| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
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XCZU1EG-2SBVA484I | AMD |
 Description: IC ZUP MPSOC EG A53 FPGA 484BGAPackaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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EK-U1-ZCU670-V2-G | AMD |
Description: ZYNQ US+ RFSOC ZCU670 V2 EVK Utilized IC / Part: XCZU67DR Part Status: Active Platform: Zynq UltraScale+ RFSoC ZCU670 V2 Contents: Board(s), Cable(s), Power Supply, Accessories Type: FPGA + MCU/MPU SoC For Use With/Related Products: XCZU67DR Packaging: Box |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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XCKU035-1FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Part Status: Active Number of I/O: 312 DigiKey Programmable: Not Verified |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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HW-SMARTLYNQ-PLUS-G-J | AMD |
Description: SMARTLYNQ+ PLUS VERSAL NO PWR Packaging: Box Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
| HW-PSA01-SK-G | AMD |
Description: KV260 ACC POWER & ADAPTER ONLY Packaging: Box For Use With/Related Products: Kria KV260 Accessory Type: Adapter Utilized IC / Part: Kria KV260 |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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| HW-BACCP01-SK-G | AMD |
Description: KV260 BASIC ACC PAC W/PWR &ADAPT Packaging: Box For Use With/Related Products: Kria KV260 Accessory Type: Accessory Pack Utilized IC / Part: Kria KV260 |
на замовлення 208 шт: термін постачання 21-31 дні (днів) |
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| A-U280-P32G-PQ-G | AMD |
Description: BOARD DCAB SERVER U280 PASSIVE Cooling Type: Heat Sink Operating Temperature: 0°C ~ 45°C Interface: PCI Express Memory Size: 16GB Power (Watts): 225W Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XC5204-5PQ160C0280 | AMD |
Description: FPGA, 120 CLBS, 4000 GATES, 83MH Part Status: Active Packaging: Bulk Number of I/O: 124 Number of LABs/CLBs: 120 Supplier Device Package: 160-PQFP (28x28) Number of Logic Elements/Cells: 480 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 6000 Mounting Type: Surface Mount Package / Case: 160-BQFP |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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XA7A12T-1CPG238Q | AMD |
Description: IC FPGA 112 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 12800 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1000 Total RAM Bits: 737280 Part Status: Active Number of I/O: 112 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 8 шт В кошику од. на суму грн. | ||
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XA7A25T-1CPG238Q | AMD |
Description: IC FPGA 150 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 23360 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1825 Total RAM Bits: 1658880 Grade: Automotive Part Status: Active Number of I/O: 150 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 7 шт В кошику од. на суму грн. | ||
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XCZU47DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU42DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-L2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU42DR-L2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU47DR-L2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU57DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Architecture: MPU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq® UltraScale+™ RFSoC Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) Speed: 533MHz, 1.3GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU55DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Primary Attributes: Zynq® UltraScale+™ RFSoC Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) Speed: 533MHz, 1.3GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray Architecture: MPU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1402-2MLIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCVM1402-2LSEVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCVM1302-2HSINBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XCVM1302-1LSENSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 1369-BGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 600MHz, 1.3GHz Package / Case: 1369-BFBGA Packaging: Tray |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XCVM1802-2MSEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Architecture: MPU, FPGA Supplier Device Package: 1760-FCBGA (40x40) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 600MHz, 1.4GHz Package / Case: 1760-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1402-1LSIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Architecture: MPU, FPGA Supplier Device Package: 1760-FCBGA (40x40) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) Speed: 400MHz, 1GHz Package / Case: 1760-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-1FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-1MLIVSVA2197 | AMD |
Description: IC VERSAL AICORE FPGA 2197BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 2197-FCBGA (45x45) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 600MHz, 1.3GHz Package / Case: 2197-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU42DR-2FFVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-2FSVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1402-2MSINSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 1369-BGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) Speed: 600MHz, 1.4GHz Package / Case: 1369-BFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU42DR-1FFVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU46DR-1FFVH1760E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1760BGA Architecture: MCU, FPGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC6SLX16-N3CPG196I | AMD |
