Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35480) > Сторінка 318 з 592
Фото | Назва | Виробник | Інформація |
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MC32PF1550A6EPR2 | NXP USA Inc. |
Description: PF1550 Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
MC56F8335VFGER | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC908AS60ACFUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8.4MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HC08 Data Converters: A/D 15x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Not For New Designs Number of I/O: 52 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S08PA4AVSC | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Not Verified |
на замовлення 2254 шт: термін постачання 21-31 дні (днів) |
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MC9S08PA4AVTJ | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 4 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
MF0UL2101DUD2A | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MF1P2121DA4/02BJ | NXP USA Inc. | Description: CLHW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MF1P2121DA6/02BJ | NXP USA Inc. | Description: CLHW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MF1P2121DUD/02BV | NXP USA Inc. | Description: CLHW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MF1P2121DUF/02BV | NXP USA Inc. | Description: CLHW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MF1S5001XDUD2/V1A | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: Die Part Status: Not For New Designs |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MF1S5031XDUD2/V1A | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MHT2012NT1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MIMXRT1020-EVK | NXP USA Inc. |
Description: I.MX RT1020 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: i.MX RT1020 Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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MMA2631NKGCWR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Selectable Low Pass Filter Package / Case: 16-QFN Exposed Pad Output Type: PCM Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±312g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 1.64 Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MMA5124LCWR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Selectable Low Pass Filter Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: Z Acceleration Range: ±240g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.2V ~ 17V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 2 Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MMA5148LCWR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Selectable Low Pass Filter Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: Z Acceleration Range: ±480g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.2V ~ 17V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 1 Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MMA5248LCWR2 | NXP USA Inc. |
Description: PSI5 ACCELEROMETER QFN 16 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MMA6519KCWR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Selectable Low Pass Filter Package / Case: 16-QFN Exposed Pad Output Type: SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y Acceleration Range: ±80g Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 3.135V ~ 5.25V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 24 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MMA6525KCWR2 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
MMA6555KCWR2 | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
MMA6813KCWR2 | NXP USA Inc. |
Description: XTRINSIC 10 BITS SPI ACCELEROMET Packaging: Tape & Reel (TR) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MRF1K50H-TF5 | NXP USA Inc. |
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на замовлення 1 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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MRF24301HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS NI780 Packaging: Tube Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.4GHz ~ 2.5GHz Power - Output: 300W Gain: 13.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MRF300AN | NXP USA Inc. |
![]() Packaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Frequency: 27MHz ~ 250MHz Power - Output: 300W Gain: 28dB Technology: LDMOS Supplier Device Package: TO-247 Part Status: Active Voltage - Test: 50 V |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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MRF300BN | NXP USA Inc. |
![]() Packaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Frequency: 27MHz ~ 250MHz Power - Output: 300W Gain: 18.7dB Technology: LDMOS Supplier Device Package: TO-247 Part Status: Active Voltage - Test: 50 V |
на замовлення 182 шт: термін постачання 21-31 дні (днів) |
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MWCT1014SFVLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: General Purpose Supplier Device Package: 64-LQFP (10x10) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
NCF2957VHN4/0200IY | NXP USA Inc. |
Description: TOKEN PLUS Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
NCF29A7EHN3/0200IY | NXP USA Inc. | Description: TOKEN PLUS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
NCF29A7EHN4/0200IY | NXP USA Inc. | Description: TOKEN PLUS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
NCF29A7VHN3/0200IY | NXP USA Inc. | Description: TOKEN PLUS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
NT4H1321G0DUD/06BV | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, NFC Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
NTB0101GS1XL | NXP USA Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
NX20P3483UKZ | NXP USA Inc. | Description: IC PWR SWITCH 1:1 42WLCSP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
NX30P6093UKAZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Slew Rate Controlled Package / Case: 20-UFBGA, WLCSP Output Type: P-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: I2C Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Rds On (Typ): 8.95mOhm Voltage - Load: 2.8V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V Current - Output (Max): 8A Ratio - Input:Output: 1:1 Supplier Device Package: 20-WLCSP (2.16x1.7) Fault Protection: Over Temperature, Over Voltage, UVLO Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
