Продукція > BOYD LACONIA, LLC > Всі товари виробника BOYD LACONIA, LLC (837) > Сторінка 5 з 14
| Фото | Назва | Виробник | Інформація |
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533422B02552G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 SOLDERPIN/CLIPPackaging: Bulk Material: Aluminum Length: 1.650" (41.91mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 (Dual) Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 10.0W @ 50°C Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM Fin Height: 1.500" (38.10mm) Material Finish: Black Anodized |
на замовлення 5719 шт: термін постачання 21-31 дні (днів) |
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| 533501B12552G | Boyd Laconia, LLC |
Description: STD,533501B12552G Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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533502B02552G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.650" (41.91mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 6.0W @ 30°C Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM Thermal Resistance @ Natural: 4.50°C/W Fin Height: 2.000" (50.80mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 533522B02552G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 2.000" (50.80mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.650" (41.91mm) Package Cooled: TO-220 (Dual) Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 6.0W @ 30°C Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM Thermal Resistance @ Natural: 2.70°C/W Fin Height: 1.000" (25.40mm) Material Finish: Black Anodized Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 533566B42552G | Boyd Laconia, LLC |
Description: 533566B42552G Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 533602B02552G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 2.500" (63.50mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.650" (41.91mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 16.0W @ 50°C Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM Thermal Resistance @ Natural: 3.80°C/W Fin Height: 1.000" (25.40mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 533621B02500G | Boyd Laconia, LLC |
Description: STD,533621B02500G Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 533766B42152G | Boyd Laconia, LLC |
Description: STD,533766B42152G Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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533802B02500G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.000" (25.40mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.375" (34.93mm) Package Cooled: TO-220 Attachment Method: PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM Thermal Resistance @ Natural: 13.00°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
на замовлення 2091 шт: термін постачання 21-31 дні (днів) |
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534202B02853G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 W/SHURLOCK-CLIPPackaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Clip and Board Locks Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM Thermal Resistance @ Natural: 13.40°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 17603 шт: термін постачання 21-31 дні (днів) |
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534202B03453G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEATSINK .5" TO-220Packaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Clip and Board Locks Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM Thermal Resistance @ Natural: 13.40°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
на замовлення 705 шт: термін постачання 21-31 дні (днів) |
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534302B03553G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 W/TAB-KOOLCLIPPackaging: Bulk Material: Aluminum Length: 2.000" (50.80mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.380" (35.05mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 6.0W @ 60°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM Thermal Resistance @ Natural: 10.40°C/W Fin Height: 0.480" (12.19mm) Material Finish: Black Anodized Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 534302B13553 | Boyd Laconia, LLC |
Description: STD,534302B13553 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 53-77-13ACG | Boyd Laconia, LLC |
Description: THERM PAD 18.03X12.7MM W/ADH Packaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 18.03mm x 12.70mm Thermal Conductivity: 0.9W/m-K Adhesive: Adhesive - One Side Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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53-77-2G | Boyd Laconia, LLC |
Description: THERM PAD 17.5MMX14.27MM GRY/GRNPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 17.50mm x 14.27mm Thermal Conductivity: 0.9W/m-K |
на замовлення 2840 шт: термін постачання 21-31 дні (днів) |
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| 53-77-3G | Boyd Laconia, LLC |
Description: THERM PAD 17.5MMX14.27MM GRY/GRN Packaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 17.50mm x 14.27mm Thermal Conductivity: 0.9W/m-K |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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53-77-4ACG | Boyd Laconia, LLC |
Description: THERM PAD 19.05X12.7MM W/ADHPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 19.05mm x 12.70mm Thermal Conductivity: 0.9W/m-K Adhesive: Adhesive - One Side |
на замовлення 13277 шт: термін постачання 21-31 дні (днів) |
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53-77-4G | Boyd Laconia, LLC |
Description: THERM PAD 19.05MMX12.7MM GRY/GRNPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 19.05mm x 12.70mm Thermal Conductivity: 0.9W/m-K |
на замовлення 5292 шт: термін постачання 21-31 дні (днів) |
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53-77-9ACG | Boyd Laconia, LLC |
Description: THERM PAD 18.42X13.21MM W/ADHPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 18.42mm x 13.21mm Thermal Conductivity: 0.9W/m-K Adhesive: Adhesive - One Side |
