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XCZU48DR-1FSVE1156I XCZU48DR-1FSVE1156I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU43DR-L1FSVG1517I XCZU43DR-L1FSVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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XCZU47DR-L1FSVG1517I XCZU47DR-L1FSVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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XCZU65DR-L2FSVE1156I XCZU65DR-L2FSVE1156I AMD Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU46DR-1FSVH1760I XCZU46DR-1FSVH1760I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
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XCZU67DR-L2FSVE1156I XCZU67DR-L2FSVE1156I AMD Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU48DR-1FSVG1517I XCZU48DR-1FSVG1517I AMD ds889-zynq-usp-rfsoc-overview Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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XC7A200T-L1FB676I XC7A200T-L1FB676I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 400 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 400
DigiKey Programmable: Not Verified
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XC7A200T-2FB676I XC7A200T-2FB676I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 400
DigiKey Programmable: Not Verified
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XC7A200T-L2SBG484E XC7A200T-L2SBG484E AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-L1FB484I XC7A200T-L1FB484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tube
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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 Мінімальне замовлення: 60 шт
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XC7A200T-2FB484I XC7A200T-2FB484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-1SB484I XC7A200T-1SB484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-L2FFG1156E XC7A200T-L2FFG1156E AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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XC7A200T-1FF1156I XC7A200T-1FF1156I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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XC7A200T-2SB484I XC7A200T-2SB484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-2FF1156I XC7A200T-2FF1156I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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XCZU65DR-1FFVE1156I XCZU65DR-1FFVE1156I AMD Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU67DR-1FFVE1156I XCZU67DR-1FFVE1156I AMD Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU65DR-L1FFVE1156I XCZU65DR-L1FFVE1156I AMD Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCV150-4BG256C XCV150-4BG256C AMD Virtex_2.5_V.pdf Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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XCV150-5BG256I XCV150-5BG256I AMD Virtex_2.5_V.pdf Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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XCV150-6BG256C XCV150-6BG256C AMD Virtex_2.5_V.pdf Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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XCZU4EV-2FBVB900I XCZU4EV-2FBVB900I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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XC7S100-2FGGA676C XC7S100-2FGGA676C AMD Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
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XC7A75T-2FGG676I XC7A75T-2FGG676I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 300
DigiKey Programmable: Not Verified
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
1+16554.70 грн
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A-V80-P64G-PQ-G A-V80-P64G-PQ-G AMD Summary Description: BD V80 DCAB ALVEO QSFP56/4 PCIE
Power (Watts): 190W
Packaging: Box
Memory Size: 32GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 819GB/s
Cooling Type: Heat Sink
LUTs: 2600K
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
1+724615.07 грн
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XC3S1500-4FG320C XC3S1500-4FG320C AMD ds099 Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Number of I/O: 221
DigiKey Programmable: Not Verified
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 Мінімальне замовлення: 84 шт
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XCVE1752-1MSENSVG1369 XCVE1752-1MSENSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-1MSEVSVA2197 XCVE1752-1MSEVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
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XCVE1752-1LSENSVG1369 XCVE1752-1LSENSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-2MSENSVG1369 XCVE1752-2MSENSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-1MSINSVG1369 XCVE1752-1MSINSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товару немає в наявності
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XCVE1752-1LSEVSVA2197 XCVE1752-1LSEVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AI-EDGE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
товару немає в наявності
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XCVE1752-1MSIVSVA2197 XCVE1752-1MSIVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
товару немає в наявності
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XCVE1752-2MSEVSVA2197 XCVE1752-2MSEVSVA2197 AMD ds950-versal-overview Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
товару немає в наявності
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XCVE1752-1LSINSVG1369 XCVE1752-1LSINSVG1369 AMD ds950-versal-overview Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товару немає в наявності
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CK-U1-ZCU1285-G CK-U1-ZCU1285-G AMD ug1348-zcu1285-char-bd.pdf Description: KIT ZUP RFSOC ZCU1285
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU39DR
Platform: Zynq UltraScale+ RFSoC ZCU1285
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XCZU7EV-2FBVB900I XCZU7EV-2FBVB900I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+316628.23 грн
В кошику  од. на суму  грн.
