| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
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XQ18V04VQ44N | AMD |
 Description: IC CONFIG PROM 4MBIT 44TQFPPart Status: Obsolete Supplier Device Package: 44-VQFP (10x10) Voltage - Supply: 3V ~ 3.6V Operating Temperature: -55°C ~ 125°C Programmable Type: In System Programmable Memory Size: 4MB Mounting Type: Surface Mount Package / Case: 44-TQFP Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| A-U280-A32G-DEV-G | AMD |
Description: BOARD DCAB SERVER U280 ACTIVE Cooling Type: Fan + Heat Sink Operating Temperature: 0°C ~ 45°C Interface: PCI Express Memory Size: 16GB Power (Watts): 225W Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XC4044XLA-09HQ208C | AMD |
Description: FPGA, 1600 CLBS, 27000 GATES Part Status: Active Number of LABs/CLBs: 1600 Supplier Device Package: 208-PQFP (28x28) Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 27000 Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 57 шт: термін постачання 21-31 дні (днів) |
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XCZU1CG-2SFVC784I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 784BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.333GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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XCZU2EG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Architecture: MCU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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XCZU1EG-2SFVC784I | AMD |
Description: IC ZUP MPSOC EG A53 FPGA 784BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.333GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SM-K26-XCL2GI | AMD |
Description: SOM ARM A53 ZYNQ MPSOC KRIA K26 Packaging: Box Connector Type: 2 x 240 Pin Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm) Speed: 533MHz, 1.333GHz RAM Size: 4GB Operating Temperature: -40°C ~ 100°C (TJ) Module/Board Type: FPGA Core Core Processor: ARM® Cortex®-A53 Co-Processor: Arm® Cortex®-R5F Flash Size: 16GB eMMC, 64MB QSPI Part Status: Active |
на замовлення 1338 шт: термін постачання 21-31 дні (днів) |
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| XA7A12T-2CPG238I | AMD |
Description: IC FPGA 112 I/O 238CSBGA Part Status: Active Total RAM Bits: 737280 Number of LABs/CLBs: 1000 Supplier Device Package: 238-CSBGA (10x10) Number of Logic Elements/Cells: 12800 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 238-LFBGA, CSPBGA Packaging: Tray Number of I/O: 112 |
товару немає в наявності |
Мінімальне замовлення: 8 шт В кошику од. на суму грн. | |||
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XC4VFX100-11FF1152C | AMD |
Description: IC FPGA 576 I/O 1152FCBGA DigiKey Programmable: Not Verified Number of I/O: 576 Total RAM Bits: 6930432 Number of LABs/CLBs: 10544 Supplier Device Package: 1152-FCBGA (35x35) Number of Logic Elements/Cells: 94896 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 1152-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC4VFX60-12FFG1152C | AMD |
Description: IC FPGA 576 I/O 1152FCBGA DigiKey Programmable: Not Verified Number of I/O: 576 Total RAM Bits: 4276224 Number of LABs/CLBs: 6320 Supplier Device Package: 1152-FCBGA (35x35) Number of Logic Elements/Cells: 56880 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 1152-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC4VFX100-10FF1152C | AMD |
Description: IC FPGA 576 I/O 1152FCBGA DigiKey Programmable: Not Verified Number of I/O: 576 Total RAM Bits: 6930432 Number of LABs/CLBs: 10544 Supplier Device Package: 1152-FCBGA (35x35) Number of Logic Elements/Cells: 94896 Voltage - Supply: 1.14V ~ 1.26V Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 1152-BBGA, FCBGA Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XC95144XL-10CS144I | AMD |
Description: IC CPLD 144MC 10NS 144LCSBGA Number of I/O: 117 Part Status: Active Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 8 Supplier Device Package: 144-LCSBGA (12x12) Delay Time tpd(1) Max: 10 ns Operating Temperature: -40°C ~ 85°C (TA) Number of Macrocells: 144 Number of Gates: 3200 Programmable Type: In System Programmable (min 10K program/erase cycles) Mounting Type: Surface Mount Package / Case: 144-TFBGA, CSPBGA Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 198 шт В кошику од. на суму грн. | |||
| XC95144XL-7CS144I | AMD |
