| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
| XCKU085-2FLVA1517E4836 | AMD |
Description: XCKU085-2FLVA1517E4836 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| VWPKUS060-2FFVA1517E | AMD |
Description: VWPKUS060-2FFVA1517E Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU085-2FLVA1517I3991 | AMD |
Description: XCKU085-2FLVA1517I3991 Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU085-3FLVA1517E5134 | AMD |
Description: XCKU085-3FLVA1517E5134 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-2FLVA1517E4464 | AMD |
Description: XCKU115-2FLVA1517E4464 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-3FLVA1517E5107 | AMD |
Description: XCKU115-3FLVA1517E5107 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XQKU115-2FLQA1517I | AMD |
Description: XQKU115-2FLQA1517I Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-2FFVA1517E4539 | AMD |
Description: XCKU060-2FFVA1517E4539 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-2FFVA1517I4769 | AMD |
Description: XCKU060-2FFVA1517I4769 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU085-2FLVA1517E4636 | AMD |
Description: XCKU085-2FLVA1517E4636 Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-1FFVA1517CES9919 | AMD |
Description: ELECTRICAL REJECTS OFFERED AS ME Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XQKU060-L1FFQA1517I | AMD |
Description: XQKU060-L1FFQA1517I Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU085-L1FLVA1517I4582 | AMD |
Description: XCKU085-L1FLVA1517I4582 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-L1FFVA1517I4612 | AMD |
Description: XCKU060-L1FFVA1517I4612 Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-2FLVA1517E3991 | AMD |
Description: XCKU115-2FLVA1517E3991 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XQKU060-L1FFQA1517I4980 | AMD |
Description: XQKU060-L1FFQA1517I4980 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU085-2FLVA1517E3991 | AMD |
Description: XCKU085-2FLVA1517E3991 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU085-1FLVA1517C5394 | AMD |
Description: XCKU085-1FLVA1517C5394 Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-1FFVA1517CES9873 | AMD |
Description: XCKU060-1FFVA1517CES9873 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU085-1FLVA1517C4555 | AMD |
Description: XCKU085-1FLVA1517C4555 Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-2FFVA1517E3991 | AMD |
Description: XCKU060-2FFVA1517E3991 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-2FLVA1517I5192 | AMD |
Description: XCKU115-2FLVA1517I5192 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU085-1FLVA1517CES9919 | AMD |
Description: XCKU085-1FLVA1517CES9919 Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-2FFVA1517I4187 | AMD |
Description: XCKU060-2FFVA1517I4187 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-1FLVA1517I0886 | AMD |
Description: XCKU115-1FLVA1517I0886 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-2FLVA1517I4504 | AMD |
Description: XCKU115-2FLVA1517I4504 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-2FLVA1517I4187 | AMD |
Description: XCKU115-2FLVA1517I4187 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-1FLVA1517CES9919 | AMD |
Description: ELECTRICAL REJECTS OFFERED AS ME Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-2FFVA1517I4880 | AMD |
Description: XCKU060-2FFVA1517I4880 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-2FFVA1517E4464 | AMD |
Description: XCKU060-2FFVA1517E4464 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-3FLVA1517E4915 | AMD |
Description: XCKU115-3FLVA1517E4915 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| 5962-9851301QZC | AMD |
Description: 13000 GATE 3.3 VOLT LOGIC CELL A Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| HW-USB-II-G-PRT | AMD |
Description: PLATFORM CABLE USB-II LEADFREE, Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XA9572XL-15TQG100I4011 | AMD |
Description: SCD4011. DELPHI BARCODE LABEL A Packaging: Tape & Reel (TR) Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||
| XA9572XL-15TQG100I4011 | AMD |
Description: SCD4011. DELPHI BARCODE LABEL A Packaging: Cut Tape (CT) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC95288XL-10TQ144I0962 | AMD |
Description: 3.3V 288-MC CPLD Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC95288XL-10PQ208I4307 | AMD |
Description: XC95288XL-10PQ208I4307 Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| BNDL-OD-GE-EMBDRTL | AMD |
Description: GOLD ACADEMY ENTERPRISE RTL & EM Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| BNDL-OD-GE-EMBD | AMD |
Description: GOLD ACADEMY ENTERPRISE EMBEDDED Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| BNDL-OD-SE-EMBDHW | AMD |
Description: SILVER ACADEMY ENTERPRISE EMBEDD Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| BNDL-OD-SE-EMBDSW | AMD |
Description: SILVER ACADEMY ENTERPRISE EMBEDD Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| BO-ISE-EMBD-DL-NL-XDB | AMD |
