Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36249) > Сторінка 316 з 605
| Фото | Назва | Виробник | Інформація |
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MC33975ATEKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICPackaging: Cut Tape (CT) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Applications: Switch Monitoring Supplier Device Package: 32-SOIC-EP Part Status: Active |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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S9S12XS128J1CALR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP |
на замовлення 420 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||||
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TJA1029TK/20/1J | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8HVSONPackaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 18V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 175 mV Part Status: Active |
на замовлення 8681 шт: термін постачання 21-31 дні (днів) |
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TJA1029TK,118 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8HVSONPackaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 18V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 175 mV Part Status: Active |
на замовлення 4880 шт: термін постачання 21-31 дні (днів) |
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TEA19161T/2Y | NXP USA Inc. |
Description: IC PFC CTRLR DCM 500KHZ 16SOPackaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Voltage - Input: 18.3V ~ 19.8V Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 10.6V ~ 11.4V Applications: Power Supply Controller, Notebook Computers Supplier Device Package: 16-SO Part Status: Active Current - Supply: 5.6 mA DigiKey Programmable: Not Verified |
на замовлення 8806 шт: термін постачання 21-31 дні (днів) |
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MC33689DPEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICPackaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Mirror Control Supplier Device Package: 32-SOIC Part Status: Active Grade: Automotive |
на замовлення 377 шт: термін постачання 21-31 дні (днів) |
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TDF8590TH/N1TJ | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 160W 24HSOPPackaging: Cut Tape (CT) Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: ±14V ~ 29V Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm Supplier Device Package: 24-HSOP Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34674CEPR2 | NXP USA Inc. |
Description: IC BATT CHG LI-ION 1CELL 8UDFNPackaging: Cut Tape (CT) Package / Case: 8-UFDFN Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Battery Chemistry: Lithium Ion/Polymer Supplier Device Package: 8-UDFN (3x2) Charge Current - Max: 650mA Programmable Features: Timer Fault Protection: Over Voltage Voltage - Supply (Max): 10V Battery Pack Voltage: 4.2V Current - Charging: Constant - Programmable Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PCF7941ATSM2AB120, | NXP USA Inc. |
Description: IC REMOTE KEYLESS ENTRY 20SSOPPackaging: Cut Tape (CT) Part Status: Active Features: PLL Frequency Synthesizer and PA Modulation or Protocol: ASK, FSK, UHF Voltage - Supply: 2.1V ~ 3.6V Applications: General Purpose Data Rate (Max): 4.8kbps DigiKey Programmable: Not Verified Frequency: 315MHz, 434MHz, 868MHz Data Interface: RS232 Power - Output: 9.8dBm Antenna Connector: Not Included |
на замовлення 8938 шт: термін постачання 21-31 дні (днів) |
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TJA1022T,118 | NXP USA Inc. |
Description: IC TRANSCEIVER 2/2 14SOPackaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 18V Number of Drivers/Receivers: 2/2 Data Rate: 20kBd Protocol: LINbus Supplier Device Package: 14-SO Receiver Hysteresis: 175 mV Part Status: Active |
на замовлення 6709 шт: термін постачання 21-31 дні (днів) |
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TJA1028TK/5V0/20:1 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONPackaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 200 mV Duplex: Half Part Status: Active |
на замовлення 1370 шт: термін постачання 21-31 дні (днів) |
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AFM906NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 10.8V 16DFNPackaging: Cut Tape (CT) Package / Case: 16-VDFN Exposed Pad Current Rating (Amps): 2µA Mounting Type: Surface Mount Frequency: 136MHz ~ 941MHz Power - Output: 6.8W Technology: LDMOS Supplier Device Package: 16-DFN (4x6) Part Status: Active Voltage - Rated: 30 V Voltage - Test: 10.8 V Current - Test: 100 mA |
на замовлення 205 шт: термін постачання 21-31 дні (днів) |
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BGS8H2X | NXP USA Inc. |
Description: IC AMP CELL 2.3GHZ-2.69GHZ 6XSONPackaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.69GHz RF Type: Cellular Voltage - Supply: 1.5V ~ 3.1V Gain: 12.5dB Current - Supply: 5.8mA Noise Figure: 1dB Test Frequency: 2.3GHz Supplier Device Package: 6-XSON (1.1x0.7) |
на замовлення 4354 шт: термін постачання 21-31 дні (днів) |
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TEA1713T/N2,518 | NXP USA Inc. |
Description: IC PFC CTRLR DCM 500KHZ 24SOPackaging: Cut Tape (CT) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Voltage - Supply: 70 ~ 276 VAC Frequency - Switching: 500kHz Mode: Discontinuous Conduction (DCM) Supplier Device Package: 24-SO Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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BGU8M1X | NXP USA Inc. |
Description: IC AMP LTE 1.805-2.17GHZ 6XSONPackaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 1.805GHz ~ 2.17GHz RF Type: LTE, WiMax Voltage - Supply: 1.5V ~ 3.1V Gain: 13.5dB Current - Supply: 5mA Noise Figure: 0.8dB Test Frequency: 1.842GHz Supplier Device Package: 6-XSON (1.1x0.7) Part Status: Active |
