Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36395) > Сторінка 196 з 607

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MSC8157ADS NXP USA Inc. MSC8157.pdf Description: MSC8157 EVAL BRD
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MSC8157EADS NXP USA Inc. Description: MSC8157 EVAL BRD
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PK50N512CLQ100 PK50N512CLQ100 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
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PK51N256CLQ100 PK51N256CLQ100 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144LQFP
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PK51N256CMD100 PK51N256CMD100 NXP USA Inc. Description: IC MCU 32B 256KB FLASH 144MAPBGA
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PK51N512CLQ100 PK51N512CLQ100 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
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PK51N512CMD100 PK51N512CMD100 NXP USA Inc. Description: IC MCU 32B 512KB FLASH 144MAPBGA
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PK52N512CLQ100 PK52N512CLQ100 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
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PK60FN1M0VLQ15 PK60FN1M0VLQ15 NXP USA Inc. KINK6XFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 48x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Box
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PK60FX512VLQ15 PK60FX512VLQ15 NXP USA Inc. KINK6XFS.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 48x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Box
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PK60N256VMC100 PK60N256VMC100 NXP USA Inc. Description: IC MCU 32B 256KB FLASH 121MAPBGA
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PK61FN1M0VMD15 PK61FN1M0VMD15 NXP USA Inc. KINK6XFS.pdf Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 95
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 53x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Box
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PK70FN1M0VMJ15 PK70FN1M0VMJ15 NXP USA Inc. K70PB.pdf Description: IC MCU 32BIT 1MB FLSH 256MAPPBGA
Packaging: Box
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 81x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Obsolete
Number of I/O: 128
DigiKey Programmable: Not Verified
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S908EY8AE0CFJE S908EY8AE0CFJE NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
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S908GR8AE1MFAER S908GR8AE1MFAER NXP USA Inc. Description: IC MCU 8BIT 7.5KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
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S912XEQ512J3CAL S912XEQ512J3CAL NXP USA Inc. Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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S912XHY128F0VLL S912XHY128F0VLL NXP USA Inc. MC9S12XHY256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 76
DigiKey Programmable: Not Verified
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S912XHY128F0VLM S912XHY128F0VLM NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 88
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: HCS12X
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
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S912XHY256F0VLM S912XHY256F0VLM NXP USA Inc. MC9S12XHY256RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Number of I/O: 88
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: HCS12X
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
DigiKey Programmable: Not Verified
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S9S08SC4E0MTG S9S08SC4E0MTG NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
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S9S08SC4E0MTGR S9S08SC4E0MTGR NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Number of I/O: 12
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SCI
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S9S08SG8E2VTJR S9S08SG8E2VTJR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
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S9S12G128F0CLF S9S12G128F0CLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G128F0CLH S9S12G128F0CLH NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 896 шт:
термін постачання 21-31 дні (днів)
1+539.57 грн
10+400.36 грн
25+370.66 грн
80+321.40 грн
230+303.82 грн
800+288.78 грн
В кошику  од. на суму  грн.
S9S12G128F0CLL S9S12G128F0CLL NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 86
DigiKey Programmable: Not Verified
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S9S12G128F0MLF S9S12G128F0MLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1395 шт:
термін постачання 21-31 дні (днів)
1+576.76 грн
10+430.60 грн
25+399.34 грн
100+342.50 грн
250+327.12 грн
500+317.85 грн
1250+303.02 грн
В кошику  од. на суму  грн.
S9S12G128F0MLFR S9S12G128F0MLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
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S9S12G128F0MLH S9S12G128F0MLH NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 7394 шт:
термін постачання 21-31 дні (днів)
1+603.66 грн
10+451.10 грн
25+418.57 грн
100+359.25 грн
250+343.25 грн
800+328.06 грн
1600+315.84 грн
В кошику  од. на суму  грн.
S9S12G128F0MLL S9S12G128F0MLL NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 100LQFP
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Number of I/O: 86
DigiKey Programmable: Not Verified
на замовлення 433 шт:
термін постачання 21-31 дні (днів)
1+559.35 грн
10+415.98 грн
25+385.32 грн
80+334.30 грн
230+316.15 грн
В кошику  од. на суму  грн.