NXQ1TXH5DB1402UL | NXP USA Inc. |
Description: NXQ1TXH5 DEMOBOARD 1401 Packaging: Bulk Function: Wireless Power Supply/Charging Type: Power Management Utilized IC / Part: NXQ1TXH5 Supplied Contents: Board(s) Primary Attributes: Transmitter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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PCF7900NHN/C0K/UZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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PCF7900VHN/C0L/UZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 16-HVQFN (3x3) Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
QN9083DUKZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 47-XFBGA, WLCSP Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 32MHz Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 3.6V Power - Output: 2dBm Protocol: Bluetooth v5.0 Current - Receiving: 5mA Data Rate (Max): 16Mbps Current - Transmitting: 3.5mA Supplier Device Package: 47-WLSCP (3.28x3.2) Modulation: FSK, GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART, USART, USB Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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S912ZVL12F0MLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 10x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S912ZVL12F0MLFR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 10x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
SL2ICS5301EW/V7:00 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Standards: EPC, ISO 15693 Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SP03245-01UL | NXP USA Inc. |
Description: SP03245-01 Packaging: Bulk Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SP05127-02UL | NXP USA Inc. |
Description: EVAL BOARD FOR TEA1936X Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1936x Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
SP05145-02UL | NXP USA Inc. | Description: SP05145-02 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SP5746BBK1AMMH6R | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SP5746BTK1AVMH6R | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 100MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SP5746CSK1AVKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
SP5747CFK0AVMJ6R | NXP USA Inc. | Description: IC MCU 32BIT 4MB FLASH 256MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SPC5777CDK3MME4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 8MB (8M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 16b Sigma-Delta, eQADC Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 416-MAPBGA (27x27) Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 57 шт: термін постачання 21-31 дні (днів) |
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TEA1716DB1255UL | NXP USA Inc. |
![]() Packaging: Bulk Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA1716 Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
TEA1721ADB1102UL | NXP USA Inc. |
![]() Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1721 Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
TEA1733T/DB/65W,59 | NXP USA Inc. |
Description: EVAL BOARD FOR TEA1733 Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1733 Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
TEA1738DB01/65W/SL | NXP USA Inc. |
Description: TEA1738 DEMOBOARD 01 Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1738 Supplied Contents: Board(s) Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
TEA1751T/1791/DB/9 | NXP USA Inc. |
![]() Packaging: Bulk Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA1751 Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
TEA1752T/1791/DB/9 | NXP USA Inc. |
![]() Packaging: Bulk Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA1752 Supplied Contents: Board(s) Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
TEA1755DB1100UL | NXP USA Inc. |
![]() Packaging: Bulk Function: Power Factor Correction Type: Power Management Utilized IC / Part: TEA1755 Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
TEA1792DB1074,598 | NXP USA Inc. |
![]() Packaging: Bulk Type: Power Management Utilized IC / Part: TEA1792 Supplied Contents: Board(s) Part Status: Active Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
TEA1833DB1361UL | NXP USA Inc. |
![]() Packaging: Bulk Voltage - Output: 19.5V Voltage - Input: 90 ~ 264 VAC Regulator Topology: Flyback Board Type: Fully Populated Utilized IC / Part: TEA1833 Supplied Contents: Board(s) Main Purpose: AC/DC, Primary Side Outputs and Type: 1 Non-Isolated Output Part Status: Active Power - Output: 45W Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
TEA1836DB1200UL | NXP USA Inc. |
![]() Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1892, TEA18362 Supplied Contents: Board(s) Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. |
MC32PF1550A6EPR2 |
Виробник: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товару немає в наявності
В кошику
од. на суму грн.
MC56F8335VFGER |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 128LQFP
Description: IC MCU 16BIT 64KB FLASH 128LQFP
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MC908AS60ACFUER |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 52
DigiKey Programmable: Not Verified
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MC9S08PA4AVSC |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
на замовлення 2254 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 88.33 грн |
10+ | 61.55 грн |
98+ | 49.33 грн |
196+ | 44.05 грн |
294+ | 42.92 грн |
588+ | 41.27 грн |
1078+ | 39.41 грн |
MC9S08PA4AVTJ |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 4
DigiKey Programmable: Not Verified
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MF0UL2101DUD2A |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
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MF1P2121DA4/02BJ |
Виробник: NXP USA Inc.
Description: CLHW
Description: CLHW
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MF1P2121DA6/02BJ |
Виробник: NXP USA Inc.
Description: CLHW
Description: CLHW
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MF1P2121DUD/02BV |
Виробник: NXP USA Inc.
Description: CLHW
Description: CLHW
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MF1P2121DUF/02BV |
Виробник: NXP USA Inc.