на замовлення 1370 шт: термін постачання 21-31 дні (днів) |
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TJA1029T/20/1J | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 18V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO Receiver Hysteresis: 175 mV Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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TJA1029T,118 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 5V ~ 18V Number of Drivers/Receivers: 1/1 Protocol: LINbus Supplier Device Package: 8-SO Receiver Hysteresis: 175 mV Part Status: Active |
на замовлення 2069 шт: термін постачання 21-31 дні (днів) |
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TEA19162T/2J | NXP USA Inc. |
Description: IC PFC CTRLR DCM 134KHZ 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Voltage - Supply: 70 ~ 276 VAC Frequency - Switching: 134kHz Mode: Discontinuous Conduction (DCM) Supplier Device Package: 8-SO Part Status: Active Current - Startup: 800 µA |
на замовлення 4845 шт: термін постачання 21-31 дні (днів) |
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BF513,215 | NXP USA Inc. |
Description: RF MOSFET JFET 10V SOT23Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 100MHz Configuration: N-Channel Technology: JFET Noise Figure: 1.5dB Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Voltage - Rated: 20 V Voltage - Test: 10 V Current - Test: 5 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MP3V5050GC6T1 | NXP USA Inc. |
Description: SENSOR 7.25PSIG 0.13" 2.82VPackaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 8-SMD, Gull Wing, Top Port Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.06 V ~ 2.82 V Operating Pressure: 7.25PSI (50kPa) Pressure Type: Vented Gauge Accuracy: ±2.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 2.7V ~ 3.3V Port Size: Male - 0.13" (3.17mm) Tube, Dual Applications: Board Mount Port Style: Barbless Maximum Pressure: 29.01PSI (200kPa) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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HTMS8001FTB/AF,115 | NXP USA Inc. |
Description: RFID TAG R/W 100-150KHZ ENCAPPackaging: Cut Tape (CT) Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Style: Encapsulated Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Technology: Passive Standards: ISO 11784, ISO 11785 Writable Memory: 1.76kb (User) |
на замовлення 4897 шт: термін постачання 21-31 дні (днів) |
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TEA1738T/N1,118 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 80% Frequency - Switching: 26.5kHz ~ 78kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12V ~ 30V Supplier Device Package: 8-SO Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage Voltage - Start Up: 20.6 V Part Status: Active Power (Watts): 75 W |
на замовлення 1371 шт: термін постачання 21-31 дні (днів) |
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SL2S1512FTBX | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 3XSONPackaging: Cut Tape (CT) Package / Case: 3-XDFN Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 1.7V Standards: ISO 18000-6, EPC Supplier Device Package: 3-XSON (1x1.45) Part Status: Active |
на замовлення 9695 шт: термін постачання 21-31 дні (днів) |
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BAP70AM,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 300MW 6TSSOP |
на замовлення 588 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||||
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BB156,115 | NXP USA Inc. |
Description: DIODE VAR CAP 10V 20MA SOD323Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz Capacitance Ratio Condition: C1/C7.5 Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 10 V Capacitance Ratio: 3.9 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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TEA1731LTS/1,115 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK SC74 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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BAP50LX,315 | NXP USA Inc. |
Description: RF DIODE PIN 50V 150MW SOD2Packaging: Cut Tape (CT) Package / Case: SOD-882 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Resistance @ If, F: 3Ohm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: SOD2 Current - Max: 50 mA Power Dissipation (Max): 150 mW |
на замовлення 7720 шт: термін постачання 21-31 дні (днів) |
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BAP70-04W,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 260MW SC-70Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Diode Type: PIN - 1 Pair Series Connection Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: SC-70 Part Status: Obsolete Current - Max: 100 mA Power Dissipation (Max): 260 mW |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC9S08PL4CTG | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 3957 шт: термін постачання 21-31 дні (днів) |
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MC9S08PL60CQH | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFPPackaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 57 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC9S08PL8CTG | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC9S08PL16CTG | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC9S08PL16CTJ | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOPPackaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 10x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
на замовлення 868 шт: термін постачання 21-31 дні (днів) |