S9S12G128F0VLH S9S12G128F0VLH NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S9S12G128F0VLHR S9S12G128F0VLHR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
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S9S12G96F0CLF S9S12G96F0CLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1054 шт:
термін постачання 21-31 дні (днів)
1+481.82 грн
10+357.16 грн
25+330.53 грн
100+282.68 грн
250+269.57 грн
500+261.68 грн
В кошику  од. на суму  грн.
S9S12G96F0CLH S9S12G96F0CLH NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 96KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 3K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S9S12G96F0MLL S9S12G96F0MLL NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 96KB FLASH 100LQFP
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
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S9S12GN16F0CLF S9S12GN16F0CLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 16KB FLASH 48LQFP
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
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S9S12GN16F0VLF S9S12GN16F0VLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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S9S12GN32F0MFT S9S12GN32F0MFT NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 32KB FLASH 48QFN
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S9S12GN32F0MLF S9S12GN32F0MLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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S9S12GN32F0VLF S9S12GN32F0VLF NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
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S9S12XS128J1CALR S9S12XS128J1CALR NXP USA Inc. S12XSFS.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
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SPC5534MVM80R SPC5534MVM80R NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tape & Reel (TR)
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SPC5606SF2VLU6 SPC5606SF2VLU6 NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 176-LQFP (24x24)
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SPC5632MF1MLQ60 SPC5632MF1MLQ60 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
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SPC5633MF1MLU60 SPC5633MF1MLU60 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
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SPC5634MF1MLQ60 SPC5634MF1MLQ60 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
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SPC5634MF1MLU60 SPC5634MF1MLU60 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
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SPC5634MF1MLU80 SPC5634MF1MLU80 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
на замовлення 520 шт:
термін постачання 21-31 дні (днів)
1+2326.81 грн
10+1796.92 грн
80+1534.43 грн
440+1421.06 грн
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BGA2817,115 BGA2817,115 NXP USA Inc. BGA2817.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
3000+13.19 грн
6000+12.19 грн
9000+11.90 грн
Мінімальне замовлення: 3000 шт
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BGA2817,115 BGA2817,115 NXP USA Inc. BGA2817.pdf Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 12462 шт:
термін постачання 21-31 дні (днів)
15+22.15 грн
17+18.21 грн
25+17.16 грн
100+14.73 грн
250+13.89 грн
500+13.30 грн
1000+12.53 грн
Мінімальне замовлення: 15 шт
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LPC4330FBD144,551 LPC4330FBD144,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 188 шт:
термін постачання 21-31 дні (днів)
1+910.63 грн
10+689.33 грн
60+607.84 грн
120+549.74 грн
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LPC4330FET100,551 LPC4330FET100,551 NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
на замовлення 502 шт:
термін постачання 21-31 дні (днів)
1+418.53 грн
10+402.41 грн
25+402.05 грн
100+377.02 грн
В кошику  од. на суму  грн.
PTN3460BS/F2,518 PTN3460BS/F2,518 NXP USA Inc. PTN3460.pdf Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
2000+174.40 грн
Мінімальне замовлення: 2000 шт
В кошику  од. на суму  грн.
PTN3460BS/F2,518 PTN3460BS/F2,518 NXP USA Inc. PTN3460.pdf Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
на замовлення 5194 шт:
термін постачання 21-31 дні (днів)
2+315.67 грн
10+230.46 грн
25+212.19 грн
100+180.20 грн
250+171.19 грн
500+167.81 грн
Мінімальне замовлення: 2 шт
В кошику  од. на суму  грн.
TDF8530TH/N1,518 TDF8530TH/N1,518 NXP USA Inc. TDF8530TH.pdf Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
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TDF8541TH/N2,518 TDF8541TH/N2,518 NXP USA Inc. TDF8541.PDF Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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TDF8546TH/N1,518 TDF8546TH/N1,518 NXP USA Inc. 75017062.pdf Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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TDF8599CTH/N1,118 TDF8599CTH/N1,118 NXP USA Inc. TDF8599B.pdf Description: IC AMP D MONO/STEREO 300W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
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TDF8530TH/N1,512 TDF8530TH/N1,512 NXP USA Inc. TDF8530TH.pdf Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
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TDF8541J/N2,112 TDF8541J/N2,112 NXP USA Inc. TDF8541.PDF Description: IC AMP CLASS AB QUAD 64W DBS27P
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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TDF8541SD/N2,112 NXP USA Inc. TDF8541.PDF Description: IC AMP CLASS AB QUAD 64W 27RDBS
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 27-RDBS
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MSC8157ADS MSC8157.pdf
Виробник: NXP USA Inc.
