Продукція > BOYD LACONIA, LLC > Всі товари виробника BOYD LACONIA, LLC (908) > Сторінка 2 з 16
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||
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| 189990F00000 | Boyd Laconia, LLC |
Description: THERM PAD 21.84MMX18.8MM W/ADH Packaging: Bulk Color: Gray Material: Silicone Shape: Rectangular Thickness: 0.0090" (0.229mm) Type: Pad, Sheet Thermal Resistivity: 1.50°C/W, 1.16°C/W Usage: TO-218, TO-220, TO-247 Outline: 21.84mm x 18.80mm Adhesive: Adhesive - One Side |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | |||||||||||||||||
| 2000346-001 REV A | Boyd Laconia, LLC |
Description: 2000346-001 REV A Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 2207/PR11B ASSYG | Boyd Laconia, LLC |
 Description: HEATSINK |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | |||||||||||||||||
| 2263R | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINK |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | |||||||||||||||||
| 2263RG | Boyd Laconia, LLC |
Description: HEATSINK |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | |||||||||||||||||
| 2288BG | Boyd Laconia, LLC |
Description: 2288BG Packaging: Bulk Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD Shape: Cylindrical Type: Board Level Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Not Included) Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM |
товару немає в наявності |
Мінімальне замовлення: 89 шт В кошику од. на суму грн. | |||||||||||||||||
| 2292B | Boyd Laconia, LLC |
Description: THM,17368B REV C-G Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 91 шт В кошику од. на суму грн. | |||||||||||||||||
| 2327B-TACHG | Boyd Laconia, LLC |
Description: THM,2327B-TACHG Packaging: Bulk Material: Aluminum Length: 1.105" (28.07mm) Shape: Rectangular, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA, FPGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2W @ 50°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM Fin Height: 0.600" (15.24mm) Material Finish: Black Anodized |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 2327B W/3M 8815 TAPE | Boyd Laconia, LLC |
Description: THM,2327B W/3M 8815 TAPE Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 286 шт В кошику од. на суму грн. | |||||||||||||||||
| 2341BG | Boyd Laconia, LLC |
Description: 2341BG Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1498 шт В кошику од. на суму грн. | |||||||||||||||||
| 2342BG | Boyd Laconia, LLC |
Description: THM,18917B REV H Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 131 шт В кошику од. на суму грн. | |||||||||||||||||
| 241402B92203G | Boyd Laconia, LLC |
Description: H/S ASS'Y(RD002356)241402B92203G Packaging: Bulk Length: 2.283" (58.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.457" (37.00mm) Package Cooled: Quarter Brick DC/DC Converter Attachment Method: Bolt On Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM Thermal Resistance @ Natural: 3.90°C/W Fin Height: 0.236" (6.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 241804B92200G | Boyd Laconia, LLC |
Description: 241804B92200G Packaging: Bulk Length: 2.280" (57.90mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.902" (22.90mm) Package Cooled: Eighth Brick DC/DC Converter Attachment Method: Bolt On Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM Thermal Resistance @ Natural: 3.60°C/W Fin Height: 0.449" (11.40mm) |
товару немає в наявності |
Мінімальне замовлення: 301 шт В кошику од. на суму грн. | |||||||||||||||||
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250G | Boyd Laconia, LLC |
Description: THERMALCOTE GREASE TUBE 2OZ Packaging: Bulk Color: White Size / Dimension: 2 oz Tube Type: Silicone Compound Thermal Conductivity: 0.76W/m-K Shelf Life: Indefinite (Unopened) Usable Temperature Range: -40°F ~ 399°F (-40°C ~ 204°C) |
на замовлення 1218 шт: термін постачання 21-31 дні (днів) |
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311505B00000G | Boyd Laconia, LLC |
Description: TO-5 PUSH-ON HEATSINK Packaging: Bulk Material: Aluminum Diameter: 0.317" (8.05mm) ID, 0.375" (9.52mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 70°C Thermal Resistance @ Forced Air Flow: 45.00°C/W @ 200 LFM Thermal Resistance @ Natural: 90.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1980 шт: термін постачання 21-31 дні (днів) |
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322400B00000G | Boyd Laconia, LLC |
Description: HEAT SINK TO-18 1W BLK Packaging: Bag Material: Aluminum Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Top Mount Package Cooled: TO-18 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 0.6W @ 60°C Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM Thermal Resistance @ Natural: 100.00°C/W Fin Height: 0.235" (5.97mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 4117 шт: термін постачання 21-31 дні (днів) |
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322505B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-5 .4" BLK Packaging: Bag Material: Aluminum Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD Shape: Cylindrical Type: Top Mount Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 0.5W @ 30°C Thermal Resistance @ Forced Air Flow: 15.00°C/W @ 400 LFM Thermal Resistance @ Natural: 56.00°C/W Fin Height: 0.400" (10.16mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 3463 шт: термін постачання 21-31 дні (днів) |
