Продукція > BOYD LACONIA, LLC > Всі товари виробника BOYD LACONIA, LLC (900) > Сторінка 5 з 15
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
531302B02500G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 H=2.5" BLK W/PINPackaging: Bulk Material: Aluminum Length: 2.500" (63.50mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.375" (34.93mm) Package Cooled: TO-220, TO-202 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 6.0W @ 40°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 500 LFM Thermal Resistance @ Natural: 8.00°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1245 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| 532602B00000 | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKMaterial Finish: Black Anodized Fin Height: 1.000" (25.40mm) Thermal Resistance @ Natural: 5.50°C/W Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM Power Dissipation @ Temperature Rise: 6.0W @ 40°C Attachment Method: Bolt On Package Cooled: TO-220 Width: 1.650" (41.91mm) Type: Board Level Shape: Rectangular, Fins Length: 1.500" (38.10mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||||||
|
532602B02500G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 SOLDERPIN 38.1MMWidth: 1.650" (41.91mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.500" (38.10mm) Material: Aluminum Packaging: Bulk Material Finish: Black Anodized Fin Height: 1.000" (25.40mm) Thermal Resistance @ Natural: 5.50°C/W Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM Power Dissipation @ Temperature Rise: 6.0W @ 40°C Attachment Method: Bolt On and PC Pin Package Cooled: TO-220 |
на замовлення 3318 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
532702B02500G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 SOLDERPIN 50.8MMMaterial Finish: Black Anodized Fin Height: 1.000" (25.40mm) Length: 2.000" (50.80mm) Thermal Resistance @ Natural: 4.80°C/W Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM Power Dissipation @ Temperature Rise: 10.0W @ 50°C Attachment Method: Bolt On and PC Pin Package Cooled: TO-220 Width: 1.650" (41.91mm) Type: Board Level, Vertical Shape: Rectangular, Fins Material: Aluminum Packaging: Bulk |
на замовлення 367 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| 532802B02500G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKMaterial Finish: Black Anodized Fin Height: 1.000" (25.40mm) Thermal Resistance @ Natural: 4.20°C/W Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 6.0W @ 30°C Attachment Method: Bolt On and PC Pin Package Cooled: TO-220 Width: 1.650" (41.91mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 2.500" (63.50mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 840 шт В кошику од. на суму грн. | |||||||||||||||||||
|
533002B02551G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 SOLDERPIN/CLIPMaterial Finish: Black Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Natural: 13.00°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 400 LFM Power Dissipation @ Temperature Rise: 2.0W @ 30°C Attachment Method: Clip and PC Pin Package Cooled: TO-220 Width: 1.375" (34.93mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.000" (25.40mm) Material: Aluminum Packaging: Bulk |
на замовлення 3132 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| 533042B32500G | Boyd Laconia, LLC |
Description: STD,533042B32500G Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | |||||||||||||||||||
| 533201B02500G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKMaterial Finish: Black Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Natural: 9.00°C/W Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 400 LFM Power Dissipation @ Temperature Rise: 3.0W @ 30°C Attachment Method: Bolt On and PC Pin Package Cooled: TO-218, TO-247 Width: 1.375" (34.93mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 2.000" (50.80mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 533201B12500G | Boyd Laconia, LLC |
Description: STD,533201B12500G Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
|
533402B02552G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 SOLDERPIN/CLIPThermal Resistance @ Natural: 5.00°C/W Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 500 LFM Power Dissipation @ Temperature Rise: 8.0W @ 40°C Attachment Method: Clip and PC Pin Package Cooled: TO-220 Width: 1.000" (25.40mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.650" (41.91mm) Material: Aluminum Packaging: Bulk Material Finish: Black Anodized Fin Height: 1.500" (38.10mm) |
на замовлення 713 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
533422B02552G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 SOLDERPIN/CLIPPackaging: Bulk Material: Aluminum Length: 1.650" (41.91mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 (Dual) Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 10.0W @ 50°C Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM Fin Height: 1.500" (38.10mm) Material Finish: Black Anodized |
на замовлення 4060 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| 533501B12552G | Boyd Laconia, LLC |
Description: STD,533501B12552G Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
|
533502B02552G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKShape: Rectangular, Fins Length: 1.650" (41.91mm) Material: Aluminum Packaging: Bulk Material Finish: Black Anodized Fin Height: 2.000" (50.80mm) Thermal Resistance @ Natural: 4.50°C/W Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM Power Dissipation @ Temperature Rise: 6.0W @ 30°C Attachment Method: Clip and PC Pin Package Cooled: TO-220 Width: 1.000" (25.40mm) Type: Board Level, Vertical |
товару немає в наявності |
Мінімальне замовлення: 750 шт В кошику од. на суму грн. | ||||||||||||||||||
| 533522B02552G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPart Status: Active Material Finish: Black Anodized Fin Height: 1.000" (25.40mm) Thermal Resistance @ Natural: 2.70°C/W Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM Power Dissipation @ Temperature Rise: 6.0W @ 30°C Attachment Method: Clip and PC Pin Package Cooled: TO-220 (Dual) Width: 1.650" (41.91mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 2.000" (50.80mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 750 шт В кошику од. на суму грн. | |||||||||||||||||||
| 533566B42552G | Boyd Laconia, LLC |
Description: 533566B42552G Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 183 шт В кошику од. на суму грн. | |||||||||||||||||||
