Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36389) > Сторінка 124 з 607
| Фото | Назва | Виробник | Інформація |
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MMA7455LT | NXP USA Inc. |
  Description: ACCELEROMETER 2-8G I2C/SPI 14LGASensitivity (LSB/g): 64 (±2g) ~ 16 (±8g) Supplier Device Package: 14-LGA (3x5) Bandwidth: 62.5Hz ~ 125Hz Voltage - Supply: 2.4V ~ 3.6V Operating Temperature: -40°C ~ 85°C Acceleration Range: ±2g, 4g, 8g Axis: X, Y, Z Type: Digital Mounting Type: Surface Mount Output Type: I2C, SPI Package / Case: 14-TFLGA Features: Adjustable Bandwidth, Selectable Scale Packaging: Tray |
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MMG3006NT1 | NXP USA Inc. |
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN Current - Supply: 850mA Gain: 17.5dB Voltage - Supply: 5V RF Type: Cellular, PCS, PHS, WLL Frequency: 400MHz ~ 2.4GHz Mounting Type: Surface Mount Package / Case: 16-VQFN Exposed Pad Packaging: Tape & Reel (TR) Part Status: Active Supplier Device Package: 16-QFN (4x4) Test Frequency: 900MHz P1dB: 33dBm Noise Figure: 6.6dB |
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| MOD5270BXX | NXP USA Inc. |
Description: IC MOD COLDFIRE 95MHZ 2.064MB Flash Size: 512KB Core Processor: ColdFire 5270 Module/Board Type: MCU, Ethernet Core Operating Temperature: 0°C ~ 70°C RAM Size: 2.064MB Speed: 95MHz Size / Dimension: 2.600" L x 2.000" W (66.04mm x 50.80mm) Connector Type: RJ-45, 2x50 Header Packaging: Bulk |
товару немає в наявності |
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| MPC5510KIT208 | NXP USA Inc. |
Description: MPC5510 EVAL BRD Utilized IC / Part: MPC5510 Core Processor: e200 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| MPC5553EVB | NXP USA Inc. |
Description: MPC5553 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| MPC5553EVBGHS | NXP USA Inc. |
Description: MPC5553 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| MPC5553EVBISYS | NXP USA Inc. |
Description: MPC5553 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
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MPC5553MZP132 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 416PBGA DigiKey Programmable: Not Verified Number of I/O: 220 Supplier Device Package: 416-PBGA (27x27) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Core Size: 32-Bit Single-Core Data Converters: A/D 40x12b Core Processor: e200z6 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 132MHz Mounting Type: Surface Mount Package / Case: 416-BBGA Packaging: Tray |
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MPC5553MZQ132 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA DigiKey Programmable: Not Verified Number of I/O: 220 Supplier Device Package: 324-PBGA (23x23) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Core Size: 32-Bit Single-Core Data Converters: A/D 40x12b Core Processor: e200z6 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 132MHz Mounting Type: Surface Mount Package / Case: 324-BBGA Packaging: Tray |
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MPC5554EVB | NXP USA Inc. |
Description: MPC5554 EVAL BRD Utilized IC / Part: MPC5554 Core Processor: e200 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC5554EVBGHS | NXP USA Inc. |
Description: MPC5554 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC5554EVBISYS | NXP USA Inc. |
Description: MPC5554 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC5554INT | NXP USA Inc. |
Description: MPC5554 EVAL BRD Utilized IC / Part: MPC5554 Core Processor: e200 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||
| MPC5561EVB | NXP USA Inc. |
Description: MPC5561 EVAL BRD Utilized IC / Part: MPC5561 Core Processor: e200 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||
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MPC5566EVB | NXP USA Inc. |
Description: MPC5566 EVAL BRD Part Status: Active Utilized IC / Part: MPC5566 Board Type: Evaluation Platform Core Processor: e200 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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| MPC5567EVB | NXP USA Inc. |
Description: MPC5567 EVAL BRD Utilized IC / Part: MPC5567 Core Processor: e200 Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||
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MPC7410HX400LE | NXP USA Inc. |
Description: IC MPU MPC74XX 400MHZ 360CBGA Supplier Device Package: 360-CBGA (25x25) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC G4 Operating Temperature: 0°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Packaging: Tray Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit |
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MPC8260ADS-TCOM | NXP USA Inc. |
Description: BOARD DEV ADS POWERQUICC II For Use With/Related Products: 8260ADS Packaging: Bulk Part Status: Obsolete Accessory Type: Interface Board |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8313ECVRAFF | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
товару немає в наявності |
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MPC8313ECZQADD | NXP USA Inc. |
Description: IC MPU MPC83XX 267MHZ 516TEPBGA Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 267MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8313ECZQAFF | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8313EVRAFF | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8313EZQADD | NXP USA Inc. |
