Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (34434) > Сторінка 284 з 574
| Фото | Назва | Виробник | Інформація |
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NHS3152TEMOADKUL | NXP USA Inc. |
 Description: NHS3152 STARTER KITPackaging: Bulk For Use With/Related Products: NHS3152 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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MCIMX6V7DVN10AB | NXP USA Inc. |
Description: IC MPU I.MX6SLL 1GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Supplier Device Package: 432-MAPBGA (13x13) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active |
на замовлення 114 шт: термін постачання 21-31 дні (днів) |
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MCIMX6SLL-EVK | NXP USA Inc. |
Description: I.MX 6SLL EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply, Accessories Core Processor: ARM® Cortex®-A9 Board Type: Evaluation Platform Utilized IC / Part: i.MX 6SLL Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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ACP-CYCLONE | NXP USA Inc. |
Description: CYCLONE ARM CORTEX PROGRAMMER Packaging: Bulk For Use With/Related Products: ARM® Cortex® Devices Type: Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s), Power Supply, Accessories Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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OM23221ARD | NXP USA Inc. |
Description: EVAL BOARD FOR NT3H2111 NT3H2211 Packaging: Bulk For Use With/Related Products: NT3H2111, NT3H2211 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) Part Status: Active |
товар відсутній |
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LPC844M201JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
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LPC845M301JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 2x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 132 шт: термін постачання 21-31 дні (днів) |
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LPC844M201JHI33Y | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 29 DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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LPC845M301JHI33Y | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 29 DigiKey Programmable: Not Verified |
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LPC844M201JHI48E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
на замовлення 144 шт: термін постачання 21-31 дні (днів) |
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LPC845M301JHI48E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 2x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
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LPC844M201JBD48E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
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LPC845M301JBD48E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 2x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
на замовлення 5588 шт: термін постачання 21-31 дні (днів) |
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OM13097UL | NXP USA Inc. |
Description: LPCXPRESSO LPC84X EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: LPC84x Platform: LPCXpresso™ |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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| QN9083CUKZ | NXP USA Inc. |
Description: IC RF TXRX+MCU BLUETOOTH 47XFBGA Packaging: Tape & Reel (TR) Package / Case: 47-XFBGA, WLCSP Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 3.6V Power - Output: 2dBm Protocol: Bluetooth v5.0 Current - Receiving: 5mA Current - Transmitting: 3.5mA Supplier Device Package: 47-WLSCP (3.28x3.2) Modulation: FSK, GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART, USART, USB Part Status: Active |
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QN9080-DK | NXP USA Inc. |
Description: QN9080-DK Packaging: Bulk For Use With/Related Products: QN908x Frequency: 2.4GHz Type: Transceiver; Bluetooth® 5 Supplied Contents: Board(s) Part Status: Active |
на замовлення 289 шт: термін постачання 21-31 дні (днів) |
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LS1021ATSN-PA | NXP USA Inc. |
Description: LS1021A EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply, Accessories Core Processor: ARM® Cortex®-A7 Board Type: Evaluation Platform Utilized IC / Part: LS1021A Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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OL2385AHN/001A0Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 48VFQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -124dBm Mounting Type: Surface Mount Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 14dBm Current - Transmitting: 29mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 12 Modulation: ASK, FSK Serial Interfaces: SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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OM2385/SF001 | NXP USA Inc. |
Description: OL2385 SIGFOX DEV KIT W/ KL43Z Packaging: Bulk For Use With/Related Products: OL2385 Type: Transceiver Supplied Contents: Board(s), Cable(s) |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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OL2385AHN/00100Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 48VFQFN Packaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -124dBm Mounting Type: Surface Mount Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 14dBm Current - Transmitting: 29mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 12 Modulation: ASK, FSK Serial Interfaces: SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 1804 шт: термін постачання 21-31 дні (днів) |
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LPC54606J256ET100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
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LPC54606J512ET100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
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LPC54616J512ET100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 136 шт: термін постачання 21-31 дні (днів) |