| 533602B02552G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKMaterial Finish: Black Anodized Fin Height: 1.000" (25.40mm) Thermal Resistance @ Natural: 3.80°C/W Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM Power Dissipation @ Temperature Rise: 16.0W @ 50°C Attachment Method: Clip and PC Pin Package Cooled: TO-220 Width: 1.650" (41.91mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 2.500" (63.50mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||||
| 533621B02500G | Boyd Laconia, LLC |
Description: STD,533621B02500G Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||||
| 533766B42152G | Boyd Laconia, LLC |
Description: STD,533766B42152G Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||||
|
533802B02500G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKMaterial Finish: Black Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Natural: 13.00°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM Power Dissipation @ Temperature Rise: 3.0W @ 50°C Attachment Method: PC Pin Package Cooled: TO-220 Width: 1.375" (34.93mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.000" (25.40mm) Material: Aluminum Packaging: Bulk |
на замовлення 1689 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
534202B02853G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 W/SHURLOCK-CLIPPackaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Clip and Board Locks Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM Thermal Resistance @ Natural: 13.40°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 16432 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
|
534202B03453G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEATSINK .5" TO-220Packaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Clip and Board Locks Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM Thermal Resistance @ Natural: 13.40°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
на замовлення 1552 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
|
534302B03553G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 W/TAB-KOOLCLIPThermal Resistance @ Natural: 10.40°C/W Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 6.0W @ 60°C Attachment Method: Clip and PC Pin Package Cooled: TO-220 Width: 1.380" (35.05mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 2.000" (50.80mm) Material: Aluminum Packaging: Bulk Part Status: Active Material Finish: Black Anodized Fin Height: 0.480" (12.19mm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 534302B13553 | Boyd Laconia, LLC |
Description: STD,534302B13553 Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 129 шт В кошику од. на суму грн. | |||||||||||||||||||
| 53-77-13ACG | Boyd Laconia, LLC |
Description: THERM PAD 18.03X12.7MM W/ADH Part Status: Active Adhesive: Adhesive - One Side Thermal Conductivity: 0.9W/m-K Outline: 18.03mm x 12.70mm Usage: TO-220 Type: Pad, Sheet Thickness: 0.0060" (0.152mm) Shape: Rectangular Material: Silicone Rubber Color: Gray, Green Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 10000 шт В кошику од. на суму грн. | |||||||||||||||||||
|
53-77-2G | Boyd Laconia, LLC |
Description: THERM PAD 17.5MMX14.27MM GRY/GRNThermal Conductivity: 0.9W/m-K Outline: 17.50mm x 14.27mm Usage: TO-220 Type: Pad, Sheet Thickness: 0.0060" (0.152mm) Shape: Rectangular Material: Silicone Rubber Color: Gray, Green Packaging: Bulk |
на замовлення 510 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| 53-77-3G | Boyd Laconia, LLC |
Description: THERM PAD 17.5MMX14.27MM GRY/GRN Thermal Conductivity: 0.9W/m-K Outline: 17.50mm x 14.27mm Usage: TO-220 Type: Pad, Sheet Thickness: 0.0060" (0.152mm) Shape: Rectangular Material: Silicone Rubber Color: Gray, Green Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||||||
|
53-77-4ACG | Boyd Laconia, LLC |
Description: THERM PAD 19.05X12.7MM W/ADHPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 19.05mm x 12.70mm Thermal Conductivity: 0.9W/m-K Adhesive: Adhesive - One Side |
на замовлення 4646 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
53-77-4G | Boyd Laconia, LLC |
Description: THERM PAD 19.05MMX12.7MM GRY/GRNPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 19.05mm x 12.70mm Thermal Conductivity: 0.9W/m-K |
на замовлення 12290 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
53-77-9ACG | Boyd Laconia, LLC |
Description: THERM PAD 18.42X13.21MM W/ADHPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 18.42mm x 13.21mm Thermal Conductivity: 0.9W/m-K Adhesive: Adhesive - One Side |
на замовлення 9680 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
|
53-77-9G | Boyd Laconia, LLC |
Description: THERM PAD 18.42X13.21MM GRY/GRNPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 18.42mm x 13.21mm Thermal Conductivity: 0.9W/m-K Part Status: Active |
на замовлення 11975 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| 53-78-3AC | Boyd Laconia, LLC |
Description: THERM PAD 25.4X20.32MM W/ADH Part Status: Active Adhesive: Adhesive - One Side Thermal Conductivity: 0.9W/m-K Outline: 25.40mm x 20.32mm Usage: TO-218 Type: Pad, Sheet Thickness: 0.0060" (0.152mm) Shape: Polygon, 5-sided Material: Silicone Rubber Color: Gray, Green Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 6000 шт В кошику од. на суму грн. | |||||||||||||||||||
|
542502B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 TAB BLACKMaterial Finish: Black Anodized Fin Height: 0.250" (6.35mm) Thermal Resistance @ Natural: 24.00°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM Power Dissipation @ Temperature Rise: 2.5W @ 60°C Attachment Method: Bolt On and PC Pin Package Cooled: TO-220 Width: 0.875" (22.22mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.250" (31.75mm) Material: Aluminum Packaging: Bulk |
на замовлення 5251 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
542502D00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 TAB TINMaterial Finish: Tin Fin Height: 0.250" (6.35mm) Thermal Resistance @ Natural: 24.00°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM Power Dissipation @ Temperature Rise: 2.5W @ 60°C Attachment Method: Bolt On and PC Pin Package Cooled: TO-220 Width: 0.875" (22.22mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.250" (31.75mm) Material: Aluminum Packaging: Bulk |
на замовлення 6525 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
551002B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 1.45" HIGHPart Status: Active Material Finish: Black Anodized Fin Height: 0.787" (19.99mm) Thermal Resistance @ Natural: 12.40°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM Power Dissipation @ Temperature Rise: 1.5W @ 20°C Attachment Method: Bolt On Package Cooled: TO-220 Width: 1.006" (25.55mm) Type: Board Level Shape: Rectangular, Fins Length: 1.450" (36.83mm) Material: Aluminum Packaging: Bag |
