Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (37075) > Сторінка 318 з 618

Виробник: NXP USA Inc.
Description: IC TRANSMITTER UHF 16HVQFN
Packaging: Cut Tape (CT)
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 9x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: I.MX RT1015 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1015
Part Status: Active

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 34WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 34-XFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.5GHz
Memory Size: 96kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 10mA
Supplier Device Package: 34-WLCSP (2.87x2.45)
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 34WLCSP
Packaging: Cut Tape (CT)
Package / Case: 34-XFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.5GHz
Memory Size: 96kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 10mA
Supplier Device Package: 34-WLCSP (2.87x2.45)
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 42VFBGA
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 42-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 34
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 42-VFBGA (2.6x3)
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 42VFBGA
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 42-VFBGA
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 34
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 42-VFBGA (2.6x3)
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC USB TVS D+/- PROTECTION WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Technology: Internal Switch
Voltage - Clamping: 28V
Supplier Device Package: 12-WLCSP (1.67x1.27)
Part Status: Active
Number of Circuits: 2

Виробник: NXP USA Inc.
Description: EVAL BOARD FOR SJA1124
Packaging: Bulk
Function: LIN
Type: Interface
Contents: Board(s)
Utilized IC / Part: SJA1124
Supplied Contents: Board(s)
Primary Attributes: 4-Channel (Quad)
Secondary Attributes: On-Board LEDs
Part Status: Active

Виробник: NXP USA Inc.
Description: EVAL BRD FOR FS8400 FS8500 KL25Z
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS8400, FS8500, KL25Z
Supplied Contents: Board(s), Cable(s), Accessories
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Part Status: Active

Виробник: NXP USA Inc.
Description: EVAL BRD FOR FS8400 FS8500 KL25Z
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS8400, FS8500, KL25Z
Supplied Contents: Board(s), Cable(s), Accessories
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Part Status: Active

Виробник: NXP USA Inc.
Description: EVAL BRD FOR FS8400 FS8500 KL25Z
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS8400, FS8500, KL25Z
Supplied Contents: Board(s), Cable(s), Accessories
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Part Status: Active

Виробник: NXP USA Inc.
Description: EVAL BD FOR KL1X KL2X MC33GD3100
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: KL1x, KL2x, MC33GD3100
Supplied Contents: Board(s)
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 137
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 137
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 137
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC54S018M EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: LPC54S018M
Platform: LPCXpresso™

Виробник: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 20WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 8.95mOhm
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 8A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage, UVLO
Part Status: Active

Виробник: NXP USA Inc.
Description: IC USB SW 42-WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 28mOhm
Voltage - Load: 2.8V ~ 20V
Current - Output (Max): 5A
Ratio - Input:Output: 1:1
Supplier Device Package: 42-WLCSP (2.91x2.51)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active

Виробник: NXP USA Inc.
Description: IC USB SW 42-WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 28mOhm
Voltage - Load: 2.8V ~ 20V
Current - Output (Max): 5A
Ratio - Input:Output: 1:1
Supplier Device Package: 42-WLCSP (2.91x2.51)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Part Status: Active

Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8M MINI
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Industrial, IoT
Supplier Device Package: 56-HVQFN (8x8)

Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8M MINI
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Industrial, IoT
Supplier Device Package: 56-HVQFN (8x8)

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HWQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC PWR MGMT I.MX35/51 186BGA
Packaging: Cut Tape (CT)
Package / Case: 186-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 186-PBGA (12x12)
Part Status: Active

Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC SMART CARD READER 64HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART, USB
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Controller Series: PN7412
Program Memory Type: FLASH (160kB)
Applications: NFC Microcontrollers
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 64-HVQFN (9x9)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC SMART CARD READER 64HVQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART, USB
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Controller Series: PN7412
Program Memory Type: FLASH (160kB)
Applications: NFC Microcontrollers
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 64-HVQFN (9x9)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC SMART CARD READER 64HVQFN
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SO
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 6.5V
Supplier Device Package: 28-SO
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO220-3
Packaging: Bulk
Package / Case: TO-220-3
Current Rating (Amps): 10µA
Mounting Type: Through Hole
Frequency: 1.8MHz ~ 250MHz
Power - Output: 115W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-220-3
Part Status: Obsolete
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA

Виробник: NXP USA Inc.
Description: LS1046A EVAL BRD WITH CHASSIS

Виробник: NXP USA Inc.
Description: LS1046A EVAL BRD WITHOUT CHASSIS
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A72
Utilized IC / Part: LS1046A
Platform: Layerscape LS1046A Freeway

Виробник: NXP USA Inc.
Description: IC MPU I.MX7ULP 720MHZ
Packaging: Tray
Speed: 720MHz
Operating Temperature: 0°C ~ 95°C
Core Processor: ARM® Cortex®-A7
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces: FlexIO, GPIO, I2C, I2S, SPI, UART

Виробник: NXP USA Inc.
Description: IC I.MX 7ULP VFBGA 361

Виробник: NXP USA Inc.
Description: IC I.MX 7ULP VFBGA 361

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: IC MEDIA PROCESSOR

Виробник: NXP USA Inc.
Description: DEMO PCF8885 PCF8536 PCA8886
Packaging: Box
Interface: I2C, Serial
Voltage - Supply: 3.3V, 5V
Sensor Type: Proximity/Touch
Utilized IC / Part: PCF8885, PCF8886
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Sensing Range: 4 Buttons/Keys, Scroll Wheel, Slider
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: FLEX BOARD ADD-ON
Packaging: Box
Sensor Type: Touch, Capacitive
Utilized IC / Part: PCA8886, PCF8885
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Sensing Range: 4 Buttons/Keys, Scroll Wheel, Slider
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: MRF24G300HS REF BRD 2500MHZ 330W

Виробник: NXP USA Inc.
Description: IC AUDIO AMP D 48-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 48-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Max Output Power x Channels @ Load: 5.6W x 1 @ 8Ohm, 7W x 1 @ 6Ohm, 9.5W x 1 4Ohm
Supplier Device Package: 48-WLCSP (2.51x3.55)
Part Status: Obsolete

Виробник: NXP USA Inc.
Description: EVAL BOARD I.MX 8M
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-A53, Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8M
Part Status: Active