Description: IC CPLD 144MC 7.5NS 144LCSBGA Package / Case: 144-TFBGA, CSPBGA Packaging: Bulk Number of I/O: 117 Part Status: Active Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 8 Supplier Device Package: 144-LCSBGA (12x12) Delay Time tpd(1) Max: 7.5 ns Operating Temperature: -40°C ~ 85°C (TA) Number of Macrocells: 144 Number of Gates: 3200 Programmable Type: In System Programmable (min 10K program/erase cycles) Mounting Type: Surface Mount DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 198 шт В кошику од. на суму грн. | |||
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XC95144XL-10TQ144C | AMD |
Description: IC CPLD 144MC 10NS 144TQFP Number of I/O: 117 Part Status: Active Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 8 Supplier Device Package: 144-TQFP (20x20) Delay Time tpd(1) Max: 10 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 144 Number of Gates: 3200 Programmable Type: In System Programmable (min 10K program/erase cycles) Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 120 шт В кошику од. на суму грн. | ||
| XC95144XL-5CS144C | AMD |
Description: IC CPLD 144MC 5NS 144LCSBGA Delay Time tpd(1) Max: 5 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 144 Number of Gates: 3200 Programmable Type: In System Programmable (min 10K program/erase cycles) Mounting Type: Surface Mount Package / Case: 144-TFBGA, CSPBGA Packaging: Bulk Supplier Device Package: 144-LCSBGA (12x12) Number of I/O: 117 Part Status: Active Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 198 шт В кошику од. на суму грн. | |||
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XC95144XL-10TQ100C | AMD |
Description: IC CPLD 144MC 10NS 100TQFP Number of I/O: 81 Part Status: Active Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 8 Supplier Device Package: 100-TQFP (14x14) Delay Time tpd(1) Max: 10 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 144 Number of Gates: 3200 Programmable Type: In System Programmable (min 10K program/erase cycles) Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
| XC95144XL-10CS144C | AMD |
Description: IC CPLD 144MC 10NS 144LCSBGA Packaging: Bulk Package / Case: 144-TFBGA, CSPBGA Mounting Type: Surface Mount Programmable Type: In System Programmable (min 10K program/erase cycles) Number of Gates: 3200 Number of Macrocells: 144 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 144-LCSBGA (12x12) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 3V ~ 3.6V Part Status: Active Number of I/O: 117 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 198 шт В кошику од. на суму грн. | |||
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XCVC1802-1MSIVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-1MSIVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-2LSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-2MSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-2MSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-2MLEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-2LSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-1MSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-2MLEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-1LSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-1MLIVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-1LSIVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EK-S7-SP701-G-J | AMD |
Description: SPARTAN7 SP701 FPGA KIT NO PS Packaging: Box For Use With/Related Products: XC7S100 Type: FPGA Contents: Board(s), Cable(s) - Power Supply Not Included - Utilized IC / Part: XC7S100 Platform: Spartan-7 FPGA SP701 Japan |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCZU19EG-L2FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCZU17EG-2FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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| XCZU19EG-3FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-1FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCZU11EG-1FFVC1760E | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCZU19EG-1FFVC1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCZU19EG-2FFVC1760I | AMD |
Description: IC SOC CORTEX-A53 1760FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XC3130-5PC68C | AMD |
Description: FPGA, 100 CLBS, 2K GATES Packaging: Bulk Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Number of Gates: 2000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 100 Supplier Device Package: 68-PLCC (24.23x24.23) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 124 шт: термін постачання 21-31 дні (днів) |
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SK-KR260-G-ED | AMD |