на замовлення 601 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| 552844B00000 | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPart Status: Active Material Finish: Black Anodized Fin Height: 0.720" (18.29mm) Thermal Resistance @ Natural: 8.70°C/W Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM Power Dissipation @ Temperature Rise: 3.0W @ 30°C Attachment Method: Bolt On Package Cooled: TO-220 (Dual) Width: 1.780" (45.21mm) Type: Board Level Shape: Square, Fins Length: 1.780" (45.21mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||||
| 552844B00000G | Boyd Laconia, LLC |
Description: HEATSINKPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 56-02-101G | Boyd Laconia, LLC |
Description: THERM PAD 26.16MMX22.61MM OPAQUE Packaging: Bulk Color: Opaque Material: Mica Shape: Rectangular Thickness: 0.0030" (0.076mm) Type: Insulator Usage: TO-218, TO-247, TO-3P Outline: 26.16mm x 22.61mm |
товару немає в наявності |
Мінімальне замовлення: 6000 шт В кошику од. на суму грн. | |||||||||||||||||||
|
56-03-8G | Boyd Laconia, LLC |
Description: THERM PAD 42.85X30.15MM OPAQUE Part Status: Active Outline: 42.85mm x 30.15mm Type: Insulator Thickness: 0.0020" (0.051mm) Shape: Rhombus Material: Mica Color: Opaque Packaging: Bulk Usage: TO-3 |
на замовлення 2740 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
563002B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 VERT MNT 1.18"Packaging: Bag Material: Aluminum Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 13.00°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
на замовлення 1043 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
563002D00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 TAB TINFin Height: 0.500" (12.70mm) Thermal Resistance @ Natural: 13.00°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Power Dissipation @ Temperature Rise: 1.0W @ 20°C Attachment Method: Bolt On and PC Pin Package Cooled: TO-220 Width: 1.000" (25.40mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.180" (29.97mm) Packaging: Bulk Material Finish: Tin |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
563202D00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKMaterial Finish: Tin Fin Height: 0.500" (12.70mm) Thermal Resistance @ Natural: 9.40°C/W Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 2.0W @ 30°C Attachment Method: Bolt On and PC Pin Package Cooled: TO-220 Width: 1.380" (35.05mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 2.000" (50.80mm) Packaging: Bulk |
на замовлення 2732 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| 566010B00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKMaterial Finish: Black Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Natural: 11.50°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM Power Dissipation @ Temperature Rise: 3.0W @ 40°C Attachment Method: Clip Package Cooled: Multiwatt, SIP Width: 1.000" (25.40mm) Type: Board Level Shape: Rectangular, Fins Length: 1.220" (30.99mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 6000 шт В кошику од. на суму грн. | |||||||||||||||||||
|
566010B02800G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 CLIP-ON W/TABSMaterial Finish: Black Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Natural: 11.50°C/W Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 2.0W @ 30°C Attachment Method: Clip and Board Locks Package Cooled: Multiwatt, SIP Width: 1.000" (25.40mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.220" (30.99mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||||
|
566010B03400G | Boyd Laconia, LLC |
Description: HEATSINK W/TAB BLACKPart Status: Active Material Finish: Black Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Natural: 11.50°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM Power Dissipation @ Temperature Rise: 2.0W @ 30°C Attachment Method: Clip and PC Pin Package Cooled: Multiwatt, SIP Width: 1.000" (25.40mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.220" (30.99mm) Material: Aluminum Packaging: Bulk |
на замовлення 1591 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| 566102B00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 566902B04000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPart Status: Active Material Finish: Black Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Natural: 18.80°C/W Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 2.0W @ 40°C Attachment Method: Clip and PC Pin Package Cooled: TO-220, TO-262 Width: 1.000" (25.40mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 0.850" (21.59mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||||
| 56-77-10 | Boyd Laconia, LLC |
Description: THERM PAD 21.89MMX13.21MM OPAQUE Outline: 21.89mm x 13.21mm Usage: TO-220 Type: Insulator Thickness: 0.0020" (0.051mm) Shape: Rectangular Material: Mica Color: Opaque Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||||||
|
56-77-11G | Boyd Laconia, LLC |
Description: THERM PAD 18.92MMX13.84MM OPAQUEOutline: 18.92mm x 13.84mm Usage: TO-220 Type: Insulator Thickness: 0.0020" (0.051mm) Shape: Rectangular Material: Mica Color: Opaque Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
56-77-8G | Boyd Laconia, LLC |
Description: THERM PAD 18.92MMX13.84MM ClearPackaging: Bulk Color: Clear Material: Mica Shape: Rectangular Thickness: 0.0020" (0.051mm) Usage: TO-220 Outline: 18.92mm x 13.84mm |
на замовлення 7183 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
|
568103B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-3 12W H=.75" BLK |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
568303B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-3 1.25" 25WATTMaterial Finish: Black Anodized Fin Height: 1.250" (31.75mm) Thermal Resistance @ Natural: 5.40°C/W Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 5.0W @ 30°C Attachment Method: Bolt On Package Cooled: TO-3 Width: 1.810" (45.97mm) Type: Board Level Shape: Square Length: 1.810" (45.97mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 568403B00000 | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKMaterial Finish: Black Anodized Fin Height: 1.500" (38.10mm) Thermal Resistance @ Natural: 4.70°C/W Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM Power Dissipation @ Temperature Rise: 5.0W @ 30°C Attachment Method: Bolt On Package Cooled: TO-3 Width: 1.810" (45.97mm) Type: Top Mount Shape: Rectangular, Pin Fins Length: 1.810" (45.97mm) Material: Aluminum Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||||
|
569003B00000G | Boyd Laconia, LLC |