на замовлення 5748 шт: термін постачання 21-31 дні (днів) |
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53-77-9G | Boyd Laconia, LLC |
Description: THERM PAD 18.42X13.21MM GRY/GRNPackaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-220 Outline: 18.42mm x 13.21mm Thermal Conductivity: 0.9W/m-K Part Status: Active |
на замовлення 13235 шт: термін постачання 21-31 дні (днів) |
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| 53-78-3AC | Boyd Laconia, LLC |
Description: THERM PAD 25.4X20.32MM W/ADH Packaging: Bulk Color: Gray, Green Material: Silicone Rubber Shape: Polygon, 5-sided Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Usage: TO-218 Outline: 25.40mm x 20.32mm Thermal Conductivity: 0.9W/m-K Adhesive: Adhesive - One Side Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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542502B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 TAB BLACKPackaging: Bulk Material: Aluminum Length: 1.250" (31.75mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.875" (22.22mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 2.5W @ 60°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM Thermal Resistance @ Natural: 24.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized |
на замовлення 5275 шт: термін постачання 21-31 дні (днів) |
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542502D00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 TAB TINPackaging: Bulk Material: Aluminum Length: 1.250" (31.75mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.875" (22.22mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 2.5W @ 60°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM Thermal Resistance @ Natural: 24.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Tin |
на замовлення 6525 шт: термін постачання 21-31 дні (днів) |
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551002B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 1.45" HIGHPackaging: Bag Material: Aluminum Length: 1.450" (36.83mm) Shape: Rectangular, Fins Type: Board Level Width: 1.006" (25.55mm) Package Cooled: TO-220 Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 1.5W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM Thermal Resistance @ Natural: 12.40°C/W Fin Height: 0.787" (19.99mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1284 шт: термін постачання 21-31 дні (днів) |
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| 552844B00000 | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.780" (45.21mm) Shape: Square, Fins Type: Board Level Width: 1.780" (45.21mm) Package Cooled: TO-220 (Dual) Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 3.0W @ 30°C Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM Thermal Resistance @ Natural: 8.70°C/W Fin Height: 0.720" (18.29mm) Material Finish: Black Anodized Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 552844B00000G | Boyd Laconia, LLC |
Description: HEATSINKPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 56-02-101G | Boyd Laconia, LLC |
Description: THERM PAD 26.16MMX22.61MM OPAQUE Packaging: Bulk Color: Opaque Material: Mica Shape: Rectangular Thickness: 0.0030" (0.076mm) Type: Insulator Usage: TO-218, TO-247, TO-3P Outline: 26.16mm x 22.61mm |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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56-03-8G | Boyd Laconia, LLC |
Description: THERM PAD 42.85X30.15MM OPAQUE Packaging: Bulk Color: Opaque Material: Mica Shape: Rhombus Thickness: 0.0020" (0.051mm) Type: Insulator Usage: TO-3 Outline: 42.85mm x 30.15mm Part Status: Active |
на замовлення 2740 шт: термін постачання 21-31 дні (днів) |
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563002B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 VERT MNT 1.18"Packaging: Bag Material: Aluminum Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 13.00°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
на замовлення 1791 шт: термін постачання 21-31 дні (днів) |
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563002D00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 TAB TINPackaging: Bulk Length: 1.180" (29.97mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 13.00°C/W Fin Height: 0.500" (12.70mm) Material Finish: Tin |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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563202D00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Length: 2.000" (50.80mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.380" (35.05mm) Package Cooled: TO-220 Attachment Method: Bolt On and PC Pin Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM Thermal Resistance @ Natural: 9.40°C/W Fin Height: 0.500" (12.70mm) Material Finish: Tin |
на замовлення 2732 шт: термін постачання 21-31 дні (днів) |
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| 566010B00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.220" (30.99mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: Multiwatt, SIP Attachment Method: Clip Power Dissipation @ Temperature Rise: 3.0W @ 40°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM Thermal Resistance @ Natural: 11.50°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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566010B02800G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 CLIP-ON W/TABSPackaging: Bulk Material: Aluminum Length: 1.220" (30.99mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: Multiwatt, SIP Attachment Method: Clip and Board Locks Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM Thermal Resistance @ Natural: 11.50°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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566010B03400G | Boyd Laconia, LLC |
Description: HEATSINK W/TAB BLACKPackaging: Bulk Material: Aluminum Length: 1.220" (30.99mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: Multiwatt, SIP Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM Thermal Resistance @ Natural: 11.50°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1574 шт: термін постачання 21-31 дні (днів) |