Description: IC MPU MPC83XX 267MHZ 516TEPBGA Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 267MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8313EZQAFF | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516TEPBGA Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 516-TEPBGA (27x27) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: 0°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Exposed Pad Packaging: Tray Additional Interfaces: DUART, HSSI, I2C, PCI, SPI Security Features: Cryptography Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 2.2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8347CVVAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 672LBGA Voltage - I/O: 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 672-LBGA Packaging: Tray Additional Interfaces: DUART, I2C, PCI, SPI Graphics Acceleration: No RAM Controllers: DDR Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 672-LBGA (35x35) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8347CVVAJDB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA Additional Interfaces: DUART, I2C, PCI, SPI Graphics Acceleration: No RAM Controllers: DDR Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 672-LBGA (35x35) Voltage - I/O: 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 533MHz Mounting Type: Surface Mount Package / Case: 672-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8347CVVAJFB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 672-LBGA (35x35) Voltage - I/O: 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 533MHz Mounting Type: Surface Mount Package / Case: 672-LBGA Packaging: Tray Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8347CZUAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 672LBGA Additional Interfaces: DUART, I2C, PCI, SPI Graphics Acceleration: No RAM Controllers: DDR Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 672-LBGA (35x35) Voltage - I/O: 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 672-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8349CVVAJDB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA Additional Interfaces: DUART, I2C, PCI, SPI Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 672-LBGA (35x35) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 533MHz Mounting Type: Surface Mount Package / Case: 672-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8349CZUAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 672LBGA Package / Case: 672-LBGA Packaging: Tray Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 672-LBGA (35x35) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8358ECVVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGA Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART Part Status: Obsolete Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Communications; QUICC Engine, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 740-TBGA (37.5x37.5) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 740-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8358EVRAGDDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 668BGA Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART Part Status: Active Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Communications; QUICC Engine, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 668-PBGA-PGE (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 668-BBGA Exposed Pad Packaging: Tray |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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MPC8358VVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGA Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 740-TBGA (37.5x37.5) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 740-LBGA Packaging: Tray Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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MPC8360CVVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGA Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 740-TBGA (37.5x37.5) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 740-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8360CVVAJDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 740TBGA Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 740-TBGA (37.5x37.5) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 533MHz Mounting Type: Surface Mount Package / Case: 740-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8360EA-MDS-PB | NXP USA Inc. |
Description: MPC8360EA EVAL BRD Mounting Type: Fixed Packaging: Bulk Part Status: Discontinued at Digi-Key Utilized IC / Part: MPC8360EA Board Type: Evaluation Platform Core Processor: e300 Contents: Board(s), Cable(s), Power Supply Type: MPU |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8360EVVAJDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 740TBGA Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Communications; QUICC Engine, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 740-TBGA (37.5x37.5) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 533MHz Mounting Type: Surface Mount Package / Case: 740-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8360EVVALFHA | NXP USA Inc. |
Description: IC MPU MPC83XX 667MHZ 740TBGA Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Communications; QUICC Engine, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 740-TBGA (37.5x37.5) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 667MHz Mounting Type: Surface Mount Package / Case: 740-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8360ZUAJDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||
| MPC8377E-MDS-PB | NXP USA Inc. |
Description: MPC8377E EVAL BRD Utilized IC / Part: MPC8377E Core Processor: e300 Contents: Board(s) Type: MPU Mounting Type: Fixed Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||
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MPC8540ADS-BGA | NXP USA Inc. |
