| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||
|---|---|---|---|---|---|---|---|
| EF-DI-50G-RS-FEC-SITE | AMD |
Description: LOGICORE 50G IEEE 802.3 REED-SOL Part Status: Active Media Delivery Type: Electronically Delivered License - User Details: Site License Length: 1 Year Type: License For Use With/Related Products: Xilinx Packaging: Electronic Delivery |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EF-DI-32G-FC-FEC-SITE | AMD |
Description: LOGICORE, 32G FIBRE CHANNEL REED Part Status: Active Media Delivery Type: Electronically Delivered License - User Details: Site License Length: 1 Year Type: License For Use With/Related Products: Xilinx Packaging: Electronic Delivery |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XC4005XL-2TQ144C | AMD |
Description: IC FPGA 112 I/O 144TQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 5000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 466 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 196 Total RAM Bits: 6272 Number of I/O: 112 DigiKey Programmable: Not Verified |
на замовлення 129 шт: термін постачання 21-31 дні (днів) |
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XC3195-3PQ208C | AMD |
 Description: FPGA, 484 CLBS, 6500 GATESPart Status: Active Packaging: Bulk Number of I/O: 176 Total RAM Bits: 94944 Number of LABs/CLBs: 484 Supplier Device Package: 208-PQFP (28x28) Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad DigiKey Programmable: Not Verified |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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XC3195-PQ208CPH | AMD |
Description: XC3195 - XC3000 SERIES FIELD PRO Part Status: Active Packaging: Bulk |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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XCZU2EG-2UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA 530BGA Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.333GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2EG-L2UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.333GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2EG-1UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA 530BGA Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||
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XCZU3EG-L2UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.333GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU3EG-L1UBVA530I | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU2EG-L1UBVA530I | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU3EG-2UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA 530BGA Architecture: MPU, FPGA Supplier Device Package: 530-FCBGA (16x9.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.333GHz Package / Case: 530-WFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XA7S6-1CSGA225I | AMD |
Description: IC FPGA 100 I/O 225CSGA Qualification: AEC-Q100 Grade: Automotive DigiKey Programmable: Not Verified Number of I/O: 100 Total RAM Bits: 184320 Number of LABs/CLBs: 469 Supplier Device Package: 225-CSGA (13x13) Number of Logic Elements/Cells: 6000 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 225-LFBGA, CSPBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XA7S6-1CPGA196Q | AMD |
Description: IC FPGA 100 I/O 196CSPBGA Qualification: AEC-Q100 Grade: Automotive DigiKey Programmable: Not Verified Number of I/O: 100 Total RAM Bits: 184320 Number of LABs/CLBs: 469 Supplier Device Package: 196-CSPBGA (8x8) Number of Logic Elements/Cells: 6000 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 196-TFBGA, CSBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 14 шт В кошику од. на суму грн. | ||
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XA7S6-2CPGA196I | AMD |
Description: IC FPGA 100 I/O 196CSPBGA Qualification: AEC-Q100 Grade: Automotive DigiKey Programmable: Not Verified Number of I/O: 100 Total RAM Bits: 184320 Number of LABs/CLBs: 469 Supplier Device Package: 196-CSPBGA (8x8) Number of Logic Elements/Cells: 6000 Voltage - Supply: 0.95V ~ 1.05V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 196-TFBGA, CSBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 15 шт В кошику од. на суму грн. | ||
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XA7S6-1CSGA225Q | AMD |
Description: IC FPGA 100 I/O 225CSBGA Qualification: AEC-Q100 Grade: Automotive Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 225-LFBGA, CSPBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 100 Total RAM Bits: 184320 Number of LABs/CLBs: 469 Supplier Device Package: 225-CSPBGA (13x13) Number of Logic Elements/Cells: 6000 Voltage - Supply: 0.95V ~ 1.05V |
товару немає в наявності |
Мінімальне замовлення: 14 шт В кошику од. на суму грн. | ||
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XC4020XL-1HT144I | AMD |
Description: IC FPGA 113 I/O 144TQFP DigiKey Programmable: Not Verified Number of I/O: 113 Total RAM Bits: 25088 Number of LABs/CLBs: 784 Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Cells: 1862 Voltage - Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 20000 Mounting Type: Surface Mount Package / Case: 144-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||
| XC4020E-4HQ240C | AMD |
