Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (34627) > Сторінка 286 з 578
| Фото | Назва | Виробник | Інформація |
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| FRDM-32XSG-EVB | NXP USA Inc. |
Description: FREEDOM EXPANSION BOARD 32V EXT Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC17XSG500 Supplied Contents: Board(s) Part Status: Active |
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| FRDM-33879A-EVB | NXP USA Inc. |
 Description: FREEDOM EXPANSION KIT - MC33879Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC33879 Supplied Contents: Board(s) Part Status: Active |
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| FRDM-40XSF5-EVB | NXP USA Inc. |
Description: FREEDOM EXPANSION BOARD MC40XSF Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC40XS6500, MC40XSF500 Supplied Contents: Board(s) Part Status: Active |
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| FRDM-50XSDBEVB | NXP USA Inc. |
Description: FREEDOM PLATFORM DAUGHTER BOARD Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC50XS4200 Supplied Contents: Board(s) |
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| FRDM-HB2000-EVM | NXP USA Inc. | Description: FREEDOM EXPANSION BOARD- HB2000 |
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FRDM-HB2000ESEVM | NXP USA Inc. |
Description: FRDM EXP BD HB2000 Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC33HB2000 Supplied Contents: Board(s) Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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| FRDM-HB2000FEVM | NXP USA Inc. | Description: FREEDOM EXPANSION BOARD HB2000 |
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| FRDM-HB2001FEVM | NXP USA Inc. |
Description: FREEDOM EXPANSION BOARD HB2001 Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC33HB2001 Supplied Contents: Board(s) |
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| FRDM-K64F-AGM02 | NXP USA Inc. |
Description: DEMO KIT CONTAINING THE FRDM-K64 Packaging: Bulk Sensor Type: Accelerometer, Gyroscope, Magnetometer Utilized IC / Part: K24, K63, K64, FXAS21002C, FXLS8952C, MAG3110, mbed-Enabled Development Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
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| FRDM-K64F-AGM04 | NXP USA Inc. |
Description: KIT CONTAINING THE FRDM-K64F AND Packaging: Bulk Sensor Type: Accelerometer, Gyroscope, Magnetometer Utilized IC / Part: K24, K63, K64, FXAS21002C, MAG3110, MMA8652FC, mbed-Enabled Development Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
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FRDM-KV11Z | NXP USA Inc. |
Description: FREEDOM KV1X EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: KV1x Platform: Freedom Part Status: Active |
на замовлення 83 шт: термін постачання 21-31 дні (днів) |
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| FRDM-MC36XSD-EVB | NXP USA Inc. |
Description: FRDM EXP BD - 36 V MULTIPURPOSE Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC36XSD Supplied Contents: Board(s) Part Status: Active |
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FRDMFS6522LAEVM | NXP USA Inc. |
Description: FREEDOM EXPANSION KIT FS6522 SY Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: FS6500 Supplied Contents: Board(s), Cable(s), Accessories Embedded: Yes, MCU, 32-Bit |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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| FRDMSTBC-A8451 | NXP USA Inc. |
Description: FREEDOM SENSOR SHIELD BOARD FOR Packaging: Bulk Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g Interface: I2C, Serial Voltage - Supply: 1.95V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA8451Q Supplied Contents: Board(s) Sensing Range: ±2g, 4g, 8g Part Status: Active |
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FS32K144HAT0CLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP |
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FS32K144HAT0MLHR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP |
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FS32K144HFT0CLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Obsolete Number of I/O: 58 DigiKey Programmable: Not Verified |
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FS32K144HFT0MLHR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
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FS32K144HFT0MLLR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP |
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FS32K144HFT0VLLR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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FS32K144HFT0VLLT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
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FS32K144HNT0CLLT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP |
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FS32K144HRT0CLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP |
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FS32K144HRT0CLLT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP |
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FS32K144HRT0MLLR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP |
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FS32K144HRT0VLLR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP |
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FS32K144MNT0CLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP |
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FS32K144MNT0CLLT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 |
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FS32K144MNT0MLHR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
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FS32K144MNT0MLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 |
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FS32K144MNT0MLLR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
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FS32K144MNT0VLLT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP |
