| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
| XCVU11P-2FLGB2104E | AMD |
 Description: IC FPGA 572 I/O 2104FCBGADigiKey Programmable: Not Verified Number of I/O: 572 Part Status: Active Total RAM Bits: 396150400 Number of LABs/CLBs: 162000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of Logic Elements/Cells: 2835000 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCKU11P-2FFVD900I | AMD |
Description: IC FPGA 408 I/O 900FCBGA Number of I/O: 408 Part Status: Active Total RAM Bits: 53964800 Number of LABs/CLBs: 37320 Supplier Device Package: 900-FCBGA (31x31) Number of Logic Elements/Cells: 653100 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 900-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCKU11P-2FFVA1156I | AMD |
Description: IC FPGA 464 I/O 1156FCBGA Number of I/O: 464 Part Status: Active Total RAM Bits: 53964800 Number of LABs/CLBs: 37320 Supplier Device Package: 1156-FCBGA (35x35) Number of Logic Elements/Cells: 653100 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU11P-2FLGF1924I | AMD |
Description: IC FPGA 624 I/O 1924FCBGA Number of I/O: 624 Part Status: Active Total RAM Bits: 396150400 Number of LABs/CLBs: 162000 Supplier Device Package: 1924-FCBGA (45x45) Number of Logic Elements/Cells: 2835000 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1924-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCKU11P-2FFVD900E | AMD |
Description: IC FPGA 408 I/O 900FCBGA Number of I/O: 408 Part Status: Active Total RAM Bits: 53964800 Number of LABs/CLBs: 37320 Supplier Device Package: 900-FCBGA (31x31) Number of Logic Elements/Cells: 653100 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 900-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XCVU11P-2FLGA2577E | AMD |
Description: IC FPGA 448 I/O 2577FCBGA Number of I/O: 448 Part Status: Active Total RAM Bits: 396150400 Number of LABs/CLBs: 162000 Supplier Device Package: 2577-FCBGA (52.5x52.5) Number of Logic Elements/Cells: 2835000 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2577-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU11P-2FFVA1156E | AMD |
Description: IC FPGA 464 I/O 1156FCBGA Number of I/O: 464 Part Status: Active Total RAM Bits: 53964800 Number of LABs/CLBs: 37320 Supplier Device Package: 1156-FCBGA (35x35) Number of Logic Elements/Cells: 653100 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU11P-2FLGC2104E | AMD |
Description: IC FPGA 416 I/O 2104FCBGA Number of I/O: 416 Part Status: Active Total RAM Bits: 396150400 Number of LABs/CLBs: 162000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of Logic Elements/Cells: 2835000 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCAU25P-2SFVB784I | AMD |
Description: IC FPGA ARTIXUP 784FBGA Number of I/O: 304 Part Status: Active Total RAM Bits: 4928307 Number of LABs/CLBs: 17625 Supplier Device Package: 784-FCBGA (23x23) Number of Logic Elements/Cells: 308437 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 784-BFBGA, FCBGA Packaging: Tray DigiKey Programmable: Not Verified |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| XCS20XL-4CS144C | AMD |
Description: IC FPGA 113 I/O 144CSBGA Number of I/O: 113 Part Status: Obsolete Total RAM Bits: 12800 Number of LABs/CLBs: 400 Supplier Device Package: 144-LCSBGA (12x12) Number of Logic Elements/Cells: 950 Voltage - Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 20000 Mounting Type: Surface Mount Package / Case: 144-TFBGA, CSPBGA Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 18 шт В кошику од. на суму грн. | |||
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XCVC1502-1LLIVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1702-1LSIVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 2197-FCBGA (45x45) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) Speed: 400MHz, 1GHz Package / Case: 2197-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1502-2LLEVSVA2197 | AMD |
Description: IC VERSAL AI-CORE FPGA 2197BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 2197-FCBGA (45x45) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) Speed: 450MHz, 1.08GHz Package / Case: 2197-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-1MSEVSVA2197 | AMD |
Description: IC VERSAL AICORE FPGA 2197BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 2197-FCBGA (45x45) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 600MHz, 1.3GHz Package / Case: 2197-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVC1902-2MLIVSVA2197 | AMD |