Description: KRIA KR260 ROBOTIC START KIT ED Utilized IC / Part: SM-K26, XCK26 Part Status: Active Platform: Kria KR260 Robotics Starter Encryption Disabled Contents: Board(s), Cable(s), Power Supply, Accessories Type: FPGA + MCU/MPU SoC For Use With/Related Products: SM-K26, XCK26 Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XA7A25T-1CSG325Q | AMD |
Description: IC FPGA 150 I/O 324CSBGA Qualification: AEC-Q100 DigiKey Programmable: Not Verified Number of I/O: 150 Grade: Automotive Total RAM Bits: 1658880 Number of LABs/CLBs: 1825 Supplier Device Package: 324-CSPBGA (15x15) Number of Logic Elements/Cells: 23360 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 324-LFBGA, CSPBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 5 шт В кошику од. на суму грн. | ||
 |
XC4085XLA-09BGG352C | AMD |
Description: FPGA, 3136 CLBS, 55000 GATES DigiKey Programmable: Not Verified Number of LABs/CLBs: 3136 Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 55000 Mounting Type: Surface Mount Packaging: Bulk |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XC4085XLA-09BG352I | AMD |
Description: FPGA, 3136 CLBS, 55000 GATES DigiKey Programmable: Not Verified Number of LABs/CLBs: 3136 Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 55000 Mounting Type: Surface Mount Packaging: Bulk |
на замовлення 132 шт: термін постачання 21-31 дні (днів) |
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XC4085XLA-08HQ160I | AMD |
Description: FPGA, 3136 CLBS, 55000 GATES DigiKey Programmable: Not Verified Number of LABs/CLBs: 3136 Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 55000 Mounting Type: Surface Mount Packaging: Bulk |
на замовлення 68 шт: термін постачання 21-31 дні (днів) |
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XC4085XLA-09HQ208C | AMD |
Description: FPGA, 3136 CLBS, 55000 GATES DigiKey Programmable: Not Verified Number of LABs/CLBs: 3136 Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 55000 Mounting Type: Surface Mount Packaging: Bulk |
на замовлення 139 шт: термін постачання 21-31 дні (днів) |
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XC3130-PQ100CPH | AMD |
Description: XC3130 - XC3000 SERIES FIELD PRO Number of Logic Elements/Cells: 100 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 2000 Mounting Type: Surface Mount Package / Case: 100-BQFP Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 80 Total RAM Bits: 22176 Number of LABs/CLBs: 100 Supplier Device Package: 100-PQFP (20x14) |
на замовлення 255 шт: термін постачання 21-31 дні (днів) |
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| XCS20XL-5VQG100C | AMD |
Description: FPGA, 400 CLBS, 7000 GATES Number of I/O: 77 Part Status: Active Total RAM Bits: 12800 Number of LABs/CLBs: 400 Supplier Device Package: 100-VQFP (14x14) Number of Logic Elements/Cells: 950 Voltage - Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 7000 Mounting Type: Surface Mount Package / Case: 100-TQFP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCVC1902-1LSEVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Architecture: MPU, FPGA Supplier Device Package: 1596-FCBGA (40x40) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 400MHz, 1GHz Package / Case: 1596-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-2MSIVIVA1596 | AMD |
Description: IC VERSAL AICORE FPGA 1596BGA Architecture: MPU, FPGA Supplier Device Package: 1596-FCBGA (40x40) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 600MHz, 1.4GHz Package / Case: 1596-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2CG-2UBVA530E | AMD |
Description: IC SOC CORTEX-A53 530BGA Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.3GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2EG-2UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.3GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU2EG-1UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-1UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 1.2GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCZU2CG-2UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 1.3GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| XC4006E-4PQ208C | AMD |
Description: IC FPGA 128 I/O 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 6000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 608 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 256 Total RAM Bits: 8192 Part Status: Obsolete Number of I/O: 128 DigiKey Programmable: Not Verified |
на замовлення 174 шт: термін постачання 21-31 дні (днів) |
