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XC3195-3PQ160C XC3195-3PQ160C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 138
DigiKey Programmable: Not Verified
на замовлення 201 шт:
термін постачання 21-31 дні (днів)
12+1883.42 грн
Мінімальне замовлення: 12
В кошику  од. на суму  грн.
XC3195-3PC84C XC3195-3PC84C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 658 шт:
термін постачання 21-31 дні (днів)
10+2217.76 грн
Мінімальне замовлення: 10
В кошику  од. на суму  грн.
XC4VSX35-10FF668C AMD ds112 Description: IC FPGA 448 I/O 668FCBGA
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XC4VSX35-11FF668C AMD ds112 Description: IC FPGA 448 I/O 668FCBGA
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XC7Z012S-2CLG485E XC7Z012S-2CLG485E AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
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XC4VLX15-11FF676C XC4VLX15-11FF676C AMD ds112 Description: IC FPGA 320 I/O 676FCBGA
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XC5210-3PQ208C XC5210-3PQ208C AMD 1605200.pdf?t.download=true&u=ovmfp3 Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Part Status: Active
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XC4020XLA-09PQ208I XC4020XLA-09PQ208I AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 784 CLBS, 13000 GATES
Packaging: Bulk
Part Status: Active
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XC4013XL-3PQ208C XC4013XL-3PQ208C AMD 4000.pdf Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 13000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1368
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 576
Total RAM Bits: 18432
Part Status: Obsolete
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
4+5607.08 грн
Мінімальне замовлення: 4
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XC95288XV-7PQ208C XC95288XV-7PQ208C AMD LuSrx_iH3TbPJYzmW5yYRw Description: IC CPLD 288MC 7.5NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.37V ~ 2.62V
Part Status: Obsolete
Number of I/O: 168
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XC95288XL-6PQ208C XC95288XL-6PQ208C AMD GTHnyVMVaIJYQdBwKSx6iw Description: IC CPLD 288MC 6NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 168
DigiKey Programmable: Not Verified
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XCR3512XL-12PQ208C XCR3512XL-12PQ208C AMD ZhZgwxzXT7Ls73hot_MdtA Description: IC CPLD 512MC 10.8NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
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XCR3512XL-7PQ208C XCR3512XL-7PQ208C AMD ZhZgwxzXT7Ls73hot_MdtA Description: IC CPLD 512MC 7NSNS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
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XCR3512XL-10PQ208I XCR3512XL-10PQ208I AMD ZhZgwxzXT7Ls73hot_MdtA Description: IC CPLD 512MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
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XCR3512XL-10PQ208C XCR3512XL-10PQ208C AMD ZhZgwxzXT7Ls73hot_MdtA Description: IC CPLD 512MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
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XCR3512XL-12PQ208I XCR3512XL-12PQ208I AMD ZhZgwxzXT7Ls73hot_MdtA Description: IC CPLD 512MC 10.8NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
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XCZU3EG-1UBVA530I XCZU3EG-1UBVA530I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+44417.32 грн
В кошику  од. на суму  грн.
XCZU3EG-1UBVA530E XCZU3EG-1UBVA530E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+35589.40 грн
В кошику  од. на суму  грн.
XCZU3CG-2UBVA530I XCZU3CG-2UBVA530I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+48506.19 грн
В кошику  од. на суму  грн.
XCZU3EG-2UBVA530I XCZU3EG-2UBVA530I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+54681.67 грн
В кошику  од. на суму  грн.
XA7K160T-1FFG676Q AMD XA7K160T-1FFG676Q.pdf Description: FPGA KINTEX7 Q100 400 I/O 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 162240
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 12675
Total RAM Bits: 11980800
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+54520.92 грн
В кошику  од. на суму  грн.
XCAU10P-2SBVB484I XCAU10P-2SBVB484I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
1+15846.16 грн
В кошику  од. на суму  грн.