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| 566102B00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 566902B04000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 0.850" (21.59mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.000" (25.40mm) Package Cooled: TO-220, TO-262 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 2.0W @ 40°C Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.80°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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56-77-11G | Boyd Laconia, LLC |
Description: THERM PAD 18.92MMX13.84MM OPAQUE Packaging: Bulk Color: Opaque Material: Mica Shape: Rectangular Thickness: 0.0020" (0.051mm) Type: Insulator Usage: TO-220 Outline: 18.92mm x 13.84mm |
на замовлення 9799 шт: термін постачання 21-31 дні (днів) |
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56-77-8G | Boyd Laconia, LLC |
Description: THERM PAD 18.92MMX13.84MM Clear Packaging: Bulk Color: Clear Material: Mica Shape: Rectangular Thickness: 0.0020" (0.051mm) Usage: TO-220 Outline: 18.92mm x 13.84mm |
на замовлення 2597 шт: термін постачання 21-31 дні (днів) |
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568303B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-3 1.25" 25WATTPackaging: Bulk Material: Aluminum Length: 1.810" (45.97mm) Shape: Square Type: Board Level Width: 1.810" (45.97mm) Package Cooled: TO-3 Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 5.0W @ 30°C Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM Thermal Resistance @ Natural: 5.40°C/W Fin Height: 1.250" (31.75mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 568403B00000 | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.810" (45.97mm) Shape: Rectangular, Pin Fins Type: Top Mount Width: 1.810" (45.97mm) Package Cooled: TO-3 Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 5.0W @ 30°C Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM Thermal Resistance @ Natural: 4.70°C/W Fin Height: 1.500" (38.10mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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569003B00000G | Boyd Laconia, LLC |
Description: COOLER FOR TO-3 20 WATTSPackaging: Tray Material: Aluminum Length: 1.830" (46.48mm) Shape: Square, Pin Fins Type: Board Level Width: 1.830" (46.48mm) Package Cooled: TO-3 Attachment Method: Bolt On Power Dissipation @ Temperature Rise: 12.0W @ 60°C Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM Thermal Resistance @ Natural: 5.50°C/W Fin Height: 1.310" (33.27mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 690 шт: термін постачання 21-31 дні (днів) |
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573100D00000G | Boyd Laconia, LLC |
Description: TOP MOUNT HEATSINK .4" D-PAKPackaging: Bulk Material: Aluminum Length: 0.315" (8.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.900" (22.86mm) Package Cooled: TO-252 (DPAK) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 0.8W @ 30°C Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM Thermal Resistance @ Natural: 15.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 3237 шт: термін постачання 21-31 дні (днів) |
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573100D00010G | Boyd Laconia, LLC |
Description: HEATSINK SMT D-PAK/TO-252 TINPackaging: Tape & Reel (TR) Material: Aluminum Length: 0.315" (8.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.900" (22.86mm) Package Cooled: TO-252 (DPAK) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 0.8W @ 30°C Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM Thermal Resistance @ Natural: 26.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin |
на замовлення 12750 шт: термін постачання 21-31 дні (днів) |
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573100D00010G | Boyd Laconia, LLC |
Description: HEATSINK SMT D-PAK/TO-252 TINPackaging: Cut Tape (CT) Material: Aluminum Length: 0.315" (8.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.900" (22.86mm) Package Cooled: TO-252 (DPAK) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 0.8W @ 30°C Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM Thermal Resistance @ Natural: 26.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin |
на замовлення 12944 шт: термін постачання 21-31 дні (днів) |
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573300D00000G | Boyd Laconia, LLC |
Description: TOP MOUNT HEATSINK .4" D2PAKPackaging: Bulk Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.030" (26.16mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.3W @ 30°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM Thermal Resistance @ Natural: 18.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 1410 шт: термін постачання 21-31 дні (днів) |
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573300D00010G | Boyd Laconia, LLC |
Description: HEATSINK D2PAK .4" HIGH SMDPackaging: Tape & Reel (TR) Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.030" (26.16mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.3W @ 30°C Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 11523 шт: термін постачання 21-31 дні (днів) |
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573300D00010G | Boyd Laconia, LLC |
Description: HEATSINK D2PAK .4" HIGH SMDPackaging: Cut Tape (CT) Material: Aluminum Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.030" (26.16mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.3W @ 30°C Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Tin Part Status: Active |
на замовлення 11523 шт: термін постачання 21-31 дні (днів) |
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573400D00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.220" (30.99mm) Package Cooled: TO-268 (D³Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 14.00°C/W Fin Height: 0.401" (10.20mm) Material Finish: Tin Part Status: Active |
на замовлення 2248 шт: термін постачання 21-31 дні (днів) |