Description: IC VERSAL AICORE FPGA 2197BGA Part Status: Active Architecture: MPU, FPGA Supplier Device Package: 2197-FCBGA (45x45) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 600MHz, 1.4GHz Package / Case: 2197-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MSENSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-2LLEVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 450MHz, 1.08GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1402-2LLEVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 450MHz, 1.08GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MLIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCVM1302-1LLIVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MLIVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1402-2MLINSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.4GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-2LSENBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 450MHz, 1.08GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1402-1MLIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MLINSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MSEVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MLINBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MSEVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MSIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MSINSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MSINBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MSENBVB1024 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1024BGA Packaging: Tray Package / Case: 1024-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1024-BGA (31x31) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCVM1302-1MSIVFVC1596 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1596BGA Packaging: Tray Package / Case: 1596-BFBGA Speed: 600MHz, 1.3GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1596-BGA (37.5x37.5) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EK-U1-VCU118-G-J | AMD |
Description: KIT VCU118 VIRTEX ULTRASCALE Part Status: Active Platform: Virtex UltraScale+ FPGA VCU118 Japan PCIe Card Contents: Board(s), Cable(s) - Power Supply Not Included - Type: FPGA For Use With/Related Products: XCVU9P Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XC5202-5PC84C | AMD |
Description: FPGA, 64 CLBS, 2000 GATES DigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XC5202-5VQ100C | AMD |
Description: FPGA, 64 CLBS, 2000 GATES DigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
| XC7Z010-3CLG225E4334 | AMD |
Description: XC7Z010-3CLG225E4334 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC7Z010-3CLG400E4893 | AMD |
Description: XC7Z010-3CLG400E4893 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCVP1802-1MSELSVC4072 | AMD |
Description: IC VERSAL AI-CORE FPGA 4072BGA Primary Attributes: Versal™ Premium FPGA, 7.3M Logic Cells Supplier Device Package: 4072-FCBGA (65x65) Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Package / Case: 4072-BBGA, FCBGA Packaging: Tray Part Status: Active Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCVP1802-2MLELSVC4072 | AMD |
Description: IC VERSAL AI-CORE FPGA 4072BGA Packaging: Tray Package / Case: 4072-BBGA, FCBGA RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 7.3M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 4072-FCBGA (65x65) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
|
XCVP1802-2MSELSVC4072 | AMD |
Description: IC VERSAL AI-CORE FPGA 4072BGA Packaging: Tray Package / Case: 4072-BBGA, FCBGA RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 7.3M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 4072-FCBGA (65x65) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
| 835-1015-059 | AMD |
Description: 835-1015-059 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC2C256-7CP132I0100 | AMD |
Description: XC2C256-7CP132I UPDATING MOQ/FOI Packaging: Tape & Reel (TR) Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | |||
| XC2C256-7CP132I0100 | AMD |
Description: XC2C256-7CP132I UPDATING MOQ/FOI Packaging: Cut Tape (CT) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC2C256-7CPG132I0100 | AMD |
Description: XC2C256-7CPG132I UPDATING MOQ/FO Packaging: Tape & Reel (TR) Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | |||
| XC2C256-7CPG132I0100 | AMD |
Description: XC2C256-7CPG132I UPDATING MOQ/FO Packaging: Cut Tape (CT) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC2C256-6TQ144CR02 | AMD |
Description: XC2C256-6TQ144C Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC2C256-6VQ100CR02 | AMD |
Description: XC2C256-6VQ100C Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC2C256-7TQ144CR02 | AMD |
Description: XC2C256-7TQ144C Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC2C256-7TQG144I4011 | AMD |
Description: XC2C256-7TQG144I UPDATING MOQ/FO Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC2C256-7VQ100CR02 | AMD |
Description: XC2C256-7VQ100C Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-2FLVA1517I4186 | AMD |
Description: XCKU115-2FLVA1517I4186 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-2FLVA1517I3991 | AMD |
Description: XCKU115-2FLVA1517I3991 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-3FLVA1517E4539 | AMD |
Description: XCKU115-3FLVA1517E4539 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-2FLVA1517E4798 | AMD |
