Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36395) > Сторінка 316 з 607
| Фото | Назва | Виробник | Інформація |
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FS32R372SEK0MMMT | NXP USA Inc. |
Description: S32R RADAR MICROCONTROLLER - S32 Grade: Automotive DigiKey Programmable: Not Verified Supplier Device Package: 257-LFBGA (14x14) Core Processor: e200z7 Applications: Industrial Radar Program Memory Type: FLASH (1.3MB) Voltage - Supply: 1.19V ~ 1.31V Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1M x 8 Interface: CAN, I2C, LINFlexD, SPI Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| S32R372141EVB | NXP USA Inc. |
Description: S32R372 EVAL BRDPart Status: Active Utilized IC / Part: S32R372 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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S32R372RRSEVB | NXP USA Inc. |
Description: S32R372 EVAL BRDType: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk Utilized IC / Part: S32R372 Contents: Board(s) |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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PN7360AUEV/C300E | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGASupplier Device Package: 64-VFBGA (4.5x4.5) Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC Voltage - Supply: 1.65V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Type: RFID Reader/Transponder Interface: I2C, SPI, USB Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 64-VFBGA Packaging: Tray |
на замовлення 1470 шт: термін постачання 21-31 дні (днів) |
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PN7362AUEV/C300E | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGAPackaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 3.6V Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) Part Status: Active |
на замовлення 581 шт: термін постачання 21-31 дні (днів) |
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PN7462AUEV/C300E | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGAPackaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 3.6V Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
на замовлення 4208 шт: термін постачання 21-31 дні (днів) |
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PNEV7462C | NXP USA Inc. |
Description: EVAL BOARD FOR PN7462Packaging: Bulk For Use With/Related Products: PN7462 Type: Near Field Communication (NFC) Contents: Board(s) Utilized IC / Part: PN7462 Supplied Contents: Board(s) Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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A7101CHUK/T0BC2HAZ | NXP USA Inc. |
Description: SECURITY IC STD TEMP WLCSPDigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 12-WLCSP (2.06x2.02) Core Processor: MX51 Applications: Authentication Voltage - Supply: 2.5V ~ 3.6V Operating Temperature: -25°C ~ 85°C (TA) Interface: I2C Mounting Type: Surface Mount Package / Case: 12-UFBGA, WLCSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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A7102CHUK/T0BC2VAZ | NXP USA Inc. |
Description: SECURITY IC EXT TEMP WLCSPDigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 12-WLCSP (2.06x2.02) Core Processor: MX51 Applications: Authentication Voltage - Supply: 2.5V ~ 3.6V Operating Temperature: -40°C ~ 90°C (TA) Interface: I2C Mounting Type: Surface Mount Package / Case: 12-UFBGA, WLCSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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A7101CHTK2/T0BC2BJ | NXP USA Inc. |
Description: SECURITY IC STD TEMP HVSON8Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 8-HVSON (4x4) Part Status: Last Time Buy DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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A7102CHTK2/T0BC2CJ | NXP USA Inc. |
Description: SECURITY IC EXT TEMP HVSON8DigiKey Programmable: Not Verified Part Status: Last Time Buy Supplier Device Package: 8-HVSON (4x4) Core Processor: MX51 Applications: Authentication Voltage - Supply: 2.5V ~ 3.6V Operating Temperature: -40°C ~ 90°C (TA) Interface: I2C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MF0MOU2101DA8,118 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ PLLMCPackaging: Strip Package / Case: MOA8, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, MIFARE Supplier Device Package: PLLMC Part Status: Active |
на замовлення 19940 шт: термін постачання 21-31 дні (днів) |
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A7101CHUK/T0BC2HAZ | NXP USA Inc. |
Description: SECURITY IC STD TEMP WLCSPDigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 12-WLCSP (2.06x2.02) Core Processor: MX51 Applications: Authentication Voltage - Supply: 2.5V ~ 3.6V Operating Temperature: -25°C ~ 85°C (TA) Interface: I2C Mounting Type: Surface Mount Package / Case: 12-UFBGA, WLCSP Packaging: Cut Tape (CT) |
на замовлення 1136 шт: термін постачання 21-31 дні (днів) |
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A7101CHTK2/T0BC2BJ | NXP USA Inc. |
Description: SECURITY IC STD TEMP HVSON8Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Applications: Authentication Core Processor: MX51 Supplier Device Package: 8-HVSON (4x4) Part Status: Last Time Buy DigiKey Programmable: Not Verified |
на замовлення 4212 шт: термін постачання 21-31 дні (днів) |