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573400D00010G | Boyd Laconia, LLC |
Description: HEATSINK D-PAK3 TIN PLATED SMDPackaging: Tape & Reel (TR) Material: Copper Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.220" (30.99mm) Package Cooled: TO-268 (D³Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 14.00°C/W Fin Height: 0.401" (10.20mm) Material Finish: Tin Part Status: Active |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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573400D00010G | Boyd Laconia, LLC |
Description: HEATSINK D-PAK3 TIN PLATED SMDPackaging: Cut Tape (CT) Material: Copper Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.220" (30.99mm) Package Cooled: TO-268 (D³Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 14.00°C/W Fin Height: 0.401" (10.20mm) Material Finish: Tin Part Status: Active |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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573902B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 BLACK CLIP-ONPackaging: Bulk Material: Aluminum Length: 1.500" (38.10mm) Shape: Rectangular, Fins Type: Board Level Width: 0.500" (12.70mm) Package Cooled: TO-220 Attachment Method: Clip Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.80°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1497 шт: термін постачання 21-31 дні (днів) |
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| 573902B03100G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINK Packaging: Bulk Material: Aluminum Length: 1.500" (38.10mm) Shape: Rectangular, Fins Type: Board Level Width: 0.500" (12.70mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.80°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 573902B03900G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 1.500" (38.10mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.500" (12.70mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.80°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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573902B04000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 CLIP-ON/TABPackaging: Bulk Material: Aluminum Length: 1.500" (38.10mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.500" (12.70mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM Thermal Resistance @ Natural: 18.80°C/W Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 4665 шт: термін постачання 21-31 дні (днів) |
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574004B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-202 CLIP-ON .58" BKPackaging: Bag Material: Aluminum Length: 0.800" (20.32mm) Shape: Rectangular Type: Board Level Width: 0.577" (14.66mm) Package Cooled: TO-202 Attachment Method: Clip Power Dissipation @ Temperature Rise: 1.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM Thermal Resistance @ Natural: 28.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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574102B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 CLIP-ON BLKPackaging: Bag Material: Aluminum Length: 0.750" (19.05mm) Shape: Rectangular, Fins Type: Board Level Width: 0.860" (21.84mm) Package Cooled: TO-220 Attachment Method: Clip Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM Thermal Resistance @ Natural: 23.20°C/W Fin Height: 0.395" (10.03mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 2333 шт: термін постачання 21-31 дні (днів) |
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| 574204B03300G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINKPackaging: Bulk Material: Aluminum Length: 0.900" (22.86mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 1.020" (25.91mm) Package Cooled: TO-202 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 200 LFM Thermal Resistance @ Natural: 16.80°C/W Fin Height: 0.420" (10.67mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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574402B03200G | Boyd Laconia, LLC |
Description: HEATSINK TO220 HOR MNT W/TAB.75"Packaging: Bulk Material: Aluminum Length: 0.750" (19.05mm) Shape: Rectangular, Fins Type: Board Level Width: 0.860" (21.84mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM Thermal Resistance @ Natural: 23.20°C/W Fin Height: 0.395" (10.03mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 13359 шт: термін постачання 21-31 дні (днів) |
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574502B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 VERT MNT .75"Packaging: Bag Material: Aluminum Length: 0.750" (19.05mm) Shape: Rectangular, Fins Type: Board Level Width: 0.860" (21.84mm) Package Cooled: TO-220 Attachment Method: Clip Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM Thermal Resistance @ Natural: 21.20°C/W Fin Height: 0.395" (10.03mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 34862 шт: термін постачання 21-31 дні (днів) |
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574502B03200G | Boyd Laconia, LLC |
Description: HEATSINK TO-220 CLIP-ON/TABPackaging: Bulk Material: Aluminum Length: 0.750" (19.05mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.860" (21.84mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM Thermal Resistance @ Natural: 21.20°C/W Fin Height: 0.395" (10.03mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1640 шт: термін постачання 21-31 дні (днів) |
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| 533422B02552G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 SOLDERPIN/CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
на замовлення 5719 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 274.83 грн |
| 10+ | 234.08 грн |
| 25+ | 222.98 грн |
| 50+ | 201.71 грн |
| 240+ | 185.56 грн |
| 480+ | 178.85 грн |
| 720+ | 172.16 грн |
| 1200+ | 167.53 грн |