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XC7Z020-2CLG400E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGA Architecture: MCU, FPGA Supplier Device Package: 400-CSPBGA (17x17) Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 766MHz Package / Case: 400-LFBGA, CSPBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||
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SK-KR260-G | AMD |
Description: KRIA KR260 ROBOTIC START KIT Packaging: Box For Use With/Related Products: SM-K26, XCK26 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Utilized IC / Part: SM-K26, XCK26 Platform: Kria KR260 Robotics Starter Part Status: Active |
на замовлення 466 шт: термін постачання 21-31 дні (днів) |
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XCZU1CG-1SBVA484I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active |
на замовлення 53 шт: термін постачання 21-31 дні (днів) |
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XCZU1CG-1SFVA625I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 635BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU1CG-2SBVA484I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Peripherals: DMA, WDT Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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| XQ18V04VQ44N |
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Виробник: AMD
Description: IC CONFIG PROM 4MBIT 44TQFP
Part Status: Obsolete
Supplier Device Package: 44-VQFP (10x10)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -55°C ~ 125°C
Programmable Type: In System Programmable
Memory Size: 4MB
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC CONFIG PROM 4MBIT 44TQFP
Part Status: Obsolete
Supplier Device Package: 44-VQFP (10x10)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -55°C ~ 125°C
Programmable Type: In System Programmable
Memory Size: 4MB
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| A-U280-A32G-DEV-G |
Виробник: AMD
Description: BOARD DCAB SERVER U280 ACTIVE
Cooling Type: Fan + Heat Sink
Operating Temperature: 0°C ~ 45°C
Interface: PCI Express
Memory Size: 16GB
Power (Watts): 225W
Packaging: Box
Description: BOARD DCAB SERVER U280 ACTIVE
Cooling Type: Fan + Heat Sink
Operating Temperature: 0°C ~ 45°C
Interface: PCI Express
Memory Size: 16GB
Power (Watts): 225W
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.
| XC4044XLA-09HQ208C |
|
Виробник: AMD
Description: FPGA, 1600 CLBS, 27000 GATES
Part Status: Active
Number of LABs/CLBs: 1600
Supplier Device Package: 208-PQFP (28x28)
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 27000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: FPGA, 1600 CLBS, 27000 GATES
Part Status: Active
Number of LABs/CLBs: 1600
Supplier Device Package: 208-PQFP (28x28)
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 27000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 8456.03 грн |
| XCZU1CG-2SFVC784I |
|
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 784BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: IC ZUP MPSOC CG A53 FPGA 784BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 32867.96 грн |
| XCZU2EG-2SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 784FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 36975.10 грн |
| XCZU1EG-2SFVC784I |
|
Виробник: AMD
Description: IC ZUP MPSOC EG A53 FPGA 784BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: IC ZUP MPSOC EG A53 FPGA 784BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 32664.61 грн |
| SM-K26-XCL2GI |
|
Виробник: AMD
Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: -40°C ~ 100°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: -40°C ~ 100°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
на замовлення 1338 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 39340.26 грн |
| XA7A12T-2CPG238I |
|
Виробник: AMD
Description: IC FPGA 112 I/O 238CSBGA
Part Status: Active
Total RAM Bits: 737280
Number of LABs/CLBs: 1000
Supplier Device Package: 238-CSBGA (10x10)
Number of Logic Elements/Cells: 12800
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 238-LFBGA, CSPBGA
Packaging: Tray
Number of I/O: 112
Description: IC FPGA 112 I/O 238CSBGA
Part Status: Active
Total RAM Bits: 737280
Number of LABs/CLBs: 1000
Supplier Device Package: 238-CSBGA (10x10)
Number of Logic Elements/Cells: 12800
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 238-LFBGA, CSPBGA
Packaging: Tray
Number of I/O: 112
товару немає в наявності
Мінімальне замовлення: 8 шт
В кошику
од. на суму грн.