Description: XCKU115-2FLVA1517E4798 Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-2FFVA1517I3991 | AMD |
Description: XCKU060-2FFVA1517I3991 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU115-2FLVA1517E4539 | AMD |
Description: XCKU115-2FLVA1517E4539 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU060-1FFVA1517C4434 | AMD |
Description: XCKU060-1FFVA1517C4434 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCKU085-1FLVA1517CES9873 | AMD |
Description: XCKU085-1FLVA1517CES9873 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XQKU060-L1FFQA1517I5000 | AMD |
Description: XQKU060-L1FFQA1517I5000 Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. |
| XCVU11P-2FLGB2104E |
|
Виробник: AMD
Description: IC FPGA 572 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 572
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 572 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 572
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCKU11P-2FFVD900I |
|
Виробник: AMD
Description: IC FPGA 408 I/O 900FCBGA
Number of I/O: 408
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 900-FCBGA (31x31)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 408 I/O 900FCBGA
Number of I/O: 408
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 900-FCBGA (31x31)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCKU11P-2FFVA1156I |
|
Виробник: AMD
Description: IC FPGA 464 I/O 1156FCBGA
Number of I/O: 464
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 464 I/O 1156FCBGA
Number of I/O: 464
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU11P-2FLGF1924I |
|
Виробник: AMD
Description: IC FPGA 624 I/O 1924FCBGA
Number of I/O: 624
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 1924-FCBGA (45x45)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 624 I/O 1924FCBGA
Number of I/O: 624
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 1924-FCBGA (45x45)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1924-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCKU11P-2FFVD900E |
|
Виробник: AMD
Description: IC FPGA 408 I/O 900FCBGA
Number of I/O: 408
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 900-FCBGA (31x31)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 408 I/O 900FCBGA
Number of I/O: 408
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 900-FCBGA (31x31)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU11P-2FLGA2577E |
|
Виробник: AMD
Description: IC FPGA 448 I/O 2577FCBGA
Number of I/O: 448
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2577-FCBGA (52.5x52.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2577-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 448 I/O 2577FCBGA
Number of I/O: 448
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2577-FCBGA (52.5x52.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2577-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCKU11P-2FFVA1156E |
|
Виробник: AMD
Description: IC FPGA 464 I/O 1156FCBGA
Number of I/O: 464
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 464 I/O 1156FCBGA
Number of I/O: 464
Part Status: Active
Total RAM Bits: 53964800
Number of LABs/CLBs: 37320
Supplier Device Package: 1156-FCBGA (35x35)
Number of Logic Elements/Cells: 653100
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU11P-2FLGC2104E |
|
Виробник: AMD
Description: IC FPGA 416 I/O 2104FCBGA
Number of I/O: 416
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 416 I/O 2104FCBGA
Number of I/O: 416
Part Status: Active
Total RAM Bits: 396150400
Number of LABs/CLBs: 162000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 2835000
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCAU25P-2SFVB784I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 784FBGA
Number of I/O: 304
Part Status: Active
Total RAM Bits: 4928307
Number of LABs/CLBs: 17625
Supplier Device Package: 784-FCBGA (23x23)
Number of Logic Elements/Cells: 308437
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 784FBGA
Number of I/O: 304
Part Status: Active
Total RAM Bits: 4928307
Number of LABs/CLBs: 17625
Supplier Device Package: 784-FCBGA (23x23)
Number of Logic Elements/Cells: 308437
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 784-BFBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 46186.79 грн |
| XCS20XL-4CS144C |
|
Виробник: AMD
Description: IC FPGA 113 I/O 144CSBGA
Number of I/O: 113
Part Status: Obsolete
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 20000
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 113 I/O 144CSBGA
Number of I/O: 113
Part Status: Obsolete
Total RAM Bits: 12800
Number of LABs/CLBs: 400
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Cells: 950
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 20000
Mounting Type: Surface Mount
Package / Case: 144-TFBGA, CSPBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 18 шт
В кошику
од. на суму грн.