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LPC54628J512ET180E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 220MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
на замовлення 4678 шт: термін постачання 21-31 дні (днів) |
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LPC54606J256BD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 64 DigiKey Programmable: Not Verified |
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LPC54606J512BD100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 432 шт: термін постачання 21-31 дні (днів) |
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LPC54616J512BD100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 884 шт: термін постачання 21-31 дні (днів) |
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OM13098UL | NXP USA Inc. |
Description: LPCXPRESSO LPC54628 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: LPC54628 Platform: LPCXpresso™ Part Status: Active |
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LPC54618J512BD208E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 171 DigiKey Programmable: Not Verified |
на замовлення 74 шт: термін постачання 21-31 дні (днів) |
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| FRDM33926PNBEVM | NXP USA Inc. |
Description: BOARD EVALUATION Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC33926 Supplied Contents: Board(s) Part Status: Active |
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S912ZVML32F2WKH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP |
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S912ZVML12F2VKH | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP |
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S912ZVMC64F2MKH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP |
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BF1108/L,215 | NXP USA Inc. |
Description: IC RF SWITCH Packaging: Tape & Reel (TR) Package / Case: TO-253-4, TO-253AA Current Rating (Amps): 10mA Mounting Type: Surface Mount Configuration: N-Channel Technology: MOSFET Supplier Device Package: SOT-143B Part Status: Obsolete Voltage - Rated: 3 V |
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MC32PF3001A7EP | NXP USA Inc. |
Description: IC PWR MGMT I.MX7 6LDO QFN 48 Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
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LS1021A-IOT-B | NXP USA Inc. |
Description: LS1021A EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply, Accessories Core Processor: ARM® Cortex®-A7 Utilized IC / Part: LS1021A Part Status: Active |
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FRDM-STBC-AGM04 | NXP USA Inc. |
Description: FRDM BOARD FORMMA8652/MAG311 Packaging: Box Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC Supplied Contents: Board(s) Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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BRKT-STBC-AGM04 | NXP USA Inc. |
Description: FRDM BOARD FORMMA8652/ MAG3110 Packaging: Box Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC Supplied Contents: Board(s) Part Status: Active |
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DEVKIT-MPC5744P | NXP USA Inc. |
Description: MPC5744P EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5744P Part Status: Active |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
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DEMOAX9S12XEP100 | NXP USA Inc. |
Description: MC9S12XEP100 EVAL BRD |
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A1006TL/TA1NXZ | NXP USA Inc. |
Description: IC SECURE AUTHENTICATOR 6HXSON Packaging: Tape & Reel (TR) Package / Case: 6-XDFN Exposed Pad Mounting Type: Surface Mount Type: Secure Authenticator Supplier Device Package: 6-HXSON (2x2) DigiKey Programmable: Not Verified |
на замовлення 16000 шт: термін постачання 21-31 дні (днів) |
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A2G22S251-01SR3 | NXP USA Inc. |
Description: AIRFAST RF POWER GAN TRANSISTOR Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 1.805GHz ~ 2.2GHz Power - Output: 52dBm Gain: 17.7dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 200 mA |
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| A2G26H280-04SR3 | NXP USA Inc. | Description: AIRFAST RF POWER GAN TRANSISTOR |
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A2G26H281-04SR3 | NXP USA Inc. |
Description: AIRFAST RF POWER GAN TRANSISTOR |
товар відсутній |
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A2G35S160-01SR3 | NXP USA Inc. |
Description: AIRFAST RF POWER GAN TRANSISTOR Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz Power - Output: 51dBm Gain: 15.7dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 190 mA |
товар відсутній |
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A2G35S200-01SR3 | NXP USA Inc. |
Description: RF MOSFET GAN HEMT 48V NI400 Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz Power - Output: 180W Gain: 16.1dB Technology: GaN HEMT Supplier Device Package: NI-400S-2S Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 291 mA |
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A2I09VD030NR1 | NXP USA Inc. |
Description: IC RF AMP TO270WB-15 |
товар відсутній |
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| A2I20H080GNR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
товар відсутній |
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| A2I20H080NR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
товар відсутній |
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A2I35H060GNR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
товар відсутній |
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| A2I35H060NR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
товар відсутній |
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| A2T08VD020NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 728MHz ~ 960MHz Power - Output: 18W Gain: 19.1dB Technology: LDMOS Supplier Device Package: 24-PQFN-EP (8x8) Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 40 mA |