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SPC5775BDK3MME2 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416MAPBGAPackaging: Tray Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 220MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 40x12b eQADCx2 Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 416-MAPBGA (27x27) Part Status: Active Number of I/O: 293 DigiKey Programmable: Not Verified |
на замовлення 167 шт: термін постачання 21-31 дні (днів) |
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MPC5775BE-416DS | NXP USA Inc. |
Description: MPC5775E EVAL BRD ADAPTERPackaging: Bulk Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5775B, MPC5775E Part Status: Active Mounting Type: Socket |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| TEA19051BABTK/1J | NXP USA Inc. |
Description: IC SMPS CTRLR SMART CHRG HVSON16Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| TEA19051BACTK/1J | NXP USA Inc. |
Description: IC SMPS CTRLR SMART CHRG HVSON16Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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TEA19051BAFTK/1J | NXP USA Inc. |
Description: IC SMPS CTRLR SMART CHRG HVSON16Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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FRDM33771BSPIEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC33771Packaging: Bulk Function: Battery Cell Controller Type: Power Management Utilized IC / Part: MC33771 Supplied Contents: Board(s) Primary Attributes: 14-Channel Part Status: Active Contents: Board(s) Secondary Attributes: On-Board LEDs |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| K32W032S1M2CAVAR | NXP USA Inc. |
Description: MCU KINETIS BT5/FSK WLCSP Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 1.25MB (1.25M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D - 12bit; D/A - 12bit Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Supplier Device Package: 191-WLCSP (5.97x5.85) Number of I/O: 104 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| SAF7730HV/N231D,51 | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFPPackaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Type: Car Signal Processor Operating Temperature: -40°C ~ 85°C (TA) Clock Rate: 400MHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| SAF7730HV/N231D,55 | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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SPC5744PK1MLQ5 | NXP USA Inc. | Description: IC MCU 32BIT 2.5MB FLASH 144LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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SPC5744PK1MLQ5R | NXP USA Inc. | Description: IC MCU 32BIT 2.5MB FLASH 144LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1550A7EP | NXP USA Inc. |
Description: PF1550Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1550A7EPR2 | NXP USA Inc. |
Description: PF1550Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC32PF1510A1EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC32PF1510A3EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1510A4EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1510A6EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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FRDM-PF1550EVM | NXP USA Inc. |
Description: EVAL BOARD FOR PF1550Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: PF1550 Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU, 32-Bit Contents: Board(s), Cable(s) Secondary Attributes: On-Board Test Points |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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MC32PF1510A1EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
на замовлення 4682 шт: термін постачання 21-31 дні (днів) |
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MC32PF1510A3EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
на замовлення 3320 шт: термін постачання 21-31 дні (днів) |
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MC34PF1510A4EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1510A6EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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MC32PF1550A1EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
на замовлення 4759 шт: термін постачання 21-31 дні (днів) |
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MC32PF1550A3EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1550A1EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
|
MC34PF1550A4EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MWCT1003AVLHR | NXP USA Inc. |
Description: 5W MULTI-COIL AUTO 5V PREMIUMPackaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.7V ~ 3.6V Applications: Wireless Power Transmitter Supplier Device Package: 64-LQFP (10x10) |
товару немає в наявності |
В кошику од. на суму грн. |
| MC33975ATEKR2 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 507.41 грн |
| S9S12XS128J1CALR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Description: IC MCU 16BIT 128KB FLASH 112LQFP
на замовлення 420 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| TJA1029TK/20/1J |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
на замовлення 8681 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 60.06 грн |
| 10+ | 40.63 грн |
| 25+ | 38.85 грн |
| 100+ | 34.81 грн |
| 250+ | 33.14 грн |
| 500+ | 32.13 грн |
| 1000+ | 29.61 грн |
| TJA1029TK,118 |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Part Status: Active
на замовлення 4880 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 88.55 грн |
| 10+ | 76.22 грн |
| 25+ | 72.37 грн |
| 100+ | 55.77 грн |
| 250+ | 52.13 грн |
| 500+ | 46.07 грн |
| 1000+ | 35.77 грн |
| 2500+ | 33.39 грн |
| TEA19161T/2Y |
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Виробник: NXP USA Inc.
