Продукція > BOYD LACONIA, LLC > Всі товари виробника BOYD LACONIA, LLC (833) > Сторінка 5 з 14
| Фото | Назва | Виробник | Інформація |
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533422B02552G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 SOLDERPIN/CLIPPackaging: Bulk Material: Aluminum Length: 1.650" (41.91mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 (Dual) Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 10.0W @ 50°C Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM Fin Height: 1.500" (38.10mm) Material Finish: Black Anodized |
на замовлення 4146 шт: термін постачання 21-31 дні (днів) |
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| 533501B12552G | Boyd Laconia, LLC |
Description: STD,533501B12552G Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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533502B02552G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.650" (41.91mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 6.0W @ 30°C Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM Thermal Resistance @ Natural: 4.50°C/W Fin Height: 2.000" (50.80mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 533522B02552G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 2.000" (50.80mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.650" (41.91mm) Package Cooled: TO-220 (Dual) Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 6.0W @ 30°C Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM Thermal Resistance @ Natural: 2.70°C/W Fin Height: 1.000" (25.40mm) Material Finish: Black Anodized Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 533566B42552G | Boyd Laconia, LLC |
Description: 533566B42552G Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 533602B02552G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 2.500" (63.50mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.650" (41.91mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 16.0W @ 50°C Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM Thermal Resistance @ Natural: 3.80°C/W Fin Height: 1.000" (25.40mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 533621B02500G | Boyd Laconia, LLC |
Description: STD,533621B02500G Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 533766B42152G | Boyd Laconia, LLC |
Description: STD,533766B42152G Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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533802B02500G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.000" (25.40mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.375" (34.93mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM Thermal Resistance @ Natural: 13.00°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
на замовлення 2091 шт: термін постачання 21-31 дні (днів) |
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534202B02853G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 W/SHURLOCK-CLIPPackaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Clip and Board Locks Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM Thermal Resistance @ Natural: 13.40°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 17603 шт: термін постачання 21-31 дні (днів) |
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534202B03453G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEATSINK .5" TO-220Packaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Clip and Board Locks Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM Thermal Resistance @ Natural: 13.40°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
на замовлення 317 шт: термін постачання 21-31 дні (днів) |
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534302B03553G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 W/TAB-KOOLCLIPPackaging: Bulk Material: Aluminum Length: 2.000" (50.80mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.380" (35.05mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 6.0W @ 60°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM Thermal Resistance @ Natural: 10.40°C/W Fin Height: 0.480" (12.19mm) Material Finish: Black Anodized Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 534302B13553 | Boyd Laconia, LLC |
Description: STD,534302B13553 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 53-77-13ACG | Boyd Laconia, LLC |
Description: THERM PAD 18.03X12.7MM W/ADH Packaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 18.03mm x 12.70mm Thermal Conductivity: 0.9W/m-K Adhesive: Adhesive - One Side Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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53-77-2G | Boyd Laconia, LLC |
Description: THERM PAD 17.5MMX14.27MM GRY/GRNPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 17.50mm x 14.27mm Thermal Conductivity: 0.9W/m-K |
на замовлення 2840 шт: термін постачання 21-31 дні (днів) |
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| 53-77-3G | Boyd Laconia, LLC |
Description: THERM PAD 17.5MMX14.27MM GRY/GRN Packaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 17.50mm x 14.27mm Thermal Conductivity: 0.9W/m-K |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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53-77-4ACG | Boyd Laconia, LLC |
Description: THERM PAD 19.05X12.7MM W/ADHPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 19.05mm x 12.70mm Thermal Conductivity: 0.9W/m-K Adhesive: Adhesive - One Side |
на замовлення 15501 шт: термін постачання 21-31 дні (днів) |
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53-77-4G | Boyd Laconia, LLC |