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| A2T09D400-23NR6 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTO |
товар відсутній |
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| A2T14H450-23NR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 31V OM1230-42 Packaging: Tape & Reel (TR) Package / Case: OM-1230-4L2S Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.452GHz ~ 1.511GHz Gain: 18.8dB Technology: LDMOS Supplier Device Package: OM-1230-4L2S Voltage - Rated: 65 V Voltage - Test: 31 V Current - Test: 1 A |
товар відсутній |
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| A2T18S165-12SR3 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTO |
товар відсутній |
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| A2T18S260-12SR3 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTO |
товар відсутній |
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| A2T18S261W12NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM880X-2L2L Packaging: Tape & Reel (TR) Package / Case: OM-880X-2L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.805GHz ~ 1.88GHz Power - Output: 280W Gain: 18.2dB Technology: LDMOS Supplier Device Package: OM-880X-2L2L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
товар відсутній |
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| A2T18S262W12NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM880X-2L2L Packaging: Tape & Reel (TR) Package / Case: OM-880X-2L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.805GHz ~ 1.88GHz Power - Output: 231W Gain: 19.3dB Technology: LDMOS Supplier Device Package: OM-880X-2L2L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.6 A |
товар відсутній |
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| A2T20H330W24NR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM1230-42 Packaging: Tape & Reel (TR) Package / Case: OM-1230-4L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.88GHz ~ 2.025GHz Power - Output: 229W Gain: 15.9dB Technology: LDMOS Supplier Device Package: OM-1230-4L2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 700 mA |
товар відсутній |
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| A2T21S260W12NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM880X-2L2L Packaging: Tape & Reel (TR) Package / Case: OM-880X-2L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 2.11GHz ~ 2.2GHz Power - Output: 218W Gain: 17.9dB Technology: LDMOS Supplier Device Package: OM-880X-2L2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.6 A |
товар відсутній |
| NHS3152TEMOADKUL |
|
Виробник: NXP USA Inc.
Description: NHS3152 STARTER KIT
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: NHS3152 STARTER KIT
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9398.61 грн |
| MCIMX6V7DVN10AB |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SLL 1GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 432-MAPBGA (13x13)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Description: IC MPU I.MX6SLL 1GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 432-MAPBGA (13x13)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
на замовлення 114 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1351.59 грн |
| 10+ | 1040.32 грн |
| MCIMX6SLL-EVK |
|
Виробник: NXP USA Inc.
Description: I.MX 6SLL EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6SLL
Part Status: Active
Description: I.MX 6SLL EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6SLL
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 16342.66 грн |
| ACP-CYCLONE |
|
Виробник: NXP USA Inc.
Description: CYCLONE ARM CORTEX PROGRAMMER
Packaging: Bulk
For Use With/Related Products: ARM® Cortex® Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Active
Description: CYCLONE ARM CORTEX PROGRAMMER
Packaging: Bulk
For Use With/Related Products: ARM® Cortex® Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 53570.66 грн |
| OM23221ARD |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR NT3H2111 NT3H2211
Packaging: Bulk
For Use With/Related Products: NT3H2111, NT3H2211
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL BOARD FOR NT3H2111 NT3H2211
Packaging: Bulk
For Use With/Related Products: NT3H2111, NT3H2211
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| LPC844M201JBD64E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
товар відсутній
| LPC845M301JBD64E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 132 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 247.9 грн |
| 10+ | 186.75 грн |
| LPC844M201JHI33Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| LPC845M301JHI33Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
товар відсутній
| LPC844M201JHI48E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
на замовлення 144 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 219.16 грн |
| 10+ | 165.1 грн |
| 80+ | 135.27 грн |
| LPC845M301JHI48E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
товар відсутній
| LPC844M201JBD48E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
товар відсутній
| LPC845M301JBD48E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
на замовлення 5588 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 230.65 грн |
| 10+ | 173.74 грн |
| 80+ | 142.36 грн |
| 500+ | 130.79 грн |
| 1000+ | 110.3 грн |
| 2500+ | 104.79 грн |
| 5000+ | 99.2 грн |
| OM13097UL |
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC84X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC84x
Platform: LPCXpresso™
Description: LPCXPRESSO LPC84X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC84x
Platform: LPCXpresso™
на замовлення 13 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1534.1 грн |
| QN9083CUKZ |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLUETOOTH 47XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART, USART, USB
Part Status: Active
Description: IC RF TXRX+MCU BLUETOOTH 47XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART, USART, USB
Part Status: Active
товар відсутній
| QN9080-DK |
Виробник: NXP USA Inc.
