Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (34110) > Сторінка 257 з 569
| Фото | Назва | Виробник | Інформація |
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MMPF0100F4ANES | NXP USA Inc. |
 Description: IC REG CONV I.MX6 12OUT 56QFNPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) |
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MMPF0100F4ANESR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) |
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MMPF0100NPANES | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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MMPF0100NPANESR2 | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 105°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-QFN-EP (8x8) Part Status: Active |
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MMRF1011HR5 | NXP USA Inc. |
Description: FET RF 100V 1.4GHZ Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.4GHz Power - Output: 330W Gain: 18dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 150 mA |
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MMRF1011HSR5 | NXP USA Inc. |
Description: FET RF 100V 1.4GHZ Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.4GHz Power - Output: 330W Gain: 18dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 150 mA |
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MMRF1012NR1 | NXP USA Inc. |
Description: FET RF 120V 220MHZ Packaging: Tape & Reel (TR) Package / Case: TO-270-2 Mounting Type: Surface Mount Frequency: 220MHz Power - Output: 10W Gain: 23.9dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Obsolete Voltage - Rated: 120 V Voltage - Test: 50 V Current - Test: 30 mA |
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MMRF1013HR5 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.9GHZ Packaging: Tape & Reel (TR) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 2.9GHz Configuration: Dual Power - Output: 320W Gain: 13.3dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 100 mA |
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MMRF1013HSR5 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.9GHZ Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Mounting Type: Chassis Mount Frequency: 2.9GHz Configuration: Dual Power - Output: 320W Gain: 13.3dB Technology: LDMOS Supplier Device Package: NI-1230-4S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 100 mA |
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MMRF1014NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V PLD-1.5 Packaging: Tape & Reel (TR) Package / Case: PLD-1.5 Mounting Type: Surface Mount Frequency: 1.96GHz Power - Output: 4W Gain: 18dB Technology: LDMOS Supplier Device Package: PLD-1.5 Part Status: Active Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 50 mA |
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MMRF1015GNR1 | NXP USA Inc. |
Description: FET RF 68V 960MHZ Packaging: Tape & Reel (TR) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 10W Gain: 18dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Part Status: Last Time Buy Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 125 mA |
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MMRF1015NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270-2 Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 10W Gain: 18dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Last Time Buy Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 125 mA |
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| MMRF1016HR5 | NXP USA Inc. |
Description: FET RF 2CH 120V 225MHZ Packaging: Tape & Reel (TR) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 225MHz Configuration: Dual Power - Output: 125W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Obsolete Voltage - Rated: 120 V Voltage - Test: 50 V Current - Test: 2.6 A |
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MMRF1017NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-2 Packaging: Tape & Reel (TR) Package / Case: OM-780-2 Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 80W Gain: 20dB Technology: LDMOS Supplier Device Package: OM-780-2 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.4 A |
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MMRF1018NBR1 | NXP USA Inc. |
Description: FET RF 120V 860MHZ Packaging: Tape & Reel (TR) Package / Case: TO-272BB Mounting Type: Chassis Mount Frequency: 860MHz Power - Output: 18W Gain: 22dB Technology: LDMOS Supplier Device Package: TO-272 WB-4 Part Status: Obsolete Voltage - Rated: 120 V Voltage - Test: 50 V Current - Test: 350 mA |
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MMRF1018NR1 | NXP USA Inc. |
Description: FET RF 120V 860MHZ Packaging: Tape & Reel (TR) Package / Case: TO-270-4 Mounting Type: Surface Mount Frequency: 860MHz Power - Output: 18W Gain: 22dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Obsolete Voltage - Rated: 120 V Voltage - Test: 50 V Current - Test: 350 mA |
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MMRF1019NR4 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V PLD-1.5 Packaging: Tape & Reel (TR) Package / Case: PLD-1.5 Mounting Type: Surface Mount Frequency: 1.09GHz Power - Output: 10W Gain: 25dB Technology: LDMOS Supplier Device Package: PLD-1.5 Part Status: Obsolete Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 10 mA |
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MMRF1308HR5 | NXP USA Inc. |
Description: FET RF 2CH 133V 230MHZ NI1230 Packaging: Tape & Reel (TR) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 600W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230-4H Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
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MMRF1308HSR5 | NXP USA Inc. |
Description: FET RF 2CH 133V 230MHZ Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 600W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230-4S Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
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MMRF1310HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780-4 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 300W Gain: 26.5dB Technology: LDMOS Supplier Device Package: NI-780-4 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
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MMRF1310HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S-4L Mounting Type: Surface Mount Frequency: 230MHz Configuration: Dual Power - Output: 300W Gain: 26.5dB Technology: LDMOS Supplier Device Package: NI-780S-4L Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
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MMRF1315NR1 | NXP USA Inc. |
Description: FET RF 66V 880MHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-2 Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 14W Gain: 21.1dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Obsolete Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 450 mA |
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MMRF1316NR1 | NXP USA Inc. |
Description: FET RF 2CH 133V 230MHZ TO270 Packaging: Tape & Reel (TR) Package / Case: TO-270-4 Mounting Type: Surface Mount Frequency: 230MHz Configuration: Dual Power - Output: 300W Gain: 27dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