| 533502B02552G |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 2.000" (50.80mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.650" (41.91mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 2.000" (50.80mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 533522B02552G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 2.70°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 2.70°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 533602B02552G |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.500" (63.50mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 16.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 3.80°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 2.500" (63.50mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.650" (41.91mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 16.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Thermal Resistance @ Natural: 3.80°C/W
Fin Height: 1.000" (25.40mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 533802B02500G |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
на замовлення 2091 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 349.07 грн |
| 10+ | 298.04 грн |
| 25+ | 283.88 грн |
| 50+ | 256.77 грн |
| 100+ | 247.49 грн |
| 250+ | 235.72 грн |
| 540+ | 222.54 грн |
| 1080+ | 214.47 грн |
| 534202B02853G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/SHURLOCK-CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 W/SHURLOCK-CLIP
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 17603 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 101.09 грн |
| 10+ | 86.24 грн |
| 25+ | 82.19 грн |
| 50+ | 74.34 грн |
| 100+ | 71.66 грн |
| 486+ | 65.89 грн |
| 972+ | 63.14 грн |
| 534202B03453G |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEATSINK .5" TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEATSINK .5" TO-220
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 13.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
на замовлення 705 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 430.41 грн |
| 10+ | 367.32 грн |
| 25+ | 349.89 грн |
| 50+ | 316.48 грн |
| 100+ | 305.04 грн |
| 250+ | 290.53 грн |
| 500+ | 275.41 грн |
| 534302B03553G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 W/TAB-KOOLCLIP
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.480" (12.19mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 W/TAB-KOOLCLIP
Packaging: Bulk
Material: Aluminum
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 6.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.40°C/W
Fin Height: 0.480" (12.19mm)
Material Finish: Black Anodized
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 53-77-13ACG |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.03X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.03mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Part Status: Active
Description: THERM PAD 18.03X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.03mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 53-77-2G |
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Виробник: Boyd Laconia, LLC
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 17.50mm x 14.27mm
Thermal Conductivity: 0.9W/m-K
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 17.50mm x 14.27mm
Thermal Conductivity: 0.9W/m-K
на замовлення 2840 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 96.35 грн |
| 10+ | 82.51 грн |
| 25+ | 78.61 грн |
| 50+ | 71.11 грн |
| 100+ | 68.54 грн |
| 250+ | 65.28 грн |
| 500+ | 61.89 грн |
| 1000+ | 59.65 грн |
| 53-77-3G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 17.50mm x 14.27mm
Thermal Conductivity: 0.9W/m-K
Description: THERM PAD 17.5MMX14.27MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 17.50mm x 14.27mm
Thermal Conductivity: 0.9W/m-K
товару немає в наявності
В кошику
од. на суму грн.
| 53-77-4ACG |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 19.05X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Description: THERM PAD 19.05X12.7MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
на замовлення 13277 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 56.86 грн |
| 10+ | 48.98 грн |
| 25+ | 46.63 грн |
| 50+ | 42.17 грн |
| 100+ | 40.65 грн |
| 250+ | 38.72 грн |
| 500+ | 36.71 грн |
| 1000+ | 35.38 грн |
| 5000+ | 32.47 грн |
| 53-77-4G |
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Виробник: Boyd Laconia, LLC
Description: THERM PAD 19.05MMX12.7MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
Description: THERM PAD 19.05MMX12.7MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 19.05mm x 12.70mm
Thermal Conductivity: 0.9W/m-K
на замовлення 5292 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 52.12 грн |
| 10+ | 44.26 грн |
| 25+ | 42.16 грн |
| 50+ | 38.14 грн |
| 100+ | 36.76 грн |
| 250+ | 35.01 грн |
| 500+ | 33.19 грн |
| 1000+ | 31.99 грн |
| 5000+ | 29.37 грн |
| 53-77-9ACG |
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Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.42X13.21MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Description: THERM PAD 18.42X13.21MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
на замовлення 5748 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 70.29 грн |
| 10+ | 59.70 грн |
| 25+ | 56.89 грн |
| 50+ | 51.46 грн |
| 100+ | 49.60 грн |
| 250+ | 47.24 грн |
| 500+ | 44.79 грн |
| 2000+ | 41.61 грн |
| 53-77-9G |
![]() |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.42X13.21MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Part Status: Active
Description: THERM PAD 18.42X13.21MM GRY/GRN
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Thermal Conductivity: 0.9W/m-K
Part Status: Active
на замовлення 13235 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9+ | 37.12 грн |
| 10+ | 32.17 грн |
| 25+ | 30.60 грн |
| 50+ | 27.69 грн |
| 100+ | 26.68 грн |
| 250+ | 25.42 грн |
| 500+ | 24.10 грн |
| 2000+ | 22.39 грн |
| 6000+ | 21.12 грн |
| 53-78-3AC |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 25.4X20.32MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Polygon, 5-sided
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-218
Outline: 25.40mm x 20.32mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Part Status: Active
Description: THERM PAD 25.4X20.32MM W/ADH