Description: IC FPGA 193 I/O 240QFP DigiKey Programmable: Not Verified Number of I/O: 193 Part Status: Obsolete Total RAM Bits: 25088 Number of LABs/CLBs: 784 Supplier Device Package: 240-PQFP (32x32) Number of Logic Elements/Cells: 1862 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 20000 Mounting Type: Surface Mount Package / Case: 240-BFQFP Exposed Pad Packaging: Bulk |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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XC1701LPC20I | AMD |
Description: CONFIG MEMORY, 1MX1, SERIAL |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC1765ELPC20C | AMD |
Description: IC PROM SER C-TEMP 3.3V 20-PLCC DigiKey Programmable: Not Verified Supplier Device Package: 20-PLCC (9x9) Voltage - Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 70°C Programmable Type: OTP Memory Size: 65kb Mounting Type: Surface Mount Package / Case: 20-LCC (J-Lead) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC17256ELPC20C | AMD |
Description: IC PROM SER C-TEMP 256K 20-PLCC |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XAZU1EG-1SFVC784I | AMD |
Description: IC ZUP MPSOC A53 FPGA Q 784BGA Architecture: MPU, FPGA Supplier Device Package: 784-FCBGA (23x23) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 784-BFBGA, FCBGA Packaging: Tray |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XC3195-3PQ160C | AMD |
Description: FPGA, 484 CLBS, 6500 GATES DigiKey Programmable: Not Verified Number of I/O: 138 Total RAM Bits: 94944 Number of LABs/CLBs: 484 Supplier Device Package: 160-PQFP (28x28) Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Bulk |
на замовлення 201 шт: термін постачання 21-31 дні (днів) |
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XC3195-3PC84C | AMD |
Description: FPGA, 484 CLBS, 6500 GATES Number of LABs/CLBs: 484 Supplier Device Package: 84-PLCC (29.31x29.31) Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 84-LCC (J-Lead) Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 70 Total RAM Bits: 94944 |
на замовлення 658 шт: термін постачання 21-31 дні (днів) |
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| XC4VSX35-10FF668C | AMD |
Description: IC FPGA 448 I/O 668FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC4VSX35-11FF668C | AMD |
Description: IC FPGA 448 I/O 668FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XC7Z012S-2CLG485E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA Architecture: MCU, FPGA Supplier Device Package: 485-CSPBGA (19x19) Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Artix™-7 FPGA, 55K Logic Cells Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 766MHz Package / Case: 485-LFBGA, CSPBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | ||
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XC4VLX15-11FF676C | AMD |
Description: IC FPGA 320 I/O 676FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC5210-3PQ208C | AMD |
Description: FPGA, 324 CLBS, 10000 GATES Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC4020XLA-09PQ208I | AMD |
Description: FPGA, 784 CLBS, 13000 GATES Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC4013XL-3PQ208C | AMD |
Description: IC FPGA 160 I/O 208QFP Number of I/O: 160 Part Status: Obsolete Total RAM Bits: 18432 Number of LABs/CLBs: 576 Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Cells: 1368 Voltage - Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 13000 Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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XC95288XV-7PQ208C | AMD |
Description: IC CPLD 288MC 7.5NS 208QFP Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Tray Number of I/O: 168 Part Status: Obsolete Voltage Supply - Internal: 2.37V ~ 2.62V Number of Logic Elements/Blocks: 16 Supplier Device Package: 208-PQFP (28x28) Delay Time tpd(1) Max: 7.5 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 288 Number of Gates: 6400 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC95288XL-6PQ208C | AMD |
Description: IC CPLD 288MC 6NS 208QFP Number of I/O: 168 Part Status: Obsolete Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 16 Supplier Device Package: 208-PQFP (28x28) Delay Time tpd(1) Max: 6 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 288 Number of Gates: 6400 Programmable Type: In System Programmable (min 10K program/erase cycles) Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCR3512XL-12PQ208C | AMD |
Description: IC CPLD 512MC 10.8NS 208QFP Delay Time tpd(1) Max: 10.8 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 512 Number of Gates: 12000 Programmable Type: In System Programmable (min 1K program/erase cycles) Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Bulk Number of I/O: 180 Part Status: Obsolete Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 32 Supplier Device Package: 208-PQFP (28x28) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCR3512XL-7PQ208C | AMD |
Description: IC CPLD 512MC 7NSNS 208QFP Number of I/O: 180 Part Status: Obsolete Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 32 Supplier Device Package: 208-PQFP (28x28) Delay Time tpd(1) Max: 7 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 512 Number of Gates: 12000 Programmable Type: In System Programmable (min 1K program/erase cycles) Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCR3512XL-10PQ208I | AMD |