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MRFX600HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 65V NI780Packaging: Tape & Reel (TR) Package / Case: NI-780-4 Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.8MHz ~ 400MHz Configuration: Dual Power - Output: 600W Gain: 26.4dB Technology: LDMOS Supplier Device Package: NI-780-4 Voltage - Rated: 179 V Voltage - Test: 65 V Current - Test: 100 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MRFX600HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 65V NI780Packaging: Tape & Reel (TR) Package / Case: NI-780S-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 1.8MHz ~ 400MHz Configuration: Dual Power - Output: 600W Gain: 26.4dB Technology: LDMOS Supplier Device Package: NI-780S-4L Voltage - Rated: 179 V Voltage - Test: 65 V Current - Test: 100 mA |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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MRFX600GSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 65V NI780Packaging: Tape & Reel (TR) Package / Case: NI-780GS-4L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.8MHz ~ 400MHz Configuration: Dual Power - Output: 600W Gain: 26.4dB Technology: LDMOS Supplier Device Package: NI-780GS-4L Voltage - Rated: 179 V Voltage - Test: 65 V Current - Test: 100 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MRFX600HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 65V NI780Current - Test: 100 mA Voltage - Test: 65 V Voltage - Rated: 179 V Supplier Device Package: NI-780-4 Technology: LDMOS Gain: 26.4dB Power - Output: 600W Configuration: Dual Frequency: 1.8MHz ~ 400MHz Mounting Type: Chassis Mount Current Rating (Amps): 10µA Package / Case: NI-780-4 Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MRFX600HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 65V NI780Current - Test: 100 mA Voltage - Test: 65 V Voltage - Rated: 179 V Supplier Device Package: NI-780S-4L Technology: LDMOS Gain: 26.4dB Power - Output: 600W Configuration: Dual Frequency: 1.8MHz ~ 400MHz Mounting Type: Surface Mount Current Rating (Amps): 10µA Package / Case: NI-780S-4L Packaging: Cut Tape (CT) |
на замовлення 89 шт: термін постачання 21-31 дні (днів) |
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MRFX600GSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 65V NI780Current Rating (Amps): 10µA Package / Case: NI-780GS-4L Packaging: Cut Tape (CT) Current - Test: 100 mA Voltage - Test: 65 V Voltage - Rated: 179 V Supplier Device Package: NI-780GS-4L Technology: LDMOS Gain: 26.4dB Power - Output: 600W Configuration: Dual Frequency: 1.8MHz ~ 400MHz Mounting Type: Chassis Mount |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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MRFX1K80GNR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 65V OM1230G-4Packaging: Cut Tape (CT) Package / Case: OM-1230G-4L Mounting Type: Chassis Mount Frequency: 1.8MHz ~ 470MHz Power - Output: 1800W Gain: 24dB Technology: LDMOS Supplier Device Package: OM-1230G-4L Part Status: Active Voltage - Test: 65 V |
на замовлення 70 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1064DVL6A | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 196MAPBGADigiKey Programmable: Not Verified Number of I/O: 127 Supplier Device Package: 196-LFBGA (10x10) Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 20x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) RAM Size: 1M x 8 Program Memory Size: 4MB (4M x 8) Speed: 600MHz Mounting Type: Surface Mount Package / Case: 196-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MIMXRT1064CVL5A | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 196MAPBGADigiKey Programmable: Not Verified Number of I/O: 127 Part Status: Discontinued at Digi-Key Supplier Device Package: 196-LFBGA (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 20x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) RAM Size: 1M x 8 Program Memory Size: 4MB (4M x 8) Speed: 528MHz Mounting Type: Surface Mount Package / Case: 196-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MIMXRT1064-EVK | NXP USA Inc. |
Description: I.MX RT1064 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Board Type: Evaluation Platform Utilized IC / Part: i.MX RT1064 Part Status: Active |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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KITPF8200FRDMEVM | NXP USA Inc. |
Description: EVAL BOARD FOR PF8200Packaging: Bulk Type: Power Management Utilized IC / Part: PF8200 Supplied Contents: Board(s) Primary Attributes: 12-Channel Part Status: Active Contents: Board(s) |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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LX2160A-RDB | NXP USA Inc. |
Description: LX2160A EVAL BRDPart Status: Active Utilized IC / Part: LX2160A Board Type: Evaluation Platform Core Processor: ARM® Cortex®-A72 Contents: Board(s), Cable(s), Accessories Type: MPU Mounting Type: Fixed Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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LX2RDBKIT1-10-40 | NXP USA Inc. |
Description: RDB KIT TXRX CABLES 10GE & 40 GEPackaging: Bulk For Use With/Related Products: LX2160A Accessory Type: Accessory Kit Part Status: Active Utilized IC / Part: LX2160A |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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LX2RDBKIT2-25G | NXP USA Inc. |
Description: RDB KIT TXRX CABLES FOR 25GUtilized IC / Part: LX2160A Part Status: Active Accessory Type: Accessory Kit For Use With/Related Products: LX2160A Packaging: Bulk |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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MC10XS6200BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH 32SOICFeatures: Status Flag Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 9A Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC10XS6225BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH 32SOICFeatures: Status Flag Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm, 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 4.5A, 9A Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MC10XS6325BEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH 32SOICFeatures: Status Flag Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 3 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm, 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 4.5A, 9A Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MC17XS6500CEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32SOICFeatures: