| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|
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XC95144XL-10TQ144C | AMD |
Description: IC CPLD 144MC 10NS 144TQFPNumber of I/O: 117 Part Status: Active Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 8 Supplier Device Package: 144-TQFP (20x20) Delay Time tpd(1) Max: 10 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 144 Number of Gates: 3200 Programmable Type: In System Programmable (min 10K program/erase cycles) Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 120 шт В кошику од. на суму грн. | ||
| XC95144XL-5CS144C | AMD |
Description: IC CPLD 144MC 5NS 144LCSBGADelay Time tpd(1) Max: 5 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 144 Number of Gates: 3200 Programmable Type: In System Programmable (min 10K program/erase cycles) Mounting Type: Surface Mount Package / Case: 144-TFBGA, CSPBGA Packaging: Bulk Supplier Device Package: 144-LCSBGA (12x12) Number of I/O: 117 Part Status: Active Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 198 шт В кошику од. на суму грн. | |||
|
XC95144XL-10TQ100C | AMD |
Description: IC CPLD 144MC 10NS 100TQFPNumber of I/O: 81 Part Status: Active Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 8 Supplier Device Package: 100-TQFP (14x14) Delay Time tpd(1) Max: 10 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 144 Number of Gates: 3200 Programmable Type: In System Programmable (min 10K program/erase cycles) Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
| XC95144XL-10CS144C | AMD |
Description: IC CPLD 144MC 10NS 144LCSBGAPackaging: Bulk Package / Case: 144-TFBGA, CSPBGA Mounting Type: Surface Mount Programmable Type: In System Programmable (min 10K program/erase cycles) Number of Gates: 3200 Number of Macrocells: 144 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 144-LCSBGA (12x12) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 3V ~ 3.6V Part Status: Active Number of I/O: 117 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 198 шт В кошику од. на суму грн. | |||
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XCVC1802-1MSIVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-1MSIVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-2LSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-2MSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-2MSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-2MLEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-2LSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-1MSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-2MLEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-1LSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-1MLIVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-1LSIVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAPackaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
EK-S7-SP701-G-J | AMD |
Description: SPARTAN7 SP701 FPGA KIT NO PSPackaging: Box For Use With/Related Products: XC7S100 Type: FPGA Contents: Board(s), Cable(s) - Power Supply Not Included - Utilized IC / Part: XC7S100 Platform: Spartan-7 FPGA SP701 Japan |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCZU19EG-L2FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCZU17EG-2FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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| XCZU19EG-3FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-1FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
XCZU11EG-1FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCZU19EG-1FFVC1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVC1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
XC3130-5PC68C | AMD |
Description: FPGA, 100 CLBS, 2K GATESPackaging: Bulk Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Number of Gates: 2000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 100 Supplier Device Package: 68-PLCC (24.23x24.23) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 124 шт: термін постачання 21-31 дні (днів) |
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SK-KR260-G-ED | AMD |
Description: KRIA KR260 ROBOTIC START KIT EDUtilized IC / Part: SM-K26, XCK26 Part Status: Active Platform: Kria KR260 Robotics Starter Encryption Disabled Contents: Board(s), Cable(s), Power Supply, Accessories Type: FPGA + MCU/MPU SoC For Use With/Related Products: SM-K26, XCK26 Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
XA7A25T-1CSG325Q | AMD |
Description: IC FPGA 150 I/O 324CSBGAQualification: AEC-Q100 DigiKey Programmable: Not Verified Number of I/O: 150 Grade: Automotive Total RAM Bits: 1658880 Number of LABs/CLBs: 1825 Supplier Device Package: 324-CSPBGA (15x15) Number of Logic Elements/Cells: 23360 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 324-LFBGA, CSPBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 5 шт В кошику од. на суму грн. | ||
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XC4085XLA-09BGG352C | AMD |