Description: CLHW
Description: CLHW
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MF1S5001XDUD2/V1A |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Part Status: Not For New Designs
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Part Status: Not For New Designs
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MF1S5031XDUD2/V1A |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
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MHT2012NT1 |
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Виробник: NXP USA Inc.
Description: RF LDMOS POWER AMPLIFIER FOR CON
Packaging: Tape & Reel (TR)
Part Status: Active
Description: RF LDMOS POWER AMPLIFIER FOR CON
Packaging: Tape & Reel (TR)
Part Status: Active
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MIMXRT1020-EVK |
Виробник: NXP USA Inc.
Description: I.MX RT1020 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1020
Part Status: Active
Description: I.MX RT1020 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1020
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5169.02 грн |
10+ | 4965.90 грн |
MMA2631NKGCWR2 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 312G PCM 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±312g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 1.64
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 312G PCM 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±312g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 1.64
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MMA5124LCWR2 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±240g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 2
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±240g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 2
Grade: Automotive
Qualification: AEC-Q100
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MMA5148LCWR2 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 480G PCM/SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±480g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 1
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 480G PCM/SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: Z
Acceleration Range: ±480g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 1
Grade: Automotive
Qualification: AEC-Q100
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MMA6519KCWR2 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 80G SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
Description: ACCELEROMETER 80G SPI 16QFN
Packaging: Tape & Reel (TR)
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y
Acceleration Range: ±80g
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 24
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MMA6525KCWR2 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Description: ACCELEROMETER 105G SPI 16QFN
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MMA6555KCWR2 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Description: ACCELEROMETER 105G SPI 16QFN
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MMA6813KCWR2 |
Виробник: NXP USA Inc.
Description: XTRINSIC 10 BITS SPI ACCELEROMET
Packaging: Tape & Reel (TR)
Part Status: Active
Description: XTRINSIC 10 BITS SPI ACCELEROMET
Packaging: Tape & Reel (TR)
Part Status: Active
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MRF1K50H-TF5 |
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Виробник: NXP USA Inc.
Description: MRF1K50H REF BRD 13.56MHZ 1500W
Description: MRF1K50H REF BRD 13.56MHZ 1500W
на замовлення 1 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
MRF24301HR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS NI780
Packaging: Tube
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Description: RF MOSFET LDMOS NI780
Packaging: Tube
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
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MRF300AN |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Frequency: 27MHz ~ 250MHz
Power - Output: 300W
Gain: 28dB
Technology: LDMOS
Supplier Device Package: TO-247
Part Status: Active
Voltage - Test: 50 V
Description: RF MOSFET LDMOS 50V TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Frequency: 27MHz ~ 250MHz
Power - Output: 300W
Gain: 28dB
Technology: LDMOS
Supplier Device Package: TO-247
Part Status: Active
Voltage - Test: 50 V
на замовлення 16 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3995.01 грн |
10+ | 3170.66 грн |
MRF300BN |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Frequency: 27MHz ~ 250MHz
Power - Output: 300W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: TO-247
Part Status: Active
Voltage - Test: 50 V
Description: RF MOSFET LDMOS 50V TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Frequency: 27MHz ~ 250MHz
Power - Output: 300W
Gain: 18.7dB
Technology: LDMOS
Supplier Device Package: TO-247
Part Status: Active
Voltage - Test: 50 V
на замовлення 182 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3955.66 грн |
10+ | 3138.34 грн |
30+ | 2942.19 грн |
120+ | 2596.89 грн |
MWCT1014SFVLH |
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Виробник: NXP USA Inc.
Description: WCT1014SF 64 LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: General Purpose
Supplier Device Package: 64-LQFP (10x10)
Description: WCT1014SF 64 LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: General Purpose
Supplier Device Package: 64-LQFP (10x10)
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NCF29A7EHN3/0200IY |
Виробник: NXP USA Inc.
Description: TOKEN PLUS
Description: TOKEN PLUS
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NCF29A7EHN4/0200IY |
Виробник: NXP USA Inc.
Description: TOKEN PLUS
Description: TOKEN PLUS
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NCF29A7VHN3/0200IY |
Виробник: NXP USA Inc.
Description: TOKEN PLUS
Description: TOKEN PLUS
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NT4H1321G0DUD/06BV |
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Виробник: NXP USA Inc.
