| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
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XC5204-5PQ160C0280 | AMD |
 Description: FPGA, 120 CLBS, 4000 GATES, 83MHPackaging: Bulk Package / Case: 160-BQFP Mounting Type: Surface Mount Number of Gates: 6000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 480 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 120 Part Status: Active Number of I/O: 124 |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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XA7A12T-1CPG238Q | AMD |
Description: IC FPGA 112 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 12800 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1000 Total RAM Bits: 737280 Part Status: Active Number of I/O: 112 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 8 шт В кошику од. на суму грн. | ||
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XA7A25T-1CPG238Q | AMD |
Description: IC FPGA 150 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 23360 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1825 Total RAM Bits: 1658880 Grade: Automotive Part Status: Active Number of I/O: 150 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 7 шт В кошику од. на суму грн. | ||
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XCZU47DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU42DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-L2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU42DR-L2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU47DR-L2FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU57DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU55DR-L2FSVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq® UltraScale+™ RFSoC Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1402-2MLIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1402-2LSEVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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XCVM1302-2HSINBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XCVM1302-1LSENSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XCVM1802-2MSEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1402-1LSIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-1FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-1FSVG1517I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1517BGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1802-1MLIVSVA2197 | AMD |
Description: IC VERSAL AICORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU42DR-2FFVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU43DR-2FSVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1402-2MSINSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.4GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU42DR-1FFVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU46DR-1FFVH1760E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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HW-ADK-2-0-G | AMD |
Description: DEBUG KIT ALVEO ADK2 CARD Packaging: Box Type: Debugger Contents: Board(s) Part Status: Active |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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XC6SLX75-2FG484I | AMD |
Description: IC FPGA 280 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74637 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 5831 Total RAM Bits: 3170304 Number of I/O: 280 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
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XC4028XLA-09HQ160C | AMD |
Description: FPGA, 1024 CLBS, 18000 GATES Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 129 DigiKey Programmable: Not Verified |
на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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| XC4028XL-2HQ160C | AMD |
Description: IC FPGA 129 I/O 160QFP Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 129 DigiKey Programmable: Not Verified |
на замовлення 106 шт: термін постачання 21-31 дні (днів) |
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| XC4036XL-2HQ160C | AMD |
Description: IC FPGA 129 I/O 160QFP Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 36000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 3078 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1296 Total RAM Bits: 41472 Number of I/O: 129 DigiKey Programmable: Not Verified |
на замовлення 172 шт: термін постачання 21-31 дні (днів) |
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A-U55C-P00G-PQ-G | AMD |
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE Power (Watts): 150W Packaging: Box Memory Size: 16GB Interface: PCI Express Operating Temperature: 0°C ~ 55°C Bandwidth: 460GB/s Cooling Type: Heat Sink LUTs: 1304k |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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XCZU1CG-2UBVA494I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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XCZU1CG-1UBVA494I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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XCZU1EG-2UBVA494I | AMD |
Description: IC ZUP MPSOC EG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
на замовлення 126 шт: термін постачання 21-31 дні (днів) |
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XA7A15T-1CSG325Q | AMD |
Description: IC FPGA 150 I/O 324CSBGA Packaging: Bulk Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Grade: Automotive Number of I/O: 150 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 126 шт В кошику од. на суму грн. | ||
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XC3142-4TQ100C | AMD |
Description: FPGA, 144 CLBS, 3000 GATES Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 144 Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 82 DigiKey Programmable: Not Verified |
на замовлення 191 шт: термін постачання 21-31 дні (днів) |
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XC3142-3TQ100C | AMD |
Description: FPGA, 144 CLBS, 3000 GATES Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 144 Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 82 DigiKey Programmable: Not Verified |
на замовлення 903 шт: термін постачання 21-31 дні (днів) |
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XC3142-TQ144IPH | AMD |
Description: XC3142 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Logic Elements/Cells: 144 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 96 DigiKey Programmable: Not Verified |
на замовлення 440 шт: термін постачання 21-31 дні (днів) |
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XC3142-5TQ100C | AMD |