Description: COOLER FOR TO-3 20 WATTSPart Status: Active Material Finish: Black Anodized Fin Height: 1.310" (33.27mm) Thermal Resistance @ Natural: 5.50°C/W Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM Power Dissipation @ Temperature Rise: 12.0W @ 60°C Attachment Method: Bolt On Package Cooled: TO-3 Width: 1.830" (46.48mm) Type: Board Level Shape: Square, Pin Fins Length: 1.830" (46.48mm) Material: Aluminum Packaging: Tray |
на замовлення 690 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
|
573100D00000G | Boyd Laconia, LLC |
Description: TOP MOUNT HEATSINK .4" D-PAKLength: 0.315" (8.00mm) Material: Aluminum Packaging: Bulk Part Status: Active Material Finish: Tin Fin Height: 0.400" (10.16mm) Thermal Resistance @ Natural: 15.00°C/W Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM Power Dissipation @ Temperature Rise: 0.8W @ 30°C Attachment Method: SMD Pad Package Cooled: TO-252 (DPAK) Width: 0.900" (22.86mm) Type: Top Mount Shape: Rectangular, Fins |
на замовлення 3237 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
573100D00010G | Boyd Laconia, LLC |
Description: HEATSINK SMT D-PAK/TO-252 TINPackaging: Cut Tape (CT) Material: Aluminum Length: 0.315" (8.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.900" (22.86mm) Package Cooled: TO-252 (DPAK) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 0.8W @ 30°C Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM Thermal Resistance @ Natural: 26.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin |
на замовлення 12944 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
573100D00010G | Boyd Laconia, LLC |
Description: HEATSINK SMT D-PAK/TO-252 TINPackaging: Tape & Reel (TR) Material: Aluminum Length: 0.315" (8.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.900" (22.86mm) Package Cooled: TO-252 (DPAK) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 0.8W @ 30°C Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM Thermal Resistance @ Natural: 26.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin |
на замовлення 12750 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
|
573300D00000G | Boyd Laconia, LLC |
Description: TOP MOUNT HEATSINK .4" D2PAKPackaging: Bulk Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.030" (26.16mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.3W @ 30°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM Thermal Resistance @ Natural: 18.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 2692 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
573300D00010G | Boyd Laconia, LLC |
Description: HEATSINK D2PAK .4" HIGH SMDPackaging: Tape & Reel (TR) Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.030" (26.16mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.3W @ 30°C Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 11523 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
573300D00010G | Boyd Laconia, LLC |
Description: HEATSINK D2PAK .4" HIGH SMDPackaging: Cut Tape (CT) Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.030" (26.16mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.3W @ 30°C Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 11523 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
|
573400D00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPart Status: Active Material Finish: Tin Fin Height: 0.401" (10.20mm) Thermal Resistance @ Natural: 14.00°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Power Dissipation @ Temperature Rise: 1.0W @ 20°C Attachment Method: SMD Pad Package Cooled: TO-268 (D³Pak) Width: 1.220" (30.99mm) Type: Top Mount Shape: Rectangular, Fins Length: 0.500" (12.70mm) Packaging: Bulk |
на замовлення 2248 шт: термін постачання 21-31 дні (днів) |
|
| 531302B02500G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 H=2.5" BLK W/PIN
Packaging: Bulk
Material: Aluminum
Length: 2.500" (63.50mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220, TO-202
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 8.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 H=2.5" BLK W/PIN
Packaging: Bulk
Material: Aluminum
Length: 2.500" (63.50mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220, TO-202
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 8.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1245 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 651.92 грн |
| 10+ | 555.47 грн |
| 25+ | 529.13 грн |
| 50+ | 478.59 грн |
| 100+ | 461.28 грн |
| 250+ | 439.32 грн |
| 750+ | 407.53 грн |
| 532602B00000 |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 5.50°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Attachment Method: Bolt On
Package Cooled: TO-220
Width: 1.650" (41.91mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Material: Aluminum
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 5.50°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Attachment Method: Bolt On
Package Cooled: TO-220
Width: 1.650" (41.91mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| 532602B02500G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN 38.1MM
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 5.50°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Description: HEATSINK TO-220 SOLDERPIN 38.1MM
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 5.50°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
на замовлення 3318 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 256.34 грн |
| 10+ | 218.58 грн |
| 25+ | 208.20 грн |
| 50+ | 188.31 грн |
| 240+ | 178.11 грн |
| 532702B02500G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN 50.8MM
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Length: 2.000" (50.80mm)
Thermal Resistance @ Natural: 4.80°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Material: Aluminum
Packaging: Bulk
Description: HEATSINK TO-220 SOLDERPIN 50.8MM
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Length: 2.000" (50.80mm)
Thermal Resistance @ Natural: 4.80°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Material: Aluminum
Packaging: Bulk
на замовлення 367 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 541.16 грн |
| 10+ | 461.00 грн |
| 25+ | 439.14 грн |
| 50+ | 397.23 грн |
| 100+ | 392.81 грн |
| 532802B02500G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 4.20°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.500" (63.50mm)
Material: Aluminum
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 4.20°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.500" (63.50mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 840 шт
В кошику
од. на суму грн.