Description: IC FPGA 106 I/O 196CSBGA Packaging: Tray Package / Case: 196-TFBGA, CSBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 14579 Supplier Device Package: 196-CSPBGA (8x8) Number of LABs/CLBs: 1139 Total RAM Bits: 589824 Part Status: Active Number of I/O: 106 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 7 шт В кошику од. на суму грн. | ||
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HW-ADK-2-0-G | AMD |
Description: DEBUG KIT ALVEO ADK2 CARD Packaging: Box Type: Debugger Contents: Board(s) Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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XC6SLX75-2FG484I | AMD |
Description: IC FPGA 280 I/O 484FBGA DigiKey Programmable: Not Verified Number of I/O: 280 Total RAM Bits: 3170304 Number of LABs/CLBs: 5831 Supplier Device Package: 484-FBGA (23x23) Number of Logic Elements/Cells: 74637 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 484-BBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
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XC4028XLA-09HQ160C | AMD |
Description: FPGA, 1024 CLBS, 18000 GATES Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 129 DigiKey Programmable: Not Verified |
на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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| XC4028XL-2HQ160C | AMD |
Description: IC FPGA 129 I/O 160QFP Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 129 DigiKey Programmable: Not Verified |
на замовлення 106 шт: термін постачання 21-31 дні (днів) |
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| XC4036XL-2HQ160C | AMD |
Description: IC FPGA 129 I/O 160QFP Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 36000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 3078 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1296 Total RAM Bits: 41472 Number of I/O: 129 DigiKey Programmable: Not Verified |
на замовлення 172 шт: термін постачання 21-31 дні (днів) |
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 |
A-U55C-P00G-PQ-G | AMD |
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE LUTs: 1304k Cooling Type: Heat Sink Bandwidth: 460GB/s Operating Temperature: 0°C ~ 55°C Interface: PCI Express Memory Size: 16GB Power (Watts): 150W Packaging: Box |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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 |
XCZU1CG-2UBVA494I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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 |
XCZU1CG-1UBVA494I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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 |
XCZU1EG-2UBVA494I | AMD |
Description: IC ZUP MPSOC EG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
на замовлення 126 шт: термін постачання 21-31 дні (днів) |
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 |
XA7A15T-1CSG325Q | AMD |
Description: IC FPGA 150 I/O 324CSBGA DigiKey Programmable: Not Verified Number of I/O: 150 Grade: Automotive Total RAM Bits: 921600 Number of LABs/CLBs: 1300 Supplier Device Package: 324-CSPBGA (15x15) Number of Logic Elements/Cells: 16640 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 324-LFBGA, CSPBGA Packaging: Bulk Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 126 шт В кошику од. на суму грн. | ||
 |
XC3142-4TQ100C | AMD |
Description: FPGA, 144 CLBS, 3000 GATES DigiKey Programmable: Not Verified Number of I/O: 82 Total RAM Bits: 30784 Number of LABs/CLBs: 144 Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Cells: 144 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 3000 Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Bulk |
на замовлення 191 шт: термін постачання 21-31 дні (днів) |
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XC3142-3TQ100C | AMD |
Description: FPGA, 144 CLBS, 3000 GATES DigiKey Programmable: Not Verified Number of I/O: 82 Total RAM Bits: 30784 Number of LABs/CLBs: 144 Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Cells: 144 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 3000 Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Bulk |
на замовлення 903 шт: термін постачання 21-31 дні (днів) |
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XC3142-TQ144IPH | AMD |
Description: XC3142 - XC3000 SERIES FIELD PRO DigiKey Programmable: Not Verified Number of I/O: 96 Total RAM Bits: 30784 Number of LABs/CLBs: 144 Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Cells: 144 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 3000 Mounting Type: Surface Mount Package / Case: 144-LQFP Exposed Pad Packaging: Bulk |
на замовлення 440 шт: термін постачання 21-31 дні (днів) |
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XC3142-5TQ100C | AMD |
Description: FPGA, 144 CLBS, 3000 GATES DigiKey Programmable: Not Verified Number of I/O: 82 Total RAM Bits: 30784 Number of LABs/CLBs: 144 Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Cells: 144 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 3000 Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Bulk |
на замовлення 167 шт: термін постачання 21-31 дні (днів) |
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XC3142-PQ100CPH | AMD |
Description: XC3142 - XC3000 SERIES FIELD PRO DigiKey Programmable: Not Verified Number of I/O: 82 Total RAM Bits: 30784 Number of LABs/CLBs: 144 Supplier Device Package: 100-PQFP (20x14) Number of Logic Elements/Cells: 144 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 3000 Mounting Type: Surface Mount Package / Case: 100-BQFP Packaging: Bulk |