Description: THERM PAD 19.05MMX12.7MM GRY/GRNPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 19.05mm x 12.70mm Thermal Conductivity: 0.9W/m-K |
на замовлення 5292 шт: термін постачання 21-31 дні (днів) |
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53-77-9ACG | Boyd Laconia, LLC |
Description: THERM PAD 18.42X13.21MM W/ADHPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 18.42mm x 13.21mm Thermal Conductivity: 0.9W/m-K Adhesive: Adhesive - One Side |
на замовлення 9429 шт: термін постачання 21-31 дні (днів) |
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53-77-9G | Boyd Laconia, LLC |
Description: THERM PAD 18.42X13.21MM GRY/GRNPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 18.42mm x 13.21mm Thermal Conductivity: 0.9W/m-K Part Status: Active |
на замовлення 8837 шт: термін постачання 21-31 дні (днів) |
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| 53-78-3AC | Boyd Laconia, LLC |
Description: THERM PAD 25.4X20.32MM W/ADH Packaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Polygon, 5-sided Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-218 Outline: 25.40mm x 20.32mm Thermal Conductivity: 0.9W/m-K Adhesive: Adhesive - One Side Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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542502B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 TAB BLACKPackaging: Bulk Material: Aluminum Length: 1.250" (31.75mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.875" (22.22mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 2.5W @ 60°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM Thermal Resistance @ Natural: 24.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized |
на замовлення 5275 шт: термін постачання 21-31 дні (днів) |
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542502D00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 TAB TINPackaging: Bulk Material: Aluminum Length: 1.250" (31.75mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.875" (22.22mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 2.5W @ 60°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM Thermal Resistance @ Natural: 24.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Tin |
на замовлення 6525 шт: термін постачання 21-31 дні (днів) |
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551002B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 1.45" HIGHPackaging: Bag Material: Aluminum Length: 1.450" (36.83mm) Shape: Rectangular, Fins Type: Board Level Width: 1.006" (25.55mm) Package Cooled: TO-220 Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 1.5W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM Thermal Resistance @ Natural: 12.40°C/W Fin Height: 0.787" (19.99mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1284 шт: термін постачання 21-31 дні (днів) |
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| 552844B00000 | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.780" (45.21mm) Shape: Square, Fins Type: Board Level Width: 1.780" (45.21mm) Package Cooled: TO-220 (Dual) Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 3.0W @ 30°C Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM Thermal Resistance @ Natural: 8.70°C/W Fin Height: 0.720" (18.29mm) Material Finish: Black Anodized Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 552844B00000G | Boyd Laconia, LLC |
Description: HEATSINKPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 56-02-101G | Boyd Laconia, LLC |
Description: THERM PAD 26.16MMX22.61MM OPAQUE Packaging: Bulk Color: Opaque Material: Mica Shape: Rectangular Thickness: 0.0030" (0.076mm) Type: Insulator Usage: TO-218, TO-247, TO-3P Outline: 26.16mm x 22.61mm |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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56-03-8G | Boyd Laconia, LLC |
Description: THERM PAD 42.85X30.15MM OPAQUE Packaging: Bulk Color: Opaque Material: Mica Shape: Rhombus Thickness: 0.0020" (0.051mm) Type: Insulator Usage: TO-3 Outline: 42.85mm x 30.15mm Part Status: Active |
на замовлення 2740 шт: термін постачання 21-31 дні (днів) |
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563002B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 VERT MNT 1.18"Packaging: Bag Material: Aluminum Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 13.00°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
на замовлення 442 шт: термін постачання 21-31 дні (днів) |
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563002D00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 TAB TINPackaging: Bulk Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 13.00°C/W Fin Height: 0.500" (12.70mm) Material Finish: Tin |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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563202D00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Length: 2.000" (50.80mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.380" (35.05mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM Thermal Resistance @ Natural: 9.40°C/W Fin Height: 0.500" (12.70mm) Material Finish: Tin |
на замовлення 2732 шт: термін постачання 21-31 дні (днів) |