Description: FPGA, 144 CLBS, 3000 GATES Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 144 Supplier Device Package: 100-TQFP (14x14) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 82 DigiKey Programmable: Not Verified |
на замовлення 167 шт: термін постачання 21-31 дні (днів) |
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XC3142-PQ100CPH | AMD |
Description: XC3142 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 100-BQFP Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 144 Supplier Device Package: 100-PQFP (20x14) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 82 DigiKey Programmable: Not Verified |
на замовлення 1941 шт: термін постачання 21-31 дні (днів) |
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XC3130-PG84CPH | AMD |
Description: XC3130 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 84-BCPGA Mounting Type: Through Hole Number of Gates: 2000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 100 Supplier Device Package: 84-CPGA (28x28) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 74 DigiKey Programmable: Not Verified |
на замовлення 213 шт: термін постачання 21-31 дні (днів) |
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| XC95144XV-7TQ144C | AMD |
Description: FLASH PLD, 7.5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC95144-10PQ160I4307 | AMD |
Description: FLASH PLD, 10NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
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HW-IMX547M-SK-G | AMD |
Description: SONY IMX547 MONO CAMERA KRIA BD Packaging: Box For Use With/Related Products: KR260 Accessory Type: Camera Utilized IC / Part: KR260 Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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HW-IMX547C-SK-G | AMD |
Description: SONY IMX547 COLOR CAMERA KRIA BD Packaging: Box For Use With/Related Products: KR260 Accessory Type: Camera Utilized IC / Part: KR260 Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| XC3195-PG175IPH | AMD |
Description: XC3195 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 175-BCPGA Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 175-CPGA (42.16x42.16) Number of LABs/CLBs: 484 Total RAM Bits: 94944 Number of I/O: 144 DigiKey Programmable: Not Verified |
на замовлення 329 шт: термін постачання 21-31 дні (днів) |
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XCKU035-3FBVA676E | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.970V ~ 1.030V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 312 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU035-2FBVA676E | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 312 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU035-L1FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.880V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 312 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU035-2SFVA784I | AMD |
Description: IC FPGA 468 I/O 784FCBGA Packaging: Bulk Package / Case: 784-BFBGA, FCCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 784-FCCSPBGA (23x23) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 468 DigiKey Programmable: Not Verified |
на замовлення 78 шт: термін постачання 21-31 дні (днів) |
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XCKU035-2FFVA1156I | AMD |
Description: IC FPGA 520 I/O 1156FCBGA |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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| XC4020E-2HQ240C | AMD |
Description: IC FPGA 193 I/O 240QFP |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCKU115-1FLVD1924I | AMD |
Description: IC FPGA 832 I/O 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 1451100 Supplier Device Package: 1924-FCBGA (45x45) Number of LABs/CLBs: 82920 Total RAM Bits: 77721600 Number of I/O: 832 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU115-2FLVD1924I | AMD |
Description: IC FPGA 832 I/O 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 1451100 Supplier Device Package: 1924-FCBGA (45x45) Number of LABs/CLBs: 82920 Total RAM Bits: 77721600 Number of I/O: 832 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU115-1FLVD1924C | AMD |
Description: IC FPGA 832 I/O 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 1451100 Supplier Device Package: 1924-FCBGA (45x45) Number of LABs/CLBs: 82920 Total RAM Bits: 77721600 Number of I/O: 832 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCKU115-2FLVD1924E | AMD |
Description: IC FPGA 832 I/O 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 1451100 Supplier Device Package: 1924-FCBGA (45x45) Number of LABs/CLBs: 82920 Total RAM Bits: 77721600 Number of I/O: 832 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC5VLX110T-1FF1136C4051 | AMD |
Description: IC FPGA 640 I/O 1136FCBGA Packaging: Bulk Package / Case: 1136-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 110592 Supplier Device Package: 1136-FCBGA (35x35) Number of LABs/CLBs: 8640 Total RAM Bits: 5455872 Number of I/O: 640 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC5VLX110-2FFV1153I | AMD |
Description: IC FPGA 800 I/O 1153FCBGA Packaging: Bulk Package / Case: 1153-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 110592 Supplier Device Package: 1153-FCBGA (35x35) Number of LABs/CLBs: 8640 Total RAM Bits: 4718592 Number of I/O: 800 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC5VLX110T-1FF1136C4031 | AMD |
Description: IC FPGA 640 I/O 1136FCBGA Packaging: Bulk Package / Case: 1136-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 110592 Supplier Device Package: 1136-FCBGA (35x35) Number of LABs/CLBs: 8640 Total RAM Bits: 5455872 Number of I/O: 640 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCAU15P-2SBVB484I | AMD |
Description: IC FPGA ARTIXUP 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 170100 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 9720 Total RAM Bits: 5347738 Part Status: Active Number of I/O: 204 DigiKey Programmable: Not Verified |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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| XC5204-5PQ160C0280 |
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Виробник: AMD
Description: FPGA, 120 CLBS, 4000 GATES, 83MH
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 480
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 120
Part Status: Active
Number of I/O: 124
Description: FPGA, 120 CLBS, 4000 GATES, 83MH
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 480
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 120
Part Status: Active
Number of I/O: 124
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2300.18 грн |
| XA7A12T-1CPG238Q |
|
Виробник: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 8 шт
В кошику
од. на суму грн.