Description: FPGA, 3136 CLBS, 55000 GATESDigiKey Programmable: Not Verified Number of LABs/CLBs: 3136 Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 55000 Mounting Type: Surface Mount Packaging: Bulk |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XC4085XLA-09BG352I | AMD |
Description: FPGA, 3136 CLBS, 55000 GATESDigiKey Programmable: Not Verified Number of LABs/CLBs: 3136 Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 55000 Mounting Type: Surface Mount Packaging: Bulk |
на замовлення 132 шт: термін постачання 21-31 дні (днів) |
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XC4085XLA-08HQ160I | AMD |
Description: FPGA, 3136 CLBS, 55000 GATESDigiKey Programmable: Not Verified Number of LABs/CLBs: 3136 Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 55000 Mounting Type: Surface Mount Packaging: Bulk |
на замовлення 68 шт: термін постачання 21-31 дні (днів) |
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XC4085XLA-09HQ208C | AMD |
Description: FPGA, 3136 CLBS, 55000 GATESDigiKey Programmable: Not Verified Number of LABs/CLBs: 3136 Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 55000 Mounting Type: Surface Mount Packaging: Bulk |
на замовлення 139 шт: термін постачання 21-31 дні (днів) |
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XC3130-PQ100CPH | AMD |
Description: XC3130 - XC3000 SERIES FIELD PRONumber of Logic Elements/Cells: 100 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 2000 Mounting Type: Surface Mount Package / Case: 100-BQFP Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 80 Total RAM Bits: 22176 Number of LABs/CLBs: 100 Supplier Device Package: 100-PQFP (20x14) |
на замовлення 255 шт: термін постачання 21-31 дні (днів) |
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| XCS20XL-5VQG100C | AMD |
Description: FPGA, 400 CLBS, 7000 GATES Number of I/O: 77 Part Status: Active Total RAM Bits: 12800 Number of LABs/CLBs: 400 Supplier Device Package: 100-VQFP (14x14) Number of Logic Elements/Cells: 950 Voltage - Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 7000 Mounting Type: Surface Mount Package / Case: 100-TQFP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCVC1902-1LSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAArchitecture: MPU, FPGA Supplier Device Package: 1596-FCBGA (40x40) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 400MHz, 1GHz Package / Case: 1596-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-2MSIVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGAArchitecture: MPU, FPGA Supplier Device Package: 1596-FCBGA (40x40) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 600MHz, 1.4GHz Package / Case: 1596-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2CG-2UBVA530E | AMD |
Description: IC SOC CORTEX-A53 530BGAArchitecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.3GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2EG-2UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGAPart Status: Active Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.3GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2EG-1UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGAPart Status: Active Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-1UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGAPart Status: Active Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-2UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGAArchitecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.3GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XC4006E-4PQ208C | AMD |
Description: IC FPGA 128 I/O 208QFPPackaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 6000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 608 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 256 Total RAM Bits: 8192 Part Status: Obsolete Number of I/O: 128 DigiKey Programmable: Not Verified |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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XC7Z020-2CLG400E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGAArchitecture: MCU, FPGA Supplier Device Package: 400-CSPBGA (17x17) Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 766MHz Package / Case: 400-LFBGA, CSPBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
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SK-KR260-G | AMD |
Description: KRIA KR260 ROBOTIC START KITPackaging: Box For Use With/Related Products: SM-K26, XCK26 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: SM-K26, XCK26 Platform: Kria KR260 Robotics Starter Part Status: Active |
на замовлення 574 шт: термін постачання 21-31 дні (днів) |
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XCZU1CG-1SBVA484I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 484BGAPackaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active |
на замовлення 53 шт: термін постачання 21-31 дні (днів) |
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XCZU1CG-1SFVA625I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 635BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU1CG-2SBVA484I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 484BGAPackaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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XCZU1EG-2SBVA484I | AMD |