| 533002B02551G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 13.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.375" (34.93mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.000" (25.40mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 13.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.375" (34.93mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.000" (25.40mm)
Material: Aluminum
Packaging: Bulk
на замовлення 3132 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 472.32 грн |
| 10+ | 402.41 грн |
| 25+ | 383.31 грн |
| 50+ | 346.71 грн |
| 100+ | 340.51 грн |
| 533201B02500G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 9.00°C/W
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-218, TO-247
Width: 1.375" (34.93mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 9.00°C/W
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-218, TO-247
Width: 1.375" (34.93mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 533402B02552G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Thermal Resistance @ Natural: 5.00°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 500 LFM
Power Dissipation @ Temperature Rise: 8.0W @ 40°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.650" (41.91mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 1.500" (38.10mm)
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Thermal Resistance @ Natural: 5.00°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 500 LFM
Power Dissipation @ Temperature Rise: 8.0W @ 40°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.650" (41.91mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 1.500" (38.10mm)
на замовлення 713 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 238.93 грн |
| 10+ | 203.80 грн |
| 25+ | 194.12 грн |
| 50+ | 175.61 грн |
| 100+ | 169.26 грн |
| 250+ | 165.60 грн |
| 533422B02552G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
на замовлення 4060 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 280.07 грн |
| 10+ | 239.07 грн |
| 25+ | 227.80 грн |
| 50+ | 206.06 грн |
| 240+ | 189.57 грн |
| 480+ | 182.71 грн |
| 720+ | 175.87 грн |
| 1200+ | 171.15 грн |
| 533502B02552G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Shape: Rectangular, Fins
Length: 1.650" (41.91mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 2.000" (50.80mm)
Thermal Resistance @ Natural: 4.50°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Description: BOARD LEVEL HEAT SINK
Shape: Rectangular, Fins
Length: 1.650" (41.91mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 2.000" (50.80mm)
Thermal Resistance @ Natural: 4.50°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
товару немає в наявності
Мінімальне замовлення: 750 шт
В кошику
од. на суму грн.
| 533522B02552G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 2.70°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220 (Dual)
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 2.70°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220 (Dual)
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 750 шт
В кошику
од. на суму грн.
| 533602B02552G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 3.80°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 16.0W @ 50°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.500" (63.50mm)
Material: Aluminum
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.000" (25.40mm)
Thermal Resistance @ Natural: 3.80°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 16.0W @ 50°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.650" (41.91mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.500" (63.50mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| 533802B02500G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 13.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Attachment Method: PC Pin
Package Cooled: TO-220
Width: 1.375" (34.93mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.000" (25.40mm)
Material: Aluminum
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 13.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Attachment Method: PC Pin
Package Cooled: TO-220
Width: 1.375" (34.93mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.000" (25.40mm)
Material: Aluminum
Packaging: Bulk
на замовлення 1689 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 522.17 грн |
| 10+ | 445.31 грн |
| 25+ | 424.20 грн |
| 50+ | 383.70 грн |
| 100+ | 378.66 грн |
| 534202B02853G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/SHURLOCK-CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 W/SHURLOCK-CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 16432 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 407.45 грн |
| 10+ | 347.56 грн |
| 25+ | 331.04 грн |
| 50+ | 299.43 грн |
| 100+ | 288.61 грн |
| 486+ | 265.32 грн |
| 972+ | 251.51 грн |
| 1458+ | 246.12 грн |
| 534202B03453G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEATSINK .5" TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEATSINK .5" TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
на замовлення 1552 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 449.38 грн |
| 10+ | 383.22 грн |
| 25+ | 365.05 грн |
| 50+ | 330.23 грн |
| 100+ | 318.29 грн |
| 250+ | 303.14 грн |
| 500+ | 287.36 грн |
| 1200+ | 274.26 грн |
| 534302B03553G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/TAB-KOOLCLIP
Thermal Resistance @ Natural: 10.40°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.380" (35.05mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.480" (12.19mm)
Description: HEATSINK TO-220 W/TAB-KOOLCLIP
Thermal Resistance @ Natural: 10.40°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.380" (35.05mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.480" (12.19mm)
товару немає в наявності
В кошику
од. на суму грн.
| 53-77-13ACG |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.03X12.7MM W/ADH
Part Status: Active
Adhesive: Adhesive - One Side
Thermal Conductivity: 0.9W/m-K
Outline: 18.03mm x 12.70mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
Description: THERM PAD 18.03X12.7MM W/ADH
Part Status: Active
Adhesive: Adhesive - One Side
Thermal Conductivity: 0.9W/m-K
Outline: 18.03mm x 12.70mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 10000 шт
В кошику
од. на суму грн.