Description: MPC8540 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8548ECHXAQG | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2, SDRAM Co-Processors/DSP: Signal Processing; SPE, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 783-FCBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC8548ECVUAQG | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2, SDRAM Co-Processors/DSP: Signal Processing; SPE, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (4) Supplier Device Package: 783-FCBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
| MPC8555CDS | NXP USA Inc. | Description: MPC8555 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
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MPC8560ADS-BGA | NXP USA Inc. | Description: MPC8560 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPR083EJR2 | NXP USA Inc. |
Description: IC CTLR TOUCH SENSR PROX 16TSSOP DigiKey Programmable: Not Verified Proximity Detection: Yes Supplier Device Package: 16-TSSOP Number of Inputs: 8 Current - Supply: 1.62mA Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: Buttons, Slider, Wheel Interface: I2C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
 |
MPR084QR2 | NXP USA Inc. |
Description: IC CTLR TOUCH SENSOR PROX 16-QFN Current - Supply: 1.62mA Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: Buttons, Slider, Wheel Interface: I2C Mounting Type: Surface Mount Package / Case: 16-VQFN Exposed Pad Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Proximity Detection: Yes Supplier Device Package: 16-QFN-EP (5x5) Number of Inputs: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MRF5S4125NBR1 | NXP USA Inc. |
Description: FET RF 65V 465MHZ TO-272-4 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MRF5S4125NR1 | NXP USA Inc. |
Description: FET RF 65V 465MHZ TO-270-4 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MRF6V10250HSR3 | NXP USA Inc. |
Description: FET RF 100V 1.09GHZ NI780S |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MRF6V10250HSR5 | NXP USA Inc. |
Description: FET RF 100V 1.09GHZ NI780S |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MRF7S16150HR3 | NXP USA Inc. |
Description: FET RF 65V 1.66GHZ NI-780 Current - Test: 1.5 A Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-780H-2L Technology: LDMOS Gain: 19.7dB Power - Output: 32W Frequency: 1.6GHz ~ 1.66GHz Mounting Type: Chassis Mount Package / Case: SOT-957A Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MRF7S16150HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Current - Test: 1.5 A Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-780H-2L Technology: LDMOS Gain: 19.7dB Power - Output: 32W Frequency: 1.6GHz ~ 1.66GHz Mounting Type: Chassis Mount Package / Case: SOT-957A Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
| MRF7S18170HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI880S Current - Test: 1.4 A Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-880S Technology: LDMOS Gain: 17.5dB Power - Output: 50W Frequency: 1.81GHz Mounting Type: Surface Mount Package / Case: NI-880S Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||
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MRF7S19080HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Current - Test: 750 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780H-2L Technology: LDMOS Gain: 18dB Power - Output: 24W Frequency: 1.99GHz Mounting Type: Chassis Mount Package / Case: SOT-957A Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MRF7S19080HSR3 | NXP USA Inc. |
Description: FET RF 65V 1.99GHZ NI-780S Package / Case: NI-780S Packaging: Tape & Reel (TR) Current - Test: 750 mA Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-780S Technology: LDMOS Gain: 18dB Power - Output: 24W Frequency: 1.99GHz Mounting Type: Chassis Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||||
 |
MRF7S19080HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Current - Test: 750 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780S Technology: LDMOS Gain: 18dB Power - Output: 24W Frequency: 1.99GHz Mounting Type: Chassis Mount Package / Case: NI-780S Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MRF7S21080HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Package / Case: SOT-957A Packaging: Tape & Reel (TR) Current - Test: 800 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780H-2L Technology: LDMOS Gain: 18dB Power - Output: 22W Frequency: 2.17GHz Mounting Type: Chassis Mount |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MRF7S21080HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Technology: LDMOS Gain: 18dB Power - Output: 22W Frequency: 2.17GHz Mounting Type: Chassis Mount Package / Case: NI-780S Packaging: Tape & Reel (TR) Current - Test: 800 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780S |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MRF7S21110HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Current - Test: 1.1 A Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780H-2L Technology: LDMOS Gain: 17.3dB Power - Output: 33W Frequency: 2.17GHz Mounting Type: Chassis Mount Package / Case: SOT-957A Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. |
| MMA7455LT | |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Supplier Device Package: 14-LGA (3x5)
Bandwidth: 62.5Hz ~ 125Hz
Voltage - Supply: 2.4V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Acceleration Range: ±2g, 4g, 8g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 14-TFLGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tray
Description: ACCELEROMETER 2-8G I2C/SPI 14LGA
Sensitivity (LSB/g): 64 (±2g) ~ 16 (±8g)
Supplier Device Package: 14-LGA (3x5)
Bandwidth: 62.5Hz ~ 125Hz
Voltage - Supply: 2.4V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Acceleration Range: ±2g, 4g, 8g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 14-TFLGA
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MMG3006NT1 |
|
Виробник: NXP USA Inc.