| XA7A25T-1CPG238Q |
|
Виробник: AMD
Description: IC FPGA 150 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 150 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Grade: Automotive
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 7 шт
В кошику
од. на суму грн.
| XCZU47DR-L2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU42DR-L2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-L2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-L2FFVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU42DR-L2FFVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU47DR-L2FFVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU57DR-L2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU55DR-L2FSVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1402-2MLIVSVD1760 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1402-2LSEVFVC1596 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 605090.49 грн |
| XCVM1302-2HSINBVB1024 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 466758.91 грн |
| XCVM1302-1LSENSVF1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 310633.81 грн |
| XCVM1802-2MSEVSVD1760 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1402-1LSIVSVD1760 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-1FFVE1156I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-1FSVG1517I |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1802-1MLIVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU42DR-2FFVE1156E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU43DR-2FSVE1156E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1402-2MSINSVF1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCZU42DR-1FFVE1156E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| XCZU46DR-1FFVH1760E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| HW-ADK-2-0-G |
|
Виробник: AMD
Description: DEBUG KIT ALVEO ADK2 CARD
Packaging: Box
Type: Debugger
Contents: Board(s)
Part Status: Active
Description: DEBUG KIT ALVEO ADK2 CARD
Packaging: Box
Type: Debugger
Contents: Board(s)
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 35225.28 грн |
| XC6SLX75-2FG484I |
|
Виробник: AMD
Description: IC FPGA 280 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74637
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5831
Total RAM Bits: 3170304
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74637
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5831
Total RAM Bits: 3170304
Number of I/O: 280
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC4028XLA-09HQ160C |
|
Виробник: AMD
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
на замовлення 72 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 3258.05 грн |
| XC4028XL-2HQ160C |
|
Виробник: AMD
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
на замовлення 106 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 6560.68 грн |
| XC4036XL-2HQ160C |
|
Виробник: AMD
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 36000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3078
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1296
Total RAM Bits: 41472
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 36000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3078
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1296
Total RAM Bits: 41472
Number of I/O: 129
DigiKey Programmable: Not Verified
на замовлення 172 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 7767.11 грн |
| A-U55C-P00G-PQ-G |
|
Виробник: AMD
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE
Power (Watts): 150W
Packaging: Box
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE
Power (Watts): 150W
Packaging: Box
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 367085.65 грн |
| XCZU1CG-2UBVA494I |
|
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 24433.83 грн |
| XCZU1CG-1UBVA494I |
|
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 19089.12 грн |
| XCZU1EG-2UBVA494I |
|
Виробник: AMD
Description: IC ZUP MPSOC EG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC EG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 126 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 29439.17 грн |
| XA7A15T-1CSG325Q |
|
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 126 шт
В кошику
од. на суму грн.
| XC3142-4TQ100C |
|
Виробник: AMD
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
на замовлення 191 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 26+ | 806.39 грн |
| XC3142-3TQ100C |
|
Виробник: AMD
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
на замовлення 903 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 13+ | 1716.89 грн |
| XC3142-TQ144IPH |
|
Виробник: AMD
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 144
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 96
DigiKey Programmable: Not Verified
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 144
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 440 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 23+ | 931.83 грн |
| XC3142-5TQ100C |
|
Виробник: AMD
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
Description: FPGA, 144 CLBS, 3000 GATES
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
на замовлення 167 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 30+ | 691.29 грн |
| XC3142-PQ100CPH |
|
Виробник: AMD
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
на замовлення 1941 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 18+ | 1164.78 грн |
| XC3130-PG84CPH |
|
Виробник: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 84-BCPGA
Mounting Type: Through Hole
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-CPGA (28x28)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 84-BCPGA
Mounting Type: Through Hole