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322605B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-5 1.25W H=.25" BLK Packaging: Bag Material: Aluminum Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD Shape: Cylindrical Type: Top Mount Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 60°C Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM Thermal Resistance @ Natural: 54.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1004 шт: термін постачання 21-31 дні (днів) |
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323005B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-5 2W BLK Packaging: Bag Material: Aluminum Diameter: 0.318" (8.07mm) ID, 0.750" (19.05mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.4W @ 70°C Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM Thermal Resistance @ Natural: 56.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1273 шт: термін постачання 21-31 дні (днів) |
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325705B00000G | Boyd Laconia, LLC |
Description: TO-5 PUSH-ON HEATSINK 6.35MM Packaging: Bulk Material: Aluminum Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 60°C Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM Thermal Resistance @ Natural: 60.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 2371 шт: термін постачання 21-31 дні (днів) |
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| 325705R00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINK Packaging: Bulk Material: Aluminum Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 60°C Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM Thermal Resistance @ Natural: 60.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Red Anodized |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
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326005B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-5 1W H=.375" BLK Packaging: Bag Material: Aluminum Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.8W @ 90°C Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 200 LFM Thermal Resistance @ Natural: 57.00°C/W Fin Height: 0.375" (9.52mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 337 шт: термін постачання 21-31 дні (днів) |
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| 335214B00032G | Boyd Laconia, LLC |
Description: BGA HEAT SINK Packaging: Bulk Material: Aluminum Length: 0.984" (25.00mm) Shape: Square, Fins Type: Top Mount Width: 0.984" (25.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM Thermal Resistance @ Natural: 10.00°C/W Fin Height: 0.390" (9.91mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 840 шт В кошику од. на суму грн. | |||||||||||||||||
| 335814B00000G | Boyd Laconia, LLC |
Description: HEAT SINK Packaging: Bulk Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 5.61°C/W @ 200 LFM Thermal Resistance @ Natural: 10.50°C/W Fin Height: 0.354" (9.00mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||||
| 335824B00032G | Boyd Laconia, LLC |
Description: PGA,335824B00032G Packaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.180" (29.97mm) Package Cooled: BGA, FPGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 50°C Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM Thermal Resistance @ Natural: 29.40°C/W Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. | |||||||||||||||||
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335824B00034G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPE Packaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.180" (29.97mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 60°C Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM Thermal Resistance @ Natural: 29.40°C/W Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1282 шт: термін постачання 21-31 дні (днів) |
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342941 | Boyd Laconia, LLC |
Description: COPPER HEATSINK 40X40.5X13.5MM Packaging: Tray Material: Copper Length: 1.594" (40.50mm) Shape: Square, Fins Type: Top Mount, Skived Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM Thermal Resistance @ Natural: 13.30°C/W Fin Height: 0.531" (13.50mm) Material Finish: AavSHIELD 3C |
на замовлення 143 шт: термін постачання 21-31 дні (днів) |
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342945 | Boyd Laconia, LLC |
Description: COPPER HEATSINK 60X60X14MM Packaging: Tray Material: Copper Length: 2.362" (60.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 2.362" (60.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.70°C/W @ 200 LFM Thermal Resistance @ Natural: 7.00°C/W Fin Height: 0.551" (14.00mm) Material Finish: AavSHIELD 3C |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||||||||||||
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342947 | Boyd Laconia, LLC |
Description: COPPER HEATSINK 57.9X59X11MM Packaging: Tray Material: Copper Length: 2.323" (59.00mm) Shape: Rectangular, Fins Type: Top Mount, Skived Width: 2.280" (57.91mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM Thermal Resistance @ Natural: 7.70°C/W Fin Height: 0.433" (11.00mm) Material Finish: AavSHIELD 3C |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||||||||||||
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342948 | Boyd Laconia, LLC |