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN
Current - Supply: 850mA
Gain: 17.5dB
Voltage - Supply: 5V
RF Type: Cellular, PCS, PHS, WLL
Frequency: 400MHz ~ 2.4GHz
Mounting Type: Surface Mount
Package / Case: 16-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 16-QFN (4x4)
Test Frequency: 900MHz
P1dB: 33dBm
Noise Figure: 6.6dB
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN
Current - Supply: 850mA
Gain: 17.5dB
Voltage - Supply: 5V
RF Type: Cellular, PCS, PHS, WLL
Frequency: 400MHz ~ 2.4GHz
Mounting Type: Surface Mount
Package / Case: 16-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: 16-QFN (4x4)
Test Frequency: 900MHz
P1dB: 33dBm
Noise Figure: 6.6dB
товару немає в наявності
В кошику
од. на суму грн.
| MOD5270BXX |
Виробник: NXP USA Inc.
Description: IC MOD COLDFIRE 95MHZ 2.064MB
Flash Size: 512KB
Core Processor: ColdFire 5270
Module/Board Type: MCU, Ethernet Core
Operating Temperature: 0°C ~ 70°C
RAM Size: 2.064MB
Speed: 95MHz
Size / Dimension: 2.600" L x 2.000" W (66.04mm x 50.80mm)
Connector Type: RJ-45, 2x50 Header
Packaging: Bulk
Description: IC MOD COLDFIRE 95MHZ 2.064MB
Flash Size: 512KB
Core Processor: ColdFire 5270
Module/Board Type: MCU, Ethernet Core
Operating Temperature: 0°C ~ 70°C
RAM Size: 2.064MB
Speed: 95MHz
Size / Dimension: 2.600" L x 2.000" W (66.04mm x 50.80mm)
Connector Type: RJ-45, 2x50 Header
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MPC5510KIT208 |
|
Виробник: NXP USA Inc.
Description: MPC5510 EVAL BRD
Utilized IC / Part: MPC5510
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: MPC5510 EVAL BRD
Utilized IC / Part: MPC5510
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MPC5553EVB |
|
Виробник: NXP USA Inc.
Description: MPC5553 EVAL BRD
Description: MPC5553 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| MPC5553EVBGHS |
|
Виробник: NXP USA Inc.
Description: MPC5553 EVAL BRD
Description: MPC5553 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| MPC5553EVBISYS |
|
Виробник: NXP USA Inc.
Description: MPC5553 EVAL BRD
Description: MPC5553 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| MPC5553MZP132 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 220
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
Description: IC MCU 32BIT 1.5MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 220
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MPC5553MZQ132 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 220
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
Description: IC MCU 32BIT 1.5MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 220
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MPC5554EVB |
|
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Utilized IC / Part: MPC5554
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: MPC5554 EVAL BRD
Utilized IC / Part: MPC5554
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MPC5554EVBGHS |
|
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Description: MPC5554 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| MPC5554EVBISYS |
|
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Description: MPC5554 EVAL BRD
товару немає в наявності
В кошику
од. на суму грн.
| MPC5554INT |
|
Виробник: NXP USA Inc.
Description: MPC5554 EVAL BRD
Utilized IC / Part: MPC5554
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: MPC5554 EVAL BRD
Utilized IC / Part: MPC5554
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MPC5561EVB |
|
Виробник: NXP USA Inc.
Description: MPC5561 EVAL BRD
Utilized IC / Part: MPC5561
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: MPC5561 EVAL BRD
Utilized IC / Part: MPC5561
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MPC5566EVB |
|
Виробник: NXP USA Inc.
Description: MPC5566 EVAL BRD
Part Status: Active
Utilized IC / Part: MPC5566
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: MPC5566 EVAL BRD
Part Status: Active
Utilized IC / Part: MPC5566
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 136721.63 грн |
| MPC5567EVB |
|
Виробник: NXP USA Inc.
Description: MPC5567 EVAL BRD
Utilized IC / Part: MPC5567
Core Processor: e200
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: MPC5567 EVAL BRD
Utilized IC / Part: MPC5567
Core Processor: e200
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MPC7410HX400LE |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 400MHZ 360CBGA
Supplier Device Package: 360-CBGA (25x25)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Description: IC MPU MPC74XX 400MHZ 360CBGA
Supplier Device Package: 360-CBGA (25x25)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
товару немає в наявності
В кошику
од. на суму грн.
| MPC8260ADS-TCOM |
Виробник: NXP USA Inc.