| XC4VFX100-11FF1152C |
|
Виробник: AMD
Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 6930432
Number of LABs/CLBs: 10544
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 94896
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 6930432
Number of LABs/CLBs: 10544
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 94896
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Tray
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| XC4VFX60-12FFG1152C |
|
Виробник: AMD
Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 4276224
Number of LABs/CLBs: 6320
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 56880
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 4276224
Number of LABs/CLBs: 6320
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 56880
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Tray
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| XC4VFX100-10FF1152C |
|
Виробник: AMD
Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 6930432
Number of LABs/CLBs: 10544
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 94896
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Bulk
Description: IC FPGA 576 I/O 1152FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 576
Total RAM Bits: 6930432
Number of LABs/CLBs: 10544
Supplier Device Package: 1152-FCBGA (35x35)
Number of Logic Elements/Cells: 94896
Voltage - Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1152-BBGA, FCBGA
Packaging: Bulk
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| XC95144XL-10CS144I |
|
Виробник: AMD
Description: IC CPLD 144MC 10NS 144LCSBGA
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-LCSBGA (12x12)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 10NS 144LCSBGA
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-LCSBGA (12x12)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 198 шт
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| XC95144XL-7CS144I |
|
Виробник: AMD
Description: IC CPLD 144MC 7.5NS 144LCSBGA
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-LCSBGA (12x12)
Delay Time tpd(1) Max: 7.5 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 7.5NS 144LCSBGA
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-LCSBGA (12x12)
Delay Time tpd(1) Max: 7.5 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 198 шт
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| XC95144XL-10TQ144C |
|
Виробник: AMD
Description: IC CPLD 144MC 10NS 144TQFP
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-TQFP (20x20)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 10NS 144TQFP
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 144-TQFP (20x20)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 120 шт
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| XC95144XL-5CS144C |
|
Виробник: AMD
Description: IC CPLD 144MC 5NS 144LCSBGA
Delay Time tpd(1) Max: 5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
Supplier Device Package: 144-LCSBGA (12x12)
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 5NS 144LCSBGA
Delay Time tpd(1) Max: 5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Bulk
Supplier Device Package: 144-LCSBGA (12x12)
Number of I/O: 117
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 198 шт
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| XC95144XL-10TQ100C |
|
Виробник: AMD
Description: IC CPLD 144MC 10NS 100TQFP
Number of I/O: 81
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 100-TQFP (14x14)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 10NS 100TQFP
Number of I/O: 81
Part Status: Active
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 100-TQFP (14x14)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 144
Number of Gates: 3200
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 90 шт
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| XC95144XL-10CS144C |
|
Виробник: AMD
Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 198 шт
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| XCVC1802-1MSIVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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| XCVC1902-1MSIVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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| XCVC1902-2LSEVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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| XCVC1802-2MSEVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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| XCVC1902-2MSEVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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| XCVC1902-2MLEVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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| XCVC1802-2LSEVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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| XCVC1902-1MSEVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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| XCVC1802-2MLEVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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| XCVC1802-1LSEVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-1MLIVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-1LSIVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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В кошику
од. на суму грн.
| EK-S7-SP701-G-J |
|
Виробник: AMD
Description: SPARTAN7 SP701 FPGA KIT NO PS
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Utilized IC / Part: XC7S100
Platform: Spartan-7 FPGA SP701 Japan
Description: SPARTAN7 SP701 FPGA KIT NO PS
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Utilized IC / Part: XC7S100
Platform: Spartan-7 FPGA SP701 Japan
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В кошику
од. на суму грн.
| XCZU19EG-L2FFVC1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-2FFVC1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 686346.55 грн |
| XCZU17EG-2FFVC1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 538174.75 грн |
| XCZU19EG-3FFVC1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-1FFVC1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU11EG-1FFVC1760E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-1FFVC1760I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-2FFVC1760I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
| XC3130-5PC68C |
|
Виробник: AMD
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 124 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 38+ | 525.70 грн |
| SK-KR260-G-ED |
|
Виробник: AMD
Description: KRIA KR260 ROBOTIC START KIT ED
Utilized IC / Part: SM-K26, XCK26
Part Status: Active
Platform: Kria KR260 Robotics Starter Encryption Disabled
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: SM-K26, XCK26
Packaging: Box
Description: KRIA KR260 ROBOTIC START KIT ED
Utilized IC / Part: SM-K26, XCK26
Part Status: Active
Platform: Kria KR260 Robotics Starter Encryption Disabled
Contents: Board(s), Cable(s), Power Supply, Accessories
Type: FPGA + MCU/MPU SoC
For Use With/Related Products: SM-K26, XCK26
Packaging: Box
товару немає в наявності
В кошику
од. на суму грн.