Description: IC CPLD 512MC 9NS 208QFP Package / Case: 208-BFQFP Packaging: Bulk Number of I/O: 180 Part Status: Obsolete Voltage Supply - Internal: 2.7V ~ 3.6V Number of Logic Elements/Blocks: 32 Supplier Device Package: 208-PQFP (28x28) Delay Time tpd(1) Max: 9 ns Operating Temperature: -40°C ~ 85°C (TA) Number of Macrocells: 512 Number of Gates: 12000 Programmable Type: In System Programmable (min 1K program/erase cycles) Mounting Type: Surface Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCR3512XL-10PQ208C | AMD |
Description: IC CPLD 512MC 9NS 208QFP Number of Macrocells: 512 Number of Gates: 12000 Programmable Type: In System Programmable (min 1K program/erase cycles) Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Bulk Number of I/O: 180 Part Status: Obsolete Voltage Supply - Internal: 3V ~ 3.6V Number of Logic Elements/Blocks: 32 Supplier Device Package: 208-PQFP (28x28) Delay Time tpd(1) Max: 9 ns Operating Temperature: 0°C ~ 70°C (TA) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCR3512XL-12PQ208I | AMD |
Description: IC CPLD 512MC 10.8NS 208QFP Number of I/O: 180 Number of Logic Elements/Blocks: 32 Supplier Device Package: 208-PQFP (28x28) Delay Time tpd(1) Max: 10.8 ns Operating Temperature: -40°C ~ 85°C (TA) Number of Macrocells: 512 Number of Gates: 12000 Programmable Type: In System Programmable (min 1K program/erase cycles) Mounting Type: Surface Mount Package / Case: 208-BFQFP Packaging: Bulk Part Status: Obsolete Voltage Supply - Internal: 2.7V ~ 3.6V |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU3EG-1UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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XCZU3EG-1UBVA530E | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-2UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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XCZU3EG-2UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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| XA7K160T-1FFG676Q | AMD |
Description: FPGA KINTEX7 Q100 400 I/O 676BGA DigiKey Programmable: Not Verified Number of I/O: 400 Part Status: Active Total RAM Bits: 11980800 Number of LABs/CLBs: 12675 Supplier Device Package: 676-FCBGA (27x27) Number of Logic Elements/Cells: 162240 Voltage - Supply: 0.97V ~ 1.03V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 676-BBGA, FCBGA Packaging: Tray |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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XCAU10P-2SBVB484I | AMD |
Description: IC FPGA ARTIXUP 484BGA Number of LABs/CLBs: 5500 Supplier Device Package: 484-FCBGA (19x19) Number of Logic Elements/Cells: 96250 Mounting Type: Surface Mount Package / Case: 484-BFBGA, FCBGA Packaging: Tray Number of I/O: 204 Part Status: Active Total RAM Bits: 3670016 DigiKey Programmable: Not Verified Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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XCAU10P-1SBVB484E | AMD |
Description: IC FPGA ARTIXUP 484BGA Number of I/O: 204 Part Status: Active Total RAM Bits: 3670016 Number of LABs/CLBs: 5500 Supplier Device Package: 484-FCBGA (19x19) Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 484-BFBGA, FCBGA Packaging: Tray Number of Logic Elements/Cells: 96250 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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XCAU10P-1SBVB484I | AMD |
Description: IC FPGA ARTIXUP 484BGA Number of I/O: 204 Part Status: Active Total RAM Bits: 3670016 Number of LABs/CLBs: 5500 Supplier Device Package: 484-FCBGA (19x19) Number of Logic Elements/Cells: 96250 Voltage - Supply: 0.698V ~ 0.742V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 484-BFBGA, FCBGA Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCVU11P-2FLGB2104I | AMD |
Description: IC FPGA 572 I/O 2104FCBGA Number of I/O: 572 Part Status: Active Total RAM Bits: 396150400 Number of LABs/CLBs: 162000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of Logic Elements/Cells: 2835000 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU11P-2FLGB2104E | AMD |
Description: IC FPGA 572 I/O 2104FCBGA DigiKey Programmable: Not Verified Number of I/O: 572 Part Status: Active Total RAM Bits: 396150400 Number of LABs/CLBs: 162000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of Logic Elements/Cells: 2835000 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
XCKU11P-2FFVD900I | AMD |
Description: IC FPGA 408 I/O 900FCBGA Number of I/O: 408 Part Status: Active Total RAM Bits: 53964800 Number of LABs/CLBs: 37320 Supplier Device Package: 900-FCBGA (31x31) Number of Logic Elements/Cells: 653100 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 900-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCKU11P-2FFVA1156I | AMD |
Description: IC FPGA 464 I/O 1156FCBGA Number of I/O: 464 Part Status: Active Total RAM Bits: 53964800 Number of LABs/CLBs: 37320 Supplier Device Package: 1156-FCBGA (35x35) Number of Logic Elements/Cells: 653100 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU11P-2FLGF1924I | AMD |
Description: IC FPGA 624 I/O 1924FCBGA Number of I/O: 624 Part Status: Active Total RAM Bits: 396150400 Number of LABs/CLBs: 162000 Supplier Device Package: 1924-FCBGA (45x45) Number of Logic Elements/Cells: 2835000 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1924-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCKU11P-2FFVD900E | AMD |