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| 566010B00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.220" (30.99mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: Multiwatt, SIP Attachment Method: Clip Power Dissipation @ Temperature Rise: 3.0W @ 40°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM Thermal Resistance @ Natural: 11.50°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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566010B02800G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 CLIP-ON W/TABSPackaging: Bulk Material: Aluminum Length: 1.220" (30.99mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: Multiwatt, SIP Attachment Method: Clip and Board Locks Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM Thermal Resistance @ Natural: 11.50°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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566010B03400G | Boyd Laconia, LLC |
Description: HEATSINK W/TAB BLACKPackaging: Bulk Material: Aluminum Length: 1.220" (30.99mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: Multiwatt, SIP Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM Thermal Resistance @ Natural: 11.50°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1574 шт: термін постачання 21-31 дні (днів) |
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| 566102B00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 566902B04000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 0.850" (21.59mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220, TO-262 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 2.0W @ 40°C Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.80°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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56-77-11G | Boyd Laconia, LLC |
Description: THERM PAD 18.92MMX13.84MM OPAQUE Packaging: Bulk Color: Opaque Material: Mica Shape: Rectangular Thickness: 0.0020" (0.051mm) Type: Insulator Usage: TO-220 Outline: 18.92mm x 13.84mm |
на замовлення 9799 шт: термін постачання 21-31 дні (днів) |
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56-77-8G | Boyd Laconia, LLC |
Description: THERM PAD 18.92MMX13.84MM Clear Packaging: Bulk Color: Clear Material: Mica Shape: Rectangular Thickness: 0.0020" (0.051mm) Usage: TO-220 Outline: 18.92mm x 13.84mm |
на замовлення 2597 шт: термін постачання 21-31 дні (днів) |
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568303B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-3 1.25" 25WATTPackaging: Bulk Material: Aluminum Length: 1.810" (45.97mm) Shape: Square Type: Board Level Width: 1.810" (45.97mm) Package Cooled: TO-3 Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 5.0W @ 30°C Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM Thermal Resistance @ Natural: 5.40°C/W Fin Height: 1.250" (31.75mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 568403B00000 | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.810" (45.97mm) Shape: Rectangular, Pin Fins Type: Top Mount Width: 1.810" (45.97mm) Package Cooled: TO-3 Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 5.0W @ 30°C Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM Thermal Resistance @ Natural: 4.70°C/W Fin Height: 1.500" (38.10mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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569003B00000G | Boyd Laconia, LLC |
Description: COOLER FOR TO-3 20 WATTSPackaging: Tray Material: Aluminum Length: 1.830" (46.48mm) Shape: Square, Pin Fins Type: Board Level Width: 1.830" (46.48mm) Package Cooled: TO-3 Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 12.0W @ 60°C Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM Thermal Resistance @ Natural: 5.50°C/W Fin Height: 1.310" (33.27mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 690 шт: термін постачання 21-31 дні (днів) |
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573100D00000G | Boyd Laconia, LLC |
Description: TOP MOUNT HEATSINK .4" D-PAKPackaging: Bulk Material: Aluminum Length: 0.315" (8.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.900" (22.86mm) Package Cooled: TO-252 (DPAK) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 0.8W @ 30°C Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM Thermal Resistance @ Natural: 15.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 3237 шт: термін постачання 21-31 дні (днів) |
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573100D00010G | Boyd Laconia, LLC |
Description: HEATSINK SMT D-PAK/TO-252 TINPackaging: Tape & Reel (TR) Material: Aluminum Length: 0.315" (8.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.900" (22.86mm) Package Cooled: TO-252 (DPAK) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 0.8W @ 30°C Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM Thermal Resistance @ Natural: 26.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin |
на замовлення 12750 шт: термін постачання 21-31 дні (днів) |
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573100D00010G | Boyd Laconia, LLC |
Description: HEATSINK SMT D-PAK/TO-252 TINPackaging: Cut Tape (CT) Material: Aluminum Length: 0.315" (8.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.900" (22.86mm) Package Cooled: TO-252 (DPAK) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 0.8W @ 30°C Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM Thermal Resistance @ Natural: 26.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin |
на замовлення 12944 шт: термін постачання 21-31 дні (днів) |
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573300D00000G | Boyd Laconia, LLC |
Description: TOP MOUNT HEATSINK .4" D2PAKPackaging: Bulk Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.030" (26.16mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.3W @ 30°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM Thermal Resistance @ Natural: 18.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 1410 шт: термін постачання 21-31 дні (днів) |