на замовлення 1941 шт: термін постачання 21-31 дні (днів) |
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XC3130-PG84CPH | AMD |
Description: XC3130 - XC3000 SERIES FIELD PRO Supplier Device Package: 84-CPGA (28x28) Number of Logic Elements/Cells: 100 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 2000 Mounting Type: Through Hole Package / Case: 84-BCPGA Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 74 Total RAM Bits: 22176 Number of LABs/CLBs: 100 |
на замовлення 213 шт: термін постачання 21-31 дні (днів) |
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| XC95144XV-7TQ144C | AMD |
Description: FLASH PLD, 7.5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC95144-10PQ160I4307 | AMD |
Description: FLASH PLD, 10NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
HW-IMX547M-SK-G | AMD |
Description: SONY IMX547 MONO CAMERA KRIA BD Utilized IC / Part: KR260 Part Status: Active Accessory Type: Camera For Use With/Related Products: KR260 Packaging: Box |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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HW-IMX547C-SK-G | AMD |
Description: SONY IMX547 COLOR CAMERA KRIA BD Utilized IC / Part: KR260 Accessory Type: Camera For Use With/Related Products: KR260 Packaging: Box Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| XC3195-PG175IPH | AMD |
Description: XC3195 - XC3000 SERIES FIELD PRO DigiKey Programmable: Not Verified Number of I/O: 144 Total RAM Bits: 94944 Number of LABs/CLBs: 484 Supplier Device Package: 175-CPGA (42.16x42.16) Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 175-BCPGA Packaging: Bulk |
на замовлення 329 шт: термін постачання 21-31 дні (днів) |
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XCKU035-3FBVA676E | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.970V ~ 1.030V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 312 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU035-2FBVA676E | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 312 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU035-L1FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.880V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 312 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCKU035-2SFVA784I | AMD |
Description: IC FPGA 468 I/O 784FCBGA Packaging: Bulk Package / Case: 784-BFBGA, FCCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 784-FCCSPBGA (23x23) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 468 DigiKey Programmable: Not Verified |
на замовлення 167 шт: термін постачання 21-31 дні (днів) |
|
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| XC4020E-2HQ240C | AMD |
Description: IC FPGA 193 I/O 240QFP |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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 |
XCKU115-1FLVD1924I | AMD |
Description: IC FPGA 832 I/O 1924FCBGA DigiKey Programmable: Not Verified Number of I/O: 832 Total RAM Bits: 77721600 Number of LABs/CLBs: 82920 Supplier Device Package: 1924-FCBGA (45x45) Number of Logic Elements/Cells: 1451100 Voltage - Supply: 0.922V ~ 0.979V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1924-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
| XCZU1EG-2SBVA484I |
|
Виробник: AMD
Description: IC ZUP MPSOC EG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC EG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 30260.02 грн |
| EK-U1-ZCU670-V2-G |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU670 V2 EVK
Utilized IC / Part: XCZU67DR
Part Status: Active
Platform: Zynq UltraScale+ RFSoC ZCU670 V2
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: XCZU67DR
Packaging: Box
Description: ZYNQ US+ RFSOC ZCU670 V2 EVK
Utilized IC / Part: XCZU67DR
Part Status: Active
Platform: Zynq UltraScale+ RFSoC ZCU670 V2
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: XCZU67DR
Packaging: Box
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1271489.04 грн |
| XCKU035-1FBVA676I |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Part Status: Active
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Part Status: Active
Number of I/O: 312
DigiKey Programmable: Not Verified
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 125519.89 грн |
| HW-SMARTLYNQ-PLUS-G-J |
|
Виробник: AMD
Description: SMARTLYNQ+ PLUS VERSAL NO PWR
Packaging: Box
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FPGA
Description: SMARTLYNQ+ PLUS VERSAL NO PWR
Packaging: Box
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FPGA
товару немає в наявності
В кошику
од. на суму грн.
| HW-PSA01-SK-G |
Виробник: AMD
Description: KV260 ACC POWER & ADAPTER ONLY
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Adapter
Utilized IC / Part: Kria KV260
Description: KV260 ACC POWER & ADAPTER ONLY
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Adapter
Utilized IC / Part: Kria KV260
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2185.01 грн |
| HW-BACCP01-SK-G |
Виробник: AMD
Description: KV260 BASIC ACC PAC W/PWR &ADAPT
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Accessory Pack
Utilized IC / Part: Kria KV260
Description: KV260 BASIC ACC PAC W/PWR &ADAPT
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Accessory Pack
Utilized IC / Part: Kria KV260
на замовлення 208 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5317.94 грн |
| A-U280-P32G-PQ-G |
|
Виробник: AMD
Description: BOARD DCAB SERVER U280 PASSIVE
Cooling Type: Heat Sink
Operating Temperature: 0°C ~ 45°C
Interface: PCI Express
Memory Size: 16GB
Power (Watts): 225W
Packaging: Box
Description: BOARD DCAB SERVER U280 PASSIVE
Cooling Type: Heat Sink
Operating Temperature: 0°C ~ 45°C
Interface: PCI Express
Memory Size: 16GB
Power (Watts): 225W
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.