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MMRF1318NR1 | NXP USA Inc. |
Description: FET RF 110V 450MHZ Packaging: Tape & Reel (TR) Package / Case: TO-270-4 Mounting Type: Surface Mount Frequency: 450MHz Power - Output: 300W Gain: 22dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Obsolete Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 900 mA |
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MMRF2005NR1 | NXP USA Inc. |
Description: FET RF 65V 940MHZ Packaging: Tape & Reel (TR) Package / Case: TO-270-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 940MHz Power - Output: 3.2W Gain: 35.9dB Technology: LDMOS Supplier Device Package: TO-270 WBL-16 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 106 mA |
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MMRF2006NT1 | NXP USA Inc. |
Description: IC AMP W-CDMA 1.8-2.17GHZ 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 1.8GHz ~ 2.17GHz RF Type: W-CDMA Voltage - Supply: 26V ~ 32V Gain: 36dB Current - Supply: 230mA P1dB: 43dBm Test Frequency: 1.8GHz ~ 2.17GHz Supplier Device Package: 24-PQFN (8x8) Part Status: Obsolete |
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| MMRF2007NR1 | NXP USA Inc. |
Description: FET RF 2CH 70V 940MHZ Packaging: Tape & Reel (TR) Package / Case: TO-270-16 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 940MHz Power - Output: 35W Gain: 32.6dB Technology: LDMOS Supplier Device Package: TO-270 WBL-16 Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 60 mA |
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MRFE6VP6300GSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780GS-4L Mounting Type: Chassis Mount Frequency: 600MHz Power - Output: 300W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-780GS-4L Voltage - Rated: 50 V |
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| MWPR1516CALR | NXP USA Inc. |
Description: IC RECEIVER 16KB FLASH 32QFN |
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P1010NXN5DFB | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.0GHZ 425TEBGA |
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P1010NXN5FFB | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.0GHZ 425TEBGA |
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| RAPPID-560XSSW | NXP USA Inc. | Description: DEV TOOL MPC560XS |
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| RAPPID-563XMSW | NXP USA Inc. | Description: DEV TOOL MPC563XM |
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S912XEG128W1MAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 59 DigiKey Programmable: Not Verified |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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S912XEP100BMAG | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
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S912XET256BMAA | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 59 DigiKey Programmable: Not Verified |
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S912XET256BMAAR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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S912XET256BMALR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP |
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S912XET256W0MAA | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP |
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S912XET256W1MAA | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP |
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S912XET256W1MAG | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 119 |
на замовлення 300 шт: термін постачання 21-31 дні (днів) |
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S912XET256W1MAL | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
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S9KEAZ128ACLH | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 1599 шт: термін постачання 21-31 дні (днів) |
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S9KEAZ128ACLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP |
на замовлення 445 шт: термін постачання 21-31 дні (днів) |
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S9KEAZ128AVLH | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 4800 шт: термін постачання 21-31 дні (днів) |
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S9KEAZ64ACLH | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP |
на замовлення 780 шт: термін постачання 21-31 дні (днів) |
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S9KEAZ64AMLH | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 57 DigiKey Programmable: Not Verified |
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S9KEAZ64AVLH | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 57 DigiKey Programmable: Not Verified |
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S9KEAZN16AMLC | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 1250 шт: термін постачання 21-31 дні (днів) |
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S9KEAZN32ACLC | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFP |
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S9KEAZN32ACLH | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 57 DigiKey Programmable: Not Verified |
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S9KEAZN32AMLC | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
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S9KEAZN32AMLH | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 57 DigiKey Programmable: Not Verified |
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S9KEAZN64ACLC | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 2173 шт: термін постачання 21-31 дні (днів) |
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S9KEAZN8ACTG | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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S9S08DV16F2MLCR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 25 DigiKey Programmable: Not Verified |
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S9S08DZ60F2MLHR | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 53 DigiKey Programmable: Not Verified |
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S9S08SG32E1VTGR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 12 DigiKey Programmable: Not Verified |
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S9S08SG4E2CTJR | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 16 DigiKey Programmable: Not Verified |
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S9S08SG8E2CSC | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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| MMPF0100F4ANES |
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Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
товар відсутній
| MMPF0100F4ANESR2 |
|
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
товар відсутній
| MMPF0100NPANES |
|
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 652.61 грн |
| MMPF0100NPANESR2 |
|
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Description: IC REG CONV I.MX6 12OUT 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
товар відсутній
| MMRF1011HR5 |
Виробник: NXP USA Inc.