| 53-77-2G |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Thermal Conductivity: 0.9W/m-K
Outline: 17.50mm x 14.27mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Thermal Conductivity: 0.9W/m-K
Outline: 17.50mm x 14.27mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
на замовлення 510 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 98.10 грн |
| 10+ | 83.88 грн |
| 25+ | 79.87 грн |
| 50+ | 72.26 грн |
| 100+ | 69.65 грн |
| 250+ | 66.34 грн |
| 500+ | 62.90 грн |
| 53-77-3G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Thermal Conductivity: 0.9W/m-K
Outline: 17.50mm x 14.27mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Thermal Conductivity: 0.9W/m-K
Outline: 17.50mm x 14.27mm
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Rectangular
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| 53-77-4ACG |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 19.05X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Description: THERM PAD 19.05X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
на замовлення 4646 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 72.00 грн |
| 10+ | 61.71 грн |
| 25+ | 58.75 грн |
| 50+ | 53.15 грн |
| 100+ | 51.24 грн |
| 250+ | 48.80 грн |
| 500+ | 46.27 грн |
| 1000+ | 44.60 грн |
| 53-77-4G |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 19.05MMX12.7MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Description: THERM PAD 19.05MMX12.7MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
на замовлення 12290 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 39.56 грн |
| 10+ | 33.37 грн |
| 25+ | 31.85 грн |
| 50+ | 28.78 грн |
| 100+ | 27.76 грн |
| 250+ | 26.44 грн |
| 500+ | 25.07 грн |
| 1000+ | 24.16 грн |
| 5000+ | 22.18 грн |
| 53-77-9ACG |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.42X13.21MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Description: THERM PAD 18.42X13.21MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
на замовлення 9680 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 69.62 грн |
| 10+ | 59.50 грн |
| 25+ | 56.65 грн |
| 50+ | 51.25 грн |
| 100+ | 49.40 грн |
| 250+ | 47.07 грн |
| 500+ | 44.62 грн |
| 2000+ | 41.45 грн |
| 6000+ | 39.09 грн |
| 53-77-9G |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.42X13.21MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Part Status: Active
Description: THERM PAD 18.42X13.21MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Part Status: Active
на замовлення 11975 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 37.98 грн |
| 10+ | 32.38 грн |
| 25+ | 30.84 грн |
| 50+ | 27.91 грн |
| 100+ | 26.90 грн |
| 250+ | 25.62 грн |
| 500+ | 24.29 грн |
| 2000+ | 22.57 грн |
| 6000+ | 21.29 грн |
| 53-78-3AC |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 25.4X20.32MM W/ADH
Part Status: Active
Adhesive: Adhesive - One Side
Thermal Conductivity: 0.9W/m-K
Outline: 25.40mm x 20.32mm
Usage: TO-218
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Polygon, 5-sided
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
Description: THERM PAD 25.4X20.32MM W/ADH
Part Status: Active
Adhesive: Adhesive - One Side
Thermal Conductivity: 0.9W/m-K
Outline: 25.40mm x 20.32mm
Usage: TO-218
Type: Pad, Sheet
Thickness: 0.0060" (0.152mm)
Shape: Polygon, 5-sided
Material: Silicone Rubber
Color: Gray, Green
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 6000 шт
В кошику
од. на суму грн.
| 542502B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB BLACK
Material Finish: Black Anodized
Fin Height: 0.250" (6.35mm)
Thermal Resistance @ Natural: 24.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 0.875" (22.22mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.250" (31.75mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK TO-220 TAB BLACK
Material Finish: Black Anodized
Fin Height: 0.250" (6.35mm)
Thermal Resistance @ Natural: 24.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 0.875" (22.22mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.250" (31.75mm)
Material: Aluminum
Packaging: Bulk
на замовлення 5251 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 246.05 грн |
| 10+ | 209.89 грн |
| 25+ | 199.97 грн |
| 50+ | 180.90 грн |
| 100+ | 174.35 грн |
| 250+ | 166.07 грн |
| 500+ | 157.43 грн |
| 1000+ | 151.73 грн |
| 542502D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB TIN
Material Finish: Tin
Fin Height: 0.250" (6.35mm)
Thermal Resistance @ Natural: 24.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 0.875" (22.22mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.250" (31.75mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK TO-220 TAB TIN
Material Finish: Tin
Fin Height: 0.250" (6.35mm)
Thermal Resistance @ Natural: 24.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 0.875" (22.22mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.250" (31.75mm)
Material: Aluminum
Packaging: Bulk
на замовлення 6525 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 283.24 грн |
| 10+ | 241.13 грн |
| 25+ | 229.69 грн |
| 50+ | 207.76 грн |
| 100+ | 200.26 грн |
| 250+ | 190.73 грн |
| 500+ | 180.81 грн |
| 1000+ | 174.26 грн |
| 551002B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 1.45" HIGH
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.787" (19.99mm)
Thermal Resistance @ Natural: 12.40°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 1.5W @ 20°C
Attachment Method: Bolt On
Package Cooled: TO-220
Width: 1.006" (25.55mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Material: Aluminum
Packaging: Bag
Description: HEATSINK TO-220 1.45" HIGH
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.787" (19.99mm)
Thermal Resistance @ Natural: 12.40°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 1.5W @ 20°C
Attachment Method: Bolt On
Package Cooled: TO-220
Width: 1.006" (25.55mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Material: Aluminum
Packaging: Bag
на замовлення 601 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 320.42 грн |
| 10+ | 272.90 грн |
| 25+ | 259.95 грн |
| 50+ | 235.13 грн |
| 100+ | 226.63 грн |
| 250+ | 215.85 грн |
| 500+ | 204.62 грн |
| 552844B00000 |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.720" (18.29mm)
Thermal Resistance @ Natural: 8.70°C/W
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-220 (Dual)
Width: 1.780" (45.21mm)
Type: Board Level
Shape: Square, Fins
Length: 1.780" (45.21mm)
Material: Aluminum
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.720" (18.29mm)
Thermal Resistance @ Natural: 8.70°C/W
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-220 (Dual)
Width: 1.780" (45.21mm)
Type: Board Level
Shape: Square, Fins
Length: 1.780" (45.21mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| 56-02-101G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 26.16MMX22.61MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0030" (0.076mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 26.16mm x 22.61mm
Description: THERM PAD 26.16MMX22.61MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0030" (0.076mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 26.16mm x 22.61mm
товару немає в наявності
Мінімальне замовлення: 6000 шт
В кошику
од. на суму грн.