Internal PWM Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 17mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC22XS4200CEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32SOICFeatures: Internal PWM, Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 22mOhm Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 4.2A Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC50XS4200CEKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32SOICFeatures: Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 50mOhm Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 1.65A Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC17XS6500CEK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 32SOICFeatures: Internal PWM Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 17mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC25XS6300BEK | NXP USA Inc. |
Description: IC PWR SWITCH HIGH SIDE 32SOICFeatures: Status Flag Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 3 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 4.5A Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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LS1088ARDB-PB | NXP USA Inc. |
Description: LS1088A EVAL BRDPackaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53 Utilized IC / Part: LS1088A |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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MIMX8MD6CVAHZAB | NXP USA Inc. |
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Active |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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MIMX8MD6DVAJZAB | NXP USA Inc. |
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Active |
на замовлення 162 шт: термін постачання 21-31 дні (днів) |
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MIMX8MQ5CVAHZAB | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGAPart Status: Active Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Graphics Acceleration: Yes RAM Controllers: DDR3L, DDR4, LPDDR4 Co-Processors/DSP: ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit USB: USB 3.0 (2) Ethernet: GbE Supplier Device Package: 621-FCPBGA (17x17) Core Processor: ARM® Cortex®-A53 Operating Temperature: -40°C ~ 105°C (TJ) Speed: 1.3GHz Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Packaging: Tray Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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MIMX8MQ5DVAJZAB | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Part Status: Active Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
на замовлення 504 шт: термін постачання 21-31 дні (днів) |
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MIMX8MQ6CVAHZAB | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.3GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Part Status: Active Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
на замовлення 140 шт: термін постачання 21-31 дні (днів) |
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MIMX8MQ6DVAJZAB | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Part Status: Active Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
на замовлення 370 шт: термін постачання 21-31 дні (днів) |
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MC56F82646VLF | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFPPart Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 10x12b Core Processor: 56800EX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (32K x 16) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 48-LQFP DigiKey Programmable: Not Verified Number of I/O: 39 Packaging: Tray |
на замовлення 200 шт: термін постачання 21-31 дні (днів) |
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MC56F82643VLC | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC56F82623VLC | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFPOscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 32KB (16K x 16) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 26 Supplier Device Package: 32-LQFP (7x7) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 6x12b Core Processor: 56800EX Program Memory Type: FLASH |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| NTBMS-FSNXP | NXP USA Inc. |
Description: EVAL BD FS4503C MC33772B S32K144 Packaging: Bulk Function: Battery Monitor, Car Type: Power Management Utilized IC / Part: FS4503C, MC33772B, S32K144 Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active Contents: Board(s) |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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MCIMX6Z0DVM09AB | NXP USA Inc. |
Description: IC MPU I.MX6 900MHZ 289MAPBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 900MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Supplier Device Package: 289-MAPBGA (14x14) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB |
на замовлення 4101 шт: термін постачання 21-31 дні (днів) |
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FS32K116LAT0MFMT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32HVQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 417 шт: термін постачання 21-31 дні (днів) |
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FS32K116LAT0MLFT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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FS32K118LAT0MLFT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 43 DigiKey Programmable: Not Verified |
на замовлення 1157 шт: термін постачання 21-31 дні (днів) |
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FS32K118LAT0MLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 1125 шт: термін постачання 21-31 дні (днів) |
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S32K118EVB-Q064 | NXP USA Inc. |
Description: S32K118 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: S32K118 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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S32K116EVB-Q048 | NXP USA Inc. |