Description: IC ZUP MPSOC EG A53 FPGA 484BGAPackaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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EK-U1-ZCU670-V2-G | AMD |
Description: ZYNQ US+ RFSOC ZCU670 V2 EVKUtilized IC / Part: XCZU67DR Part Status: Active Platform: Zynq UltraScale+ RFSoC ZCU670 V2 Contents: Board(s), Cable(s), Power Supply, Accessories Type: FPGA + MCU/MPU SoC For Use With/Related Products: XCZU67DR Packaging: Box |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XCKU035-1FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGAPackaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Part Status: Active Number of I/O: 312 DigiKey Programmable: Not Verified |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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HW-SMARTLYNQ-PLUS-G-J | AMD |
Description: SMARTLYNQ+ PLUS VERSAL NO PWRPackaging: Box Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
| HW-PSA01-SK-G | AMD |
Description: KV260 ACC POWER & ADAPTER ONLY Packaging: Box For Use With/Related Products: Kria KV260 Accessory Type: Adapter Utilized IC / Part: Kria KV260 |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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| HW-BACCP01-SK-G | AMD |
Description: KV260 BASIC ACC PAC W/PWR &ADAPT Packaging: Box For Use With/Related Products: Kria KV260 Accessory Type: Accessory Pack Utilized IC / Part: Kria KV260 |
на замовлення 131 шт: термін постачання 21-31 дні (днів) |
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| A-U280-P32G-PQ-G | AMD |
Description: BOARD DCAB SERVER U280 PASSIVECooling Type: Heat Sink Operating Temperature: 0°C ~ 45°C Interface: PCI Express Memory Size: 16GB Power (Watts): 225W Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XC5204-5PQ160C0280 | AMD |
Description: FPGA, 120 CLBS, 4000 GATES, 83MHPart Status: Active Packaging: Bulk Number of I/O: 124 Number of LABs/CLBs: 120 Supplier Device Package: 160-PQFP (28x28) Number of Logic Elements/Cells: 480 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 6000 Mounting Type: Surface Mount Package / Case: 160-BQFP |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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XA7A12T-1CPG238Q | AMD |
Description: IC FPGA 112 I/O 238CSBGAPackaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 12800 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1000 Total RAM Bits: 737280 Part Status: Active Number of I/O: 112 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 8 шт В кошику од. на суму грн. | ||
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XA7A25T-1CPG238Q | AMD |
Description: IC FPGA 150 I/O 238CSBGAPackaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 23360 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1825 Total RAM Bits: 1658880 Grade: Automotive Part Status: Active Number of I/O: 150 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 7 шт В кошику од. на суму грн. | ||
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XCZU47DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGAArchitecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU42DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGAArchitecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGAArchitecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
| XC95144XL-10TQ144C |
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Виробник: AMD
Description: IC CPLD 144MC 10NS 144TQFP
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-TQFP (20x20)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 10NS 144TQFP
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-TQFP (20x20)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 120 шт
В кошику
од. на суму грн.
| XC95144XL-5CS144C |
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Виробник: AMD
Description: IC CPLD 144MC 5NS 144LCSBGA
Delay Time tpd(1) Max: 5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
Supplier Device Package: 144-LCSBGA (12x12)
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 5NS 144LCSBGA
Delay Time tpd(1) Max: 5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
Supplier Device Package: 144-LCSBGA (12x12)
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 198 шт
В кошику
од. на суму грн.
| XC95144XL-10TQ100C |
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Виробник: AMD
Description: IC CPLD 144MC 10NS 100TQFP
Number of I/O: 81
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 100-TQFP (14x14)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 10NS 100TQFP
Number of I/O: 81
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 100-TQFP (14x14)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| XC95144XL-10CS144C |
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Виробник: AMD
Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 198 шт
В кошику
од. на суму грн.