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573300D00010G | Boyd Laconia, LLC |
Description: HEATSINK D2PAK .4" HIGH SMDPackaging: Tape & Reel (TR) Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.030" (26.16mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.3W @ 30°C Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 11523 шт: термін постачання 21-31 дні (днів) |
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573300D00010G | Boyd Laconia, LLC |
Description: HEATSINK D2PAK .4" HIGH SMDPackaging: Cut Tape (CT) Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.030" (26.16mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.3W @ 30°C Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 11523 шт: термін постачання 21-31 дні (днів) |
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573400D00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.220" (30.99mm) Package Cooled: TO-268 (D³Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 14.00°C/W Fin Height: 0.401" (10.20mm) Material Finish: Tin Part Status: Active |
на замовлення 2248 шт: термін постачання 21-31 дні (днів) |
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573400D00010G | Boyd Laconia, LLC |
Description: HEATSINK D-PAK3 TIN PLATED SMDPackaging: Tape & Reel (TR) Material: Copper Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.220" (30.99mm) Package Cooled: TO-268 (D³Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 14.00°C/W Fin Height: 0.401" (10.20mm) Material Finish: Tin Part Status: Active |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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573400D00010G | Boyd Laconia, LLC |
Description: HEATSINK D-PAK3 TIN PLATED SMDPackaging: Cut Tape (CT) Material: Copper Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.220" (30.99mm) Package Cooled: TO-268 (D³Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 14.00°C/W Fin Height: 0.401" (10.20mm) Material Finish: Tin Part Status: Active |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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573902B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 BLACK CLIP-ONPackaging: Bulk Material: Aluminum Length: 1.500" (38.10mm) Shape: Rectangular, Fins Type: Board Level Width: 0.500" (12.70mm) Package Cooled: TO-220 Attachment Method: Clip Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.80°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1497 шт: термін постачання 21-31 дні (днів) |
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| 573902B03100G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINK Packaging: Bulk Material: Aluminum Length: 1.500" (38.10mm) Shape: Rectangular, Fins Type: Board Level Width: 0.500" (12.70mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.80°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 573902B03900G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.500" (38.10mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.500" (12.70mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.80°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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573902B04000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 CLIP-ON/TABPackaging: Bulk Material: Aluminum Length: 1.500" (38.10mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.500" (12.70mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.80°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 4665 шт: термін постачання 21-31 дні (днів) |
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574004B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-202 CLIP-ON .58" BKPackaging: Bag Material: Aluminum Length: 0.800" (20.32mm) Shape: Rectangular Type: Board Level Width: 0.577" (14.66mm) Package Cooled: TO-202 Attachment Method: Clip Power Dissipation @ Temperature Rise: 1.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 28.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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574102B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 CLIP-ON BLKPackaging: Bag Material: Aluminum Length: 0.750" (19.05mm) Shape: Rectangular, Fins Type: Board Level Width: 0.860" (21.84mm) Package Cooled: TO-220 Attachment Method: Clip Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM Thermal Resistance @ Natural: 23.20°C/W Fin Height: 0.395" (10.03mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 2333 шт: термін постачання 21-31 дні (днів) |
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| 574204B03300G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 0.900" (22.86mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.020" (25.91mm) Package Cooled: TO-202 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 200 LFM Thermal Resistance @ Natural: 16.80°C/W Fin Height: 0.420" (10.67mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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574402B03200G | Boyd Laconia, LLC |
Description: HEATSINK TO220 HOR MNT W/TAB.75"Packaging: Bulk Material: Aluminum Length: 0.750" (19.05mm) Shape: Rectangular, Fins Type: Board Level Width: 0.860" (21.84mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM Thermal Resistance @ Natural: 23.20°C/W Fin Height: 0.395" (10.03mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 13359 шт: термін постачання 21-31 дні (днів) |