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FS32K144MST0MLHR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
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FS32K144MST0MLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
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FS32K144UFT0VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 |
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FS32K144UFT0VLHT | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP |
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FS32K144UFT0VLLR | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP |
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FS32R274KCK2MMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA |
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FS32R274VBK2VMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz, 240MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.5M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4, e200z7 (2) Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
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FS32V234CMN1VUB | NXP USA Inc. |
Description: IC MPU FS32V23 1GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: 1Gbps Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Part Status: Obsolete |
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| FXLS60322AESR2 | NXP USA Inc. |
Description: XTRINSIC 2 AXIS MED/MED XY ACCEL Packaging: Tape & Reel (TR) |
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| FXLS60422AESR2 | NXP USA Inc. | Description: XTRINSIC 2 AXIS MED/MED XZ ACCEL |
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| FXLS60433AESR2 | NXP USA Inc. |
Description: XTRINSIC 2 AXIS HIGH/HIGH XZ ACC Packaging: Tape & Reel (TR) |
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| FXPQ3115BVT1 | NXP USA Inc. | Description: PRESSURE SENSOR 2.5V 20/110KPA |
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FXTH8715027T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
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FXTH87EH02DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
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FXTH87EH11DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
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| HTMS8301FUG/AM,005 | NXP USA Inc. |
Description: RFID TAG R/W 100-150KHZ ENCAP Packaging: Tray Style: Encapsulated Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Operating Temperature: -40°C ~ 85°C Technology: Passive Part Status: Obsolete |
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| JN5179/001Z | NXP USA Inc. |
Description: RX TXRX MODULE 802.15.4 CHIP SMD Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -96.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.485GHz Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 10dBm Protocol: Zigbee® Current - Receiving: 12.7mA ~ 14.8mA Current - Transmitting: 14mA ~ 22.5mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 1 RF Family/Standard: 802.15.4 Serial Interfaces: I2C, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
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| KIT06XS3517EVBE | NXP USA Inc. |
Description: EVALUATION KIT - MC06XS3517 SMA Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC06XS3517 Supplied Contents: Board(s) |
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| KIT07XS6517EVB | NXP USA Inc. |
Description: EVALUATION KIT - MC07XS6517 TRI Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC07XS6517, MC17XS6500 Supplied Contents: Board(s) Part Status: Active |
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| KIT10XS3425EVBE | NXP USA Inc. |
Description: EVALUATION KIT - MC10XS3425 QUA |
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| KIT10XS6325EKEVB | NXP USA Inc. |
Description: EVALUATION KIT - MC10XS6325 12 Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC10XS6325 Supplied Contents: Board(s) Part Status: Active |
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| KIT17XS6400EKEVB | NXP USA Inc. |
Description: EVALUATION KIT - MC17XS6400 12 |
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| KIT20XS4200EVBE | NXP USA Inc. |
Description: EVALUATION KIT - MC20XS4200 DUA |
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| KIT33664AEVB | NXP USA Inc. |
Description: EVALUATION BOARD - MC33664 TRAN Packaging: Bulk Function: Transceiver Type: Interface Utilized IC / Part: MC33664 Supplied Contents: Board(s) Part Status: Obsolete |
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| KIT33771TPLEVB | NXP USA Inc. |
Description: EVALUATION KIT MC33771 BATTERY |
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| KIT33883FRDMEVM | NXP USA Inc. |
Description: FREEDOM EXPANSION BBOARD - MC338 Packaging: Bulk Function: H-Bridge Driver (External FET) Type: Power Management Utilized IC / Part: MC33883 Supplied Contents: Board(s) Part Status: Active |
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| KIT33907AEEVB | NXP USA Inc. |
Description: EVALUATION KIT - MC33907 POWERS Packaging: Bulk Function: CANbus and LINbus Type: Interface Utilized IC / Part: MC33907 Supplied Contents: Board(s) Part Status: Active |
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| KIT34932SEKEVB | NXP USA Inc. |
Description: EVALUATION KIT - MC34932 36V - Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC34932 Supplied Contents: Board(s) |
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| FRDM-32XSG-EVB |
Виробник: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD 32V EXT
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC17XSG500
Supplied Contents: Board(s)
Part Status: Active
Description: FREEDOM EXPANSION BOARD 32V EXT
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC17XSG500
Supplied Contents: Board(s)
Part Status: Active
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| FRDM-33879A-EVB |
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Виробник: NXP USA Inc.