| XC5204-5PQ160C0280 |
|
Виробник: AMD
Description: FPGA, 120 CLBS, 4000 GATES, 83MH
Part Status: Active
Packaging: Bulk
Number of I/O: 124
Number of LABs/CLBs: 120
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Cells: 480
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 6000
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Description: FPGA, 120 CLBS, 4000 GATES, 83MH
Part Status: Active
Packaging: Bulk
Number of I/O: 124
Number of LABs/CLBs: 120
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Cells: 480
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 6000
Mounting Type: Surface Mount
Package / Case: 160-BQFP
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 11+ | 1865.55 грн |
| XA7A12T-1CPG238Q |
|
Виробник: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 8 шт
В кошику
од. на суму грн.
| XA7A25T-1CPG238Q |
|
Виробник: AMD
Description: IC FPGA 150 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 150 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 7 шт
В кошику
од. на суму грн.
| XCZU47DR-L2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU42DR-L2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-L2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-L2FFVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU42DR-L2FFVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU47DR-L2FFVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU57DR-L2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MPU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 533MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MPU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 533MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU55DR-L2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 533MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Primary Attributes: Zynq® UltraScale+™ RFSoC
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 533MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1402-2MLIVSVD1760 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 730889.53 грн |
| XCVM1402-2LSEVFVC1596 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 605211.92 грн |
| XCVM1302-2HSINBVB1024 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 466852.58 грн |
| XCVM1302-1LSENSVF1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 1369-BGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.3GHz
Package / Case: 1369-BFBGA
Packaging: Tray
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 1369-BGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.3GHz
Package / Case: 1369-BFBGA
Packaging: Tray
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 310696.15 грн |
| XCVM1802-2MSEVSVD1760 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Architecture: MPU, FPGA
Supplier Device Package: 1760-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.4GHz
Package / Case: 1760-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AICORE FPGA 1760BGA
Architecture: MPU, FPGA
Supplier Device Package: 1760-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.4GHz
Package / Case: 1760-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1402-1LSIVSVD1760 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Architecture: MPU, FPGA
Supplier Device Package: 1760-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 400MHz, 1GHz
Package / Case: 1760-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Architecture: MPU, FPGA
Supplier Device Package: 1760-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 400MHz, 1GHz
Package / Case: 1760-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-1FFVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-1FSVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-1MLIVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.3GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AICORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.3GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU42DR-2FFVE1156E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-2FSVE1156E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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| XCVM1402-2MSINSVF1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 1369-BGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 600MHz, 1.4GHz
Package / Case: 1369-BFBGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 1369-BGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 600MHz, 1.4GHz
Package / Case: 1369-BFBGA
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В кошику
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| XCZU42DR-1FFVE1156E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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В кошику
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| XCZU46DR-1FFVH1760E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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В кошику
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| XC6SLX16-N3CPG196I |
|
Виробник: AMD
Description: IC FPGA 106 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 14579
Supplier Device Package: 196-CSPBGA (8x8)
Number of LABs/CLBs: 1139
Total RAM Bits: 589824
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 14579
Supplier Device Package: 196-CSPBGA (8x8)
Number of LABs/CLBs: 1139
Total RAM Bits: 589824
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 7 шт
В кошику
од. на суму грн.