Description: COPPER HEATSINK 70X69X14MM Packaging: Tray Material: Copper Length: 2.717" (69.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 2.756" (70.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM Thermal Resistance @ Natural: 5.60°C/W Fin Height: 0.551" (14.00mm) Material Finish: AavSHIELD 3C Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||||||||||||
| 342948-copper skivfin | Boyd Laconia, LLC |
Description: 342948,REV03(GP) Packaging: Bulk Material: Copper Length: 2.717" (69.00mm) Shape: Rectangular, Fins Type: Board Level Width: 2.756" (70.00mm) Package Cooled: BGA, FPGA Attachment Method: Push Pin, Thermal Material Fin Height: 0.551" (14.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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342949 | Boyd Laconia, LLC |
Description: COPPER HEATSINK 80X80X12MM Packaging: Tray Material: Copper Length: 3.150" (80.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 3.150" (80.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM Thermal Resistance @ Natural: 5.10°C/W Fin Height: 0.472" (12.00mm) Material Finish: AavSHIELD 3C Part Status: Active |
на замовлення 57 шт: термін постачання 21-31 дні (днів) |
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| 342949-copper skivfin | Boyd Laconia, LLC |
Description: 342949 Packaging: Bulk Material: Copper Length: 3.150" (80.00mm) Shape: Square, Fins Type: Board Level Width: 3.150" (80.00mm) Package Cooled: BGA, FPGA Attachment Method: Push Pin, Thermal Material Fin Height: 0.472" (12.00mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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342950 | Boyd Laconia, LLC |
Description: COPPER HEATSINK 90X90X10MM Packaging: Tray Material: Copper Length: 3.543" (90.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 3.543" (90.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM Thermal Resistance @ Natural: 4.50°C/W Fin Height: 0.394" (10.00mm) Material Finish: AavSHIELD 3C |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||||||||||||
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371824B00032G | Boyd Laconia, LLC |
 Description: HEATSINK BGA W/ADHESIVE TAPEPackaging: Tray Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 50°C Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM Thermal Resistance @ Natural: 31.90°C/W Fin Height: 0.275" (7.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1215 шт: термін постачання 21-31 дні (днів) |
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| 371924B00032G | Boyd Laconia, LLC |
Description: 371924B00032G Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA, FPGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Thermal Resistance @ Natural: 31.90°C/W Fin Height: 0.551" (14.00mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 298 шт В кошику од. на суму грн. | |||||||||||||||||
| 372924M02000G( 10-5597-02G ) | Boyd Laconia, LLC |
Description: 372924M02000G( 10-5597-02G ) Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | |||||||||||||||||
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373324M00000G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/OUT AD-TAPE Packaging: Box Material: Aluminum Length: 1.472" (37.39mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.472" (37.39mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Not Included) Fin Height: 0.236" (6.00mm) Material Finish: Green Anodized |
товару немає в наявності |
Мінімальне замовлення: 3640 шт В кошику од. на суму грн. | ||||||||||||||||
| 374024B00032G | Boyd Laconia, LLC |
Description: 374024B00032G Packaging: Bulk Material: Aluminum Length: 0.906" (23.00mm) Shape: Square, Fins Type: Top Mount Width: 0.906" (23.00mm) Power Dissipation @ Temperature Rise: 0.5W @ 20°C Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 450 LFM Thermal Resistance @ Natural: 40.00°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 2541 шт В кошику од. на суму грн. | |||||||||||||||||
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374024B00035G | Boyd Laconia, LLC |
Description: HEATSINK BGA 23X23X10MM W/ADH Packaging: Bulk Material: Aluminum Length: 0.906" (23.01mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.01mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.0W @ 40°C Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM Thermal Resistance @ Natural: 40.00°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 2857 шт: термін постачання 21-31 дні (днів) |
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| 374024B60023G | Boyd Laconia, LLC |
Description: 374024B60023G Packaging: Bulk Material: Aluminum Length: 0.906" (23.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.00mm) Package Cooled: BGA Attachment Method: Solder Anchor Thermal Resistance @ Forced Air Flow: 11.69°C/W @ 200 LFM Thermal Resistance @ Natural: 40.00°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 216 шт В кошику од. на суму грн. | |||||||||||||||||
| 374024B60024G-MOD W/STAB PAD | Boyd Laconia, LLC |
Description: 374024B60024G-MOD W/STAB PAD Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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374124B00035G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPE Packaging: Bulk Material: Aluminum Length: 0.906" (23.01mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.01mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 50°C Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM Thermal Resistance @ Natural: 23.40°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 410 шт: термін постачання 21-31 дні (днів) |