| XCVC1802-1MSIVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1902-1MSIVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1902-2LSEVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-2MSEVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1902-2MSEVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1902-2MLEVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-2LSEVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1902-1MSEVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-2MLEVIVA1596 |
![]() |
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-1LSEVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-1MLIVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-1LSIVIVA1596 |
![]() |
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| EK-S7-SP701-G-J |
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Виробник: AMD
Description: SPARTAN7 SP701 FPGA KIT NO PS
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Utilized IC / Part: XC7S100
Platform: Spartan-7 FPGA SP701 Japan
Description: SPARTAN7 SP701 FPGA KIT NO PS
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Utilized IC / Part: XC7S100
Platform: Spartan-7 FPGA SP701 Japan
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-L2FFVC1760E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-2FFVC1760E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 702308.10 грн |
| XCZU17EG-2FFVC1760E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 550690.44 грн |
| XCZU19EG-3FFVC1760E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-1FFVC1760E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU11EG-1FFVC1760E |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-1FFVC1760I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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| XCZU19EG-2FFVC1760I |
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Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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| XC3130-5PC68C |
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Виробник: AMD
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 124 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 38+ | 537.93 грн |
| SK-KR260-G-ED |
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Виробник: AMD
Description: KRIA KR260 ROBOTIC START KIT ED
Utilized IC / Part: SM-K26, XCK26
Part Status: Active
Platform: Kria KR260 Robotics Starter Encryption Disabled
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: SM-K26, XCK26
Packaging: Box
Description: KRIA KR260 ROBOTIC START KIT ED
Utilized IC / Part: SM-K26, XCK26
Part Status: Active
Platform: Kria KR260 Robotics Starter Encryption Disabled
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: SM-K26, XCK26
Packaging: Box
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| XA7A25T-1CSG325Q |
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Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 150
Grade: Automotive
Total RAM Bits: 1658880
Number of LABs/CLBs: 1825
Supplier Device Package: 324-CSPBGA (15x15)
Number of Logic Elements/Cells: 23360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 324-LFBGA, CSPBGA
Packaging: Tray
Description: IC FPGA 150 I/O 324CSBGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 150
Grade: Automotive
Total RAM Bits: 1658880
Number of LABs/CLBs: 1825
Supplier Device Package: 324-CSPBGA (15x15)
Number of Logic Elements/Cells: 23360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 324-LFBGA, CSPBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 5 шт
В кошику
од. на суму грн.
| XC4085XLA-09BGG352C |
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Виробник: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 31297.61 грн |
| XC4085XLA-09BG352I |
![]() |
Виробник: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
на замовлення 132 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 40714.03 грн |
| XC4085XLA-08HQ160I |
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Виробник: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
на замовлення 68 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 43224.39 грн |
| XC4085XLA-09HQ208C |
![]() |
Виробник: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
на замовлення 139 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 9506.08 грн |
| XC3130-PQ100CPH |
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Виробник: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Number of Logic Elements/Cells: 100
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 2000
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 80
Total RAM Bits: 22176
Number of LABs/CLBs: 100
Supplier Device Package: 100-PQFP (20x14)
Description: XC3130 - XC3000 SERIES FIELD PRO
Number of Logic Elements/Cells: 100
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 2000
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 80
Total RAM Bits: 22176
Number of LABs/CLBs: 100
Supplier Device Package: 100-PQFP (20x14)
на замовлення 255 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 34+ | 656.55 грн |
| XCS20XL-5VQG100C |
Виробник: AMD
Description: FPGA, 400 CLBS, 7000 GATES
Number of I/O: 77
Part Status: Active
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 7000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Bulk
Description: FPGA, 400 CLBS, 7000 GATES
Number of I/O: 77
Part Status: Active
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 7000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Bulk
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В кошику
од. на суму грн.