Packaging: Bulk
Color: Gray, Green
Material: Silicone Rubber
Shape: Polygon, 5-sided
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Usage: TO-218
Outline: 25.40mm x 20.32mm
Thermal Conductivity: 0.9W/m-K
Adhesive: Adhesive - One Side
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 542502B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
на замовлення 5275 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 236.14 грн |
| 10+ | 201.38 грн |
| 25+ | 191.80 грн |
| 50+ | 173.51 грн |
| 100+ | 167.24 грн |
| 250+ | 159.29 грн |
| 500+ | 151.01 грн |
| 1000+ | 145.53 грн |
| 542502D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Tin
Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Material: Aluminum
Length: 1.250" (31.75mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.875" (22.22mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.5W @ 60°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 24.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Tin
на замовлення 6525 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 282.73 грн |
| 10+ | 240.70 грн |
| 25+ | 229.28 грн |
| 50+ | 207.39 грн |
| 100+ | 199.90 грн |
| 250+ | 190.39 грн |
| 500+ | 180.49 грн |
| 1000+ | 173.95 грн |
| 551002B00000G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 1.45" HIGH
Packaging: Bag
Material: Aluminum
Length: 1.450" (36.83mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.006" (25.55mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 1.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 12.40°C/W
Fin Height: 0.787" (19.99mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 1.45" HIGH
Packaging: Bag
Material: Aluminum
Length: 1.450" (36.83mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.006" (25.55mm)
Package Cooled: TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 1.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 12.40°C/W
Fin Height: 0.787" (19.99mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1284 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 299.32 грн |
| 10+ | 280.32 грн |
| 25+ | 272.81 грн |
| 50+ | 241.77 грн |
| 100+ | 227.55 грн |
| 250+ | 213.33 грн |
| 500+ | 202.84 грн |
| 1000+ | 181.86 грн |
| 552844B00000 |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.780" (45.21mm)
Shape: Square, Fins
Type: Board Level
Width: 1.780" (45.21mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 8.70°C/W
Fin Height: 0.720" (18.29mm)
Material Finish: Black Anodized
Part Status: Active
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.780" (45.21mm)
Shape: Square, Fins
Type: Board Level
Width: 1.780" (45.21mm)
Package Cooled: TO-220 (Dual)
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 8.70°C/W
Fin Height: 0.720" (18.29mm)
Material Finish: Black Anodized
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 56-02-101G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 26.16MMX22.61MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0030" (0.076mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 26.16mm x 22.61mm
Description: THERM PAD 26.16MMX22.61MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0030" (0.076mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 26.16mm x 22.61mm
товару немає в наявності
В кошику
од. на суму грн.
| 56-03-8G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 42.85X30.15MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rhombus
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-3
Outline: 42.85mm x 30.15mm
Part Status: Active
Description: THERM PAD 42.85X30.15MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rhombus
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-3
Outline: 42.85mm x 30.15mm
Part Status: Active
на замовлення 2740 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 60.81 грн |
| 10+ | 52.32 грн |
| 25+ | 49.95 грн |
| 50+ | 45.21 грн |
| 100+ | 43.61 грн |
| 250+ | 41.59 грн |
| 500+ | 39.46 грн |
| 563002B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 VERT MNT 1.18"
Packaging: Bag
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 VERT MNT 1.18"
Packaging: Bag
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
на замовлення 1791 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 334.85 грн |
| 10+ | 285.19 грн |
| 25+ | 271.62 грн |
| 50+ | 245.68 грн |
| 100+ | 236.81 грн |
| 250+ | 225.55 грн |
| 500+ | 213.82 грн |
| 563002D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
Description: HEATSINK TO-220 TAB TIN
Packaging: Bulk
Length: 1.180" (29.97mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
на замовлення 500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 135.05 грн |
| 10+ | 115.37 грн |
| 25+ | 109.85 грн |
| 50+ | 99.38 грн |
| 100+ | 95.78 грн |
| 250+ | 91.23 грн |
| 500+ | 86.49 грн |
| 563202D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 2.000" (50.80mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.380" (35.05mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.40°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Tin
на замовлення 2732 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 147.68 грн |
| 10+ | 126.01 грн |
| 25+ | 120.13 грн |
| 50+ | 108.77 грн |
| 100+ | 104.91 грн |
| 420+ | 101.44 грн |
| 566010B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 566010B02800G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON W/TABS
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: HEATSINK TO-220 CLIP-ON W/TABS
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and Board Locks
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 566010B03400G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK W/TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK W/TAB BLACK
Packaging: Bulk
Material: Aluminum
Length: 1.220" (30.99mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: Multiwatt, SIP
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.50°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1574 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 623.90 грн |
