Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35983) > Сторінка 288 з 600
| Фото | Назва | Виробник | Інформація |
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LS1046ASE8T1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 780FCPBGAPackaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LS1046ASN8MQA | NXP USA Inc. |
Description: IC MPU QORIQ 1.2GHZ 780FCPBGAPackaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Part Status: Active |
на замовлення 101 шт: термін постачання 21-31 дні (днів) |
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LS1046ASN8P1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.4GHZ 780FCPBGAPackaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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LS1046ASN8Q1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.6GHZ 780FCPBGAPackaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Part Status: Active |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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LS1046ASN8T1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 780FCPBGAPackaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
на замовлення 128 шт: термін постачання 21-31 дні (днів) |
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LS1046AXE8P1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.4GHZ 780FCPBGAPackaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LS1046AXN8MQA | NXP USA Inc. |
Description: IC MPU QORIQ 1.2GHZ 780FCPBGAPackaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LS1046AXN8P1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.4GHZ 780FCPBGAPackaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LS1046AXN8T1A | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 780FCPBGAPackaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Part Status: Active |
на замовлення 203 шт: термін постачання 21-31 дні (днів) |
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MAC7111MAG50 | NXP USA Inc. |
Description: IC MCU 32BIT 544KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 32K x 8 Core Processor: ARM7® Data Converters: A/D 16x8/10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR Supplier Device Package: 144-LQFP (20x20) Part Status: Obsolete Number of I/O: 112 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC07XS6517BEK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 54HSOPPackaging: Tube Features: Internal PWM Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 7mOhm, 17mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 1:1 Supplier Device Package: 54-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC07XS6517BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 54HSOPPackaging: Tape & Reel (TR) Features: Internal PWM Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 7mOhm, 17mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A, 11A Ratio - Input:Output: 1:1 Supplier Device Package: 54-HSOP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC13234CHTR | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 48MAPLGAPackaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -93dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash, 8kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 3.6V Power - Output: 2dBm Protocol: Zigbee® Current - Receiving: 26.8mA ~ 35mA Data Rate (Max): 250kbps Current - Transmitting: 21.3mA ~ 28.2mA Supplier Device Package: 48-MAPLGA (7x7) GPIO: 32 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF1550A1EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF1550A3EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF3000A1EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF3000A2EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE-Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
на замовлення 134 шт: термін постачання 21-31 дні (днів) |
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MC32PF3000A3EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE-Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF3000A4EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE-Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF3000A5EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- |
на замовлення 245 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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MC32PF3000A6EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF3000A7EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE-Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
на замовлення 209 шт: термін постачання 21-31 дні (днів) |
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MC32PF3000A7EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE-Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: i.MX Processors Supplier Device Package: 48-HVQFN (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF3001A1EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE-Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF3001A1EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF3001A3EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE-Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
на замовлення 310 шт: термін постачання 21-31 дні (днів) |
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MC32PF3001A6EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE-Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF3001A6EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE-Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF4210A0ES | NXP USA Inc. |
Description: PF4210Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: 0°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Audio, Video Supplier Device Package: 56-QFN-EP (8x8) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF4210A0ESR2 | NXP USA Inc. |
Description: PF4210Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: 0°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Audio, Video Supplier Device Package: 56-QFN-EP (8x8) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC32PF4210A1ES | NXP USA Inc. |
Description: PF4210Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: 0°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Audio, Video Supplier Device Package: 56-QFN-EP (8x8) Part Status: Active |
на замовлення 162 шт: термін постачання 21-31 дні (днів) |
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MC32PF4210A1ESR2 | NXP USA Inc. |