Description: IC RFID READER/TRAN 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, NFC
Supplier Device Package: Die
Description: IC RFID READER/TRAN 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, NFC
Supplier Device Package: Die
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NTB0101GS1XL |
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Виробник: NXP USA Inc.
Description: IC PWR 1BIT BIDIRECTION 6X2SON
Description: IC PWR 1BIT BIDIRECTION 6X2SON
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NX20P3483UKZ |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH 1:1 42WLCSP
Description: IC PWR SWITCH 1:1 42WLCSP
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NX30P6093UKAZ |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage, UVLO
Part Status: Active
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Packaging: Tape & Reel (TR)
Features: Slew Rate Controlled
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage, UVLO
Part Status: Active
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NXQ1TXH5DB1402UL |
Виробник: NXP USA Inc.
Description: NXQ1TXH5 DEMOBOARD 1401
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: NXQ1TXH5
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Description: NXQ1TXH5 DEMOBOARD 1401
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Utilized IC / Part: NXQ1TXH5
Supplied Contents: Board(s)
Primary Attributes: Transmitter
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PCF7900NHN/C0K/UZ |
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Виробник: NXP USA Inc.
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
6000+ | 99.28 грн |
PCF7900VHN/C0L/UZ |
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Виробник: NXP USA Inc.
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
Part Status: Active
DigiKey Programmable: Not Verified
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QN9083DUKZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
Part Status: Active
DigiKey Programmable: Not Verified
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S912ZVL12F0MLF |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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S912ZVL12F0MLFR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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SL2ICS5301EW/V7:00 |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Standards: EPC, ISO 15693
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Standards: EPC, ISO 15693
Supplier Device Package: Die
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SP03245-01UL |
Виробник: NXP USA Inc.
Description: SP03245-01
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: SP03245-01
Packaging: Bulk
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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SP05127-02UL |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1936X
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR TEA1936X
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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SP05145-02UL |
Виробник: NXP USA Inc.
Description: SP05145-02
Description: SP05145-02
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SP5746BBK1AMMH6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
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SP5746BTK1AVMH6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
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SP5746CSK1AVKU6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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SP5747CFK0AVMJ6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 256MAPBGA
Description: IC MCU 32BIT 4MB FLASH 256MAPBGA
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SPC5777CDK3MME4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 57 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5205.96 грн |
10+ | 4152.10 грн |
25+ | 3937.09 грн |
TEA1716DB1255UL |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1716
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1716
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR TEA1716
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1716
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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TEA1721ADB1102UL |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR TEA1721
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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TEA1733T/DB/65W,59 |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1733
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1733
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR TEA1733
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1733
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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TEA1738DB01/65W/SL |
Виробник: NXP USA Inc.
Description: TEA1738 DEMOBOARD 01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1738
Supplied Contents: Board(s)
Contents: Board(s)
Description: TEA1738 DEMOBOARD 01
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1738
Supplied Contents: Board(s)
Contents: Board(s)
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TEA1751T/1791/DB/9 |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1751
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1751
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR TEA1751
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1751
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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TEA1752T/1791/DB/9 |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1752
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1752
Supplied Contents: Board(s)
Contents: Board(s)
Description: EVAL BOARD FOR TEA1752
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1752
Supplied Contents: Board(s)
Contents: Board(s)
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TEA1755DB1100UL |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1755
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1755
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR TEA1755
Packaging: Bulk
Function: Power Factor Correction
Type: Power Management
Utilized IC / Part: TEA1755
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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TEA1792DB1074,598 |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1792
Packaging: Bulk
Type: Power Management
Utilized IC / Part: TEA1792
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR TEA1792
Packaging: Bulk
Type: Power Management
Utilized IC / Part: TEA1792
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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TEA1833DB1361UL |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1833
Packaging: Bulk
Voltage - Output: 19.5V
Voltage - Input: 90 ~ 264 VAC
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1833
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 45W
Contents: Board(s)
Description: EVAL BOARD FOR TEA1833
Packaging: Bulk
Voltage - Output: 19.5V
Voltage - Input: 90 ~ 264 VAC
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1833
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 45W
Contents: Board(s)
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TEA1836DB1200UL |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TEA1892 TEA18362
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1892, TEA18362
Supplied Contents: Board(s)
Contents: Board(s)
Description: EVAL BOARD FOR TEA1892 TEA18362
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1892, TEA18362
Supplied Contents: Board(s)
Contents: Board(s)
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