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| 374124B60023G | Boyd Laconia, LLC |
Description: 374124B60023G Packaging: Bulk Material: Aluminum Length: 0.906" (23.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.0W @ 30°C Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM Thermal Resistance @ Natural: 23.40°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 1296 шт В кошику од. на суму грн. | |||||||||||||||||
| 374224B00035G | Boyd Laconia, LLC | Description: 374224B00035G |
товару немає в наявності |
Мінімальне замовлення: 1680 шт В кошику од. на суму грн. | |||||||||||||||||
 |
374224B60023G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Packaging: Bulk Material: Aluminum Length: 0.906" (23.01mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.01mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 400 LFM Thermal Resistance @ Natural: 19.70°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 1344 шт В кошику од. на суму грн. | ||||||||||||||||
| 374324B00032G | Boyd Laconia, LLC |
Description: 374324B00032G Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 2016 шт В кошику од. на суму грн. | |||||||||||||||||
 |
374324B00035G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPE |
на замовлення 1887 шт: термін постачання 21-31 дні (днів) |
|
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 |
374324B60023G | Boyd Laconia, LLC |
Description: BGA HEAT SINK Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Board Level Width: 1.063" (27.00mm) Package Cooled: BGA, FPGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 1.5W @ 50°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 2325 шт: термін постачання 21-31 дні (днів) |
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 |
374424B00035G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPE Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 4.0W @ 80°C Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM Thermal Resistance @ Natural: 20.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 4746 шт: термін постачання 21-31 дні (днів) |
|
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| 374424B60023G | Boyd Laconia, LLC |
Description: 374424B60023G Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA, FPGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM Thermal Resistance @ Natural: 20.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 1080 шт В кошику од. на суму грн. | |||||||||||||||||
| 374524B00000G | Boyd Laconia, LLC |
Description: 374524B00000G Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 488 шт В кошику од. на суму грн. | |||||||||||||||||
 |
374524B60023G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM Thermal Resistance @ Natural: 16.50°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 864 шт В кошику од. на суму грн. | ||||||||||||||||
| 374624B00000G W/3M8810 | Boyd Laconia, LLC |
Description: 374624B00000G W/3M8810 Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 101 шт В кошику од. на суму грн. | |||||||||||||||||
 |
374624B00032G | Boyd Laconia, LLC |
Description: HEATSINK BGA 35X35X10MM W/ADH Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM Thermal Resistance @ Natural: 23.40°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 380 шт: термін постачання 21-31 дні (днів) |
|
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 |
374724B00032G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPE Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1649 шт: термін постачання 21-31 дні (днів) |
|
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|
|
374724B00035G | Boyd Laconia, LLC |
Description: HEATSINK BGA 35X35X18MM W/ADH Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1423 шт: термін постачання 21-31 дні (днів) |
|
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 |
374724B60024G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 859 шт: термін постачання 21-31 дні (днів) |
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| 374824B00000G | Boyd Laconia, LLC |
Description: 374824B00000G Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1800 шт В кошику од. на суму грн. | |||||||||||||||||
| 374824B00032G | Boyd Laconia, LLC |
Description: 374824B00032G Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM Thermal Resistance @ Natural: 12.00°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
товару немає в наявності |
Мінімальне замовлення: 227 шт В кошику од. на суму грн. |
| 189990F00000 |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 21.84MMX18.8MM W/ADH
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0090" (0.229mm)
Type: Pad, Sheet
Thermal Resistivity: 1.50°C/W, 1.16°C/W
Usage: TO-218, TO-220, TO-247
Outline: 21.84mm x 18.80mm
Adhesive: Adhesive - One Side
Description: THERM PAD 21.84MMX18.8MM W/ADH
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0090" (0.229mm)
Type: Pad, Sheet
Thermal Resistivity: 1.50°C/W, 1.16°C/W
Usage: TO-218, TO-220, TO-247
Outline: 21.84mm x 18.80mm
Adhesive: Adhesive - One Side
товару немає в наявності
Мінімальне замовлення: 5000 шт
В кошику
од. на суму грн.