Description: IC PFC CTRLR DCM 500KHZ 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 18.3V ~ 19.8V
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10.6V ~ 11.4V
Applications: Power Supply Controller, Notebook Computers
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 5.6 mA
DigiKey Programmable: Not Verified
Description: IC PFC CTRLR DCM 500KHZ 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 18.3V ~ 19.8V
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10.6V ~ 11.4V
Applications: Power Supply Controller, Notebook Computers
Supplier Device Package: 16-SO
Part Status: Active
Current - Supply: 5.6 mA
DigiKey Programmable: Not Verified
на замовлення 8806 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 163.23 грн |
| 10+ | 116.56 грн |
| 25+ | 106.32 грн |
| 100+ | 89.27 грн |
| 250+ | 84.26 грн |
| 500+ | 81.24 грн |
| 1000+ | 77.46 грн |
| MC33689DPEWR2 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Part Status: Active
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Part Status: Active
Grade: Automotive
на замовлення 377 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 447.35 грн |
| 10+ | 386.74 грн |
| 25+ | 365.60 грн |
| 100+ | 297.37 грн |
| 250+ | 282.12 грн |
| TDF8590TH/N1TJ |
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Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 160W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±14V ~ 29V
Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
Description: IC AMP D MONO/STEREO 160W 24HSOP
Packaging: Cut Tape (CT)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: ±14V ~ 29V
Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm
Supplier Device Package: 24-HSOP
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MC34674CEPR2 |
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Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 650mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Part Status: Obsolete
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 650mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| PCF7941ATSM2AB120, |
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Виробник: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 20SSOP
Packaging: Cut Tape (CT)
Part Status: Active
Features: PLL Frequency Synthesizer and PA
Modulation or Protocol: ASK, FSK, UHF
Voltage - Supply: 2.1V ~ 3.6V
Applications: General Purpose
Data Rate (Max): 4.8kbps
DigiKey Programmable: Not Verified
Frequency: 315MHz, 434MHz, 868MHz
Data Interface: RS232
Power - Output: 9.8dBm
Antenna Connector: Not Included
Description: IC REMOTE KEYLESS ENTRY 20SSOP
Packaging: Cut Tape (CT)
Part Status: Active
Features: PLL Frequency Synthesizer and PA
Modulation or Protocol: ASK, FSK, UHF
Voltage - Supply: 2.1V ~ 3.6V
Applications: General Purpose
Data Rate (Max): 4.8kbps
DigiKey Programmable: Not Verified
Frequency: 315MHz, 434MHz, 868MHz
Data Interface: RS232
Power - Output: 9.8dBm
Antenna Connector: Not Included
на замовлення 8938 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 380.37 грн |
| 10+ | 280.57 грн |
| 25+ | 259.15 грн |
| 100+ | 221.04 грн |
| 250+ | 210.48 грн |
| 500+ | 204.11 грн |
| TJA1022T,118 |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 175 mV
Part Status: Active
Description: IC TRANSCEIVER 2/2 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 2/2
Data Rate: 20kBd
Protocol: LINbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 175 mV
Part Status: Active
на замовлення 6709 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 81.62 грн |
| 10+ | 74.15 грн |
| 25+ | 72.90 грн |
| 100+ | 66.64 грн |
| 250+ | 62.47 грн |
| 500+ | 60.09 грн |
| 1000+ | 56.88 грн |
| TJA1028TK/5V0/20:1 |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
на замовлення 1370 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 125.51 грн |
| 10+ | 88.60 грн |
| 25+ | 80.58 грн |
| 100+ | 67.31 грн |
| 250+ | 63.35 грн |
| 500+ | 60.96 грн |
| AFM906NT1 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 2µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 6.8W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 2µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 6.8W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
на замовлення 205 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 224.06 грн |
| 10+ | 162.30 грн |
| 25+ | 148.88 грн |
| 100+ | 125.86 грн |
| BGS8H2X |
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Виробник: NXP USA Inc.