Description: QN9080-DK
Packaging: Bulk
For Use With/Related Products: QN908x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5
Supplied Contents: Board(s)
Part Status: Active
Description: QN9080-DK
Packaging: Bulk
For Use With/Related Products: QN908x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5
Supplied Contents: Board(s)
Part Status: Active
на замовлення 289 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8003.91 грн |
| LS1021ATSN-PA |
|
Виробник: NXP USA Inc.
Description: LS1021A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Board Type: Evaluation Platform
Utilized IC / Part: LS1021A
Part Status: Active
Description: LS1021A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Board Type: Evaluation Platform
Utilized IC / Part: LS1021A
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 64699.53 грн |
| OL2385AHN/001A0Y |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
| OM2385/SF001 |
|
Виробник: NXP USA Inc.
Description: OL2385 SIGFOX DEV KIT W/ KL43Z
Packaging: Bulk
For Use With/Related Products: OL2385
Type: Transceiver
Supplied Contents: Board(s), Cable(s)
Description: OL2385 SIGFOX DEV KIT W/ KL43Z
Packaging: Bulk
For Use With/Related Products: OL2385
Type: Transceiver
Supplied Contents: Board(s), Cable(s)
на замовлення 13 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7048.96 грн |
| OL2385AHN/00100Y |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1804 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 482.15 грн |
| 10+ | 425.54 грн |
| 25+ | 386.87 грн |
| 100+ | 326.76 грн |
| 250+ | 299.53 грн |
| 500+ | 272.3 грн |
| 1000+ | 241.05 грн |
| LPC54606J256ET100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
| LPC54606J512ET100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
| LPC54616J512ET100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 136 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 815.55 грн |
| 10+ | 627.38 грн |
| 80+ | 529.85 грн |
| LPC54628J512ET180E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
на замовлення 4678 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 889.56 грн |
| 10+ | 684.53 грн |
| 189+ | 578.15 грн |
| 567+ | 539.25 грн |
| 945+ | 509.12 грн |
| LPC54606J256BD100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
товар відсутній
| LPC54606J512BD100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 432 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 883.1 грн |
| 10+ | 667.99 грн |
| 90+ | 553.04 грн |
| LPC54616J512BD100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 884 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 901.06 грн |
| 10+ | 681.49 грн |
| 90+ | 564.23 грн |
| OM13098UL |
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC54628 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC54628
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC54628 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC54628
Platform: LPCXpresso™
Part Status: Active
товар відсутній
| LPC54618J512BD208E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
на замовлення 74 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 911.12 грн |
| 10+ | 701.14 грн |
| FRDM33926PNBEVM |
|
Виробник: NXP USA Inc.
Description: BOARD EVALUATION
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33926
Supplied Contents: Board(s)
Part Status: Active
Description: BOARD EVALUATION
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33926
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| BF1108/L,215 |
|
Виробник: NXP USA Inc.