Description: BOARD DEV ADS POWERQUICC II
For Use With/Related Products: 8260ADS
Packaging: Bulk
Part Status: Obsolete
Accessory Type: Interface Board
Description: BOARD DEV ADS POWERQUICC II
For Use With/Related Products: 8260ADS
Packaging: Bulk
Part Status: Obsolete
Accessory Type: Interface Board
товару немає в наявності
В кошику
од. на суму грн.
| MPC8313ECVRAFF |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
товару немає в наявності
В кошику
од. на суму грн.
| MPC8313ECZQADD |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MPC8313ECZQAFF |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
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В кошику
од. на суму грн.
| MPC8313EVRAFF |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
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В кошику
од. на суму грн.
| MPC8313EZQADD |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
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В кошику
од. на суму грн.
| MPC8313EZQAFF |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
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В кошику
од. на суму грн.
| MPC8347CVVAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672LBGA
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Description: IC MPU MPC83XX 400MHZ 672LBGA
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
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В кошику
од. на суму грн.
| MPC8347CVVAJDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
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В кошику
од. на суму грн.
| MPC8347CVVAJFB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 533MHZ 672LBGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Additional Interfaces: DUART, I2C, PCI, SPI
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В кошику
од. на суму грн.
| MPC8347CZUAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
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В кошику
од. на суму грн.
| MPC8349CVVAJDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
Description: IC MPU MPC83XX 533MHZ 672LBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
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В кошику
од. на суму грн.
| MPC8349CZUAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 672LBGA
Package / Case: 672-LBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Description: IC MPU MPC83XX 400MHZ 672LBGA
Package / Case: 672-LBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 672-LBGA (35x35)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
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В кошику
од. на суму грн.
| MPC8358ECVVAGDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
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В кошику
од. на суму грн.
| MPC8358EVRAGDDA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 668-PBGA-PGE (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 668-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 668BGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 668-PBGA-PGE (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 668-BBGA Exposed Pad
Packaging: Tray
на замовлення 32 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5951.13 грн |
| 10+ | 5660.24 грн |
| MPC8358VVAGDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 740TBGA
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8017.64 грн |
| 21+ | 5937.11 грн |
| MPC8360CVVAGDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
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В кошику
од. на суму грн.
| MPC8360CVVAJDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Description: IC MPU MPC83XX 533MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
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В кошику
од. на суму грн.
| MPC8360EA-MDS-PB |
|
Виробник: NXP USA Inc.
Description: MPC8360EA EVAL BRD
Mounting Type: Fixed
Packaging: Bulk
Part Status: Discontinued at Digi-Key
Utilized IC / Part: MPC8360EA
Board Type: Evaluation Platform
Core Processor: e300
Contents: Board(s), Cable(s), Power Supply
Type: MPU
Description: MPC8360EA EVAL BRD
Mounting Type: Fixed
Packaging: Bulk
Part Status: Discontinued at Digi-Key
Utilized IC / Part: MPC8360EA
Board Type: Evaluation Platform
Core Processor: e300
Contents: Board(s), Cable(s), Power Supply
Type: MPU
товару немає в наявності
В кошику
од. на суму грн.
| MPC8360EVVAJDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Description: IC MPU MPC83XX 533MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MPC8360EVVALFHA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 667MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Description: IC MPU MPC83XX 667MHZ 740TBGA
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 667MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MPC8360ZUAJDGA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
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| MPC8377E-MDS-PB |
|
Виробник: NXP USA Inc.
Description: MPC8377E EVAL BRD
Utilized IC / Part: MPC8377E
Core Processor: e300
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Description: MPC8377E EVAL BRD
Utilized IC / Part: MPC8377E
Core Processor: e300
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
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| MPC8540ADS-BGA |
|
Виробник: NXP USA Inc.
Description: MPC8540 EVAL BRD
Description: MPC8540 EVAL BRD
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| MPC8548ECHXAQG |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
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| MPC8548ECVUAQG |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (4)
Supplier Device Package: 783-FCBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
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| MPC8555CDS |
Виробник: NXP USA Inc.
Description: MPC8555 EVAL BRD
Description: MPC8555 EVAL BRD
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| MPC8560ADS-BGA |
Виробник: NXP USA Inc.
Description: MPC8560 EVAL BRD
Description: MPC8560 EVAL BRD
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| MPR083EJR2 |
Виробник: NXP USA Inc.