Description: IC FPGA 408 I/O 900FCBGA Number of I/O: 408 Part Status: Active Total RAM Bits: 53964800 Number of LABs/CLBs: 37320 Supplier Device Package: 900-FCBGA (31x31) Number of Logic Elements/Cells: 653100 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 900-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCVU11P-2FLGA2577E | AMD |
Description: IC FPGA 448 I/O 2577FCBGA Number of I/O: 448 Part Status: Active Total RAM Bits: 396150400 Number of LABs/CLBs: 162000 Supplier Device Package: 2577-FCBGA (52.5x52.5) Number of Logic Elements/Cells: 2835000 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2577-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU11P-2FFVA1156E | AMD |
Description: IC FPGA 464 I/O 1156FCBGA Number of I/O: 464 Part Status: Active Total RAM Bits: 53964800 Number of LABs/CLBs: 37320 Supplier Device Package: 1156-FCBGA (35x35) Number of Logic Elements/Cells: 653100 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU11P-2FLGC2104E | AMD |
Description: IC FPGA 416 I/O 2104FCBGA Number of I/O: 416 Part Status: Active Total RAM Bits: 396150400 Number of LABs/CLBs: 162000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of Logic Elements/Cells: 2835000 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
XCAU25P-2SFVB784I | AMD |
Description: IC FPGA ARTIXUP 784FBGA Number of I/O: 304 Part Status: Active Total RAM Bits: 4928307 Number of LABs/CLBs: 17625 Supplier Device Package: 784-FCBGA (23x23) Number of Logic Elements/Cells: 308437 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 784-BFBGA, FCBGA Packaging: Tray DigiKey Programmable: Not Verified |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| XCS20XL-4CS144C | AMD |
Description: IC FPGA 113 I/O 144CSBGA Number of I/O: 113 Part Status: Obsolete Total RAM Bits: 12800 Number of LABs/CLBs: 400 Supplier Device Package: 144-LCSBGA (12x12) Number of Logic Elements/Cells: 950 Voltage - Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 20000 Mounting Type: Surface Mount Package / Case: 144-TFBGA, CSPBGA Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 18 шт В кошику од. на суму грн. | |||
 |
XCVC1502-1LLIVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1702-1LSIVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 2197-FCBGA (45x45) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) Speed: 400MHz, 1GHz Package / Case: 2197-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1502-2LLEVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 2197-FCBGA (45x45) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) Speed: 450MHz, 1.08GHz Package / Case: 2197-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
| EF-DI-50G-RS-FEC-SITE |
Виробник: AMD
Description: LOGICORE 50G IEEE 802.3 REED-SOL
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Site
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Description: LOGICORE 50G IEEE 802.3 REED-SOL
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Site
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
товару немає в наявності
В кошику
од. на суму грн.
| EF-DI-32G-FC-FEC-SITE |
Виробник: AMD
Description: LOGICORE, 32G FIBRE CHANNEL REED
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Site
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
Description: LOGICORE, 32G FIBRE CHANNEL REED
Part Status: Active
Media Delivery Type: Electronically Delivered
License - User Details: Site
License Length: 1 Year
Type: License
For Use With/Related Products: Xilinx
Packaging: Electronic Delivery
товару немає в наявності
В кошику
од. на суму грн.
| XC4005XL-2TQ144C |
Виробник: AMD
Description: IC FPGA 112 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 466
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Total RAM Bits: 6272
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC FPGA 112 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 466
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Total RAM Bits: 6272
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 129 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 17+ | 1332.09 грн |
| XC3195-3PQ208C |
|
Виробник: AMD
Description: FPGA, 484 CLBS, 6500 GATES
Part Status: Active
Packaging: Bulk
Number of I/O: 176
Total RAM Bits: 94944
Number of LABs/CLBs: 484
Supplier Device Package: 208-PQFP (28x28)
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
DigiKey Programmable: Not Verified
Description: FPGA, 484 CLBS, 6500 GATES
Part Status: Active
Packaging: Bulk
Number of I/O: 176
Total RAM Bits: 94944
Number of LABs/CLBs: 484
Supplier Device Package: 208-PQFP (28x28)
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
DigiKey Programmable: Not Verified
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 4784.48 грн |
| XC3195-PQ208CPH |
|
на замовлення 56 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 9+ | 2623.85 грн |
| XCZU2EG-2UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC ZUP MPSOC A53 FPGA 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-L2UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-1UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC ZUP MPSOC A53 FPGA 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 2 шт
В кошику
од. на суму грн.
| XCZU3EG-L2UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
товару немає в наявності
В кошику
од. на суму грн.