Description: MSC8157 EVAL BRD
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MSC8157EADS
Виробник: NXP USA Inc.
Description: MSC8157 EVAL BRD
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PK50N512CLQ100
PK50N512CLQ100
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
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PK51N256CLQ100
PK51N256CLQ100
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
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PK51N256CMD100
PK51N256CMD100
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
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PK51N512CLQ100
PK51N512CLQ100
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
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PK51N512CMD100
PK51N512CMD100
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
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PK52N512CLQ100
PK52N512CLQ100
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
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PK60FN1M0VLQ15 KINK6XFS.pdf
PK60FN1M0VLQ15
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 48x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Box
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PK60FX512VLQ15 KINK6XFS.pdf
PK60FX512VLQ15
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 48x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Box
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PK60N256VMC100
PK60N256VMC100
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
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PK61FN1M0VMD15 KINK6XFS.pdf
PK61FN1M0VMD15
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 95
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 53x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Box
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PK70FN1M0VMJ15 K70PB.pdf
PK70FN1M0VMJ15
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLSH 256MAPPBGA
Packaging: Box
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 81x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Obsolete
Number of I/O: 128
DigiKey Programmable: Not Verified
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S908EY8AE0CFJE
S908EY8AE0CFJE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
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S908GR8AE1MFAER
S908GR8AE1MFAER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
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S912XEQ512J3CAL
S912XEQ512J3CAL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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S912XHY128F0VLL MC9S12XHY256RMV1.pdf
S912XHY128F0VLL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 76
DigiKey Programmable: Not Verified
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S912XHY128F0VLM
S912XHY128F0VLM
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 88
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: HCS12X
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
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S912XHY256F0VLM MC9S12XHY256RMV1.pdf
S912XHY256F0VLM
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Number of I/O: 88
Part Status: Active
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: HCS12X
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
DigiKey Programmable: Not Verified
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S9S08SC4E0MTG
S9S08SC4E0MTG
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
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S9S08SC4E0MTGR
S9S08SC4E0MTGR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Number of I/O: 12
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SCI
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S9S08SG8E2VTJR MC9S08SG8.pdf
S9S08SG8E2VTJR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
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S9S12G128F0CLF MC9S12GRMV1.pdf
S9S12G128F0CLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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S9S12G128F0CLH MC9S12GRMV1.pdf
S9S12G128F0CLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 896 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+539.57 грн
10+400.36 грн
25+370.66 грн
80+321.40 грн
230+303.82 грн
800+288.78 грн
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S9S12G128F0CLL MC9S12GRMV1.pdf
S9S12G128F0CLL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 86
DigiKey Programmable: Not Verified
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S9S12G128F0MLF MC9S12GRMV1.pdf
S9S12G128F0MLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1395 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+576.76 грн
10+430.60 грн
25+399.34 грн
100+342.50 грн
250+327.12 грн
500+317.85 грн
1250+303.02 грн
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S9S12G128F0MLFR MC9S12GRMV1.pdf
S9S12G128F0MLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
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S9S12G128F0MLH MC9S12GRMV1.pdf
S9S12G128F0MLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 7394 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+603.66 грн
10+451.10 грн
25+418.57 грн
100+359.25 грн
250+343.25 грн
800+328.06 грн
1600+315.84 грн
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S9S12G128F0MLL MC9S12GRMV1.pdf
S9S12G128F0MLL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 100LQFP
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Number of I/O: 86
DigiKey Programmable: Not Verified
на замовлення 433 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+559.35 грн
10+415.98 грн
25+385.32 грн
80+334.30 грн
230+316.15 грн
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S9S12G128F0VLH MC9S12GRMV1.pdf
S9S12G128F0VLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S9S12G128F0VLHR MC9S12GRMV1.pdf
S9S12G128F0VLHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
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S9S12G96F0CLF MC9S12GRMV1.pdf
S9S12G96F0CLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1054 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+481.82 грн
10+357.16 грн
25+330.53 грн
100+282.68 грн
250+269.57 грн
500+261.68 грн
В кошику  од. на суму  грн.