XCZU3EG-2SFVC784I XCZU3EG-2SFVC784I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+69490.28 грн
В кошику  од. на суму  грн.
XCZU4EV-1SFVC784I XCZU4EV-1SFVC784I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
1+109161.75 грн
В кошику  од. на суму  грн.
XCZU5EV-2SFVC784I XCZU5EV-2SFVC784I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+196246.87 грн
В кошику  од. на суму  грн.
XCZU4EG-2SFVE784I XCZU4EG-2SFVE784I AMD Description: FPGA MPSOC QUAD A53 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
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В кошику  од. на суму  грн.
XCZU4EV-2SFVC784I XCZU4EV-2SFVC784I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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XCZU5EG-1SFVC784I XCZU5EG-1SFVC784I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+141627.02 грн
В кошику  од. на суму  грн.
XCZU5EV-1SFVC784I XCZU5EV-1SFVC784I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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XCZU7EV-1FBVB900E XCZU7EV-1FBVB900E AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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XCZU5EG-2SFVE784I XCZU5EG-2SFVE784I AMD Description: FPGA MPSOC QUAD A53 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
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XCZU5EV-2SFVE784I XCZU5EV-2SFVE784I AMD XCZU4EG-2SFVC784I.pdf Description: FPGA MPSOC QUADA53 H264/5 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+242063.72 грн
В кошику  од. на суму  грн.
XCZU7EV-1FBVB900I XCZU7EV-1FBVB900I AMD dfRkDKgzEvo5CsUiQJdEkg Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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XCZU9EG-1FFVC900I XCZU9EG-1FFVC900I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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В кошику  од. на суму  грн.
XCZU9EG-2FFVC900I XCZU9EG-2FFVC900I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+381178.68 грн
В кошику  од. на суму  грн.
XC3S400-4PQG208C XC3S400-4PQG208C AMD ds099 Description: IC FPGA 141 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 141
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
XC3S1200E-4FGG320I XC3S1200E-4FGG320I AMD ds312 Description: IC FPGA 250 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 19512
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 2168
Total RAM Bits: 516096
Number of I/O: 250
DigiKey Programmable: Not Verified
на замовлення 304 шт:
термін постачання 21-31 дні (днів)
1+12589.78 грн
В кошику  од. на суму  грн.
XC3S2000-4FGG456C XC3S2000-4FGG456C AMD ds099 Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
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XC3S2000-4FGG676C XC3S2000-4FGG676C AMD ds099 Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 40 шт
В кошику  од. на суму  грн.
XC3S2000-4FG456C XC3S2000-4FG456C AMD ds099 Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 60 шт
В кошику  од. на суму  грн.
XC3S2000-4FGG676I XC3S2000-4FGG676I AMD ds099 Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 40 шт
В кошику  од. на суму  грн.
XC3S2000-4FG456I XC3S2000-4FG456I AMD ds099 Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 60 шт
В кошику  од. на суму  грн.
XC3S2000-4FG676C XC3S2000-4FG676C AMD ds099 Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 40 шт
В кошику  од. на суму  грн.