Description: IC AMP CELL 2.3GHZ-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 12.5dB
Current - Supply: 5.8mA
Noise Figure: 1dB
Test Frequency: 2.3GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Description: IC AMP CELL 2.3GHZ-2.69GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.69GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 12.5dB
Current - Supply: 5.8mA
Noise Figure: 1dB
Test Frequency: 2.3GHz
Supplier Device Package: 6-XSON (1.1x0.7)
на замовлення 4354 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 46.97 грн |
| 10+ | 40.19 грн |
| 25+ | 36.30 грн |
| 100+ | 29.81 грн |
| 250+ | 26.15 грн |
| 500+ | 23.11 грн |
| 1000+ | 17.95 грн |
| TEA1713T/N2,518 |
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Виробник: NXP USA Inc.
Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 247.93 грн |
| 10+ | 179.65 грн |
| BGU8M1X |
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Виробник: NXP USA Inc.
Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13.5dB
Current - Supply: 5mA
Noise Figure: 0.8dB
Test Frequency: 1.842GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Description: IC AMP LTE 1.805-2.17GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: LTE, WiMax
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13.5dB
Current - Supply: 5mA
Noise Figure: 0.8dB
Test Frequency: 1.842GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
на замовлення 1370 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8+ | 40.04 грн |
| 10+ | 34.48 грн |
| 25+ | 31.14 грн |
| 100+ | 25.58 грн |
| 250+ | 22.45 грн |
| 500+ | 19.84 грн |
| 1000+ | 15.40 грн |
| TJA1029T/20/1J |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
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| TJA1029T,118 |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 18V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Part Status: Active
на замовлення 2069 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 92.40 грн |
| 10+ | 79.48 грн |
| 25+ | 75.42 грн |
| 100+ | 58.13 грн |
| 250+ | 54.34 грн |
| 500+ | 48.02 грн |
| 1000+ | 37.29 грн |
| TEA19162T/2J |
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Виробник: NXP USA Inc.
Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Part Status: Active
Current - Startup: 800 µA
Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Part Status: Active
Current - Startup: 800 µA
на замовлення 4845 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 74.69 грн |
| 10+ | 52.12 грн |
| 25+ | 47.13 грн |
| 100+ | 39.06 грн |
| 250+ | 36.59 грн |
| 500+ | 35.11 грн |
| 1000+ | 33.33 грн |
| BF513,215 |
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Виробник: NXP USA Inc.
Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
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| MP3V5050GC6T1 |
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Виробник: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" 2.82V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Description: SENSOR 7.25PSIG 0.13" 2.82V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
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| HTMS8001FTB/AF,115 |
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Виробник: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
на замовлення 4897 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 33.11 грн |
| 11+ | 27.36 грн |
| 25+ | 25.71 грн |
| 100+ | 22.09 грн |
| 250+ | 20.85 грн |
| 500+ | 19.98 грн |
| 1000+ | 18.84 грн |
| TEA1738T/N1,118 |
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Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
на замовлення 1371 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 74.69 грн |
| 10+ | 51.98 грн |
| 25+ | 46.92 грн |
| 100+ | 38.83 грн |
| 250+ | 36.36 грн |
| 500+ | 34.87 грн |
| 1000+ | 33.10 грн |
| SL2S1512FTBX |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
на замовлення 9695 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 12+ | 27.72 грн |
| 13+ | 23.13 грн |
| 25+ | 21.83 грн |
| 100+ | 18.71 грн |
| 250+ | 17.66 грн |
| 500+ | 16.92 грн |
| 1000+ | 15.95 грн |
| BAP70AM,115 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
Description: RF DIODE PIN 50V 300MW 6TSSOP
на замовлення 588 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| BB156,115 |
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Виробник: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
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| TEA1731LTS/1,115 |
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Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Description: IC OFFLINE SWITCH FLYBACK SC74
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| BAP50LX,315 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
на замовлення 7720 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 34+ | 9.24 грн |
| 50+ | 6.01 грн |
| 57+ | 5.28 грн |
| 100+ | 4.19 грн |
| 250+ | 3.83 грн |
| 500+ | 3.61 грн |
| 1000+ | 3.37 грн |
| 2500+ | 3.18 грн |
| 5000+ | 3.07 грн |