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
DigiKey Programmable: Not Verified
Proximity Detection: Yes
Supplier Device Package: 16-TSSOP
Number of Inputs: 8
Current - Supply: 1.62mA
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: Buttons, Slider, Wheel
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Description: IC CTLR TOUCH SENSR PROX 16TSSOP
DigiKey Programmable: Not Verified
Proximity Detection: Yes
Supplier Device Package: 16-TSSOP
Number of Inputs: 8
Current - Supply: 1.62mA
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: Buttons, Slider, Wheel
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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| MPR084QR2 |
Виробник: NXP USA Inc.
Description: IC CTLR TOUCH SENSOR PROX 16-QFN
Current - Supply: 1.62mA
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: Buttons, Slider, Wheel
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 16-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Proximity Detection: Yes
Supplier Device Package: 16-QFN-EP (5x5)
Number of Inputs: 8
Description: IC CTLR TOUCH SENSOR PROX 16-QFN
Current - Supply: 1.62mA
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: Buttons, Slider, Wheel
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 16-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Proximity Detection: Yes
Supplier Device Package: 16-QFN-EP (5x5)
Number of Inputs: 8
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| MRF5S4125NBR1 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 465MHZ TO-272-4
Description: FET RF 65V 465MHZ TO-272-4
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| MRF5S4125NR1 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 465MHZ TO-270-4
Description: FET RF 65V 465MHZ TO-270-4
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| MRF6V10250HSR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 100V 1.09GHZ NI780S
Description: FET RF 100V 1.09GHZ NI780S
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| MRF6V10250HSR5 |
|
Виробник: NXP USA Inc.
Description: FET RF 100V 1.09GHZ NI780S
Description: FET RF 100V 1.09GHZ NI780S
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| MRF7S16150HR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 1.66GHZ NI-780
Current - Test: 1.5 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.7dB
Power - Output: 32W
Frequency: 1.6GHz ~ 1.66GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Description: FET RF 65V 1.66GHZ NI-780
Current - Test: 1.5 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.7dB
Power - Output: 32W
Frequency: 1.6GHz ~ 1.66GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
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| MRF7S16150HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.5 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.7dB
Power - Output: 32W
Frequency: 1.6GHz ~ 1.66GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.5 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.7dB
Power - Output: 32W
Frequency: 1.6GHz ~ 1.66GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
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| MRF7S18170HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Current - Test: 1.4 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-880S
Technology: LDMOS
Gain: 17.5dB
Power - Output: 50W
Frequency: 1.81GHz
Mounting Type: Surface Mount
Package / Case: NI-880S
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI880S
Current - Test: 1.4 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-880S
Technology: LDMOS
Gain: 17.5dB
Power - Output: 50W
Frequency: 1.81GHz
Mounting Type: Surface Mount
Package / Case: NI-880S
Packaging: Tape & Reel (TR)
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| MRF7S19080HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 750 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 18dB
Power - Output: 24W
Frequency: 1.99GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 750 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 18dB
Power - Output: 24W
Frequency: 1.99GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
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| MRF7S19080HSR3 |
|
Виробник: NXP USA Inc.
Description: FET RF 65V 1.99GHZ NI-780S
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Current - Test: 750 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 18dB
Power - Output: 24W
Frequency: 1.99GHz
Mounting Type: Chassis Mount
Description: FET RF 65V 1.99GHZ NI-780S
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Current - Test: 750 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 18dB
Power - Output: 24W
Frequency: 1.99GHz
Mounting Type: Chassis Mount
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| MRF7S19080HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 750 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 18dB
Power - Output: 24W
Frequency: 1.99GHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 750 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 18dB
Power - Output: 24W
Frequency: 1.99GHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
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| MRF7S21080HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 18dB
Power - Output: 22W
Frequency: 2.17GHz
Mounting Type: Chassis Mount
Description: RF MOSFET LDMOS 28V NI780
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 18dB
Power - Output: 22W
Frequency: 2.17GHz
Mounting Type: Chassis Mount
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| MRF7S21080HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 18dB
Power - Output: 22W
Frequency: 2.17GHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S
Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 18dB
Power - Output: 22W
Frequency: 2.17GHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S
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| MRF7S21110HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 17.3dB
Power - Output: 33W
Frequency: 2.17GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 17.3dB
Power - Output: 33W
Frequency: 2.17GHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
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