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574502B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 VERT MNT .75"Packaging: Bag Material: Aluminum Length: 0.750" (19.05mm) Shape: Rectangular, Fins Type: Board Level Width: 0.860" (21.84mm) Package Cooled: TO-220 Attachment Method: Clip Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM Thermal Resistance @ Natural: 21.20°C/W Fin Height: 0.395" (10.03mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 34862 шт: термін постачання 21-31 дні (днів) |
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574502B03200G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 CLIP-ON/TABPackaging: Bulk Material: Aluminum Length: 0.750" (19.05mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.860" (21.84mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM Thermal Resistance @ Natural: 21.20°C/W Fin Height: 0.395" (10.03mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1640 шт: термін постачання 21-31 дні (днів) |
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| 533422B02552G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
на замовлення 4146 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 300.34 грн |
| 10+ | 255.84 грн |
| 25+ | 243.66 грн |
| 50+ | 220.43 грн |
| 240+ | 202.79 грн |
| 480+ | 195.45 грн |
| 720+ | 188.14 грн |
| 1200+ | 183.08 грн |
| 533502B02552G |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 2.000" (50.80mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 2.000" (50.80mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 533522B02552G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 2.70°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 2.70°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 533602B02552G |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.500" (63.50mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 16.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 3.80°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.500" (63.50mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 16.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 3.80°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 533802B02500G |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
на замовлення 2091 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 378.20 грн |
| 10+ | 322.91 грн |
| 25+ | 307.57 грн |
| 50+ | 278.21 грн |
| 100+ | 268.15 грн |
| 250+ | 255.39 грн |
| 540+ | 241.12 грн |
| 1080+ | 232.37 грн |
| 534202B02853G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/SHURLOCK-CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 W/SHURLOCK-CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 17603 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 109.52 грн |
| 10+ | 93.44 грн |
| 25+ | 89.05 грн |
| 50+ | 80.54 грн |
| 100+ | 77.64 грн |
| 486+ | 71.38 грн |
| 972+ | 68.41 грн |
| 534202B03453G |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEATSINK .5" TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEATSINK .5" TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
на замовлення 317 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 463.77 грн |
| 10+ | 395.51 грн |
| 25+ | 376.79 грн |
| 50+ | 340.82 грн |
| 100+ | 328.51 грн |
| 250+ | 312.88 грн |
| 534302B03553G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/TAB-KOOLCLIP
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.480" (12.19mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 W/TAB-KOOLCLIP
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.480" (12.19mm)
Material Finish: Black Anodized
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 53-77-13ACG |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.03X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.03mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Part Status: Active
Description: THERM PAD 18.03X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.03mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 53-77-2G |
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Виробник: Boyd Laconia, LLC
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 17.50mm x 14.27mm
Thermal Conductivity: 0.9W/m-K
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 17.50mm x 14.27mm
Thermal Conductivity: 0.9W/m-K
на замовлення 2840 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 104.39 грн |
| 10+ | 89.40 грн |
| 25+ | 85.17 грн |
| 50+ | 77.05 грн |
| 100+ | 74.26 грн |
| 250+ | 70.73 грн |
| 500+ | 67.06 грн |
| 1000+ | 64.63 грн |
| 53-77-3G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 17.50mm x 14.27mm
Thermal Conductivity: 0.9W/m-K
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 17.50mm x 14.27mm
Thermal Conductivity: 0.9W/m-K
товару немає в наявності
В кошику
од. на суму грн.
| 53-77-4ACG |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 19.05X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Description: THERM PAD 19.05X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
на замовлення 15501 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 60.75 грн |
| 10+ | 51.99 грн |
| 25+ | 49.54 грн |
| 50+ | 44.82 грн |
| 100+ | 43.19 грн |
| 250+ | 41.14 грн |
| 500+ | 39.01 грн |
| 1000+ | 37.60 грн |
| 5000+ | 34.51 грн |
| 53-77-4G |
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Виробник: Boyd Laconia, LLC
Description: THERM PAD 19.05MMX12.7MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Description: THERM PAD 19.05MMX12.7MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
на замовлення 5292 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 56.47 грн |
| 10+ | 47.96 грн |
| 25+ | 45.68 грн |
| 50+ | 41.32 грн |