| HW-ADK-2-0-G |
|
Виробник: AMD
Description: DEBUG KIT ALVEO ADK2 CARD
Packaging: Box
Type: Debugger
Contents: Board(s)
Part Status: Active
Description: DEBUG KIT ALVEO ADK2 CARD
Packaging: Box
Type: Debugger
Contents: Board(s)
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 33871.55 грн |
| XC6SLX75-2FG484I |
|
Виробник: AMD
Description: IC FPGA 280 I/O 484FBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 3170304
Number of LABs/CLBs: 5831
Supplier Device Package: 484-FBGA (23x23)
Number of Logic Elements/Cells: 74637
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA
Packaging: Tray
Description: IC FPGA 280 I/O 484FBGA
DigiKey Programmable: Not Verified
Number of I/O: 280
Total RAM Bits: 3170304
Number of LABs/CLBs: 5831
Supplier Device Package: 484-FBGA (23x23)
Number of Logic Elements/Cells: 74637
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC4028XLA-09HQ160C |
|
Виробник: AMD
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
на замовлення 72 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 3029.33 грн |
| XC4028XL-2HQ160C |
|
Виробник: AMD
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
на замовлення 106 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 6100.21 грн |
| XC4036XL-2HQ160C |
|
Виробник: AMD
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 36000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3078
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1296
Total RAM Bits: 41472
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 36000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3078
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1296
Total RAM Bits: 41472
Number of I/O: 129
DigiKey Programmable: Not Verified
на замовлення 172 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 7221.52 грн |
| A-U55C-P00G-PQ-G |
|
Виробник: AMD
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE
LUTs: 1304k
Cooling Type: Heat Sink
Bandwidth: 460GB/s
Operating Temperature: 0°C ~ 55°C
Interface: PCI Express
Memory Size: 16GB
Power (Watts): 150W
Packaging: Box
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE
LUTs: 1304k
Cooling Type: Heat Sink
Bandwidth: 460GB/s
Operating Temperature: 0°C ~ 55°C
Interface: PCI Express
Memory Size: 16GB
Power (Watts): 150W
Packaging: Box
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 402461.22 грн |
| XCZU1CG-2UBVA494I |
|
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 25872.21 грн |
| XCZU1CG-1UBVA494I |
|
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 21405.54 грн |
| XCZU1EG-2UBVA494I |
|
Виробник: AMD
Description: IC ZUP MPSOC EG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC EG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 126 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 28767.78 грн |
| XA7A15T-1CSG325Q |
|
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 150
Grade: Automotive
Total RAM Bits: 921600
Number of LABs/CLBs: 1300
Supplier Device Package: 324-CSPBGA (15x15)
Number of Logic Elements/Cells: 16640
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 324-LFBGA, CSPBGA
Packaging: Bulk
Qualification: AEC-Q100
Description: IC FPGA 150 I/O 324CSBGA
DigiKey Programmable: Not Verified
Number of I/O: 150
Grade: Automotive
Total RAM Bits: 921600
Number of LABs/CLBs: 1300
Supplier Device Package: 324-CSPBGA (15x15)
Number of Logic Elements/Cells: 16640
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 324-LFBGA, CSPBGA
Packaging: Bulk
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 126 шт
В кошику
од. на суму грн.
| XC3142-4TQ100C |
|
Виробник: AMD
Description: FPGA, 144 CLBS, 3000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 82
Total RAM Bits: 30784
Number of LABs/CLBs: 144
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Cells: 144
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 3000
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
Description: FPGA, 144 CLBS, 3000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 82
Total RAM Bits: 30784
Number of LABs/CLBs: 144
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Cells: 144
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 3000
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
на замовлення 191 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 26+ | 806.55 грн |
| XC3142-3TQ100C |
|
Виробник: AMD
Description: FPGA, 144 CLBS, 3000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 82
Total RAM Bits: 30784
Number of LABs/CLBs: 144
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Cells: 144
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 3000
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
Description: FPGA, 144 CLBS, 3000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 82
Total RAM Bits: 30784
Number of LABs/CLBs: 144
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Cells: 144
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 3000
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
на замовлення 903 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 13+ | 1717.24 грн |
| XC3142-TQ144IPH |
|
Виробник: AMD
Description: XC3142 - XC3000 SERIES FIELD PRO
DigiKey Programmable: Not Verified
Number of I/O: 96
Total RAM Bits: 30784
Number of LABs/CLBs: 144
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 144
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 3000
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Bulk
Description: XC3142 - XC3000 SERIES FIELD PRO
DigiKey Programmable: Not Verified
Number of I/O: 96
Total RAM Bits: 30784
Number of LABs/CLBs: 144
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 144
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 3000
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Bulk