| XCVC1902-1LSEVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 400MHz, 1GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 400MHz, 1GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCVC1802-2MSIVIVA1596 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.4GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.4GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU2CG-2UBVA530E |
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Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-2UBVA530I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-1UBVA530I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 31472.46 грн |
| XCZU2CG-1UBVA530I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 26227.05 грн |
| XCZU2CG-2UBVA530I |
![]() |
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 30208.18 грн |
| XC4006E-4PQ208C |
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Виробник: AMD
Description: IC FPGA 128 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 608
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 256
Total RAM Bits: 8192
Part Status: Obsolete
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC FPGA 128 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 608
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 256
Total RAM Bits: 8192
Part Status: Obsolete
Number of I/O: 128
DigiKey Programmable: Not Verified
на замовлення 54 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 4931.95 грн |
| XC7Z020-2CLG400E |
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Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| SK-KR260-G |
![]() |
Виробник: AMD
Description: KRIA KR260 ROBOTIC START KIT
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KR260 Robotics Starter
Part Status: Active
Description: KRIA KR260 ROBOTIC START KIT
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KR260 Robotics Starter
Part Status: Active
на замовлення 574 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 29213.69 грн |
| XCZU1CG-1SBVA484I |
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Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 53 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 20673.08 грн |
| XCZU1CG-1SFVA625I |
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Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 635BGA
Description: IC ZUP MPSOC CG A53 FPGA 635BGA
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| XCZU1CG-2SBVA484I |
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Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 31163.90 грн |
| XCZU1EG-2SBVA484I |
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Виробник: AMD
Description: IC ZUP MPSOC EG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC EG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 30963.74 грн |
| EK-U1-ZCU670-V2-G |
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Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU670 V2 EVK
Utilized IC / Part: XCZU67DR
Part Status: Active
Platform: Zynq UltraScale+ RFSoC ZCU670 V2
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: XCZU67DR
Packaging: Box
Description: ZYNQ US+ RFSOC ZCU670 V2 EVK
Utilized IC / Part: XCZU67DR
Part Status: Active
Platform: Zynq UltraScale+ RFSoC ZCU670 V2
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: XCZU67DR
Packaging: Box
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1403421.58 грн |
| XCKU035-1FBVA676I |
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Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Part Status: Active
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Part Status: Active
Number of I/O: 312
DigiKey Programmable: Not Verified
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 128438.95 грн |
| HW-SMARTLYNQ-PLUS-G-J |
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Виробник: AMD
Description: SMARTLYNQ+ PLUS VERSAL NO PWR
Packaging: Box
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FPGA
Description: SMARTLYNQ+ PLUS VERSAL NO PWR
Packaging: Box
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: FPGA
товару немає в наявності
В кошику
од. на суму грн.
| HW-PSA01-SK-G |
Виробник: AMD
Description: KV260 ACC POWER & ADAPTER ONLY
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Adapter
Utilized IC / Part: Kria KV260
Description: KV260 ACC POWER & ADAPTER ONLY
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Adapter
Utilized IC / Part: Kria KV260
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 2235.83 грн |
| HW-BACCP01-SK-G |
Виробник: AMD
Description: KV260 BASIC ACC PAC W/PWR &ADAPT
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Accessory Pack
Utilized IC / Part: Kria KV260
Description: KV260 BASIC ACC PAC W/PWR &ADAPT
Packaging: Box
For Use With/Related Products: Kria KV260
Accessory Type: Accessory Pack
Utilized IC / Part: Kria KV260
на замовлення 131 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 5276.26 грн |
| A-U280-P32G-PQ-G |
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Виробник: AMD
Description: BOARD DCAB SERVER U280 PASSIVE
Cooling Type: Heat Sink
Operating Temperature: 0°C ~ 45°C
Interface: PCI Express
Memory Size: 16GB
Power (Watts): 225W
Packaging: Box
Description: BOARD DCAB SERVER U280 PASSIVE
Cooling Type: Heat Sink
Operating Temperature: 0°C ~ 45°C
Interface: PCI Express
Memory Size: 16GB
Power (Watts): 225W
Packaging: Box
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| XC5204-5PQ160C0280 |
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Виробник: AMD
Description: FPGA, 120 CLBS, 4000 GATES, 83MH
Part Status: Active
Packaging: Bulk
Number of I/O: 124
Number of LABs/CLBs: 120
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Cells: 480
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 6000
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Description: FPGA, 120 CLBS, 4000 GATES, 83MH
Part Status: Active
Packaging: Bulk
Number of I/O: 124
Number of LABs/CLBs: 120
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Cells: 480
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 6000
Mounting Type: Surface Mount
Package / Case: 160-BQFP
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 11+ | 1908.93 грн |
| XA7A12T-1CPG238Q |
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Виробник: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 8 шт
В кошику
од. на суму грн.
| XA7A25T-1CPG238Q |
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Виробник: AMD
Description: IC FPGA 150 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 150 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 7 шт
В кошику
од. на суму грн.
| XCZU47DR-L2FSVE1156I |
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Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU42DR-L2FSVE1156I |
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Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-L2FSVE1156I |
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Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
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од. на суму грн.





