| 100+ | 39.82 грн |
| 250+ | 37.93 грн |
| 500+ | 35.96 грн |
| 1000+ | 34.66 грн |
| 5000+ | 31.82 грн |
| 53-77-9ACG |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.42X13.21MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Description: THERM PAD 18.42X13.21MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
на замовлення 9429 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 75.30 грн |
| 10+ | 63.78 грн |
| 25+ | 60.78 грн |
| 50+ | 54.96 грн |
| 100+ | 52.97 грн |
| 250+ | 50.46 грн |
| 500+ | 47.83 грн |
| 2000+ | 44.44 грн |
| 6000+ | 41.91 грн |
| 53-77-9G |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.42X13.21MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Part Status: Active
Description: THERM PAD 18.42X13.21MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Part Status: Active
на замовлення 8837 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9+ | 39.36 грн |
| 10+ | 34.11 грн |
| 25+ | 32.53 грн |
| 50+ | 29.43 грн |
| 100+ | 28.36 грн |
| 250+ | 27.01 грн |
| 500+ | 25.61 грн |
| 2000+ | 23.79 грн |
| 6000+ | 22.44 грн |
| 53-78-3AC |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 25.4X20.32MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Polygon, 5-sided
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-218
Outline: 25.40mm x 20.32mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Part Status: Active
Description: THERM PAD 25.4X20.32MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Polygon, 5-sided
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-218
Outline: 25.40mm x 20.32mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 542502B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
на замовлення 5275 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 255.84 грн |
| 10+ | 218.19 грн |
| 25+ | 207.81 грн |
| 50+ | 188.00 грн |
| 100+ | 181.20 грн |
| 250+ | 172.59 грн |
| 500+ | 163.61 грн |
| 1000+ | 157.68 грн |
| 542502D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Tin
Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Tin
на замовлення 6525 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 306.33 грн |
| 10+ | 260.79 грн |
| 25+ | 248.41 грн |
| 50+ | 224.70 грн |
| 100+ | 216.58 грн |
| 250+ | 206.28 грн |
| 500+ | 195.55 грн |
| 1000+ | 188.46 грн |
| 551002B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 1.45" HIGH
Packaging: Bag
Material: Aluminum
Length: 1.450" (36.83mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.006" (25.55mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 1.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 12.40°C/W
Fin Height: 0.787" (19.99mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 1.45" HIGH
Packaging: Bag
Material: Aluminum
Length: 1.450" (36.83mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.006" (25.55mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 1.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 12.40°C/W
Fin Height: 0.787" (19.99mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1284 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 324.30 грн |
| 10+ | 303.72 грн |
| 25+ | 295.57 грн |
| 50+ | 261.95 грн |
| 100+ | 246.54 грн |
| 250+ | 231.14 грн |
| 500+ | 219.77 грн |
| 1000+ | 197.03 грн |
| 552844B00000 |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.780" (45.21mm)
Shape: Square, Fins
Type: Board Level
Width: 1.780" (45.21mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 8.70°C/W
Fin Height: 0.720" (18.29mm)
Material Finish: Black Anodized
Part Status: Active
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.780" (45.21mm)
Shape: Square, Fins
Type: Board Level
Width: 1.780" (45.21mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 8.70°C/W
Fin Height: 0.720" (18.29mm)
Material Finish: Black Anodized
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 56-02-101G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 26.16MMX22.61MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0030" (0.076mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 26.16mm x 22.61mm
Description: THERM PAD 26.16MMX22.61MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0030" (0.076mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 26.16mm x 22.61mm
товару немає в наявності
В кошику
од. на суму грн.
| 56-03-8G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 42.85X30.15MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rhombus
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-3
Outline: 42.85mm x 30.15mm
Part Status: Active
Description: THERM PAD 42.85X30.15MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rhombus
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-3
Outline: 42.85mm x 30.15mm
Part Status: Active
на замовлення 2740 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 65.89 грн |
| 10+ | 56.69 грн |
| 25+ | 54.12 грн |
| 50+ | 48.98 грн |
| 100+ | 47.25 грн |
| 250+ | 45.06 грн |
| 500+ | 42.75 грн |
| 563002B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 VERT MNT 1.18"
Packaging: Bag
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 VERT MNT 1.18"
Packaging: Bag
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
на замовлення 442 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 353.39 грн |
| 10+ | 301.00 грн |
| 25+ | 286.74 грн |
| 50+ | 259.35 грн |
| 100+ | 249.99 грн |
| 250+ | 238.10 грн |
| 563002D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
на замовлення 500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 146.32 грн |
| 10+ | 125.00 грн |
| 25+ | 119.01 грн |