XCZU48DR-1FSVE1156I ds889-zynq-usp-rfsoc-overview
XCZU48DR-1FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU43DR-L1FSVG1517I ds889-zynq-usp-rfsoc-overview
XCZU43DR-L1FSVG1517I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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XCZU47DR-L1FSVG1517I ds889-zynq-usp-rfsoc-overview
XCZU47DR-L1FSVG1517I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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XCZU65DR-L2FSVE1156I
XCZU65DR-L2FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU46DR-1FSVH1760I ds889-zynq-usp-rfsoc-overview
XCZU46DR-1FSVH1760I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
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XCZU67DR-L2FSVE1156I
XCZU67DR-L2FSVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU48DR-1FSVG1517I ds889-zynq-usp-rfsoc-overview
XCZU48DR-1FSVG1517I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1517BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
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XC7A200T-L1FB676I ds181_Artix_7_Data_Sheet
XC7A200T-L1FB676I
Виробник: AMD
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 400
DigiKey Programmable: Not Verified
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XC7A200T-2FB676I ds181_Artix_7_Data_Sheet
XC7A200T-2FB676I
Виробник: AMD
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 400
DigiKey Programmable: Not Verified
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XC7A200T-L2SBG484E ds181_Artix_7_Data_Sheet
XC7A200T-L2SBG484E
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-L1FB484I ds181_Artix_7_Data_Sheet
XC7A200T-L1FB484I
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tube
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
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XC7A200T-2FB484I ds181_Artix_7_Data_Sheet
XC7A200T-2FB484I
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-1SB484I ds181_Artix_7_Data_Sheet
XC7A200T-1SB484I
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-L2FFG1156E ds181_Artix_7_Data_Sheet
XC7A200T-L2FFG1156E
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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XC7A200T-1FF1156I ds181_Artix_7_Data_Sheet
XC7A200T-1FF1156I
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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XC7A200T-2SB484I ds181_Artix_7_Data_Sheet
XC7A200T-2SB484I
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-2FF1156I ds181_Artix_7_Data_Sheet
XC7A200T-2FF1156I
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 500
DigiKey Programmable: Not Verified
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XCZU65DR-1FFVE1156I
XCZU65DR-1FFVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU67DR-1FFVE1156I
XCZU67DR-1FFVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCZU65DR-L1FFVE1156I
XCZU65DR-L1FFVE1156I
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA LP 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq® UltraScale+™ RFSoC
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
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XCV150-4BG256C Virtex_2.5_V.pdf
XCV150-4BG256C
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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XCV150-5BG256I Virtex_2.5_V.pdf
XCV150-5BG256I
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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XCV150-6BG256C Virtex_2.5_V.pdf
XCV150-6BG256C
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 164674
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 3888
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 864
Total RAM Bits: 49152
Number of I/O: 180
DigiKey Programmable: Not Verified
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XCZU4EV-2FBVB900I dfRkDKgzEvo5CsUiQJdEkg
XCZU4EV-2FBVB900I
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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XC7S100-2FGGA676C Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics
XC7S100-2FGGA676C
Виробник: AMD
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
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XC7A75T-2FGG676I ds181_Artix_7_Data_Sheet
XC7A75T-2FGG676I
Виробник: AMD
Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 300
DigiKey Programmable: Not Verified
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+16554.70 грн
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A-V80-P64G-PQ-G Summary
A-V80-P64G-PQ-G
Виробник: AMD
Description: BD V80 DCAB ALVEO QSFP56/4 PCIE
Power (Watts): 190W
Packaging: Box
Memory Size: 32GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 819GB/s
Cooling Type: Heat Sink
LUTs: 2600K
на замовлення 47 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+724615.07 грн
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XC3S1500-4FG320C ds099
XC3S1500-4FG320C
Виробник: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Bulk
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Number of I/O: 221
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 84 шт
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XCVE1752-1MSENSVG1369 ds950-versal-overview
XCVE1752-1MSENSVG1369
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-1MSEVSVA2197 ds950-versal-overview
XCVE1752-1MSEVSVA2197
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
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XCVE1752-1LSENSVG1369 ds950-versal-overview
XCVE1752-1LSENSVG1369
Виробник: AMD
Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-2MSENSVG1369 ds950-versal-overview
XCVE1752-2MSENSVG1369
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-1MSINSVG1369 ds950-versal-overview
XCVE1752-1MSINSVG1369
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
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XCVE1752-1LSEVSVA2197 ds950-versal-overview
XCVE1752-1LSEVSVA2197
Виробник: AMD
Description: IC VERSAL AI-EDGE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
товару немає в наявності
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XCVE1752-1MSIVSVA2197 ds950-versal-overview
XCVE1752-1MSIVSVA2197
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
XCVE1752-2MSEVSVA2197 ds950-versal-overview
XCVE1752-2MSEVSVA2197
Виробник: AMD
Description: IC VERSAL AI-CORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Edge FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
XCVE1752-1LSINSVG1369 ds950-versal-overview
XCVE1752-1LSINSVG1369
Виробник: AMD
Description: IC VERSAL AI-EDGE FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-FCBGA (35x35)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
CK-U1-ZCU1285-G ug1348-zcu1285-char-bd.pdf
CK-U1-ZCU1285-G
Виробник: AMD
Description: KIT ZUP RFSOC ZCU1285
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: XCZU39DR
Platform: Zynq UltraScale+ RFSoC ZCU1285
товару немає в наявності
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XCZU7EV-2FBVB900I dfRkDKgzEvo5CsUiQJdEkg
XCZU7EV-2FBVB900I
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+316628.23 грн
В кошику  од. на суму  грн.