| XCVC1502-1LLIVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1702-1LSIVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 400MHz, 1GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AI-CORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
Speed: 400MHz, 1GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1502-2LLEVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
Speed: 450MHz, 1.08GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AI-CORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 800k Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
Speed: 450MHz, 1.08GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1902-1MSEVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.3GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AICORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.3GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVC1902-2MLIVSVA2197 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.4GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
Description: IC VERSAL AICORE FPGA 2197BGA
Part Status: Active
Architecture: MPU, FPGA
Supplier Device Package: 2197-FCBGA (45x45)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 1.4GHz
Package / Case: 2197-BFBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MSENSVF1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-2LLEVSVD1760 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1402-2LLEVSVD1760 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MLIVSVD1760 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1LLIVFVC1596 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MLIVFVC1596 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1402-2MLINSVF1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-2LSENBVB1024 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 450MHz, 1.08GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1402-1MLIVSVD1760 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MLINSVF1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MSEVSVD1760 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MLINBVB1024 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MSEVFVC1596 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MSIVSVD1760 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MSINSVF1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MSINBVB1024 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVM1302-1MSENBVB1024 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1024BGA
Packaging: Tray
Package / Case: 1024-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1024-BGA (31x31)
Architecture: MPU, FPGA
Part Status: Active
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| XCVM1302-1MSIVFVC1596 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA
Speed: 600MHz, 1.3GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-BGA (37.5x37.5)
Architecture: MPU, FPGA
Part Status: Active
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| EK-U1-VCU118-G-J |
|
Виробник: AMD
Description: KIT VCU118 VIRTEX ULTRASCALE
Part Status: Active
Platform: Virtex UltraScale+ FPGA VCU118 Japan PCIe Card
Contents: Board(s), Cable(s) - Power Supply Not Included -
Type: FPGA
For Use With/Related Products: XCVU9P
Packaging: Bulk
Description: KIT VCU118 VIRTEX ULTRASCALE
Part Status: Active
Platform: Virtex UltraScale+ FPGA VCU118 Japan PCIe Card
Contents: Board(s), Cable(s) - Power Supply Not Included -
Type: FPGA
For Use With/Related Products: XCVU9P
Packaging: Bulk
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| XC5202-5PC84C |
|
Виробник: AMD
Description: FPGA, 64 CLBS, 2000 GATES
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: FPGA, 64 CLBS, 2000 GATES
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
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В кошику
од. на суму грн.
| XC5202-5VQ100C |
|
Виробник: AMD
Description: FPGA, 64 CLBS, 2000 GATES
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: FPGA, 64 CLBS, 2000 GATES
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| XCVP1802-1MSELSVC4072 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 4072BGA
Primary Attributes: Versal™ Premium FPGA, 7.3M Logic Cells
Supplier Device Package: 4072-FCBGA (65x65)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Package / Case: 4072-BBGA, FCBGA
Packaging: Tray
Part Status: Active
Architecture: MPU, FPGA
Description: IC VERSAL AI-CORE FPGA 4072BGA
Primary Attributes: Versal™ Premium FPGA, 7.3M Logic Cells
Supplier Device Package: 4072-FCBGA (65x65)
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Package / Case: 4072-BBGA, FCBGA
Packaging: Tray
Part Status: Active
Architecture: MPU, FPGA
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В кошику
од. на суму грн.
| XCVP1802-2MLELSVC4072 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 4072BGA
Packaging: Tray
Package / Case: 4072-BBGA, FCBGA
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 7.3M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 4072-FCBGA (65x65)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AI-CORE FPGA 4072BGA
Packaging: Tray
Package / Case: 4072-BBGA, FCBGA
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 7.3M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 4072-FCBGA (65x65)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| XCVP1802-2MSELSVC4072 |
|
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 4072BGA
Packaging: Tray
Package / Case: 4072-BBGA, FCBGA
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 7.3M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 4072-FCBGA (65x65)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AI-CORE FPGA 4072BGA
Packaging: Tray
Package / Case: 4072-BBGA, FCBGA
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 7.3M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 4072-FCBGA (65x65)
Architecture: MPU, FPGA
Part Status: Active
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| XC2C256-7CP132I0100 |
Виробник: AMD
Description: XC2C256-7CP132I UPDATING MOQ/FOI
Packaging: Tape & Reel (TR)
Part Status: Active
Description: XC2C256-7CP132I UPDATING MOQ/FOI
Packaging: Tape & Reel (TR)
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 3000 шт
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од. на суму грн.
| XC2C256-7CP132I0100 |
Виробник: AMD
Description: XC2C256-7CP132I UPDATING MOQ/FOI
Packaging: Cut Tape (CT)
Part Status: Active
Description: XC2C256-7CP132I UPDATING MOQ/FOI
Packaging: Cut Tape (CT)
Part Status: Active
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| XC2C256-7CPG132I0100 |
Виробник: AMD
Description: XC2C256-7CPG132I UPDATING MOQ/FO
Packaging: Tape & Reel (TR)
Part Status: Active
Description: XC2C256-7CPG132I UPDATING MOQ/FO
Packaging: Tape & Reel (TR)
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 3000 шт
В кошику
од. на суму грн.
| XC2C256-7CPG132I0100 |
Виробник: AMD
Description: XC2C256-7CPG132I UPDATING MOQ/FO
Packaging: Cut Tape (CT)
Part Status: Active
Description: XC2C256-7CPG132I UPDATING MOQ/FO
Packaging: Cut Tape (CT)
Part Status: Active
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од. на суму грн.