Description: IC RF SWITCH
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 10mA
Mounting Type: Surface Mount
Configuration: N-Channel
Technology: MOSFET
Supplier Device Package: SOT-143B
Part Status: Obsolete
Voltage - Rated: 3 V
Description: IC RF SWITCH
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 10mA
Mounting Type: Surface Mount
Configuration: N-Channel
Technology: MOSFET
Supplier Device Package: SOT-143B
Part Status: Obsolete
Voltage - Rated: 3 V
товар відсутній
| MC32PF3001A7EP |
|
Виробник: NXP USA Inc.
Description: IC PWR MGMT I.MX7 6LDO QFN 48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: IC PWR MGMT I.MX7 6LDO QFN 48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
товар відсутній
| LS1021A-IOT-B |
|
Виробник: NXP USA Inc.
Description: LS1021A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: LS1021A
Part Status: Active
Description: LS1021A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: LS1021A
Part Status: Active
товар відсутній
| FRDM-STBC-AGM04 |
|
Виробник: NXP USA Inc.
Description: FRDM BOARD FORMMA8652/MAG311
Packaging: Box
Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis
Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM BOARD FORMMA8652/MAG311
Packaging: Box
Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis
Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC
Supplied Contents: Board(s)
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2190.85 грн |
| BRKT-STBC-AGM04 |
|
Виробник: NXP USA Inc.
Description: FRDM BOARD FORMMA8652/ MAG3110
Packaging: Box
Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis
Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM BOARD FORMMA8652/ MAG3110
Packaging: Box
Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis
Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| DEVKIT-MPC5744P |
|
Виробник: NXP USA Inc.
Description: MPC5744P EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5744P
Part Status: Active
Description: MPC5744P EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5744P
Part Status: Active
на замовлення 61 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7791.22 грн |
| A1006TL/TA1NXZ |
Виробник: NXP USA Inc.
Description: IC SECURE AUTHENTICATOR 6HXSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XDFN Exposed Pad
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 6-HXSON (2x2)
DigiKey Programmable: Not Verified
Description: IC SECURE AUTHENTICATOR 6HXSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XDFN Exposed Pad
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 6-HXSON (2x2)
DigiKey Programmable: Not Verified
на замовлення 16000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4000+ | 51.95 грн |
| 8000+ | 49.48 грн |
| 12000+ | 47.85 грн |
| A2G22S251-01SR3 |
|
Виробник: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
Power - Output: 52dBm
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 200 mA
Description: AIRFAST RF POWER GAN TRANSISTOR
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
Power - Output: 52dBm
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 200 mA
товар відсутній
| A2G35S160-01SR3 |
|
Виробник: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 51dBm
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 190 mA
Description: AIRFAST RF POWER GAN TRANSISTOR
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 51dBm
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 190 mA
товар відсутній
| A2G35S200-01SR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET GAN HEMT 48V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 180W
Gain: 16.1dB
Technology: GaN HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 291 mA
Description: RF MOSFET GAN HEMT 48V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 180W
Gain: 16.1dB
Technology: GaN HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 291 mA
товар відсутній
| A2T08VD020NT1 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 48V 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Power - Output: 18W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: 24-PQFN-EP (8x8)
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF MOSFET LDMOS 48V 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Power - Output: 18W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: 24-PQFN-EP (8x8)
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 40 mA
товар відсутній
| A2T14H450-23NR6 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 31V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.452GHz ~ 1.511GHz
Gain: 18.8dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2S
Voltage - Rated: 65 V
Voltage - Test: 31 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 31V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.452GHz ~ 1.511GHz
Gain: 18.8dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2S
Voltage - Rated: 65 V
Voltage - Test: 31 V
Current - Test: 1 A
товар відсутній
| A2T18S261W12NR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 280W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 280W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
товар відсутній
| A2T18S262W12NR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 231W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.6 A
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 231W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.6 A
товар відсутній
| A2T20H330W24NR6 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.88GHz ~ 2.025GHz
Power - Output: 229W
Gain: 15.9dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 700 mA
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.88GHz ~ 2.025GHz
Power - Output: 229W
Gain: 15.9dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 700 mA
товар відсутній
| A2T21S260W12NR3 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 218W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.6 A
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 218W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.6 A
товар відсутній