| 10+ | 531.59 грн |
| 25+ | 506.34 грн |
| 50+ | 458.00 грн |
| 100+ | 441.43 грн |
| 250+ | 420.42 грн |
| 800+ | 388.66 грн |
| 566902B04000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.850" (21.59mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220, TO-262
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.850" (21.59mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220, TO-262
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 56-77-11G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.92MMX13.84MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-220
Outline: 18.92mm x 13.84mm
Description: THERM PAD 18.92MMX13.84MM OPAQUE
Packaging: Bulk
Color: Opaque
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Insulator
Usage: TO-220
Outline: 18.92mm x 13.84mm
на замовлення 9799 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9+ | 37.91 грн |
| 10+ | 31.94 грн |
| 25+ | 30.39 грн |
| 50+ | 27.49 грн |
| 100+ | 26.50 грн |
| 250+ | 25.24 грн |
| 500+ | 23.93 грн |
| 1000+ | 23.07 грн |
| 5000+ | 21.18 грн |
| 56-77-8G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 18.92MMX13.84MM Clear
Packaging: Bulk
Color: Clear
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Usage: TO-220
Outline: 18.92mm x 13.84mm
Description: THERM PAD 18.92MMX13.84MM Clear
Packaging: Bulk
Color: Clear
Material: Mica
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Usage: TO-220
Outline: 18.92mm x 13.84mm
на замовлення 2597 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 15+ | 20.38 грн |
| 100+ | 18.57 грн |
| 1000+ | 13.85 грн |
| 568303B00000G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-3 1.25" 25WATT
Packaging: Bulk
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Square
Type: Board Level
Width: 1.810" (45.97mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.40°C/W
Fin Height: 1.250" (31.75mm)
Material Finish: Black Anodized
Description: HEATSINK TO-3 1.25" 25WATT
Packaging: Bulk
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Square
Type: Board Level
Width: 1.810" (45.97mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.40°C/W
Fin Height: 1.250" (31.75mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 568403B00000 |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.810" (45.97mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 4.70°C/W
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.810" (45.97mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.810" (45.97mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 5.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 4.70°C/W
Fin Height: 1.500" (38.10mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 569003B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: COOLER FOR TO-3 20 WATTS
Packaging: Tray
Material: Aluminum
Length: 1.830" (46.48mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.830" (46.48mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 12.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Thermal Resistance @ Natural: 5.50°C/W
Fin Height: 1.310" (33.27mm)
Material Finish: Black Anodized
Part Status: Active
Description: COOLER FOR TO-3 20 WATTS
Packaging: Tray
Material: Aluminum
Length: 1.830" (46.48mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.830" (46.48mm)
Package Cooled: TO-3
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 12.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Thermal Resistance @ Natural: 5.50°C/W
Fin Height: 1.310" (33.27mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 690 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 548.88 грн |
| 10+ | 467.94 грн |
| 25+ | 445.68 грн |
| 50+ | 403.15 грн |
| 100+ | 388.56 грн |
| 250+ | 370.07 грн |
| 500+ | 350.80 грн |
| 573100D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: TOP MOUNT HEATSINK .4" D-PAK
Packaging: Bulk
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 15.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: TOP MOUNT HEATSINK .4" D-PAK
Packaging: Bulk
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 15.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 3237 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 353.81 грн |
| 10+ | 301.99 грн |
| 25+ | 287.62 грн |
| 50+ | 260.19 грн |
| 100+ | 250.77 грн |
| 250+ | 238.85 грн |
| 500+ | 226.42 грн |
| 573100D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
на замовлення 12750 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 250+ | 29.87 грн |
| 500+ | 27.73 грн |
| 750+ | 27.14 грн |
| 1250+ | 24.79 грн |
| 1750+ | 24.35 грн |
| 2500+ | 23.89 грн |
| 6250+ | 22.38 грн |
| 12500+ | 21.57 грн |
| 573100D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Description: HEATSINK SMT D-PAK/TO-252 TIN
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.315" (8.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.900" (22.86mm)
Package Cooled: TO-252 (DPAK)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 0.8W @ 30°C
Thermal Resistance @ Forced Air Flow: 12.50°C/W @ 600 LFM
Thermal Resistance @ Natural: 26.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
на замовлення 12944 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8+ | 40.28 грн |
| 10+ | 34.07 грн |
| 25+ | 32.49 грн |
| 50+ | 29.40 грн |
| 100+ | 28.34 грн |
| 573300D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: TOP MOUNT HEATSINK .4" D2PAK
Packaging: Bulk
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: TOP MOUNT HEATSINK .4" D2PAK
Packaging: Bulk
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 1410 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 277.20 грн |
| 10+ | 235.91 грн |
| 25+ | 224.68 грн |
| 50+ | 203.26 грн |
| 100+ | 195.91 грн |
| 250+ | 186.59 грн |
| 500+ | 176.89 грн |
| 573300D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Tape & Reel (TR)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 11523 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 250+ | 35.58 грн |
| 500+ | 33.02 грн |
| 750+ | 32.32 грн |
| 1250+ | 29.52 грн |
| 1750+ | 28.99 грн |