Description: PF4210Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: 0°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Audio, Video Supplier Device Package: 56-QFN-EP (8x8) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33660BEF | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8SOICPackaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: Serial Link Bus Interface Voltage - Supply: 8V ~ 18V Supplier Device Package: 8-SOIC Part Status: Active Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33660BEFR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8SOICPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: Serial Link Bus Interface Voltage - Supply: 8V ~ 18V Supplier Device Package: 8-SOIC Part Status: Active Grade: Automotive |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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MC33664ATL1EG | NXP USA Inc. |
Description: TRANSFORMER PHYSICAL LAYERPackaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Applications: Isolated Communications Interface Current - Supply: 40mA Supplier Device Package: 16-SOIC Part Status: Active |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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| MC33926ES | NXP USA Inc. |
Description: H-BRIDGE BRUSHED DC MOTOR DRIVEPackaging: Tray Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Function: Driver Current - Output: 5A Operating Temperature: -40°C ~ 125°C Output Configuration: Half Bridge Voltage - Supply: 5V ~ 28V Applications: General Purpose Supplier Device Package: 28-HVQFN (6x6) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| MC33926ESR2 | NXP USA Inc. |
Description: H-BRIDGE BRUSHED DC MOTOR DRIVEPackaging: Tape & Reel (TR) Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Function: Driver Current - Output: 5A Operating Temperature: -40°C ~ 125°C Output Configuration: Half Bridge Voltage - Supply: 5V ~ 28V Applications: General Purpose Supplier Device Package: 28-HVQFN (6x6) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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MC33FS4500CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A VPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
на замовлення 161 шт: термін постачання 21-31 дні (днів) |
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MC33FS4501NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33FS4501NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33FS4502CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A VPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33FS4502CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A VPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33FS4502LAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A VPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
на замовлення 645 шт: термін постачання 21-31 дні (днів) |
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MC33FS4503CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A VPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
на замовлення 130 шт: термін постачання 21-31 дні (днів) |
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MC33FS4503NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33FS4503NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33FS6500NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 0.8A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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MC33FS6502CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 0.8A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
на замовлення 135 шт: термін постачання 21-31 дні (днів) |
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MC33FS6502LAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 0.8A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
на замовлення 173 шт: термін постачання 21-31 дні (днів) |
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MC33FS6503CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 0.8A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
на замовлення 259 шт: термін постачання 21-31 дні (днів) |
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MC33FS6503NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 0.8A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33FS6510CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33FS6513CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33FS6520LAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
MC33FS6521NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
на замовлення 448 шт: термін постачання 21-31 дні (днів) |
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MC33FS6522CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33FS6522CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
MC33FS6522LAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
на замовлення 291 шт: термін постачання 21-31 дні (днів) |
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MC33FS6522LAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
MC33FS6522NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. |
| LS1046ASE8T1A |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
товару немає в наявності
В кошику
од. на суму грн.
| LS1046ASN8MQA |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
на замовлення 101 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 6235.97 грн |
| 10+ | 5850.64 грн |
| LS1046ASN8P1A |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8205.14 грн |
| 10+ | 6639.63 грн |
| LS1046ASN8Q1A |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 9460.52 грн |
| 10+ | 7685.22 грн |
| 60+ | 7065.25 грн |
| LS1046ASN8T1A |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
на замовлення 128 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 9846.66 грн |
| 10+ | 8043.30 грн |
| 60+ | 7789.17 грн |
| LS1046AXE8P1A |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
товару немає в наявності
В кошику
од. на суму грн.
| LS1046AXN8MQA |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Obsolete
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| LS1046AXN8P1A |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| LS1046AXN8T1A |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
на замовлення 203 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 12968.41 грн |
| 10+ | 10622.61 грн |
| 60+ | 9811.13 грн |
| MAC7111MAG50 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 544KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 544KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 112
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC07XS6517BEK |
![]() |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tube
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tube
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
товару немає в наявності
В кошику
од. на суму грн.
| MC07XS6517BEKR2 |
![]() |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Packaging: Tape & Reel (TR)
Features: Internal PWM
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
товару немає в наявності
В кошику
од. на суму грн.