| XCZU3EG-L1UBVA530I |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU2EG-L1UBVA530I |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU3EG-2UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
Description: IC ZUP MPSOC A53 FPGA 530BGA
Architecture: MPU, FPGA
Supplier Device Package: 530-FCBGA (16x9.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.333GHz
Package / Case: 530-WFBGA, FCBGA
Packaging: Tray
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| XA7S6-1CSGA225I |
|
Виробник: AMD
Description: IC FPGA 100 I/O 225CSGA
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Number of I/O: 100
Total RAM Bits: 184320
Number of LABs/CLBs: 469
Supplier Device Package: 225-CSGA (13x13)
Number of Logic Elements/Cells: 6000
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
Description: IC FPGA 100 I/O 225CSGA
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Number of I/O: 100
Total RAM Bits: 184320
Number of LABs/CLBs: 469
Supplier Device Package: 225-CSGA (13x13)
Number of Logic Elements/Cells: 6000
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XA7S6-1CPGA196Q |
|
Виробник: AMD
Description: IC FPGA 100 I/O 196CSPBGA
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Number of I/O: 100
Total RAM Bits: 184320
Number of LABs/CLBs: 469
Supplier Device Package: 196-CSPBGA (8x8)
Number of Logic Elements/Cells: 6000
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-TFBGA, CSBGA
Packaging: Tray
Description: IC FPGA 100 I/O 196CSPBGA
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Number of I/O: 100
Total RAM Bits: 184320
Number of LABs/CLBs: 469
Supplier Device Package: 196-CSPBGA (8x8)
Number of Logic Elements/Cells: 6000
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-TFBGA, CSBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 14 шт
В кошику
од. на суму грн.
| XA7S6-2CPGA196I |
|
Виробник: AMD
Description: IC FPGA 100 I/O 196CSPBGA
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Number of I/O: 100
Total RAM Bits: 184320
Number of LABs/CLBs: 469
Supplier Device Package: 196-CSPBGA (8x8)
Number of Logic Elements/Cells: 6000
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-TFBGA, CSBGA
Packaging: Tray
Description: IC FPGA 100 I/O 196CSPBGA
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Number of I/O: 100
Total RAM Bits: 184320
Number of LABs/CLBs: 469
Supplier Device Package: 196-CSPBGA (8x8)
Number of Logic Elements/Cells: 6000
Voltage - Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-TFBGA, CSBGA
Packaging: Tray
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Мінімальне замовлення: 15 шт
В кошику
од. на суму грн.
| XA7S6-1CSGA225Q |
|
Виробник: AMD
Description: IC FPGA 100 I/O 225CSBGA
Qualification: AEC-Q100
Grade: Automotive
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Total RAM Bits: 184320
Number of LABs/CLBs: 469
Supplier Device Package: 225-CSPBGA (13x13)
Number of Logic Elements/Cells: 6000
Voltage - Supply: 0.95V ~ 1.05V
Description: IC FPGA 100 I/O 225CSBGA
Qualification: AEC-Q100
Grade: Automotive
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 225-LFBGA, CSPBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Total RAM Bits: 184320
Number of LABs/CLBs: 469
Supplier Device Package: 225-CSPBGA (13x13)
Number of Logic Elements/Cells: 6000
Voltage - Supply: 0.95V ~ 1.05V
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Мінімальне замовлення: 14 шт
В кошику
од. на суму грн.
| XC4020XL-1HT144I |
Виробник: AMD
Description: IC FPGA 113 I/O 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 113
Total RAM Bits: 25088
Number of LABs/CLBs: 784
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 1862
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 20000
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tray
Description: IC FPGA 113 I/O 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 113
Total RAM Bits: 25088
Number of LABs/CLBs: 784
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Cells: 1862
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 20000
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| XC4020E-4HQ240C |
|
Виробник: AMD
Description: IC FPGA 193 I/O 240QFP
DigiKey Programmable: Not Verified
Number of I/O: 193
Part Status: Obsolete
Total RAM Bits: 25088
Number of LABs/CLBs: 784
Supplier Device Package: 240-PQFP (32x32)
Number of Logic Elements/Cells: 1862
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 20000
Mounting Type: Surface Mount
Package / Case: 240-BFQFP Exposed Pad
Packaging: Bulk
Description: IC FPGA 193 I/O 240QFP
DigiKey Programmable: Not Verified
Number of I/O: 193
Part Status: Obsolete
Total RAM Bits: 25088
Number of LABs/CLBs: 784
Supplier Device Package: 240-PQFP (32x32)
Number of Logic Elements/Cells: 1862
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 20000
Mounting Type: Surface Mount
Package / Case: 240-BFQFP Exposed Pad
Packaging: Bulk
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 23311.61 грн |
| XC1701LPC20I |
|
Виробник: AMD
Description: CONFIG MEMORY, 1MX1, SERIAL
Description: CONFIG MEMORY, 1MX1, SERIAL
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| XC1765ELPC20C |
|
Виробник: AMD
Description: IC PROM SER C-TEMP 3.3V 20-PLCC
DigiKey Programmable: Not Verified
Supplier Device Package: 20-PLCC (9x9)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Programmable Type: OTP
Memory Size: 65kb
Mounting Type: Surface Mount
Package / Case: 20-LCC (J-Lead)
Packaging: Tube
Description: IC PROM SER C-TEMP 3.3V 20-PLCC
DigiKey Programmable: Not Verified
Supplier Device Package: 20-PLCC (9x9)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 70°C
Programmable Type: OTP
Memory Size: 65kb
Mounting Type: Surface Mount