Description: FREEDOM EXPANSION KIT - MC33879
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC33879
Supplied Contents: Board(s)
Part Status: Active
Description: FREEDOM EXPANSION KIT - MC33879
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC33879
Supplied Contents: Board(s)
Part Status: Active
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| FRDM-40XSF5-EVB |
Виробник: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD MC40XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC40XS6500, MC40XSF500
Supplied Contents: Board(s)
Part Status: Active
Description: FREEDOM EXPANSION BOARD MC40XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC40XS6500, MC40XSF500
Supplied Contents: Board(s)
Part Status: Active
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| FRDM-50XSDBEVB |
Виробник: NXP USA Inc.
Description: FREEDOM PLATFORM DAUGHTER BOARD
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC50XS4200
Supplied Contents: Board(s)
Description: FREEDOM PLATFORM DAUGHTER BOARD
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC50XS4200
Supplied Contents: Board(s)
товар відсутній
| FRDM-HB2000ESEVM |
|
Виробник: NXP USA Inc.
Description: FRDM EXP BD HB2000
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33HB2000
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM EXP BD HB2000
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33HB2000
Supplied Contents: Board(s)
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10108.83 грн |
| FRDM-HB2001FEVM |
|
Виробник: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD HB2001
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33HB2001
Supplied Contents: Board(s)
Description: FREEDOM EXPANSION BOARD HB2001
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33HB2001
Supplied Contents: Board(s)
товар відсутній
| FRDM-K64F-AGM02 |
Виробник: NXP USA Inc.
Description: DEMO KIT CONTAINING THE FRDM-K64
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002C, FXLS8952C, MAG3110, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: DEMO KIT CONTAINING THE FRDM-K64
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002C, FXLS8952C, MAG3110, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
товар відсутній
| FRDM-K64F-AGM04 |
|
Виробник: NXP USA Inc.
Description: KIT CONTAINING THE FRDM-K64F AND
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002C, MAG3110, MMA8652FC, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: KIT CONTAINING THE FRDM-K64F AND
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002C, MAG3110, MMA8652FC, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
товар відсутній
| FRDM-KV11Z |
|
Виробник: NXP USA Inc.
Description: FREEDOM KV1X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KV1x
Platform: Freedom
Part Status: Active
Description: FREEDOM KV1X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KV1x
Platform: Freedom
Part Status: Active
на замовлення 83 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2100 грн |
| FRDM-MC36XSD-EVB |
Виробник: NXP USA Inc.
Description: FRDM EXP BD - 36 V MULTIPURPOSE
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC36XSD
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM EXP BD - 36 V MULTIPURPOSE
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC36XSD
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| FRDMFS6522LAEVM |
|
Виробник: NXP USA Inc.
Description: FREEDOM EXPANSION KIT FS6522 SY
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS6500
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Description: FREEDOM EXPANSION KIT FS6522 SY
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS6500
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15448.8 грн |
| FRDMSTBC-A8451 |
Виробник: NXP USA Inc.