Description: FET RF 100V 1.4GHZ
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.4GHz
Power - Output: 330W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: FET RF 100V 1.4GHZ
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.4GHz
Power - Output: 330W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 150 mA
товар відсутній
| MMRF1011HSR5 |
Виробник: NXP USA Inc.
Description: FET RF 100V 1.4GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.4GHz
Power - Output: 330W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 150 mA
Description: FET RF 100V 1.4GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.4GHz
Power - Output: 330W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 150 mA
товар відсутній
| MMRF1012NR1 |
|
Виробник: NXP USA Inc.
Description: FET RF 120V 220MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 30 mA
Description: FET RF 120V 220MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 30 mA
товар відсутній
| MMRF1013HR5 |
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 2.9GHZ
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 2.9GHz
Configuration: Dual
Power - Output: 320W
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 100 mA
Description: FET RF 2CH 65V 2.9GHZ
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 2.9GHz
Configuration: Dual
Power - Output: 320W
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 100 mA
товар відсутній
| MMRF1013HSR5 |
Виробник: NXP USA Inc.
Description: FET RF 2CH 65V 2.9GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 2.9GHz
Configuration: Dual
Power - Output: 320W
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 100 mA
Description: FET RF 2CH 65V 2.9GHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 2.9GHz
Configuration: Dual
Power - Output: 320W
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 100 mA
товар відсутній
| MMRF1014NT1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
товар відсутній
| MMRF1015GNR1 |
|
Виробник: NXP USA Inc.
Description: FET RF 68V 960MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Last Time Buy
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Description: FET RF 68V 960MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Last Time Buy
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
товар відсутній
| MMRF1015NR1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Last Time Buy
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Last Time Buy
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
товар відсутній
| MMRF1016HR5 |
Виробник: NXP USA Inc.
Description: FET RF 2CH 120V 225MHZ
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 2.6 A
Description: FET RF 2CH 120V 225MHZ
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 2.6 A
товар відсутній
| MMRF1017NR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 80W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 80W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
товар відсутній
| MMRF1018NBR1 |
Виробник: NXP USA Inc.
Description: FET RF 120V 860MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 350 mA
Description: FET RF 120V 860MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 350 mA
товар відсутній
| MMRF1018NR1 |
Виробник: NXP USA Inc.
Description: FET RF 120V 860MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 350 mA
Description: FET RF 120V 860MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 120 V
Voltage - Test: 50 V
Current - Test: 350 mA
товар відсутній
| MMRF1019NR4 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 10W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 50V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 10W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 10 mA
товар відсутній
| MMRF1308HR5 |
|
Виробник: NXP USA Inc.
Description: FET RF 2CH 133V 230MHZ NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: FET RF 2CH 133V 230MHZ NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
| MMRF1308HSR5 |
Виробник: NXP USA Inc.
Description: FET RF 2CH 133V 230MHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: FET RF 2CH 133V 230MHZ
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
| MMRF1310HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
| MMRF1310HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 26.5dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
| MMRF1315NR1 |
Виробник: NXP USA Inc.
Description: FET RF 66V 880MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: FET RF 66V 880MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
товар відсутній
| MMRF1316NR1 |
|
Виробник: NXP USA Inc.
Description: FET RF 2CH 133V 230MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: FET RF 2CH 133V 230MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 300W
Gain: 27dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
| MMRF1318NR1 |
Виробник: NXP USA Inc.