XCAU10P-1SBVB484E XCAU10P-1SBVB484E AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
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XCAU10P-1SBVB484I XCAU10P-1SBVB484I AMD ds890-ultrascale-overview Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
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XCVU11P-2FLGB2104I AMD ds923-virtex-ultrascale-plus Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 572
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XCVU11P-2FLGB2104E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 572
DigiKey Programmable: Not Verified
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XCKU11P-2FFVD900I XCKU11P-2FFVD900I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 408 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 408
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XCKU11P-2FFVA1156I AMD ds922-kintex-ultrascale-plus Description: IC FPGA 464 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 464
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XCVU11P-2FLGF1924I AMD ds923-virtex-ultrascale-plus Description: IC FPGA 624 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 624
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XCKU11P-2FFVD900E XCKU11P-2FFVD900E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 408 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 408
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XCVU11P-2FLGA2577E AMD ds923-virtex-ultrascale-plus Description: IC FPGA 448 I/O 2577FCBGA
Packaging: Tray
Package / Case: 2577-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2577-FCBGA (52.5x52.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 448
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XCKU11P-2FFVA1156E AMD ds922-kintex-ultrascale-plus Description: IC FPGA 464 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 464
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XCVU11P-2FLGC2104E AMD virtex-ultrascale-plus-product-brief.pdf Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 416
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XCAU25P-2SFVB784I XCAU25P-2SFVB784I AMD root Description: IC FPGA ARTIXUP 784FBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 4928307
Part Status: Active
Number of I/O: 304
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+47538.48 грн
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XCS20XL-4CS144C AMD ds060 Description: IC FPGA 113 I/O 144CSBGA
Packaging: Tray
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 20000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 950
Supplier Device Package: 144-LCSBGA (12x12)
Number of LABs/CLBs: 400
Total RAM Bits: 12800
Part Status: Obsolete
Number of I/O: 113
DigiKey Programmable: Not Verified
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XCVC1502-1LLIVSVA2197 XCVC1502-1LLIVSVA2197 AMD ds957-versal-ai-core.pdf Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
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XCVC1702-1LSIVSVA2197 XCVC1702-1LSIVSVA2197 AMD ds957-versal-ai-core.pdf Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
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XCVC1502-2LLEVSVA2197 XCVC1502-2LLEVSVA2197 AMD ds957-versal-ai-core.pdf Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
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XCVC1902-1MSEVSVA2197 XCVC1902-1MSEVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
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XCVC1902-2MLIVSVA2197 XCVC1902-2MLIVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSENSVF1369 XCVM1302-1MSENSVF1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-2LLEVSVD1760 XCVM1302-2LLEVSVD1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1402-2LLEVSVD1760 XCVM1402-2LLEVSVD1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MLIVSVD1760 XCVM1302-1MLIVSVD1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1LLIVFVC1596 XCVM1302-1LLIVFVC1596 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MLIVFVC1596 XCVM1302-1MLIVFVC1596 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1402-2MLINSVF1369 XCVM1402-2MLINSVF1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-2LSENBVB1024 XCVM1302-2LSENBVB1024 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1402-1MLIVSVD1760 XCVM1402-1MLIVSVD1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MLINSVF1369 XCVM1302-1MLINSVF1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSEVSVD1760 XCVM1302-1MSEVSVD1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MLINBVB1024 XCVM1302-1MLINBVB1024 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSEVFVC1596 XCVM1302-1MSEVFVC1596 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSIVSVD1760 XCVM1302-1MSIVSVD1760 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSINSVF1369 XCVM1302-1MSINSVF1369 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSINBVB1024 XCVM1302-1MSINBVB1024 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSENBVB1024 XCVM1302-1MSENBVB1024 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSIVFVC1596 XCVM1302-1MSIVFVC1596 AMD ds950-versal-overview Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
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EK-U1-VCU118-G-J AMD virtex-ultrascale-plus-product-brief.pdf Description: KIT VCU118 VIRTEX ULTRASCALE
Packaging: Bulk
For Use With/Related Products: XCVU9P
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale+ FPGA VCU118 Japan PCIe Card
Part Status: Active
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XC5202-5PC84C XC5202-5PC84C AMD 1605200.pdf?t.download=true&u=ovmfp3 Description: FPGA, 64 CLBS, 2000 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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XC3195-3PQ160C 1153000.pdf?t.download=true&u=ovmfp3
XC3195-3PQ160C
Виробник: AMD
Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 138
DigiKey Programmable: Not Verified
на замовлення 201 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
12+1883.42 грн
Мінімальне замовлення: 12
В кошику  од. на суму  грн.
XC3195-3PC84C 1153000.pdf?t.download=true&u=ovmfp3
XC3195-3PC84C
Виробник: AMD
Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 84-PLCC (29.31x29.31)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 658 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+2217.76 грн
Мінімальне замовлення: 10
В кошику  од. на суму  грн.