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-CPGA (28x28)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
на замовлення 213 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 15+ | 1355.63 грн |
| XC95144XV-7TQ144C |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC95144-10PQ160I4307 |
|
Виробник: AMD
Description: FLASH PLD, 10NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 10NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| HW-IMX547M-SK-G |
|
Виробник: AMD
Description: SONY IMX547 MONO CAMERA KRIA BD
Packaging: Box
For Use With/Related Products: KR260
Accessory Type: Camera
Utilized IC / Part: KR260
Part Status: Active
Description: SONY IMX547 MONO CAMERA KRIA BD
Packaging: Box
For Use With/Related Products: KR260
Accessory Type: Camera
Utilized IC / Part: KR260
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 33874.03 грн |
| HW-IMX547C-SK-G |
|
Виробник: AMD
Description: SONY IMX547 COLOR CAMERA KRIA BD
Packaging: Box
For Use With/Related Products: KR260
Accessory Type: Camera
Utilized IC / Part: KR260
Part Status: Active
Description: SONY IMX547 COLOR CAMERA KRIA BD
Packaging: Box
For Use With/Related Products: KR260
Accessory Type: Camera
Utilized IC / Part: KR260
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 33874.03 грн |
| XC3195-PG175IPH |
|
Виробник: AMD
Description: XC3195 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: XC3195 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 329 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2460.29 грн |
| XCKU035-3FBVA676E |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU035-2FBVA676E |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU035-L1FBVA676I |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| XCKU035-2SFVA784I |
|
Виробник: AMD
Description: IC FPGA 468 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 784-FCCSPBGA (23x23)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 468
DigiKey Programmable: Not Verified
Description: IC FPGA 468 I/O 784FCBGA
Packaging: Bulk
Package / Case: 784-BFBGA, FCCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 784-FCCSPBGA (23x23)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 468
DigiKey Programmable: Not Verified
на замовлення 78 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 148978.47 грн |
| XCKU035-2FFVA1156I |
|
Виробник: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Description: IC FPGA 520 I/O 1156FCBGA
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 181548.41 грн |
| XC4020E-2HQ240C |
|
Виробник: AMD
Description: IC FPGA 193 I/O 240QFP
Description: IC FPGA 193 I/O 240QFP
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 36595.86 грн |
| XCKU115-1FLVD1924I |
|
Виробник: AMD
Description: IC FPGA 832 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Number of I/O: 832
DigiKey Programmable: Not Verified
Description: IC FPGA 832 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Number of I/O: 832
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU115-2FLVD1924I |
|
Виробник: AMD
Description: IC FPGA 832 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Number of I/O: 832
DigiKey Programmable: Not Verified
Description: IC FPGA 832 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Number of I/O: 832
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU115-1FLVD1924C |
|
Виробник: AMD
Description: IC FPGA 832 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Number of I/O: 832
DigiKey Programmable: Not Verified
Description: IC FPGA 832 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Number of I/O: 832
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCKU115-2FLVD1924E |
|
Виробник: AMD
Description: IC FPGA 832 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Number of I/O: 832
DigiKey Programmable: Not Verified
Description: IC FPGA 832 I/O 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 1451100
Supplier Device Package: 1924-FCBGA (45x45)
Number of LABs/CLBs: 82920
Total RAM Bits: 77721600
Number of I/O: 832
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC5VLX110T-1FF1136C4051 |
|
Виробник: AMD
Description: IC FPGA 640 I/O 1136FCBGA
Packaging: Bulk
Package / Case: 1136-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1136-FCBGA (35x35)
Number of LABs/CLBs: 8640
Total RAM Bits: 5455872
Number of I/O: 640
DigiKey Programmable: Not Verified
Description: IC FPGA 640 I/O 1136FCBGA
Packaging: Bulk
Package / Case: 1136-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1136-FCBGA (35x35)
Number of LABs/CLBs: 8640
Total RAM Bits: 5455872
Number of I/O: 640
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC5VLX110-2FFV1153I |
|
Виробник: AMD
Description: IC FPGA 800 I/O 1153FCBGA
Packaging: Bulk
Package / Case: 1153-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1153-FCBGA (35x35)
Number of LABs/CLBs: 8640
Total RAM Bits: 4718592
Number of I/O: 800
DigiKey Programmable: Not Verified
Description: IC FPGA 800 I/O 1153FCBGA
Packaging: Bulk
Package / Case: 1153-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1153-FCBGA (35x35)
Number of LABs/CLBs: 8640
Total RAM Bits: 4718592
Number of I/O: 800
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC5VLX110T-1FF1136C4031 |
|
Виробник: AMD
Description: IC FPGA 640 I/O 1136FCBGA
Packaging: Bulk
Package / Case: 1136-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1136-FCBGA (35x35)
Number of LABs/CLBs: 8640
Total RAM Bits: 5455872
Number of I/O: 640
DigiKey Programmable: Not Verified
Description: IC FPGA 640 I/O 1136FCBGA
Packaging: Bulk
Package / Case: 1136-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1136-FCBGA (35x35)
Number of LABs/CLBs: 8640
Total RAM Bits: 5455872
Number of I/O: 640
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCAU15P-2SBVB484I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 21164.70 грн |