| BAP70-04W,115 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
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| MC9S08PL4CTG |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 3957 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 73.15 грн |
| 10+ | 51.01 грн |
| 96+ | 40.80 грн |
| 192+ | 36.39 грн |
| 288+ | 35.43 грн |
| 576+ | 34.03 грн |
| 1056+ | 32.47 грн |
| 2592+ | 31.27 грн |
| MC9S08PL60CQH |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
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| MC9S08PL8CTG |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
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| MC9S08PL16CTG |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
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| MC9S08PL16CTJ |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 868 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 139.36 грн |
| 10+ | 99.21 грн |
| 75+ | 82.50 грн |
| 150+ | 73.78 грн |
| 300+ | 70.78 грн |
| 525+ | 68.75 грн |
| SPC5775BDK3MME2 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
Number of I/O: 293
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
Number of I/O: 293
DigiKey Programmable: Not Verified
на замовлення 167 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2687.20 грн |
| 10+ | 2118.48 грн |
| 25+ | 2052.19 грн |
| MPC5775BE-416DS |
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Виробник: NXP USA Inc.
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 49421.35 грн |
| TEA19051BABTK/1J |
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Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| TEA19051BACTK/1J |
![]() |
Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| TEA19051BAFTK/1J |
![]() |
Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| FRDM33771BSPIEVB |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 16461.98 грн |
| K32W032S1M2CAVAR |
Виробник: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| SAF7730HV/N231D,51 |
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Виробник: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| SAF7730HV/N231D,55 |
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Виробник: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Description: IC HD RADIO PROCESSOR 144HLQFP
товару немає в наявності
В кошику
од. на суму грн.
| SPC5744PK1MLQ5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
товару немає в наявності
В кошику
од. на суму грн.
| SPC5744PK1MLQ5R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
товару немає в наявності
В кошику
од. на суму грн.
| MC34PF1550A7EP |
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Виробник: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товару немає в наявності
В кошику
од. на суму грн.
| MC34PF1550A7EPR2 |
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Виробник: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF1510A1EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF1510A3EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC34PF1510A4EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC34PF1510A6EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 168.25 грн |
| FRDM-PF1550EVM |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 19985.37 грн |
| MC32PF1510A1EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
на замовлення 4682 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 303.37 грн |
| 10+ | 221.40 грн |
| 25+ | 203.66 грн |
| 100+ | 172.87 грн |
| 250+ | 164.17 грн |
| 500+ | 158.92 грн |
| 1000+ | 152.07 грн |
| 2500+ | 147.58 грн |
| MC32PF1510A3EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
на замовлення 3320 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 307.22 грн |
| 10+ | 223.84 грн |
| 25+ | 205.98 грн |
| 100+ | 174.85 грн |
| 250+ | 166.04 грн |
| 500+ | 160.73 грн |
| 1000+ | 153.80 грн |
| 2500+ | 149.59 грн |
| MC34PF1510A4EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MC34PF1510A6EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 310.30 грн |
| 10+ | 227.11 грн |
| 25+ | 209.24 грн |
| 100+ | 177.91 грн |
| 250+ | 169.11 грн |
| 500+ | 163.80 грн |
| 1000+ | 156.82 грн |
| 2500+ | 152.29 грн |
| MC32PF1550A1EPR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
на замовлення 4759 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 394.23 грн |
| 10+ | 340.99 грн |
| 25+ | 322.41 грн |
| 100+ | 262.24 грн |
| 250+ | 248.79 грн |
| 500+ | 223.24 грн |
| 1000+ | 185.19 грн |
| 2500+ | 175.93 грн |
| MC32PF1550A3EPR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товару немає в наявності
В кошику
од. на суму грн.
| MC34PF1550A1EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товару немає в наявності
В кошику
од. на суму грн.
| MC34PF1550A4EPR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| MWCT1003AVLHR |
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Виробник: NXP USA Inc.
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
товару немає в наявності
В кошику
од. на суму грн.






