Description: S32K116 EVAL BRD |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||||
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IMXAI2ETH-ATH | NXP USA Inc. |
Description: ENET 1GBPS PHY (STD ENET PHY)Packaging: Bulk For Use With/Related Products: i.MX 6 Accessory Type: Interface Board Utilized IC / Part: i.MX 6 Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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MCIMX8QXP-CPU | NXP USA Inc. |
Description: I.MX 8 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply, Accessories Board Type: Evaluation Platform Utilized IC / Part: i.MX 8 Part Status: Active |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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MCIMX8-8X-BB | NXP USA Inc. |
Description: BASEBRD I.MX 8QUADXPLUS/8QUADMAXPackaging: Bulk For Use With/Related Products: i.MX 8 Accessory Type: Interface Board Utilized IC / Part: i.MX 8 Part Status: Active |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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MX8XMIPI4CAM2 | NXP USA Inc. |
Description: 4 CAMERA BOARD MINISAS OV10635Packaging: Bulk For Use With/Related Products: i.MX 8 Accessory Type: Interface Board Utilized IC / Part: i.MX 8 |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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FS32K146HAT0MMHT | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100MAPBGAPackaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-MAPBGA (11x11) Number of I/O: 89 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MRF101AN | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V TO220-3Packaging: Tube Package / Case: TO-220-3 Current Rating (Amps): 10µA Frequency: 1.8MHz ~ 250MHz Power - Output: 115W Gain: 21.1dB Technology: LDMOS Supplier Device Package: TO-220-3 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 486 шт: термін постачання 21-31 дні (днів) |
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| FS32R372SEK0MMMT |
Виробник: NXP USA Inc.
Description: S32R RADAR MICROCONTROLLER - S32
Grade: Automotive
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Core Processor: e200z7
Applications: Industrial Radar
Program Memory Type: FLASH (1.3MB)
Voltage - Supply: 1.19V ~ 1.31V
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1M x 8
Interface: CAN, I2C, LINFlexD, SPI
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Part Status: Active
Description: S32R RADAR MICROCONTROLLER - S32
Grade: Automotive
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Core Processor: e200z7
Applications: Industrial Radar
Program Memory Type: FLASH (1.3MB)
Voltage - Supply: 1.19V ~ 1.31V
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1M x 8
Interface: CAN, I2C, LINFlexD, SPI
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| S32R372141EVB |
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Виробник: NXP USA Inc.
Description: S32R372 EVAL BRD
Part Status: Active
Utilized IC / Part: S32R372
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: S32R372 EVAL BRD
Part Status: Active
Utilized IC / Part: S32R372
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 30948.71 грн |
| S32R372RRSEVB |
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Виробник: NXP USA Inc.
Description: S32R372 EVAL BRD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: S32R372
Contents: Board(s)
Description: S32R372 EVAL BRD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: S32R372
Contents: Board(s)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 27327.55 грн |
| PN7360AUEV/C300E |
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Виробник: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Supplier Device Package: 64-VFBGA (4.5x4.5)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: RFID Reader/Transponder
Interface: I2C, SPI, USB
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 64-VFBGA
Packaging: Tray
на замовлення 1470 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 623.44 грн |
| 10+ | 521.19 грн |
| 25+ | 493.69 грн |
| 100+ | 427.91 грн |
| 490+ | 392.17 грн |
| 980+ | 378.07 грн |
| 1470+ | 364.13 грн |
| PN7362AUEV/C300E |
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Виробник: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Part Status: Active
на замовлення 581 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 878.19 грн |
| 10+ | 734.97 грн |
| 25+ | 696.49 грн |
| 100+ | 604.08 грн |
| 490+ | 554.05 грн |
| PN7462AUEV/C300E |
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Виробник: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: IC RFID RDR/TRAN 13.56MZ 64VFBGA
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
на замовлення 4208 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 939.90 грн |
| 10+ | 786.39 грн |
| 25+ | 745.37 грн |
| 100+ | 646.65 грн |
| 490+ | 593.31 грн |
| 980+ | 572.25 грн |
| PNEV7462C |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PN7462
Packaging: Bulk
For Use With/Related Products: PN7462
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN7462
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL BOARD FOR PN7462
Packaging: Bulk
For Use With/Related Products: PN7462
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN7462
Supplied Contents: Board(s)
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 14338.24 грн |
| A7101CHUK/T0BC2HAZ |
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Виробник: NXP USA Inc.
Description: SECURITY IC STD TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -25°C ~ 85°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Description: SECURITY IC STD TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -25°C ~ 85°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| A7102CHUK/T0BC2VAZ |
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Виробник: NXP USA Inc.