Description: XDB BILLING, ISE DESIGN SUITE: E Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
XCAU20P-1FFVB676I | AMD |
 Description: IC FPGA ARTIXUP 676FBGAPackaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 238437 Supplier Device Package: 676-FCBGA (27x27) Total RAM Bits: 3355443 Part Status: Active Number of I/O: 156 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCAU20P-2SFVB784I | AMD |
Description: IC FPGA ARTIXUP 784FBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 238437 Supplier Device Package: 784-FCBGA (23x23) Total RAM Bits: 3355443 Part Status: Active Number of I/O: 156 DigiKey Programmable: Not Verified |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
||
 |
XCAU20P-2FFVB676I | AMD |
Description: IC FPGA ARTIXUP 676FBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 238437 Supplier Device Package: 676-FCBGA (27x27) Total RAM Bits: 3355443 Part Status: Active Number of I/O: 156 DigiKey Programmable: Not Verified |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
|
||
 |
XA7A100T-1CSG324Q | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 101440 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 7925 Total RAM Bits: 4976640 Grade: Automotive Part Status: Active Number of I/O: 210 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
на замовлення 464 шт: термін постачання 21-31 дні (днів) |
|
||
| XCF04SVO20C0100 | AMD |
Description: IC PROM ISP 4MB 3.3V 20TSSOP DigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 20-TSSOP Voltage - Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Programmable Type: In System Programmable Memory Size: 4MB Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EK-U1-ZCU670-V2-G-J | AMD |
Description: ZYNQ US+ RFSOC ZCU670 V2 J EVK Utilized IC / Part: XCZU67DR Part Status: Active Platform: Zynq UltraScale+ RFSoC ZCU670 V2 Japan Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Type: FPGA + MCU/MPU SoC For Use With/Related Products: XCZU67DR Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
XCZU19EG-L2FFVB1517E | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCZU19EG-3FFVE1924E | AMD |
Description: IC SOC CORTEX-A53 1924FCBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1924-FCBGA (45x45) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 600MHz, 667MHz, 1.5GHz Package / Case: 1924-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
|
XCZU19EG-2FFVB1517E | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU19EG-1FFVB1517I | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCZU19EG-2FFVE1924I | AMD |
Description: IC SOC CORTEX-A53 1924FCBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1924-FCBGA (45x45) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1924-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVE1924E | AMD |
Description: IC SOC CORTEX-A53 1924FCBGA Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1924-BBGA, FCBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1924-FCBGA (45x45) |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
|
XCZU19EG-1FFVB1517E | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU19EG-2FFVB1517I | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCZU19EG-3FFVB1517E | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XC4VLX100-11FF1148C | AMD |
Description: IC FPGA 768 I/O 1148FCBGA Packaging: Tray Package / Case: 1148-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 110592 Supplier Device Package: 1148-FCPBGA (35x35) Number of LABs/CLBs: 12288 Total RAM Bits: 4423680 Part Status: Active Number of I/O: 768 DigiKey Programmable: Not Verified |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
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 |
XC7S100-1FGGA484C | AMD |
Description: IC FPGA 338 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 102400 Supplier Device Package: 484-FPBGA (23x23) Number of LABs/CLBs: 8000 Total RAM Bits: 4423680 Part Status: Active Number of I/O: 338 DigiKey Programmable: Not Verified |
на замовлення 87 шт: термін постачання 21-31 дні (днів) |
|
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| XCF02SVO20C0100 | AMD |
Description: IC PROM ISP 2MB 3.3V 20TSSOP Packaging: Tray Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Memory Size: 2MB Programmable Type: In System Programmable Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-TSSOP Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
| XA9572XL-15TQG100I4011 |
Виробник: AMD
Description: SCD4011. DELPHI BARCODE LABEL A
Packaging: Tape & Reel (TR)
Part Status: Active
Description: SCD4011. DELPHI BARCODE LABEL A
Packaging: Tape & Reel (TR)
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| XA9572XL-15TQG100I4011 |
Виробник: AMD
Description: SCD4011. DELPHI BARCODE LABEL A
Packaging: Cut Tape (CT)
Part Status: Active
Description: SCD4011. DELPHI BARCODE LABEL A