| MC13234CHTR |
![]() |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -93dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 2dBm
Protocol: Zigbee®
Current - Receiving: 26.8mA ~ 35mA
Data Rate (Max): 250kbps
Current - Transmitting: 21.3mA ~ 28.2mA
Supplier Device Package: 48-MAPLGA (7x7)
GPIO: 32
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 48MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -93dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 2dBm
Protocol: Zigbee®
Current - Receiving: 26.8mA ~ 35mA
Data Rate (Max): 250kbps
Current - Transmitting: 21.3mA ~ 28.2mA
Supplier Device Package: 48-MAPLGA (7x7)
GPIO: 32
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF1550A1EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF1550A3EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF3000A1EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Description: POWER MANAGEMENT IC I.MX7 PRE-
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF3000A2EP |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 134 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 554.14 грн |
| 10+ | 412.65 грн |
| 25+ | 382.40 грн |
| 100+ | 327.70 грн |
| MC32PF3000A3EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF3000A4EP |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF3000A5EP |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Description: POWER MANAGEMENT IC I.MX7 PRE-
на замовлення 245 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| MC32PF3000A6EP |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Description: POWER MANAGEMENT IC I.MX7 PRE-
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF3000A7EP |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 209 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 561.66 грн |
| 10+ | 417.56 грн |
| 25+ | 386.68 грн |
| 100+ | 331.08 грн |
| MC32PF3000A7EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF3001A1EP |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF3001A1EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Description: POWER MANAGEMENT IC I.MX7 PRE-
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF3001A3EP |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
на замовлення 310 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 470.56 грн |
| 10+ | 348.74 грн |
| 25+ | 322.59 грн |
| 100+ | 275.79 грн |
| 260+ | 262.45 грн |
| MC32PF3001A6EP |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF3001A6EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF4210A0ES |
![]() |
Виробник: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF4210A0ESR2 |
![]() |
Виробник: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF4210A1ES |
![]() |
Виробник: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
на замовлення 162 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 590.92 грн |
| 10+ | 441.46 грн |
| 25+ | 409.41 грн |
| 100+ | 351.21 грн |
| MC32PF4210A1ESR2 |
![]() |
Виробник: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC33660BEF |
![]() |
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Active
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Active
Grade: Automotive
товару немає в наявності
В кошику
од. на суму грн.
| MC33660BEFR2 |
![]() |
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Active
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Active
Grade: Automotive
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 77.95 грн |
| 5000+ | 73.48 грн |
| 7500+ | 72.69 грн |
| MC33664ATL1EG |
![]() |
Виробник: NXP USA Inc.
Description: TRANSFORMER PHYSICAL LAYER
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Applications: Isolated Communications Interface
Current - Supply: 40mA
Supplier Device Package: 16-SOIC
Part Status: Active
Description: TRANSFORMER PHYSICAL LAYER
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Applications: Isolated Communications Interface
Current - Supply: 40mA
Supplier Device Package: 16-SOIC
Part Status: Active
на замовлення 41 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 625.18 грн |
| 10+ | 466.41 грн |
| MC33926ES |
![]() |
Виробник: NXP USA Inc.
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Packaging: Tray
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Active
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Packaging: Tray
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC33926ESR2 |
![]() |
Виробник: NXP USA Inc.
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Active
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS4500CAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 161 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 766.44 грн |
| 10+ | 513.01 грн |
| 25+ | 454.84 грн |
| 80+ | 374.23 грн |
| MC33FS4501NAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS4501NAER2 |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS4502CAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS4502CAER2 |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS4502LAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 645 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 590.92 грн |
| 10+ | 443.72 грн |
| 25+ | 412.21 грн |
| 80+ | 366.53 грн |
| MC33FS4503CAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 130 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 954.49 грн |
| 10+ | 647.67 грн |
| 25+ | 577.69 грн |
| 80+ | 478.86 грн |
| MC33FS4503NAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS4503NAER2 |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
товару немає в наявності
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од. на суму грн.
| MC33FS6500NAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
на замовлення 250 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 517.37 грн |
| 10+ | 385.04 грн |
| 25+ | 356.65 грн |
| 100+ | 305.37 грн |
| 250+ | 291.38 грн |
| MC33FS6502CAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
на замовлення 135 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 665.30 грн |
| 10+ | 499.25 грн |
| 25+ | 463.82 грн |
| 100+ | 398.65 грн |
| MC33FS6502LAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 173 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 683.69 грн |
| 10+ | 513.42 грн |
| 25+ | 477.12 грн |
| 100+ | 410.26 грн |
| MC33FS6503CAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
на замовлення 259 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 554.14 грн |
| 10+ | 420.37 грн |
| MC33FS6503NAER2 |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6510CAER2 |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6513CAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6520LAER2 |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6521NAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 448 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 560.83 грн |
| 10+ | 418.12 грн |
| 25+ | 387.62 грн |
| 100+ | 332.32 грн |
| 250+ | 317.32 грн |
| MC33FS6522CAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6522CAER2 |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6522LAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 291 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 718.80 грн |
| 10+ | 540.22 грн |
| 25+ | 502.16 грн |
| 100+ | 432.03 грн |
| 250+ | 413.33 грн |
| MC33FS6522LAER2 |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6522NAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
В кошику
од. на суму грн.
