| XA7A25T-1CSG325Q |
|
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 150
Grade: Automotive
Total RAM Bits: 1658880
Number of LABs/CLBs: 1825
Supplier Device Package: 324-CSPBGA (15x15)
Number of Logic Elements/Cells: 23360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 324-LFBGA, CSPBGA
Packaging: Tray
Description: IC FPGA 150 I/O 324CSBGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Number of I/O: 150
Grade: Automotive
Total RAM Bits: 1658880
Number of LABs/CLBs: 1825
Supplier Device Package: 324-CSPBGA (15x15)
Number of Logic Elements/Cells: 23360
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 324-LFBGA, CSPBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 5 шт
В кошику
од. на суму грн.
| XC4085XLA-09BGG352C |
|
Виробник: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 30586.30 грн |
| XC4085XLA-09BG352I |
|
Виробник: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
на замовлення 132 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 39788.71 грн |
| XC4085XLA-08HQ160I |
|
Виробник: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
на замовлення 68 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 42242.02 грн |
| XC4085XLA-09HQ208C |
|
Виробник: AMD
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
Description: FPGA, 3136 CLBS, 55000 GATES
DigiKey Programmable: Not Verified
Number of LABs/CLBs: 3136
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 55000
Mounting Type: Surface Mount
Packaging: Bulk
на замовлення 139 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 9290.04 грн |
| XC3130-PQ100CPH |
|
Виробник: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Number of Logic Elements/Cells: 100
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 2000
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 80
Total RAM Bits: 22176
Number of LABs/CLBs: 100
Supplier Device Package: 100-PQFP (20x14)
Description: XC3130 - XC3000 SERIES FIELD PRO
Number of Logic Elements/Cells: 100
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 2000
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 80
Total RAM Bits: 22176
Number of LABs/CLBs: 100
Supplier Device Package: 100-PQFP (20x14)
на замовлення 255 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 34+ | 641.63 грн |
| XCS20XL-5VQG100C |
Виробник: AMD
Description: FPGA, 400 CLBS, 7000 GATES
Number of I/O: 77
Part Status: Active
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 7000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Bulk
Description: FPGA, 400 CLBS, 7000 GATES
Number of I/O: 77
Part Status: Active
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 7000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1902-1LSEVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 400MHz, 1GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 400MHz, 1GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-2MSIVIVA1596 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.4GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AICORE FPGA 1596BGA
Architecture: MPU, FPGA
Supplier Device Package: 1596-FCBGA (40x40)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.4GHz
Package / Case: 1596-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2CG-2UBVA530E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-2UBVA530I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-1UBVA530I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 30757.17 грн |
| XCZU2CG-1UBVA530I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 530BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 25630.98 грн |
| XCZU2CG-2UBVA530I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 1.3GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 29521.63 грн |
| XC4006E-4PQ208C |
Виробник: AMD
Description: IC FPGA 128 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 608
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 256
Total RAM Bits: 8192
Part Status: Obsolete
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC FPGA 128 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 608
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 256
Total RAM Bits: 8192
Part Status: Obsolete
Number of I/O: 128
DigiKey Programmable: Not Verified
на замовлення 174 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 5029.55 грн |
| XC7Z020-2CLG400E |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Architecture: MCU, FPGA
Supplier Device Package: 400-CSPBGA (17x17)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 400-LFBGA, CSPBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| SK-KR260-G |
|
Виробник: AMD
Description: KRIA KR260 ROBOTIC START KIT
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KR260 Robotics Starter
Part Status: Active
Description: KRIA KR260 ROBOTIC START KIT
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KR260 Robotics Starter
Part Status: Active
на замовлення 466 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 29210.04 грн |
| XCZU1CG-1SBVA484I |
|
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 53 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 20203.24 грн |
| XCZU1CG-1SFVA625I |
|
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 635BGA
Description: IC ZUP MPSOC CG A53 FPGA 635BGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU1CG-2SBVA484I |
|
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 30455.63 грн |