| 2207/PR11B ASSYG |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK
Description: HEATSINK
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 2263R |
|
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Description: BOARD LEVEL HEAT SINK
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| 2263RG |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK
Description: HEATSINK
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| 2288BG |
Виробник: Boyd Laconia, LLC
Description: 2288BG
Packaging: Bulk
Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
Description: 2288BG
Packaging: Bulk
Diameter: 0.300" (7.62mm) ID, 1.000" (25.40mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 400 LFM
товару немає в наявності
Мінімальне замовлення: 89 шт
В кошику
од. на суму грн.
| 2327B-TACHG |
Виробник: Boyd Laconia, LLC
Description: THM,2327B-TACHG
Packaging: Bulk
Material: Aluminum
Length: 1.105" (28.07mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Fin Height: 0.600" (15.24mm)
Material Finish: Black Anodized
Description: THM,2327B-TACHG
Packaging: Bulk
Material: Aluminum
Length: 1.105" (28.07mm)
Shape: Rectangular, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 300 LFM
Fin Height: 0.600" (15.24mm)
Material Finish: Black Anodized
товару немає в наявності
В кошику
од. на суму грн.
| 2327B W/3M 8815 TAPE |
товару немає в наявності
Мінімальне замовлення: 286 шт
В кошику
од. на суму грн.
| 241402B92203G |
Виробник: Boyd Laconia, LLC
Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
товару немає в наявності
В кошику
од. на суму грн.
| 241804B92200G |
Виробник: Boyd Laconia, LLC
Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
товару немає в наявності
Мінімальне замовлення: 301 шт
В кошику
од. на суму грн.
| 250G |
|
Виробник: Boyd Laconia, LLC
Description: THERMALCOTE GREASE TUBE 2OZ
Packaging: Bulk
Color: White
Size / Dimension: 2 oz Tube
Type: Silicone Compound
Thermal Conductivity: 0.76W/m-K
Shelf Life: Indefinite (Unopened)
Usable Temperature Range: -40°F ~ 399°F (-40°C ~ 204°C)
Description: THERMALCOTE GREASE TUBE 2OZ
Packaging: Bulk
Color: White
Size / Dimension: 2 oz Tube
Type: Silicone Compound
Thermal Conductivity: 0.76W/m-K
Shelf Life: Indefinite (Unopened)
Usable Temperature Range: -40°F ~ 399°F (-40°C ~ 204°C)
на замовлення 1218 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1119.96 грн |
| 10+ | 954.59 грн |
| 25+ | 909.22 грн |
| 50+ | 822.40 грн |
| 100+ | 792.62 грн |
| 250+ | 754.85 грн |
| 500+ | 715.52 грн |
| 311505B00000G |
|
Виробник: Boyd Laconia, LLC
Description: TO-5 PUSH-ON HEATSINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.317" (8.05mm) ID, 0.375" (9.52mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 45.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 90.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
Description: TO-5 PUSH-ON HEATSINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.317" (8.05mm) ID, 0.375" (9.52mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 45.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 90.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1980 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 191.29 грн |
| 10+ | 162.96 грн |
| 25+ | 155.18 грн |
| 50+ | 140.37 грн |
| 100+ | 135.30 грн |
| 250+ | 128.87 грн |
| 500+ | 122.17 грн |
| 322400B00000G |
|
Виробник: Boyd Laconia, LLC
Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 4117 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 431.17 грн |
| 10+ | 367.96 грн |
| 25+ | 350.43 грн |
| 50+ | 317.00 грн |
| 100+ | 305.54 грн |
| 250+ | 291.00 грн |
| 500+ | 275.85 грн |
| 1000+ | 265.85 грн |
| 322505B00000G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-5 .4" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 15.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 .4" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 15.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.400" (10.16mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 3463 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 222.91 грн |
| 10+ | 189.92 грн |
| 25+ | 180.90 грн |
| 50+ | 163.64 грн |
| 100+ | 157.73 грн |
| 250+ | 150.23 грн |
| 500+ | 142.42 грн |
| 2000+ | 132.28 грн |
| 322605B00000G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1004 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 279.99 грн |
| 10+ | 238.35 грн |
| 25+ | 227.01 грн |
| 50+ | 205.36 грн |
| 100+ | 197.95 грн |
| 250+ | 188.53 грн |
| 500+ | 178.73 грн |
| 1000+ | 172.25 грн |
| 323005B00000G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.4W @ 70°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.4W @ 70°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 56.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1273 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 327.81 грн |
| 10+ | 278.90 грн |
| 25+ | 265.64 грн |
| 50+ | 240.30 грн |
| 100+ | 231.60 грн |
| 250+ | 220.59 грн |
| 500+ | 209.11 грн |
| 1000+ | 201.53 грн |
| 325705B00000G |
|
Виробник: Boyd Laconia, LLC
Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 2371 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 154.26 грн |
| 10+ | 131.17 грн |
| 25+ | 124.93 грн |
| 50+ | 113.03 грн |
| 100+ | 108.95 грн |
| 250+ | 103.77 грн |
| 500+ | 98.38 грн |
| 325705R00000G |
|
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| 326005B00000G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-5 1W H=.375" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.8W @ 90°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 57.00°C/W
Fin Height: 0.375" (9.52mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 1W H=.375" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.8W @ 90°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 57.00°C/W
Fin Height: 0.375" (9.52mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 337 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 232.94 грн |
| 10+ | 198.83 грн |
| 25+ | 189.43 грн |
| 50+ | 171.35 грн |
| 100+ | 165.16 грн |
| 250+ | 157.31 грн |
| 335214B00032G |
|
Виробник: Boyd Laconia, LLC
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.00°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.00°C/W
Fin Height: 0.390" (9.91mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 840 шт
В кошику
од. на суму грн.