Package / Case: 20-LCC (J-Lead)
Packaging: Tube
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| XC17256ELPC20C |
|
Виробник: AMD
Description: IC PROM SER C-TEMP 256K 20-PLCC
Description: IC PROM SER C-TEMP 256K 20-PLCC
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| XAZU1EG-1SFVC784I |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA Q 784BGA
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
Description: IC ZUP MPSOC A53 FPGA Q 784BGA
Architecture: MPU, FPGA
Supplier Device Package: 784-FCBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 27702.56 грн |
| XC3195-3PQ160C |
|
Виробник: AMD
Description: FPGA, 484 CLBS, 6500 GATES
DigiKey Programmable: Not Verified
Number of I/O: 138
Total RAM Bits: 94944
Number of LABs/CLBs: 484
Supplier Device Package: 160-PQFP (28x28)
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Bulk
Description: FPGA, 484 CLBS, 6500 GATES
DigiKey Programmable: Not Verified
Number of I/O: 138
Total RAM Bits: 94944
Number of LABs/CLBs: 484
Supplier Device Package: 160-PQFP (28x28)
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Bulk
на замовлення 201 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 12+ | 1872.42 грн |
| XC3195-3PC84C |
|
Виробник: AMD
Description: FPGA, 484 CLBS, 6500 GATES
Number of LABs/CLBs: 484
Supplier Device Package: 84-PLCC (29.31x29.31)
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 84-LCC (J-Lead)
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 70
Total RAM Bits: 94944
Description: FPGA, 484 CLBS, 6500 GATES
Number of LABs/CLBs: 484
Supplier Device Package: 84-PLCC (29.31x29.31)
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 84-LCC (J-Lead)
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 70
Total RAM Bits: 94944
на замовлення 658 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 10+ | 2204.81 грн |
| XC4VSX35-10FF668C |
|
Виробник: AMD
Description: IC FPGA 448 I/O 668FCBGA
Description: IC FPGA 448 I/O 668FCBGA
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| XC4VSX35-11FF668C |
|
Виробник: AMD
Description: IC FPGA 448 I/O 668FCBGA
Description: IC FPGA 448 I/O 668FCBGA
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| XC7Z012S-2CLG485E |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Architecture: MCU, FPGA
Supplier Device Package: 485-CSPBGA (19x19)
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Artix™-7 FPGA, 55K Logic Cells
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 766MHz
Package / Case: 485-LFBGA, CSPBGA
Packaging: Tray
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Мінімальне замовлення: 84 шт
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од. на суму грн.
| XC4VLX15-11FF676C |
|
Виробник: AMD
Description: IC FPGA 320 I/O 676FCBGA
Description: IC FPGA 320 I/O 676FCBGA
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| XC4013XL-3PQ208C |
|
Виробник: AMD
Description: IC FPGA 160 I/O 208QFP
Number of I/O: 160
Part Status: Obsolete
Total RAM Bits: 18432
Number of LABs/CLBs: 576
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 1368
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 13000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC FPGA 160 I/O 208QFP
Number of I/O: 160
Part Status: Obsolete
Total RAM Bits: 18432
Number of LABs/CLBs: 576
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 1368
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 13000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 4+ | 5574.34 грн |
| XC95288XV-7PQ208C |
|
Виробник: AMD
Description: IC CPLD 288MC 7.5NS 208QFP
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
Number of I/O: 168
Part Status: Obsolete
Voltage Supply - Internal: 2.37V ~ 2.62V
Number of Logic Elements/Blocks: 16
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 7.5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 288
Number of Gates: 6400
Description: IC CPLD 288MC 7.5NS 208QFP
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
Number of I/O: 168
Part Status: Obsolete
Voltage Supply - Internal: 2.37V ~ 2.62V
Number of Logic Elements/Blocks: 16
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 7.5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 288
Number of Gates: 6400
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| XC95288XL-6PQ208C |
|
Виробник: AMD
Description: IC CPLD 288MC 6NS 208QFP
Number of I/O: 168
Part Status: Obsolete
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 16
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 6 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 288
Number of Gates: 6400
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC CPLD 288MC 6NS 208QFP
Number of I/O: 168
Part Status: Obsolete
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 16
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 6 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 288
Number of Gates: 6400
Programmable Type: In System Programmable (min 10K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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| XCR3512XL-12PQ208C |
|
Виробник: AMD
Description: IC CPLD 512MC 10.8NS 208QFP
Delay Time tpd(1) Max: 10.8 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 512
Number of Gates: 12000
Programmable Type: In System Programmable (min 1K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Bulk
Number of I/O: 180
Part Status: Obsolete
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 32
Supplier Device Package: 208-PQFP (28x28)
Description: IC CPLD 512MC 10.8NS 208QFP
Delay Time tpd(1) Max: 10.8 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 512
Number of Gates: 12000
Programmable Type: In System Programmable (min 1K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Bulk