XC4VSX35-10FF668C ds112
Виробник: AMD
Description: IC FPGA 448 I/O 668FCBGA
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XC4VSX35-11FF668C ds112
Виробник: AMD
Description: IC FPGA 448 I/O 668FCBGA
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XC7Z012S-2CLG485E ds190-Zynq-7000-Overview
XC7Z012S-2CLG485E
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
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XC4VLX15-11FF676C ds112
XC4VLX15-11FF676C
Виробник: AMD
Description: IC FPGA 320 I/O 676FCBGA
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XC5210-3PQ208C 1605200.pdf?t.download=true&u=ovmfp3
XC5210-3PQ208C
Виробник: AMD
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Part Status: Active
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XC4020XLA-09PQ208I 4000.pdf?t.download=true&u=ovmfp3
XC4020XLA-09PQ208I
Виробник: AMD
Description: FPGA, 784 CLBS, 13000 GATES
Packaging: Bulk
Part Status: Active
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XC4013XL-3PQ208C 4000.pdf
XC4013XL-3PQ208C
Виробник: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 13000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1368
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 576
Total RAM Bits: 18432
Part Status: Obsolete
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+5607.08 грн
Мінімальне замовлення: 4
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XC95288XV-7PQ208C LuSrx_iH3TbPJYzmW5yYRw
XC95288XV-7PQ208C
Виробник: AMD
Description: IC CPLD 288MC 7.5NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.37V ~ 2.62V
Part Status: Obsolete
Number of I/O: 168
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XC95288XL-6PQ208C GTHnyVMVaIJYQdBwKSx6iw
XC95288XL-6PQ208C
Виробник: AMD
Description: IC CPLD 288MC 6NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 168
DigiKey Programmable: Not Verified
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XCR3512XL-12PQ208C ZhZgwxzXT7Ls73hot_MdtA
XCR3512XL-12PQ208C
Виробник: AMD
Description: IC CPLD 512MC 10.8NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
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XCR3512XL-7PQ208C ZhZgwxzXT7Ls73hot_MdtA
XCR3512XL-7PQ208C
Виробник: AMD
Description: IC CPLD 512MC 7NSNS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
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XCR3512XL-10PQ208I ZhZgwxzXT7Ls73hot_MdtA
XCR3512XL-10PQ208I
Виробник: AMD
Description: IC CPLD 512MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
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XCR3512XL-10PQ208C ZhZgwxzXT7Ls73hot_MdtA
XCR3512XL-10PQ208C
Виробник: AMD
Description: IC CPLD 512MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
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XCR3512XL-12PQ208I ZhZgwxzXT7Ls73hot_MdtA
XCR3512XL-12PQ208I
Виробник: AMD
Description: IC CPLD 512MC 10.8NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 12000
Number of Macrocells: 512
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 180
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XCZU3EG-1UBVA530I ds891-zynq-ultrascale-plus-overview
XCZU3EG-1UBVA530I
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+44417.32 грн
В кошику  од. на суму  грн.
XCZU3EG-1UBVA530E ds891-zynq-ultrascale-plus-overview
XCZU3EG-1UBVA530E
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+35589.40 грн
В кошику  од. на суму  грн.
XCZU3CG-2UBVA530I ds891-zynq-ultrascale-plus-overview
XCZU3CG-2UBVA530I
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+48506.19 грн
В кошику  од. на суму  грн.
XCZU3EG-2UBVA530I ds891-zynq-ultrascale-plus-overview
XCZU3EG-2UBVA530I
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+54681.67 грн
В кошику  од. на суму  грн.
XA7K160T-1FFG676Q XA7K160T-1FFG676Q.pdf
Виробник: AMD
Description: FPGA KINTEX7 Q100 400 I/O 676BGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 162240
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 12675
Total RAM Bits: 11980800
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+54520.92 грн
В кошику  од. на суму  грн.
XCAU10P-2SBVB484I ds890-ultrascale-overview
XCAU10P-2SBVB484I
Виробник: AMD
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+15846.16 грн
В кошику  од. на суму  грн.
