | 656.26 грн |
| 450+ | 643.82 грн |
| MK22FX512AVLQ12 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
на замовлення 331 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1061.53 грн |
| 10+ | 675.77 грн |
| 60+ | 648.79 грн |
| 120+ | 594.24 грн |
| MK22FX512AVMC12 |
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Description: IC MCU 32B 512KB FLASH 121MAPBGA
товару немає в наявності
В кошику
од. на суму грн.
| MK22FX512AVMD12 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
на замовлення 178 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1199.48 грн |
| 10+ | 914.10 грн |
| 25+ | 853.85 грн |
| 160+ | 722.94 грн |
| MKE02Z16VFM4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Verified
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Verified
на замовлення 16808 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 165.22 грн |
| 10+ | 118.85 грн |
| 25+ | 108.66 грн |
| 100+ | 91.47 грн |
| 490+ | 88.89 грн |
| MKE02Z32VFM4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 1950 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 185.87 грн |
| 10+ | 134.04 грн |
| 25+ | 124.64 грн |
| MKE02Z64VFM4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 758 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 132.17 грн |
| 10+ | 126.48 грн |
| A2I25D012GNR1 |
Виробник: NXP USA Inc.
Description: IC AMP CDMA 2.3-2.69GHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 33dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WBG-15
Part Status: Obsolete
Description: IC AMP CDMA 2.3-2.69GHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 33dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WBG-15
Part Status: Obsolete
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| A2I25D012NR1 |
Виробник: NXP USA Inc.
Description: IC AMP CDMA 2.3-2.69GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 35dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WB-15
Part Status: Obsolete
Description: IC AMP CDMA 2.3-2.69GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 35dB
Current - Supply: 110mA
P1dB: 12dBm
Test Frequency: 2.3GHz
Supplier Device Package: TO-270WB-15
Part Status: Obsolete
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| A2T07D160W04SR3 |
Виробник: NXP USA Inc.
Description: FET RF 2CH 70V 803MHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 803MHz
Configuration: Dual
Power - Output: 30W
Gain: 21.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: FET RF 2CH 70V 803MHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 803MHz
Configuration: Dual
Power - Output: 30W
Gain: 21.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 450 mA
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| A2T07H310-24SR6 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 880MHz
Configuration: Dual
Power - Output: 47W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 700 mA
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 880MHz
Configuration: Dual
Power - Output: 47W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4LS2L
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 700 mA
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| A2T18H100-25SR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 18W
Gain: 18.1dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 230 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S4
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 18W
Gain: 18.1dB
Technology: LDMOS
Supplier Device Package: NI-780-4S4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 230 mA
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| A2T21H100-25SR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Configuration: N-Channel
Technology: MOSFET (Metal Oxide)
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Configuration: N-Channel
Technology: MOSFET (Metal Oxide)
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| AFT05MS004NT1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 7.5V SOT89A
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 4.9W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: SOT-89A
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
на замовлення 13000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 124.25 грн |
| AFT09S200W02GNR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2G
Mounting Type: Chassis Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2 Gull
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2G
Mounting Type: Chassis Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2 Gull
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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| AFT09S200W02NR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 56W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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| AFT21S240-12SR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 2.17GHZ NI780S-2
Description: FET RF 65V 2.17GHZ NI780S-2
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| B4420NXE7QQMD |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
Description: IC MPU QORIQ 1.6GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, SPI, UART
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| B4860NXE7QUMD |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Description: IC MPU QORIQ 1.8GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
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| FXLN8362QR1 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 4-16G ANALOG 12QFN
Packaging: Tape & Reel (TR)
Features: Selectable Scale
Package / Case: 12-VQFN Exposed Pad
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.1kHz (X,Y), 600Hz (Z)
Supplier Device Package: 12-QFN (3x3)
Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
Description: ACCELEROMETER 4-16G ANALOG 12QFN
Packaging: Tape & Reel (TR)
Features: Selectable Scale
Package / Case: 12-VQFN Exposed Pad
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.1kHz (X,Y), 600Hz (Z)
Supplier Device Package: 12-QFN (3x3)
Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
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| FXTH8709116T1 |
|
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Part Status: Obsolete
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| FXTH8709126T1 |
Виробник: NXP USA Inc.
Description: IC SENSOR MULTICHIP XZAXIS 24QFN
Packaging: Tape & Reel (TR)
Part Status: Active
Description: IC SENSOR MULTICHIP XZAXIS 24QFN
Packaging: Tape & Reel (TR)
Part Status: Active
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| KKL15Z128CAD4R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 35WLCSP
Description: IC MCU 32BIT 128KB FLASH 35WLCSP
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| LS101MASE7DFA |
Виробник: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Description: IC PROCESSOR DUAL CORE
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| LS101MASE7EHA |
Виробник: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Description: IC PROCESSOR DUAL CORE
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| LS101MASN7DFA |
Виробник: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Description: IC PROCESSOR DUAL CORE
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| LS101MAXE7DFA |
Виробник: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Description: IC PROCESSOR DUAL CORE
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| LS1024ASE7JLA |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
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| LS1024ASN7ELA |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
на замовлення 55 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3999.93 грн |
| 10+ | 3173.31 грн |
| LS1024ASN7JLA |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5031.71 грн |
| 10+ | 3957.98 грн |
| LS102MASN7BFA |
Виробник: NXP USA Inc.
Description: IC PROCESSOR DUAL CORE
Description: IC PROCESSOR DUAL CORE
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| MC08XS6421EKR2 |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 8mOhm, 21mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MC10XS6325EKR2 |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32HSOP
Description: IC PWR SWITCH HIGH SIDE 32HSOP
товару немає в наявності
В кошику
од. на суму грн.
| MC10XSD200BFKR2 |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 23PQFN
Description: IC PWR SWITCH HIGH SIDE 23PQFN
товару немає в наявності
В кошику
од. на суму грн.