| 335814B00000G |
|
Виробник: Boyd Laconia, LLC
Description: HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.61°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.50°C/W
Fin Height: 0.354" (9.00mm)
Material Finish: Black Anodized
Description: HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 5.61°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.50°C/W
Fin Height: 0.354" (9.00mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| 335824B00032G |
Виробник: Boyd Laconia, LLC
Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| 335824B00034G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1282 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 650.22 грн |
| 10+ | 553.87 грн |
| 25+ | 527.56 грн |
| 50+ | 477.20 грн |
| 100+ | 459.93 грн |
| 250+ | 438.04 грн |
| 672+ | 408.73 грн |
| 342941 |
|
Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
на замовлення 143 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2607.06 грн |
| 10+ | 2227.29 грн |
| 25+ | 2123.56 грн |
| 40+ | 1944.67 грн |
| 80+ | 1875.57 грн |
| 342945 |
|
Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 60X60X14MM
Packaging: Tray
Material: Copper
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.362" (60.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.00°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Description: COPPER HEATSINK 60X60X14MM
Packaging: Tray
Material: Copper
Length: 2.362" (60.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.362" (60.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.00°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 342947 |
|
Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 342948 |
|
Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 342948-copper skivfin |
Виробник: Boyd Laconia, LLC
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
товару немає в наявності
В кошику
од. на суму грн.
| 342949 |
|
Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5128.51 грн |
| 10+ | 4370.43 грн |
| 25+ | 4162.33 грн |
| 50+ | 3764.52 грн |
| 342949-copper skivfin |
Виробник: Boyd Laconia, LLC
Description: 342949
Packaging: Bulk
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Board Level
Width: 3.150" (80.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.472" (12.00mm)
Description: 342949
Packaging: Bulk
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Board Level
Width: 3.150" (80.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.472" (12.00mm)
товару немає в наявності
В кошику
од. на суму грн.
| 342950 |
|
Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| 371824B00032G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1215 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 379.49 грн |
| 10+ | 356.08 грн |
| 25+ | 348.26 грн |
| 371924B00032G |
Виробник: Boyd Laconia, LLC
Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 298 шт
В кошику
од. на суму грн.
| 372924M02000G( 10-5597-02G ) |
товару немає в наявності
Мінімальне замовлення: 3000 шт
В кошику
од. на суму грн.
| 373324M00000G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/OUT AD-TAPE
Packaging: Box
Material: Aluminum
Length: 1.472" (37.39mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.472" (37.39mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Fin Height: 0.236" (6.00mm)
Material Finish: Green Anodized
Description: HEATSINK BGA W/OUT AD-TAPE
Packaging: Box
Material: Aluminum
Length: 1.472" (37.39mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.472" (37.39mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Fin Height: 0.236" (6.00mm)
Material Finish: Green Anodized
товару немає в наявності
Мінімальне замовлення: 3640 шт
В кошику
од. на суму грн.
| 374024B00032G |
Виробник: Boyd Laconia, LLC
Description: 374024B00032G
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 450 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: 374024B00032G
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 450 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 2541 шт
В кошику
од. на суму грн.