| 56-03-8G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 42.85X30.15MM OPAQUE
Part Status: Active
Outline: 42.85mm x 30.15mm
Type: Insulator
Thickness: 0.0020" (0.051mm)
Shape: Rhombus
Material: Mica
Color: Opaque
Packaging: Bulk
Usage: TO-3
Description: THERM PAD 42.85X30.15MM OPAQUE
Part Status: Active
Outline: 42.85mm x 30.15mm
Type: Insulator
Thickness: 0.0020" (0.051mm)
Shape: Rhombus
Material: Mica
Color: Opaque
Packaging: Bulk
Usage: TO-3
на замовлення 2740 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 60.92 грн |
| 10+ | 52.42 грн |
| 25+ | 50.04 грн |
| 50+ | 45.29 грн |
| 100+ | 43.69 грн |
| 250+ | 41.67 грн |
| 500+ | 39.53 грн |
| 563002B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 VERT MNT 1.18"
Packaging: Bag
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 VERT MNT 1.18"
Packaging: Bag
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
на замовлення 1043 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 341.78 грн |
| 10+ | 291.26 грн |
| 25+ | 277.47 грн |
| 50+ | 251.00 грн |
| 100+ | 241.92 грн |
| 250+ | 230.42 грн |
| 500+ | 218.43 грн |
| 563002D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB TIN
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 13.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.180" (29.97mm)
Packaging: Bulk
Material Finish: Tin
Description: HEATSINK TO-220 TAB TIN
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 13.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.180" (29.97mm)
Packaging: Bulk
Material Finish: Tin
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 135.29 грн |
| 10+ | 115.57 грн |
| 25+ | 110.04 грн |
| 50+ | 99.55 грн |
| 100+ | 95.95 грн |
| 250+ | 91.39 грн |
| 500+ | 86.65 грн |
| 563202D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Tin
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 9.40°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.380" (35.05mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Material Finish: Tin
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 9.40°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-220
Width: 1.380" (35.05mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Packaging: Bulk
на замовлення 2732 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 147.95 грн |
| 10+ | 126.24 грн |
| 25+ | 120.34 грн |
| 50+ | 108.96 грн |
| 100+ | 105.10 грн |
| 420+ | 101.62 грн |
| 566010B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 40°C
Attachment Method: Clip
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 40°C
Attachment Method: Clip
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 6000 шт
В кошику
од. на суму грн.
| 566010B02800G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON W/TABS
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and Board Locks
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK TO-220 CLIP-ON W/TABS
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and Board Locks
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| 566010B03400G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK W/TAB BLACK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK W/TAB BLACK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
на замовлення 1591 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 655.08 грн |
| 10+ | 558.14 грн |
| 25+ | 531.60 грн |
| 50+ | 480.85 грн |
| 100+ | 463.46 грн |
| 250+ | 441.40 грн |
| 800+ | 408.05 грн |
| 566902B04000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 18.80°C/W
Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220, TO-262
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 0.850" (21.59mm)
Material: Aluminum
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 18.80°C/W
Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220, TO-262
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 0.850" (21.59mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| 56-77-10 |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 21.89MMX13.21MM OPAQUE
Outline: 21.89mm x 13.21mm
Usage: TO-220
Type: Insulator
Thickness: 0.0020" (0.051mm)
Shape: Rectangular
Material: Mica
Color: Opaque
Packaging: Bulk
Description: THERM PAD 21.89MMX13.21MM OPAQUE
Outline: 21.89mm x 13.21mm
Usage: TO-220
Type: Insulator
Thickness: 0.0020" (0.051mm)
Shape: Rectangular
Material: Mica
Color: Opaque
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| 56-77-11G |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.92MMX13.84MM OPAQUE
Outline: 18.92mm x 13.84mm
Usage: TO-220
Type: Insulator
Thickness: 0.0020" (0.051mm)
Shape: Rectangular
Material: Mica
Color: Opaque
Packaging: Bulk
Description: THERM PAD 18.92MMX13.84MM OPAQUE
Outline: 18.92mm x 13.84mm
Usage: TO-220
Type: Insulator
Thickness: 0.0020" (0.051mm)
Shape: Rectangular
Material: Mica
Color: Opaque
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 56-77-8G |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.92MMX13.84MM Clear
Packaging: Bulk
Color: Clear
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Usage: TO-220
Outline: 18.92mm x 13.84mm
Description: THERM PAD 18.92MMX13.84MM Clear
Packaging: Bulk
Color: Clear
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Usage: TO-220
Outline: 18.92mm x 13.84mm
на замовлення 7183 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 7+ | 47.47 грн |
| 10+ | 40.45 грн |
| 25+ | 38.52 грн |
| 50+ | 34.83 грн |
| 100+ | 33.58 грн |
| 250+ | 31.98 грн |
| 500+ | 30.32 грн |
| 1000+ | 29.23 грн |
| 5000+ | 26.83 грн |
| 568103B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-3 12W H=.75" BLK
Description: HEATSINK TO-3 12W H=.75" BLK
товару немає в наявності
В кошику
од. на суму грн.