Number of I/O: 180
Part Status: Obsolete
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 32
Supplier Device Package: 208-PQFP (28x28)
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| XCR3512XL-7PQ208C |
|
Виробник: AMD
Description: IC CPLD 512MC 7NSNS 208QFP
Number of I/O: 180
Part Status: Obsolete
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 32
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 7 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 512
Number of Gates: 12000
Programmable Type: In System Programmable (min 1K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Bulk
Description: IC CPLD 512MC 7NSNS 208QFP
Number of I/O: 180
Part Status: Obsolete
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 32
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 7 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 512
Number of Gates: 12000
Programmable Type: In System Programmable (min 1K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Bulk
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| XCR3512XL-10PQ208I |
|
Виробник: AMD
Description: IC CPLD 512MC 9NS 208QFP
Package / Case: 208-BFQFP
Packaging: Bulk
Number of I/O: 180
Part Status: Obsolete
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of Logic Elements/Blocks: 32
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 9 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 512
Number of Gates: 12000
Programmable Type: In System Programmable (min 1K program/erase cycles)
Mounting Type: Surface Mount
Description: IC CPLD 512MC 9NS 208QFP
Package / Case: 208-BFQFP
Packaging: Bulk
Number of I/O: 180
Part Status: Obsolete
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of Logic Elements/Blocks: 32
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 9 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 512
Number of Gates: 12000
Programmable Type: In System Programmable (min 1K program/erase cycles)
Mounting Type: Surface Mount
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В кошику
од. на суму грн.
| XCR3512XL-10PQ208C |
|
Виробник: AMD
Description: IC CPLD 512MC 9NS 208QFP
Number of Macrocells: 512
Number of Gates: 12000
Programmable Type: In System Programmable (min 1K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Bulk
Number of I/O: 180
Part Status: Obsolete
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 32
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 9 ns
Operating Temperature: 0°C ~ 70°C (TA)
Description: IC CPLD 512MC 9NS 208QFP
Number of Macrocells: 512
Number of Gates: 12000
Programmable Type: In System Programmable (min 1K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Bulk
Number of I/O: 180
Part Status: Obsolete
Voltage Supply - Internal: 3V ~ 3.6V
Number of Logic Elements/Blocks: 32
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 9 ns
Operating Temperature: 0°C ~ 70°C (TA)
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| XCR3512XL-12PQ208I |
|
Виробник: AMD
Description: IC CPLD 512MC 10.8NS 208QFP
Number of I/O: 180
Number of Logic Elements/Blocks: 32
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 10.8 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 512
Number of Gates: 12000
Programmable Type: In System Programmable (min 1K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Bulk
Part Status: Obsolete
Voltage Supply - Internal: 2.7V ~ 3.6V
Description: IC CPLD 512MC 10.8NS 208QFP
Number of I/O: 180
Number of Logic Elements/Blocks: 32
Supplier Device Package: 208-PQFP (28x28)
Delay Time tpd(1) Max: 10.8 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 512
Number of Gates: 12000
Programmable Type: In System Programmable (min 1K program/erase cycles)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Packaging: Bulk
Part Status: Obsolete
Voltage Supply - Internal: 2.7V ~ 3.6V
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| XCZU3EG-1UBVA530I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 44157.96 грн |
| XCZU3EG-1UBVA530E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 35381.59 грн |
| XCZU3CG-2UBVA530I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 48222.96 грн |
| XCZU3EG-2UBVA530I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 54362.38 грн |
| XA7K160T-1FFG676Q |
|
Виробник: AMD
Description: FPGA KINTEX7 Q100 400 I/O 676BGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Part Status: Active
Total RAM Bits: 11980800
Number of LABs/CLBs: 12675
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 162240
Voltage - Supply: 0.97V ~ 1.03V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
Description: FPGA KINTEX7 Q100 400 I/O 676BGA
DigiKey Programmable: Not Verified
Number of I/O: 400
Part Status: Active
Total RAM Bits: 11980800
Number of LABs/CLBs: 12675
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 162240
Voltage - Supply: 0.97V ~ 1.03V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Tray
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 54202.56 грн |
| XCAU10P-2SBVB484I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 484BGA
Number of LABs/CLBs: 5500
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 96250
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
Number of I/O: 204
Part Status: Active
Total RAM Bits: 3670016
DigiKey Programmable: Not Verified
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Description: IC FPGA ARTIXUP 484BGA
Number of LABs/CLBs: 5500
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 96250
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
Number of I/O: 204
Part Status: Active
Total RAM Bits: 3670016
DigiKey Programmable: Not Verified
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 15753.63 грн |