| 374024B00035G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 2857 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 142.69 грн |
| 10+ | 121.74 грн |
| 25+ | 115.99 грн |
| 50+ | 104.92 грн |
| 100+ | 101.13 грн |
| 480+ | 93.05 грн |
| 960+ | 88.21 грн |
| 1440+ | 86.32 грн |
| 374024B60023G |
Виробник: Boyd Laconia, LLC
Description: 374024B60023G
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Thermal Resistance @ Forced Air Flow: 11.69°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: 374024B60023G
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Thermal Resistance @ Forced Air Flow: 11.69°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 216 шт
В кошику
од. на суму грн.
| 374124B00035G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 410 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 141.92 грн |
| 10+ | 121.37 грн |
| 25+ | 115.60 грн |
| 50+ | 104.58 грн |
| 100+ | 100.81 грн |
| 250+ | 96.01 грн |
| 374124B60023G |
Виробник: Boyd Laconia, LLC
Description: 374124B60023G
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Description: 374124B60023G
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 7.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 1296 шт
В кошику
од. на суму грн.
| 374224B00035G |
Виробник: Boyd Laconia, LLC
Description: 374224B00035G
Description: 374224B00035G
товару немає в наявності
Мінімальне замовлення: 1680 шт
В кошику
од. на суму грн.
| 374224B60023G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 19.70°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 400 LFM
Thermal Resistance @ Natural: 19.70°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 1344 шт
В кошику
од. на суму грн.
| 374324B00032G |
Виробник: Boyd Laconia, LLC
Description: 374324B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: 374324B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 2016 шт
В кошику
од. на суму грн.
| 374324B00035G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Description: HEATSINK BGA W/ADHESIVE TAPE
на замовлення 1887 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 175.09 грн |
| 10+ | 149.00 грн |
| 25+ | 141.90 грн |
| 50+ | 128.37 грн |
| 100+ | 123.73 грн |
| 250+ | 117.85 грн |
| 756+ | 109.29 грн |
| 1512+ | 105.33 грн |
| 374324B60023G |
|
Виробник: Boyd Laconia, LLC
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 2325 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 236.02 грн |
| 10+ | 201.66 грн |
| 25+ | 192.11 грн |
| 50+ | 173.76 грн |
| 216+ | 160.77 грн |
| 432+ | 154.94 грн |
| 648+ | 149.15 грн |
| 1080+ | 145.14 грн |
| 374424B00035G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 4746 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 213.66 грн |
| 10+ | 182.64 грн |
| 25+ | 173.98 грн |
| 50+ | 157.38 грн |
| 100+ | 151.69 грн |
| 250+ | 144.48 грн |
| 567+ | 136.06 грн |
| 1134+ | 131.12 грн |
| 374424B60023G |
Виробник: Boyd Laconia, LLC
Description: 374424B60023G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Description: 374424B60023G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 1080 шт
В кошику
од. на суму грн.
| 374524B60023G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.50°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 16.50°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 864 шт
В кошику
од. на суму грн.
| 374624B00000G W/3M8810 |
товару немає в наявності
Мінімальне замовлення: 101 шт
В кошику
од. на суму грн.
| 374624B00032G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 380 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 248.37 грн |
| 10+ | 211.54 грн |
| 25+ | 201.52 грн |
| 50+ | 182.28 грн |
| 100+ | 175.69 грн |
| 250+ | 167.34 грн |
| 374724B00032G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1649 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 259.93 грн |
| 10+ | 221.41 грн |
| 25+ | 210.91 грн |
| 50+ | 190.78 грн |
| 100+ | 183.89 грн |
| 250+ | 175.15 грн |
| 672+ | 163.45 грн |
| 1344+ | 157.52 грн |
| 374724B00035G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1423 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 283.07 грн |
| 10+ | 241.32 грн |
| 25+ | 229.87 грн |
| 50+ | 207.94 грн |
| 100+ | 200.42 грн |
| 250+ | 190.90 грн |
| 672+ | 178.14 грн |
| 1344+ | 171.68 грн |
| 374724B60024G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 859 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 395.69 грн |
| 10+ | 337.51 грн |
| 25+ | 321.49 грн |
| 50+ | 290.79 грн |
| 168+ | 273.15 грн |
| 374824B00032G |
Виробник: Boyd Laconia, LLC
Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
товару немає в наявності
Мінімальне замовлення: 227 шт
В кошику
од. на суму грн.