| 50+ | 107.67 грн |
| 100+ | 103.77 грн |
| 250+ | 98.84 грн |
| 500+ | 93.71 грн |
| 563202D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
на замовлення 2732 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 160.01 грн |
| 10+ | 136.53 грн |
| 25+ | 130.15 грн |
| 50+ | 117.85 грн |
| 100+ | 113.67 грн |
| 420+ | 109.90 грн |
| 566010B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 566010B02800G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON W/TABS
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 CLIP-ON W/TABS
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 566010B03400G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK W/TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK W/TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1574 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 675.97 грн |
| 10+ | 575.96 грн |
| 25+ | 548.60 грн |
| 50+ | 496.22 грн |
| 100+ | 478.27 грн |
| 250+ | 455.51 грн |
| 800+ | 421.10 грн |
| 566902B04000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.850" (21.59mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220, TO-262
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.850" (21.59mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220, TO-262
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 56-77-11G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.92MMX13.84MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-220
Outline: 18.92mm x 13.84mm
Description: THERM PAD 18.92MMX13.84MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-220
Outline: 18.92mm x 13.84mm
на замовлення 9799 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9+ | 41.07 грн |
| 10+ | 34.61 грн |
| 25+ | 32.93 грн |
| 50+ | 29.79 грн |
| 100+ | 28.71 грн |
| 250+ | 27.35 грн |
| 500+ | 25.93 грн |
| 1000+ | 24.99 грн |
| 5000+ | 22.94 грн |
| 56-77-8G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.92MMX13.84MM Clear
Packaging: Bulk
Color: Clear
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Usage: TO-220
Outline: 18.92mm x 13.84mm
Description: THERM PAD 18.92MMX13.84MM Clear
Packaging: Bulk
Color: Clear
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Usage: TO-220
Outline: 18.92mm x 13.84mm
на замовлення 2597 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 15+ | 22.08 грн |
| 100+ | 20.12 грн |
| 1000+ | 15.00 грн |
| 568303B00000G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-3 1.25" 25WATT
Packaging: Bulk
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Square
Type: Board Level
Width: 1.810" (45.97mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.40°C/W
Fin Height: 1.250" (31.75mm)
Material Finish: Black Anodized
Description: HEATSINK TO-3 1.25" 25WATT
Packaging: Bulk
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Square
Type: Board Level
Width: 1.810" (45.97mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.40°C/W
Fin Height: 1.250" (31.75mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 568403B00000 |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.810" (45.97mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 4.70°C/W
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.810" (45.97mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 4.70°C/W
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 569003B00000G |
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Виробник: Boyd Laconia, LLC
Description: COOLER FOR TO-3 20 WATTS
Packaging: Tray
Material: Aluminum
Length: 1.830" (46.48mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.830" (46.48mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 12.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Thermal Resistance @ Natural: 5.50°C/W
Fin Height: 1.310" (33.27mm)
Material Finish: Black Anodized
Part Status: Active
Description: COOLER FOR TO-3 20 WATTS
Packaging: Tray
Material: Aluminum
Length: 1.830" (46.48mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.830" (46.48mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 12.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Thermal Resistance @ Natural: 5.50°C/W
Fin Height: 1.310" (33.27mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 690 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 594.68 грн |
| 10+ | 506.99 грн |
| 25+ | 482.88 грн |
| 50+ | 436.80 грн |
| 100+ | 420.99 грн |
| 250+ | 400.95 грн |
| 500+ | 380.08 грн |
| 573100D00000G |
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Виробник: Boyd Laconia, LLC
Description: TOP MOUNT HEATSINK .4" D-PAK
Packaging: Bulk
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 15.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: TOP MOUNT HEATSINK .4" D-PAK
Packaging: Bulk
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 15.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 3237 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 383.34 грн |
| 10+ | 327.20 грн |
| 25+ | 311.63 грн |
| 50+ | 281.90 грн |
| 100+ | 271.70 грн |
| 250+ | 258.78 грн |
| 500+ | 245.32 грн |
| 573100D00010G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
на замовлення 12750 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 250+ | 32.37 грн |
| 500+ | 30.04 грн |
| 750+ | 29.40 грн |
| 1250+ | 26.85 грн |
| 1750+ | 26.38 грн |
| 2500+ | 25.88 грн |
| 6250+ | 24.25 грн |
| 12500+ | 23.37 грн |
| 573100D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
на замовлення 12944 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8+ | 43.64 грн |
| 10+ | 36.91 грн |
| 25+ | 35.20 грн |
| 50+ | 31.86 грн |