| XCAU10P-1SBVB484E |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 484BGA
Number of I/O: 204
Part Status: Active
Total RAM Bits: 3670016
Number of LABs/CLBs: 5500
Supplier Device Package: 484-FCBGA (19x19)
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
Number of Logic Elements/Cells: 96250
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 484BGA
Number of I/O: 204
Part Status: Active
Total RAM Bits: 3670016
Number of LABs/CLBs: 5500
Supplier Device Package: 484-FCBGA (19x19)
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
Number of Logic Elements/Cells: 96250
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCAU10P-1SBVB484I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 484BGA
Number of I/O: 204
Part Status: Active
Total RAM Bits: 3670016
Number of LABs/CLBs: 5500
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 96250
Voltage - Supply: 0.698V ~ 0.742V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 484BGA
Number of I/O: 204
Part Status: Active
Total RAM Bits: 3670016
Number of LABs/CLBs: 5500
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 96250
Voltage - Supply: 0.698V ~ 0.742V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XCVU11P-2FLGB2104I |
|
Виробник: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Number of I/O: 572
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 572 I/O 2104FCBGA
Number of I/O: 572
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU11P-2FLGB2104E |
|
Виробник: AMD
Description: IC FPGA 572 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 572
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 572 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 572
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCKU11P-2FFVD900I |
|
Виробник: AMD
Description: IC FPGA 408 I/O 900FCBGA
Number of I/O: 408
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 900-FCBGA (31x31)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 408 I/O 900FCBGA
Number of I/O: 408
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 900-FCBGA (31x31)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCKU11P-2FFVA1156I |
|
Виробник: AMD
Description: IC FPGA 464 I/O 1156FCBGA
Number of I/O: 464
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 464 I/O 1156FCBGA
Number of I/O: 464
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU11P-2FLGF1924I |
|
Виробник: AMD
Description: IC FPGA 624 I/O 1924FCBGA
Number of I/O: 624
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 1924-FCBGA (45x45)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 624 I/O 1924FCBGA
Number of I/O: 624
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 1924-FCBGA (45x45)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCKU11P-2FFVD900E |
|
Виробник: AMD
Description: IC FPGA 408 I/O 900FCBGA
Number of I/O: 408
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 900-FCBGA (31x31)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 408 I/O 900FCBGA
Number of I/O: 408
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 900-FCBGA (31x31)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU11P-2FLGA2577E |
|
Виробник: AMD
Description: IC FPGA 448 I/O 2577FCBGA
Number of I/O: 448
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2577-FCBGA (52.5x52.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2577-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 448 I/O 2577FCBGA
Number of I/O: 448
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2577-FCBGA (52.5x52.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2577-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCKU11P-2FFVA1156E |
|
Виробник: AMD
Description: IC FPGA 464 I/O 1156FCBGA
Number of I/O: 464
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 464 I/O 1156FCBGA
Number of I/O: 464
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU11P-2FLGC2104E |
|
Виробник: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Number of I/O: 416
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 416 I/O 2104FCBGA
Number of I/O: 416
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCAU25P-2SFVB784I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 784FBGA
Number of I/O: 304
Part Status: Active
Total RAM Bits: 4928307
Number of LABs/CLBs: 17625
Supplier Device Package: 784-FCBGA (23x23)
Number of Logic Elements/Cells: 308437
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 784FBGA
Number of I/O: 304
Part Status: Active
Total RAM Bits: 4928307
Number of LABs/CLBs: 17625
Supplier Device Package: 784-FCBGA (23x23)
Number of Logic Elements/Cells: 308437
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 47260.90 грн |
| XCS20XL-4CS144C |
|
Виробник: AMD
Description: IC FPGA 113 I/O 144CSBGA
Number of I/O: 113
Part Status: Obsolete
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 20000
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 113 I/O 144CSBGA
Number of I/O: 113
Part Status: Obsolete
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 20000
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 18 шт
В кошику
од. на суму грн.
| XCVC1502-1LLIVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
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| XCVC1702-1LSIVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 400MHz, 1GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AI-CORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 400MHz, 1GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1502-2LLEVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
Speed: 450MHz, 1.08GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AI-CORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
Speed: 450MHz, 1.08GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.