Description: SECURITY IC EXT TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Description: SECURITY IC EXT TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| A7101CHTK2/T0BC2BJ |
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Виробник: NXP USA Inc.
Description: SECURITY IC STD TEMP HVSON8
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: SECURITY IC STD TEMP HVSON8
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| A7102CHTK2/T0BC2CJ |
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Виробник: NXP USA Inc.
Description: SECURITY IC EXT TEMP HVSON8
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: SECURITY IC EXT TEMP HVSON8
DigiKey Programmable: Not Verified
Part Status: Last Time Buy
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MF0MOU2101DA8,118 |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Strip
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ PLLMC
Packaging: Strip
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: PLLMC
Part Status: Active
на замовлення 19940 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8+ | 43.51 грн |
| 11+ | 29.64 грн |
| 25+ | 26.57 грн |
| 100+ | 21.75 грн |
| 250+ | 20.22 грн |
| 500+ | 19.30 грн |
| 1000+ | 18.24 грн |
| 2500+ | 17.46 грн |
| 5000+ | 16.98 грн |
| A7101CHUK/T0BC2HAZ |
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Виробник: NXP USA Inc.
Description: SECURITY IC STD TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -25°C ~ 85°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Cut Tape (CT)
Description: SECURITY IC STD TEMP WLCSP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 12-WLCSP (2.06x2.02)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -25°C ~ 85°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 12-UFBGA, WLCSP
Packaging: Cut Tape (CT)
на замовлення 1136 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 239.72 грн |
| 10+ | 173.09 грн |
| 25+ | 158.65 грн |
| 100+ | 133.98 грн |
| 250+ | 126.87 грн |
| 500+ | 122.59 грн |
| 1000+ | 117.11 грн |
| A7101CHTK2/T0BC2BJ |
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Виробник: NXP USA Inc.
Description: SECURITY IC STD TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Description: SECURITY IC STD TEMP HVSON8
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 8-HVSON (4x4)
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
на замовлення 4212 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 238.93 грн |
| 10+ | 173.02 грн |
| 25+ | 158.74 грн |
| 100+ | 134.23 грн |
| 250+ | 127.20 грн |
| 500+ | 123.34 грн |
| MRFX600HR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
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| MRFX600HSR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 50+ | 9948.86 грн |
| MRFX600GSR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-4L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 65V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780GS-4L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 400MHz
Configuration: Dual
Power - Output: 600W
Gain: 26.4dB
Technology: LDMOS
Supplier Device Package: NI-780GS-4L
Voltage - Rated: 179 V
Voltage - Test: 65 V
Current - Test: 100 mA
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| MRFX600HR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: NI-780-4
Packaging: Cut Tape (CT)
Description: RF MOSFET LDMOS 65V NI780
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780-4
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Chassis Mount
Current Rating (Amps): 10µA
Package / Case: NI-780-4
Packaging: Cut Tape (CT)
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| MRFX600HSR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780S-4L
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: NI-780S-4L
Packaging: Cut Tape (CT)
Description: RF MOSFET LDMOS 65V NI780
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780S-4L
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: NI-780S-4L
Packaging: Cut Tape (CT)
на замовлення 89 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 12614.30 грн |
| 10+ | 10313.84 грн |
| 25+ | 9856.19 грн |
| MRFX600GSR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V NI780
Current Rating (Amps): 10µA
Package / Case: NI-780GS-4L
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780GS-4L
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Chassis Mount
Description: RF MOSFET LDMOS 65V NI780
Current Rating (Amps): 10µA
Package / Case: NI-780GS-4L
Packaging: Cut Tape (CT)
Current - Test: 100 mA
Voltage - Test: 65 V
Voltage - Rated: 179 V
Supplier Device Package: NI-780GS-4L
Technology: LDMOS
Gain: 26.4dB
Power - Output: 600W
Configuration: Dual
Frequency: 1.8MHz ~ 400MHz
Mounting Type: Chassis Mount
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 12701.33 грн |
| 10+ | 10387.05 грн |
| 25+ | 9926.71 грн |
| MRFX1K80GNR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 65V OM1230G-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Test: 65 V
Description: RF MOSFET LDMOS 65V OM1230G-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Part Status: Active
Voltage - Test: 65 V
на замовлення 70 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 20635.11 грн |
| 10+ | 17811.15 грн |
| MIMXRT1064DVL6A |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
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| MIMXRT1064CVL5A |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Part Status: Discontinued at Digi-Key
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
Description: IC MCU 32BIT 4MB FLASH 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 127
Part Status: Discontinued at Digi-Key
Supplier Device Package: 196-LFBGA (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 1M x 8
Program Memory Size: 4MB (4M x 8)
Speed: 528MHz
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Packaging: Tray
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| MIMXRT1064-EVK |
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Виробник: NXP USA Inc.