Packaging: Cut Tape (CT)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCAU20P-1FFVB676I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCAU20P-2SFVB784I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 784FBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 784FBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 36177.95 грн |
| XCAU20P-2FFVB676I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 35220.75 грн |
| XA7A100T-1CSG324Q |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 101440
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 7925
Total RAM Bits: 4976640
Grade: Automotive
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 101440
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 7925
Total RAM Bits: 4976640
Grade: Automotive
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 464 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 14827.31 грн |
| XCF04SVO20C0100 |
Виробник: AMD
Description: IC PROM ISP 4MB 3.3V 20TSSOP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Programmable Type: In System Programmable
Memory Size: 4MB
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tray
Description: IC PROM ISP 4MB 3.3V 20TSSOP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Programmable Type: In System Programmable
Memory Size: 4MB
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tray
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| EK-U1-ZCU670-V2-G-J |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU670 V2 J EVK
Utilized IC / Part: XCZU67DR
Part Status: Active
Platform: Zynq UltraScale+ RFSoC ZCU670 V2 Japan
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: XCZU67DR
Packaging: Box
Description: ZYNQ US+ RFSOC ZCU670 V2 J EVK
Utilized IC / Part: XCZU67DR
Part Status: Active
Platform: Zynq UltraScale+ RFSoC ZCU670 V2 Japan
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: XCZU67DR
Packaging: Box
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В кошику
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| XCZU19EG-L2FFVB1517E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU19EG-3FFVE1924E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1924FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1924-FCBGA (45x45)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 667MHz, 1.5GHz
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1924FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1924-FCBGA (45x45)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 667MHz, 1.5GHz
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU19EG-2FFVB1517E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU19EG-1FFVB1517I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU19EG-2FFVE1924I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1924FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1924-FCBGA (45x45)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1924FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1924-FCBGA (45x45)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-2FFVE1924E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1924FCBGA
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1924-FCBGA (45x45)
Description: IC SOC CORTEX-A53 1924FCBGA
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1924-FCBGA (45x45)
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В кошику
од. на суму грн.
| XCZU19EG-1FFVB1517E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
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В кошику
од. на суму грн.
| XCZU19EG-2FFVB1517I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU19EG-3FFVB1517E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 667MHz, 1.5GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Description: IC SOC CORTEX-A53 1517FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 667MHz, 1.5GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
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| XC4VLX100-11FF1148C |
|
Виробник: AMD
Description: IC FPGA 768 I/O 1148FCBGA
Packaging: Tray
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 12288
Total RAM Bits: 4423680
Part Status: Active
Number of I/O: 768
DigiKey Programmable: Not Verified
Description: IC FPGA 768 I/O 1148FCBGA
Packaging: Tray
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 12288
Total RAM Bits: 4423680
Part Status: Active
Number of I/O: 768
DigiKey Programmable: Not Verified
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 382307.49 грн |
| XC7S100-1FGGA484C |
|
Виробник: AMD
Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
на замовлення 87 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10932.79 грн |
| XCF02SVO20C0100 |
Виробник: AMD
Description: IC PROM ISP 2MB 3.3V 20TSSOP
Packaging: Tray
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC PROM ISP 2MB 3.3V 20TSSOP
Packaging: Tray
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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