Description: FET RF 110V 450MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 450MHz
Power - Output: 300W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
Description: FET RF 110V 450MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270-4
Mounting Type: Surface Mount
Frequency: 450MHz
Power - Output: 300W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 900 mA
товар відсутній
| MMRF2005NR1 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 940MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 940MHz
Power - Output: 3.2W
Gain: 35.9dB
Technology: LDMOS
Supplier Device Package: TO-270 WBL-16
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 106 mA
Description: FET RF 65V 940MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 940MHz
Power - Output: 3.2W
Gain: 35.9dB
Technology: LDMOS
Supplier Device Package: TO-270 WBL-16
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 106 mA
товар відсутній
| MMRF2006NT1 |
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.17GHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 36dB
Current - Supply: 230mA
P1dB: 43dBm
Test Frequency: 1.8GHz ~ 2.17GHz
Supplier Device Package: 24-PQFN (8x8)
Part Status: Obsolete
Description: IC AMP W-CDMA 1.8-2.17GHZ 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 26V ~ 32V
Gain: 36dB
Current - Supply: 230mA
P1dB: 43dBm
Test Frequency: 1.8GHz ~ 2.17GHz
Supplier Device Package: 24-PQFN (8x8)
Part Status: Obsolete
товар відсутній
| MMRF2007NR1 |
|
Виробник: NXP USA Inc.
Description: FET RF 2CH 70V 940MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 35W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: TO-270 WBL-16
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 60 mA
Description: FET RF 2CH 70V 940MHZ
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 35W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: TO-270 WBL-16
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 60 mA
товар відсутній
| MRFE6VP6300GSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-4L
Mounting Type: Chassis Mount
Frequency: 600MHz
Power - Output: 300W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 50 V
Description: RF MOSFET LDMOS 50V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-4L
Mounting Type: Chassis Mount
Frequency: 600MHz
Power - Output: 300W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 50 V
товар відсутній
| S912XEG128W1MAA |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1170.15 грн |
| 10+ | 900.35 грн |
| S912XEP100BMAG |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
товар відсутній
| S912XET256BMAA |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
товар відсутній
| S912XET256BMAAR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товар відсутній
| S912XET256W1MAG |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 119
на замовлення 300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1556.88 грн |
| 10+ | 1198.14 грн |
| 80+ | 1011.9 грн |
| S912XET256W1MAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
| S9KEAZ128ACLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 1599 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 457.82 грн |
| 10+ | 344.27 грн |
| 80+ | 282.05 грн |
| 800+ | 259.13 грн |
| S9KEAZ128ACLK |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Description: IC MCU 32BIT 128KB FLASH 80LQFP
на замовлення 445 шт:
термін постачання 21-31 дні (днів)| S9KEAZ128AVLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 4800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 478.44 грн |
| 10+ | 360.02 грн |
| 80+ | 294.94 грн |
| 800+ | 270.97 грн |
| 1600+ | 228.53 грн |
| 2400+ | 217.1 грн |
| S9KEAZ64ACLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Description: IC MCU 32BIT 64KB FLASH 64LQFP
на замовлення 780 шт:
термін постачання 21-31 дні (днів)| S9KEAZ64AMLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
товар відсутній
| S9KEAZ64AVLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
товар відсутній
| S9KEAZN16AMLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 251.66 грн |
| 10+ | 189.22 грн |
| 80+ | 155.05 грн |
| 440+ | 142.45 грн |
| 1250+ | 120.14 грн |
| S9KEAZN32ACLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
товар відсутній
| S9KEAZN32AMLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
товар відсутній
| S9KEAZN32AMLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
товар відсутній
| S9KEAZN64ACLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2173 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 287.21 грн |
| 10+ | 215.71 грн |
| 80+ | 176.76 грн |
| 440+ | 162.39 грн |
| 1250+ | 136.96 грн |
| S9KEAZN8ACTG |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 30 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 162.8 грн |
| 10+ | 122.54 грн |
| S9S08DV16F2MLCR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
товар відсутній
| S9S08DZ60F2MLHR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
товар відсутній
| S9S08SG32E1VTGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
товар відсутній
| S9S08SG4E2CTJR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
товар відсутній
| S9S08SG8E2CSC |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
Description: IC MCU 8BIT 8KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 258.77 грн |
| 10+ | 194.76 грн |