| 100+ | 30.71 грн |
| 573300D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: TOP MOUNT HEATSINK .4" D2PAK
Packaging: Bulk
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: TOP MOUNT HEATSINK .4" D2PAK
Packaging: Bulk
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 1410 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 300.34 грн |
| 10+ | 255.60 грн |
| 25+ | 243.43 грн |
| 50+ | 220.23 грн |
| 100+ | 212.26 грн |
| 250+ | 202.17 грн |
| 500+ | 191.65 грн |
| 573300D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 11523 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 250+ | 38.55 грн |
| 500+ | 35.78 грн |
| 750+ | 35.01 грн |
| 1250+ | 31.98 грн |
| 1750+ | 31.41 грн |
| 2500+ | 30.82 грн |
| 6250+ | 28.87 грн |
| 573300D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 11523 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 51.34 грн |
| 10+ | 44.08 грн |
| 25+ | 41.92 грн |
| 50+ | 37.94 грн |
| 100+ | 36.58 грн |
| 573400D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
на замовлення 2248 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 232.74 грн |
| 10+ | 218.76 грн |
| 25+ | 212.85 грн |
| 50+ | 188.66 грн |
| 100+ | 177.56 грн |
| 250+ | 166.46 грн |
| 500+ | 158.27 грн |
| 1000+ | 141.90 грн |
| 573400D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 250+ | 232.66 грн |
| 500+ | 215.93 грн |
| 750+ | 211.31 грн |
| 1250+ | 192.99 грн |
| 1750+ | 189.55 грн |
| 2500+ | 185.98 грн |
| 573400D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 314.88 грн |
| 10+ | 269.03 грн |
| 25+ | 256.49 грн |
| 50+ | 232.21 грн |
| 100+ | 224.00 грн |
| 573902B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 BLACK CLIP-ON
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 BLACK CLIP-ON
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1497 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 198.51 грн |
| 10+ | 169.08 грн |
| 25+ | 161.04 грн |
| 50+ | 145.67 грн |
| 100+ | 140.40 грн |
| 250+ | 133.73 грн |
| 500+ | 126.78 грн |
| 573902B03100G |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 573902B03900G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 573902B04000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON/TAB
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 CLIP-ON/TAB
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 4665 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 130.92 грн |
| 10+ | 111.32 грн |
| 25+ | 106.06 грн |
| 50+ | 95.95 грн |
| 100+ | 92.48 грн |
| 250+ | 88.09 грн |
| 500+ | 83.51 грн |
| 2000+ | 82.37 грн |
| 574004B00000G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-202 CLIP-ON .58" BK
Packaging: Bag
Material: Aluminum
Length: 0.800" (20.32mm)
Shape: Rectangular
Type: Board Level
Width: 0.577" (14.66mm)
Package Cooled: TO-202
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 28.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Description: HEATSINK TO-202 CLIP-ON .58" BK
Packaging: Bag
Material: Aluminum
Length: 0.800" (20.32mm)
Shape: Rectangular
Type: Board Level
Width: 0.577" (14.66mm)
Package Cooled: TO-202
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 28.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 574102B00000G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON BLK
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 CLIP-ON BLK
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 2333 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 140.33 грн |
| 10+ | 119.23 грн |
| 25+ | 113.54 грн |
| 50+ | 102.71 грн |
| 100+ | 98.99 грн |
| 250+ | 94.29 грн |
| 500+ | 89.39 грн |
| 2000+ | 83.03 грн |
| 574204B03300G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.900" (22.86mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.020" (25.91mm)
Package Cooled: TO-202
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.80°C/W
Fin Height: 0.420" (10.67mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.900" (22.86mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.020" (25.91mm)
Package Cooled: TO-202
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.80°C/W
Fin Height: 0.420" (10.67mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 574402B03200G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO220 HOR MNT W/TAB.75"
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO220 HOR MNT W/TAB.75"
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 13359 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 176.27 грн |
| 10+ | 149.88 грн |
| 25+ | 142.78 грн |
| 50+ | 129.15 грн |
| 100+ | 124.47 грн |
| 250+ | 118.56 грн |
| 500+ | 112.40 грн |
| 3000+ | 102.17 грн |
| 6000+ | 98.45 грн |
| 574502B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 VERT MNT .75"
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 VERT MNT .75"
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 34862 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11+ | 32.52 грн |
| 12+ | 28.10 грн |
| 25+ | 26.76 грн |
| 50+ | 24.22 грн |
| 100+ | 23.34 грн |
| 250+ | 22.23 грн |
| 500+ | 21.07 грн |
| 3000+ | 19.16 грн |
| 6000+ | 18.47 грн |
| 574502B03200G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON/TAB
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 CLIP-ON/TAB
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1640 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 58.18 грн |
| 10+ | 49.44 грн |
| 25+ | 47.03 грн |
| 50+ | 42.55 грн |
| 100+ | 41.01 грн |
| 250+ | 39.07 грн |
| 500+ | 37.04 грн |
| 1000+ | 35.70 грн |