на замовлення 440 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 23+ | 932.02 грн |
| XC3142-5TQ100C |
|
Виробник: AMD
Description: FPGA, 144 CLBS, 3000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 82
Total RAM Bits: 30784
Number of LABs/CLBs: 144
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Cells: 144
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 3000
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
Description: FPGA, 144 CLBS, 3000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 82
Total RAM Bits: 30784
Number of LABs/CLBs: 144
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Cells: 144
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 3000
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Bulk
на замовлення 167 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 30+ | 691.43 грн |
| XC3142-PQ100CPH |
|
Виробник: AMD
Description: XC3142 - XC3000 SERIES FIELD PRO
DigiKey Programmable: Not Verified
Number of I/O: 82
Total RAM Bits: 30784
Number of LABs/CLBs: 144
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Cells: 144
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 3000
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
Description: XC3142 - XC3000 SERIES FIELD PRO
DigiKey Programmable: Not Verified
Number of I/O: 82
Total RAM Bits: 30784
Number of LABs/CLBs: 144
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Cells: 144
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 3000
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
на замовлення 1941 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 18+ | 1165.01 грн |
| XC3130-PG84CPH |
|
Виробник: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Supplier Device Package: 84-CPGA (28x28)
Number of Logic Elements/Cells: 100
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 2000
Mounting Type: Through Hole
Package / Case: 84-BCPGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 74
Total RAM Bits: 22176
Number of LABs/CLBs: 100
Description: XC3130 - XC3000 SERIES FIELD PRO
Supplier Device Package: 84-CPGA (28x28)
Number of Logic Elements/Cells: 100
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 2000
Mounting Type: Through Hole
Package / Case: 84-BCPGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 74
Total RAM Bits: 22176
Number of LABs/CLBs: 100
на замовлення 213 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 15+ | 1355.90 грн |
| XC95144XV-7TQ144C |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC95144-10PQ160I4307 |
|
Виробник: AMD
Description: FLASH PLD, 10NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 10NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| HW-IMX547M-SK-G |
|
Виробник: AMD
Description: SONY IMX547 MONO CAMERA KRIA BD
Utilized IC / Part: KR260
Part Status: Active
Accessory Type: Camera
For Use With/Related Products: KR260
Packaging: Box
Description: SONY IMX547 MONO CAMERA KRIA BD
Utilized IC / Part: KR260
Part Status: Active
Accessory Type: Camera
For Use With/Related Products: KR260
Packaging: Box
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 33904.80 грн |
| HW-IMX547C-SK-G |
|
Виробник: AMD
Description: SONY IMX547 COLOR CAMERA KRIA BD
Utilized IC / Part: KR260
Accessory Type: Camera
For Use With/Related Products: KR260
Packaging: Box
Part Status: Active
Description: SONY IMX547 COLOR CAMERA KRIA BD
Utilized IC / Part: KR260
Accessory Type: Camera
For Use With/Related Products: KR260
Packaging: Box
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 33948.09 грн |
| XC3195-PG175IPH |
|
Виробник: AMD
Description: XC3195 - XC3000 SERIES FIELD PRO
DigiKey Programmable: Not Verified
Number of I/O: 144
Total RAM Bits: 94944
Number of LABs/CLBs: 484
Supplier Device Package: 175-CPGA (42.16x42.16)
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Through Hole
Package / Case: 175-BCPGA
Packaging: Bulk
Description: XC3195 - XC3000 SERIES FIELD PRO
DigiKey Programmable: Not Verified
Number of I/O: 144
Total RAM Bits: 94944
Number of LABs/CLBs: 484
Supplier Device Package: 175-CPGA (42.16x42.16)
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Through Hole
Package / Case: 175-BCPGA
Packaging: Bulk
на замовлення 329 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2460.78 грн |
| XCKU035-3FBVA676E |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU035-2FBVA676E |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU035-L1FBVA676I |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU035-2SFVA784I |
|
Виробник: AMD
Description: IC FPGA 468 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 784-FCCSPBGA (23x23)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 468
DigiKey Programmable: Not Verified
Description: IC FPGA 468 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 784-FCCSPBGA (23x23)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 468
DigiKey Programmable: Not Verified
на замовлення 167 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 157748.42 грн |
| XC4020E-2HQ240C |
|
Виробник: AMD
Description: IC FPGA 193 I/O 240QFP
Description: IC FPGA 193 I/O 240QFP
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 36603.20 грн |
| XCKU115-1FLVD1924I |
|
Виробник: AMD
Description: IC FPGA 832 I/O 1924FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 832
Total RAM Bits: 77721600
Number of LABs/CLBs: 82920
Supplier Device Package: 1924-FCBGA (45x45)
Number of Logic Elements/Cells: 1451100
Voltage - Supply: 0.922V ~ 0.979V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 832 I/O 1924FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 832
Total RAM Bits: 77721600
Number of LABs/CLBs: 82920
Supplier Device Package: 1924-FCBGA (45x45)
Number of Logic Elements/Cells: 1451100
Voltage - Supply: 0.922V ~ 0.979V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.