S9S12G96F0CLH MC9S12GRMV1.pdf
S9S12G96F0CLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 3K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S9S12G96F0MLL MC9S12GRMV1.pdf
S9S12G96F0MLL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 100LQFP
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
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S9S12GN16F0CLF MC9S12GRMV1.pdf
S9S12GN16F0CLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
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S9S12GN16F0VLF MC9S12GRMV1.pdf
S9S12GN16F0VLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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S9S12GN32F0MFT MC9S12GRMV1.pdf
S9S12GN32F0MFT
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
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S9S12GN32F0MLF MC9S12GRMV1.pdf
S9S12GN32F0MLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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S9S12GN32F0VLF MC9S12GRMV1.pdf
S9S12GN32F0VLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
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S9S12XS128J1CALR S12XSFS.pdf
S9S12XS128J1CALR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
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SPC5534MVM80R
SPC5534MVM80R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tape & Reel (TR)
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SPC5606SF2VLU6 MPC5606S.pdf
SPC5606SF2VLU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 176-LQFP (24x24)
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SPC5632MF1MLQ60 MPC5634M.pdf
SPC5632MF1MLQ60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
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SPC5633MF1MLU60 MPC5634M.pdf
SPC5633MF1MLU60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
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SPC5634MF1MLQ60 MPC5634M.pdf
SPC5634MF1MLQ60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 80
DigiKey Programmable: Not Verified
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SPC5634MF1MLU60
SPC5634MF1MLU60
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
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SPC5634MF1MLU80
SPC5634MF1MLU80
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 114
DigiKey Programmable: Not Verified
на замовлення 520 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2326.81 грн
10+1796.92 грн
80+1534.43 грн
440+1421.06 грн
В кошику  од. на суму  грн.
BGA2817,115 BGA2817.pdf
BGA2817,115
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+13.19 грн
6000+12.19 грн
9000+11.90 грн
Мінімальне замовлення: 3000 шт
В кошику  од. на суму  грн.
BGA2817,115 BGA2817.pdf
BGA2817,115
Виробник: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 25.1dB
Current - Supply: 20mA
Noise Figure: 3.8dB
P1dB: 5dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
на замовлення 12462 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
15+22.15 грн
17+18.21 грн
25+17.16 грн
100+14.73 грн
250+13.89 грн
500+13.30 грн
1000+12.53 грн
Мінімальне замовлення: 15 шт
В кошику  од. на суму  грн.
LPC4330FBD144,551 LPC4350_30_20_10.pdf
LPC4330FBD144,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
на замовлення 188 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+910.63 грн
10+689.33 грн
60+607.84 грн
120+549.74 грн
В кошику  од. на суму  грн.
LPC4330FET100,551 LPC4350_30_20_10.pdf
LPC4330FET100,551
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
на замовлення 502 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+418.53 грн
10+402.41 грн
25+402.05 грн
100+377.02 грн
В кошику  од. на суму  грн.
PTN3460BS/F2,518 PTN3460.pdf
PTN3460BS/F2,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2000+174.40 грн
Мінімальне замовлення: 2000 шт
В кошику  од. на суму  грн.
PTN3460BS/F2,518 PTN3460.pdf
PTN3460BS/F2,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: LVDS
Supplier Device Package: 56-HVQFN (7x7)
Part Status: Active
на замовлення 5194 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+315.67 грн
10+230.46 грн
25+212.19 грн
100+180.20 грн
250+171.19 грн
500+167.81 грн
Мінімальне замовлення: 2 шт
В кошику  од. на суму  грн.
TDF8530TH/N1,518 TDF8530TH.pdf
TDF8530TH/N1,518
Виробник: NXP USA Inc.
Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
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TDF8541TH/N2,518 TDF8541.PDF
TDF8541TH/N2,518
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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TDF8546TH/N1,518 75017062.pdf
TDF8546TH/N1,518
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 36HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
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TDF8599CTH/N1,118 TDF8599B.pdf
TDF8599CTH/N1,118
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 300W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 8V ~ 48V
Max Output Power x Channels @ Load: 300W x 1 @ 3Ohm; 155W x 2 @ 6Ohm
Supplier Device Package: 36-HSOP
Part Status: Active
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TDF8530TH/N1,512 TDF8530TH.pdf
TDF8530TH/N1,512
Виробник: NXP USA Inc.
Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
Part Status: Obsolete
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TDF8541J/N2,112 TDF8541.PDF
TDF8541J/N2,112
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W DBS27P
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
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TDF8541SD/N2,112 TDF8541.PDF
Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 64W 27RDBS
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tube
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm
Supplier Device Package: 27-RDBS
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