Description: FREEDOM SENSOR SHIELD BOARD FOR
Packaging: Bulk
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Description: FREEDOM SENSOR SHIELD BOARD FOR
Packaging: Bulk
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 4g, 8g
Part Status: Active
товар відсутній
| FS32K144HFT0CLHT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
товар відсутній
| FS32K144HFT0MLHR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
товар відсутній
| FS32K144HFT0MLLR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
товар відсутній
| FS32K144HFT0VLLR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 459.23 грн |
| FS32K144HFT0VLLT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
товар відсутній
| FS32K144HNT0CLLT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
товар відсутній
| FS32K144HRT0CLLT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
товар відсутній
| FS32K144HRT0MLLR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
товар відсутній
| FS32K144HRT0VLLR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
товар відсутній
| FS32K144MNT0CLLT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
товар відсутній
| FS32K144MNT0MLHR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
товар відсутній
| FS32K144MNT0MLHT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
товар відсутній
| FS32K144MNT0MLLR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
товар відсутній
| FS32K144MNT0VLLT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
товар відсутній
| FS32K144MST0MLHR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
товар відсутній
| FS32K144MST0MLHT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
товар відсутній
| FS32K144UFT0VLHR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
товар відсутній
| FS32K144UFT0VLLR |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
товар відсутній
| FS32R274VBK2VMM |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| FS32V234CMN1VUB |
|
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Part Status: Obsolete
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: 1Gbps
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Part Status: Obsolete
товар відсутній
| FXLS60322AESR2 |
товар відсутній
| FXLS60433AESR2 |
товар відсутній
| FXTH8715027T1 |
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
товар відсутній
| FXTH87EH02DT1 |
|
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
товар відсутній
| FXTH87EH11DT1 |
|
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
товар відсутній
| HTMS8301FUG/AM,005 |
|
Виробник: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Tray
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Technology: Passive
Part Status: Obsolete
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Tray
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Technology: Passive
Part Status: Obsolete
товар відсутній
| JN5179/001Z |
|
Виробник: NXP USA Inc.
Description: RX TXRX MODULE 802.15.4 CHIP SMD
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.485GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 12.7mA ~ 14.8mA
Current - Transmitting: 14mA ~ 22.5mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 1
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: RX TXRX MODULE 802.15.4 CHIP SMD
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.485GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 12.7mA ~ 14.8mA
Current - Transmitting: 14mA ~ 22.5mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 1
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| KIT06XS3517EVBE |
|
Виробник: NXP USA Inc.
Description: EVALUATION KIT - MC06XS3517 SMA
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC06XS3517
Supplied Contents: Board(s)
Description: EVALUATION KIT - MC06XS3517 SMA
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC06XS3517
Supplied Contents: Board(s)
товар відсутній
| KIT07XS6517EVB |
|
Виробник: NXP USA Inc.
Description: EVALUATION KIT - MC07XS6517 TRI
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC07XS6517, MC17XS6500
Supplied Contents: Board(s)
Part Status: Active
Description: EVALUATION KIT - MC07XS6517 TRI
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC07XS6517, MC17XS6500
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| KIT10XS6325EKEVB |
|
Виробник: NXP USA Inc.
Description: EVALUATION KIT - MC10XS6325 12
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC10XS6325
Supplied Contents: Board(s)
Part Status: Active
Description: EVALUATION KIT - MC10XS6325 12
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC10XS6325
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| KIT33664AEVB |
|
Виробник: NXP USA Inc.
Description: EVALUATION BOARD - MC33664 TRAN
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVALUATION BOARD - MC33664 TRAN
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: MC33664
Supplied Contents: Board(s)
Part Status: Obsolete
товар відсутній
| KIT33883FRDMEVM |
|
Виробник: NXP USA Inc.
Description: FREEDOM EXPANSION BBOARD - MC338
Packaging: Bulk
Function: H-Bridge Driver (External FET)
Type: Power Management
Utilized IC / Part: MC33883
Supplied Contents: Board(s)
Part Status: Active
Description: FREEDOM EXPANSION BBOARD - MC338
Packaging: Bulk
Function: H-Bridge Driver (External FET)
Type: Power Management
Utilized IC / Part: MC33883
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| KIT33907AEEVB |
|
Виробник: NXP USA Inc.
Description: EVALUATION KIT - MC33907 POWERS
Packaging: Bulk
Function: CANbus and LINbus
Type: Interface
Utilized IC / Part: MC33907
Supplied Contents: Board(s)
Part Status: Active
Description: EVALUATION KIT - MC33907 POWERS
Packaging: Bulk
Function: CANbus and LINbus
Type: Interface
Utilized IC / Part: MC33907
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| KIT34932SEKEVB |
|
Виробник: NXP USA Inc.
Description: EVALUATION KIT - MC34932 36V -
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34932
Supplied Contents: Board(s)
Description: EVALUATION KIT - MC34932 36V -
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC34932
Supplied Contents: Board(s)
товар відсутній