| 2500+ | 28.45 грн |
| 6250+ | 26.65 грн |
| 573300D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D2PAK .4" HIGH SMD
Packaging: Cut Tape (CT)
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.030" (26.16mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.3W @ 30°C
Thermal Resistance @ Forced Air Flow: 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Tin
Part Status: Active
на замовлення 11523 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 47.38 грн |
| 10+ | 40.69 грн |
| 25+ | 38.69 грн |
| 50+ | 35.01 грн |
| 100+ | 33.76 грн |
| 573400D00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
на замовлення 2248 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 214.81 грн |
| 10+ | 201.91 грн |
| 25+ | 196.45 грн |
| 50+ | 174.13 грн |
| 100+ | 163.88 грн |
| 250+ | 153.64 грн |
| 500+ | 146.08 грн |
| 1000+ | 130.97 грн |
| 573400D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 250+ | 214.74 грн |
| 500+ | 199.29 грн |
| 750+ | 195.04 грн |
| 1250+ | 178.12 грн |
| 1750+ | 174.95 грн |
| 2500+ | 171.65 грн |
| 573400D00010G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK D-PAK3 TIN PLATED SMD
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.220" (30.99mm)
Package Cooled: TO-268 (D³Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 14.00°C/W
Fin Height: 0.401" (10.20mm)
Material Finish: Tin
Part Status: Active
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 290.63 грн |
| 10+ | 248.30 грн |
| 25+ | 236.73 грн |
| 50+ | 214.32 грн |
| 100+ | 206.74 грн |
| 573902B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 BLACK CLIP-ON
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 BLACK CLIP-ON
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1497 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 183.22 грн |
| 10+ | 156.05 грн |
| 25+ | 148.63 грн |
| 50+ | 134.45 грн |
| 100+ | 129.59 грн |
| 250+ | 123.43 грн |
| 500+ | 117.01 грн |
| 573902B03100G |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 573902B03900G |
![]() |
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 573902B04000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON/TAB
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 CLIP-ON/TAB
Packaging: Bulk
Material: Aluminum
Length: 1.500" (38.10mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.500" (12.70mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.80°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 4665 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 120.83 грн |
| 10+ | 102.74 грн |
| 25+ | 97.89 грн |
| 50+ | 88.56 грн |
| 100+ | 85.36 грн |
| 250+ | 81.30 грн |
| 500+ | 77.08 грн |
| 2000+ | 76.03 грн |
| 574004B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-202 CLIP-ON .58" BK
Packaging: Bag
Material: Aluminum
Length: 0.800" (20.32mm)
Shape: Rectangular
Type: Board Level
Width: 0.577" (14.66mm)
Package Cooled: TO-202
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 28.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Description: HEATSINK TO-202 CLIP-ON .58" BK
Packaging: Bag
Material: Aluminum
Length: 0.800" (20.32mm)
Shape: Rectangular
Type: Board Level
Width: 0.577" (14.66mm)
Package Cooled: TO-202
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 28.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 574102B00000G |
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Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON BLK
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 CLIP-ON BLK
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 2333 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 139.00 грн |
| 10+ | 118.26 грн |
| 25+ | 112.65 грн |
| 50+ | 101.92 грн |
| 100+ | 98.23 грн |
| 250+ | 93.57 грн |
| 500+ | 88.70 грн |
| 2000+ | 82.39 грн |
| 574204B03300G |
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Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.900" (22.86mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.020" (25.91mm)
Package Cooled: TO-202
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.80°C/W
Fin Height: 0.420" (10.67mm)
Material Finish: Black Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.900" (22.86mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.020" (25.91mm)
Package Cooled: TO-202
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.80°C/W
Fin Height: 0.420" (10.67mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 574402B03200G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO220 HOR MNT W/TAB.75"
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO220 HOR MNT W/TAB.75"
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 13359 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 162.69 грн |
| 10+ | 138.33 грн |
| 25+ | 131.78 грн |
| 50+ | 119.20 грн |
| 100+ | 114.88 грн |
| 250+ | 109.43 грн |
| 500+ | 103.74 грн |
| 3000+ | 94.30 грн |
| 6000+ | 90.87 грн |
| 574502B00000G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 VERT MNT .75"
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 VERT MNT .75"
Packaging: Bag
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 34862 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11+ | 30.01 грн |
| 12+ | 25.93 грн |
| 25+ | 24.70 грн |
| 50+ | 22.35 грн |
| 100+ | 21.54 грн |
| 250+ | 20.51 грн |
| 500+ | 19.45 грн |
| 3000+ | 17.68 грн |
| 6000+ | 17.04 грн |
| 574502B03200G |
![]() |
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-220 CLIP-ON/TAB
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-220 CLIP-ON/TAB
Packaging: Bulk
Material: Aluminum
Length: 0.750" (19.05mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.860" (21.84mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 21.20°C/W
Fin Height: 0.395" (10.03mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1640 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 53.70 грн |
| 10+ | 45.63 грн |
| 25+ | 43.41 грн |
| 50+ | 39.27 грн |
| 100+ | 37.85 грн |
| 250+ | 36.06 грн |
| 500+ | 34.19 грн |
| 1000+ | 32.95 грн |