| 568303B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-3 1.25" 25WATT
Material Finish: Black Anodized
Fin Height: 1.250" (31.75mm)
Thermal Resistance @ Natural: 5.40°C/W
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.810" (45.97mm)
Type: Board Level
Shape: Square
Length: 1.810" (45.97mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK TO-3 1.25" 25WATT
Material Finish: Black Anodized
Fin Height: 1.250" (31.75mm)
Thermal Resistance @ Natural: 5.40°C/W
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.810" (45.97mm)
Type: Board Level
Shape: Square
Length: 1.810" (45.97mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 568403B00000 |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.500" (38.10mm)
Thermal Resistance @ Natural: 4.70°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.810" (45.97mm)
Type: Top Mount
Shape: Rectangular, Pin Fins
Length: 1.810" (45.97mm)
Material: Aluminum
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 1.500" (38.10mm)
Thermal Resistance @ Natural: 4.70°C/W
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.810" (45.97mm)
Type: Top Mount
Shape: Rectangular, Pin Fins
Length: 1.810" (45.97mm)
Material: Aluminum
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| 569003B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: COOLER FOR TO-3 20 WATTS
Part Status: Active
Material Finish: Black Anodized
Fin Height: 1.310" (33.27mm)
Thermal Resistance @ Natural: 5.50°C/W
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Power Dissipation @ Temperature Rise: 12.0W @ 60°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.830" (46.48mm)
Type: Board Level
Shape: Square, Pin Fins
Length: 1.830" (46.48mm)
Material: Aluminum
Packaging: Tray
Description: COOLER FOR TO-3 20 WATTS
Part Status: Active
Material Finish: Black Anodized
Fin Height: 1.310" (33.27mm)
Thermal Resistance @ Natural: 5.50°C/W
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Power Dissipation @ Temperature Rise: 12.0W @ 60°C
Attachment Method: Bolt On
Package Cooled: TO-3
Width: 1.830" (46.48mm)
Type: Board Level
Shape: Square, Pin Fins
Length: 1.830" (46.48mm)
Material: Aluminum
Packaging: Tray
на замовлення 690 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 549.86 грн |
| 10+ | 468.77 грн |
| 25+ | 446.48 грн |
| 50+ | 403.88 грн |
| 100+ | 389.25 грн |
| 250+ | 370.73 грн |
| 500+ | 351.43 грн |
| 573100D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: TOP MOUNT HEATSINK .4" D-PAK
Length: 0.315" (8.00mm)
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Tin
Fin Height: 0.400" (10.16mm)
Thermal Resistance @ Natural: 15.00°C/W
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Attachment Method: SMD Pad
Package Cooled: TO-252 (DPAK)
Width: 0.900" (22.86mm)
Type: Top Mount
Shape: Rectangular, Fins
Description: TOP MOUNT HEATSINK .4" D-PAK
Length: 0.315" (8.00mm)
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Tin
Fin Height: 0.400" (10.16mm)
Thermal Resistance @ Natural: 15.00°C/W
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Attachment Method: SMD Pad
Package Cooled: TO-252 (DPAK)
Width: 0.900" (22.86mm)
Type: Top Mount
Shape: Rectangular, Fins
на замовлення 3237 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 354.44 грн |
| 10+ | 302.53 грн |
| 25+ | 288.14 грн |
| 50+ | 260.65 грн |
| 100+ | 251.22 грн |
| 250+ | 239.27 грн |
| 500+ | 226.83 грн |
| 573100D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
на замовлення 12944 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 40.35 грн |
| 10+ | 34.13 грн |
| 25+ | 32.55 грн |
| 50+ | 29.46 грн |
| 100+ | 28.39 грн |
| 573100D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
на замовлення 12750 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 250+ | 29.93 грн |
| 500+ | 27.78 грн |
| 750+ | 27.19 грн |
| 1250+ | 24.83 грн |
| 1750+ | 24.39 грн |
| 2500+ | 23.93 грн |
| 6250+ | 22.42 грн |
| 12500+ | 21.60 грн |
| 573300D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: TOP MOUNT HEATSINK .4" D2PAK
Packaging: Bulk
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: TOP MOUNT HEATSINK .4" D2PAK
Packaging: Bulk
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 2692 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 282.45 грн |
| 10+ | 240.67 грн |
| 25+ | 229.26 грн |
| 50+ | 207.40 грн |
| 100+ | 199.90 грн |
| 250+ | 190.40 грн |
| 500+ | 180.49 грн |
| 573300D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 11523 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 250+ | 35.64 грн |
| 500+ | 33.08 грн |
| 750+ | 32.38 грн |
| 1250+ | 29.57 грн |
| 1750+ | 29.04 грн |
| 2500+ | 28.50 грн |
| 6250+ | 26.70 грн |
| 573300D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 11523 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 7+ | 47.47 грн |
| 10+ | 40.76 грн |
| 25+ | 38.76 грн |
| 50+ | 35.08 грн |
| 100+ | 33.82 грн |
| 573400D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Packaging: Bulk
Description: BOARD LEVEL HEAT SINK
Part Status: Active
Material Finish: Tin
Fin Height: 0.401" (10.20mm)
Thermal Resistance @ Natural: 14.00°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Attachment Method: SMD Pad
Package Cooled: TO-268 (D³Pak)
Width: 1.220" (30.99mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 0.500" (12.70mm)
Packaging: Bulk
на замовлення 2248 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 215.20 грн |
| 10+ | 202.27 грн |
| 25+ | 196.80 грн |
| 50+ | 174.44 грн |
| 100+ | 164.17 грн |
| 250+ | 153.91 грн |
| 500+ | 146.34 грн |
| 1000+ | 131.20 грн |