XCAU10P-1SBVB484E ds890-ultrascale-overview
XCAU10P-1SBVB484E
Виробник: AMD
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
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XCAU10P-1SBVB484I ds890-ultrascale-overview
XCAU10P-1SBVB484I
Виробник: AMD
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 96250
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 5500
Total RAM Bits: 3670016
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
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XCVU11P-2FLGB2104I ds923-virtex-ultrascale-plus
Виробник: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 572
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XCVU11P-2FLGB2104E ds923-virtex-ultrascale-plus
Виробник: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 572
DigiKey Programmable: Not Verified
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XCKU11P-2FFVD900I ds922-kintex-ultrascale-plus
XCKU11P-2FFVD900I
Виробник: AMD
Description: IC FPGA 408 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 408
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XCKU11P-2FFVA1156I ds922-kintex-ultrascale-plus
Виробник: AMD
Description: IC FPGA 464 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 464
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XCVU11P-2FLGF1924I ds923-virtex-ultrascale-plus
Виробник: AMD
Description: IC FPGA 624 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 624
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XCKU11P-2FFVD900E ds922-kintex-ultrascale-plus
XCKU11P-2FFVD900E
Виробник: AMD
Description: IC FPGA 408 I/O 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 900-FCBGA (31x31)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 408
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XCVU11P-2FLGA2577E ds923-virtex-ultrascale-plus
Виробник: AMD
Description: IC FPGA 448 I/O 2577FCBGA
Packaging: Tray
Package / Case: 2577-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2577-FCBGA (52.5x52.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 448
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XCKU11P-2FFVA1156E ds922-kintex-ultrascale-plus
Виробник: AMD
Description: IC FPGA 464 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 653100
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 37320
Total RAM Bits: 53964800
Part Status: Active
Number of I/O: 464
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XCVU11P-2FLGC2104E virtex-ultrascale-plus-product-brief.pdf
Виробник: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Part Status: Active
Number of I/O: 416
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XCAU25P-2SFVB784I root
XCAU25P-2SFVB784I
Виробник: AMD
Description: IC FPGA ARTIXUP 784FBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 4928307
Part Status: Active
Number of I/O: 304
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+47538.48 грн
В кошику  од. на суму  грн.
XCS20XL-4CS144C ds060
Виробник: AMD
Description: IC FPGA 113 I/O 144CSBGA
Packaging: Tray
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 20000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 950
Supplier Device Package: 144-LCSBGA (12x12)
Number of LABs/CLBs: 400
Total RAM Bits: 12800
Part Status: Obsolete
Number of I/O: 113
DigiKey Programmable: Not Verified
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XCVC1502-1LLIVSVA2197 ds957-versal-ai-core.pdf
XCVC1502-1LLIVSVA2197
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
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XCVC1702-1LSIVSVA2197 ds957-versal-ai-core.pdf
XCVC1702-1LSIVSVA2197
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
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XCVC1502-2LLEVSVA2197 ds957-versal-ai-core.pdf
XCVC1502-2LLEVSVA2197
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
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XCVC1902-1MSEVSVA2197 ds950-versal-overview
XCVC1902-1MSEVSVA2197
Виробник: AMD
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
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XCVC1902-2MLIVSVA2197 ds950-versal-overview
XCVC1902-2MLIVSVA2197
Виробник: AMD
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSENSVF1369 ds950-versal-overview
XCVM1302-1MSENSVF1369
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-2LLEVSVD1760 ds950-versal-overview
XCVM1302-2LLEVSVD1760
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1402-2LLEVSVD1760 ds950-versal-overview
XCVM1402-2LLEVSVD1760
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MLIVSVD1760 ds950-versal-overview
XCVM1302-1MLIVSVD1760
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1LLIVFVC1596 ds950-versal-overview
XCVM1302-1LLIVFVC1596
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MLIVFVC1596 ds950-versal-overview
XCVM1302-1MLIVFVC1596
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1402-2MLINSVF1369 ds950-versal-overview
XCVM1402-2MLINSVF1369
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-2LSENBVB1024 ds950-versal-overview
XCVM1302-2LSENBVB1024
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1402-1MLIVSVD1760 ds950-versal-overview
XCVM1402-1MLIVSVD1760
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MLINSVF1369 ds950-versal-overview
XCVM1302-1MLINSVF1369
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSEVSVD1760 ds950-versal-overview
XCVM1302-1MSEVSVD1760
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MLINBVB1024 ds950-versal-overview
XCVM1302-1MLINBVB1024
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSEVFVC1596 ds950-versal-overview
XCVM1302-1MSEVFVC1596
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSIVSVD1760 ds950-versal-overview
XCVM1302-1MSIVSVD1760
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSINSVF1369 ds950-versal-overview
XCVM1302-1MSINSVF1369
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSINBVB1024 ds950-versal-overview
XCVM1302-1MSINBVB1024
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSENBVB1024 ds950-versal-overview
XCVM1302-1MSENBVB1024
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
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XCVM1302-1MSIVFVC1596 ds950-versal-overview
XCVM1302-1MSIVFVC1596
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
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EK-U1-VCU118-G-J virtex-ultrascale-plus-product-brief.pdf
Виробник: AMD
Description: KIT VCU118 VIRTEX ULTRASCALE
Packaging: Bulk
For Use With/Related Products: XCVU9P
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale+ FPGA VCU118 Japan PCIe Card
Part Status: Active
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XC5202-5PC84C 1605200.pdf?t.download=true&u=ovmfp3
XC5202-5PC84C
Виробник: AMD
Description: FPGA, 64 CLBS, 2000 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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