XCZU3EG-2SFVC784I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU3EG-2SFVC784I
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+69490.28 грн
В кошику  од. на суму  грн.
XCZU4EV-1SFVC784I dfRkDKgzEvo5CsUiQJdEkg
XCZU4EV-1SFVC784I
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+109161.75 грн
В кошику  од. на суму  грн.
XCZU5EV-2SFVC784I dfRkDKgzEvo5CsUiQJdEkg
XCZU5EV-2SFVC784I
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+196246.87 грн
В кошику  од. на суму  грн.
XCZU4EG-2SFVE784I
XCZU4EG-2SFVE784I
Виробник: AMD
Description: FPGA MPSOC QUAD A53 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
XCZU4EV-2SFVC784I dfRkDKgzEvo5CsUiQJdEkg
XCZU4EV-2SFVC784I
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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В кошику  од. на суму  грн.
XCZU5EG-1SFVC784I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU5EG-1SFVC784I
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+141627.02 грн
В кошику  од. на суму  грн.
XCZU5EV-1SFVC784I dfRkDKgzEvo5CsUiQJdEkg
XCZU5EV-1SFVC784I
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
XCZU7EV-1FBVB900E dfRkDKgzEvo5CsUiQJdEkg
XCZU7EV-1FBVB900E
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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XCZU5EG-2SFVE784I
XCZU5EG-2SFVE784I
Виробник: AMD
Description: FPGA MPSOC QUAD A53 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
XCZU5EV-2SFVE784I XCZU4EG-2SFVC784I.pdf
XCZU5EV-2SFVE784I
Виробник: AMD
Description: FPGA MPSOC QUADA53 H264/5 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+242063.72 грн
В кошику  од. на суму  грн.
XCZU7EV-1FBVB900I dfRkDKgzEvo5CsUiQJdEkg
XCZU7EV-1FBVB900I
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
XCZU9EG-1FFVC900I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-1FFVC900I
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
XCZU9EG-2FFVC900I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU9EG-2FFVC900I
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+381178.68 грн
В кошику  од. на суму  грн.
XC3S400-4PQG208C ds099
XC3S400-4PQG208C
Виробник: AMD
Description: IC FPGA 141 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Number of I/O: 141
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
XC3S1200E-4FGG320I ds312
XC3S1200E-4FGG320I
Виробник: AMD
Description: IC FPGA 250 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 19512
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 2168
Total RAM Bits: 516096
Number of I/O: 250
DigiKey Programmable: Not Verified
на замовлення 304 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+12589.78 грн
В кошику  од. на суму  грн.
XC3S2000-4FGG456C ds099
XC3S2000-4FGG456C
Виробник: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Tray
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
XC3S2000-4FGG676C ds099
XC3S2000-4FGG676C
Виробник: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику  од. на суму  грн.
XC3S2000-4FG456C ds099
XC3S2000-4FG456C
Виробник: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику  од. на суму  грн.
XC3S2000-4FGG676I ds099
XC3S2000-4FGG676I
Виробник: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику  од. на суму  грн.
XC3S2000-4FG456I ds099
XC3S2000-4FG456I
Виробник: AMD
Description: IC FPGA 333 I/O 456FBGA
Packaging: Bulk
Package / Case: 456-BBGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 456-FBGA (23x23)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 333
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику  од. на суму  грн.
XC3S2000-4FG676C ds099
XC3S2000-4FG676C
Виробник: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 2000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 46080
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5120
Total RAM Bits: 737280
Number of I/O: 489
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику  од. на суму  грн.