Description: I.MX RT1064 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1064
Part Status: Active
Description: I.MX RT1064 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1064
Part Status: Active
на замовлення 59 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 12020.14 грн |
| KITPF8200FRDMEVM |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PF8200
Packaging: Bulk
Type: Power Management
Utilized IC / Part: PF8200
Supplied Contents: Board(s)
Primary Attributes: 12-Channel
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR PF8200
Packaging: Bulk
Type: Power Management
Utilized IC / Part: PF8200
Supplied Contents: Board(s)
Primary Attributes: 12-Channel
Part Status: Active
Contents: Board(s)
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 30028.58 грн |
| LX2160A-RDB |
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Виробник: NXP USA Inc.
Description: LX2160A EVAL BRD
Part Status: Active
Utilized IC / Part: LX2160A
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A72
Contents: Board(s), Cable(s), Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Description: LX2160A EVAL BRD
Part Status: Active
Utilized IC / Part: LX2160A
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-A72
Contents: Board(s), Cable(s), Accessories
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
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| LX2RDBKIT1-10-40 |
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Виробник: NXP USA Inc.
Description: RDB KIT TXRX CABLES 10GE & 40 GE
Packaging: Bulk
For Use With/Related Products: LX2160A
Accessory Type: Accessory Kit
Part Status: Active
Utilized IC / Part: LX2160A
Description: RDB KIT TXRX CABLES 10GE & 40 GE
Packaging: Bulk
For Use With/Related Products: LX2160A
Accessory Type: Accessory Kit
Part Status: Active
Utilized IC / Part: LX2160A
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 13803.42 грн |
| LX2RDBKIT2-25G |
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Виробник: NXP USA Inc.
Description: RDB KIT TXRX CABLES FOR 25G
Utilized IC / Part: LX2160A
Part Status: Active
Accessory Type: Accessory Kit
For Use With/Related Products: LX2160A
Packaging: Bulk
Description: RDB KIT TXRX CABLES FOR 25G
Utilized IC / Part: LX2160A
Part Status: Active
Accessory Type: Accessory Kit
For Use With/Related Products: LX2160A
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 26890.83 грн |
| MC10XS6200BEKR2 |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
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| MC10XS6225BEKR2 |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 314.69 грн |
| MC10XS6325BEKR2 |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A, 9A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 320.65 грн |
| MC17XS6500CEKR2 |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
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| MC22XS4200CEKR2 |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 22mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 22mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Part Status: Obsolete
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| MC50XS4200CEKR2 |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 50mOhm
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
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| MC17XS6500CEK |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:1 32SOIC
Features: Internal PWM
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Part Status: Obsolete
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| MC25XS6300BEK |
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Виробник: NXP USA Inc.
Description: IC PWR SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Description: IC PWR SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
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| LS1088ARDB-PB |
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Виробник: NXP USA Inc.
Description: LS1088A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1088A
Description: LS1088A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1088A
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 180004.56 грн |
| MIMX8MD6CVAHZAB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Description: IC MPU I.MX8MD 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
на замовлення 90 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5405.50 грн |
| 10+ | 4320.94 грн |
| 90+ | 3872.80 грн |
| MIMX8MD6DVAJZAB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Description: IC MPU I.MX8MD 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
на замовлення 162 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4655.20 грн |
| 10+ | 3709.73 грн |
| 90+ | 3318.12 грн |
| MIMX8MQ5CVAHZAB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Part Status: Active
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: GbE
Supplier Device Package: 621-FCPBGA (17x17)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Part Status: Active
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: GbE
Supplier Device Package: 621-FCPBGA (17x17)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TJ)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
на замовлення 25 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5004.90 грн |
| 10+ | 4000.45 грн |
| MIMX8MQ5DVAJZAB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
на замовлення 504 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4655.20 грн |
| 10+ | 3709.73 грн |
| 90+ | 3318.12 грн |
| 180+ | 3037.76 грн |
| MIMX8MQ6CVAHZAB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
на замовлення 140 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5384.65 грн |
| 10+ | 4309.31 грн |
| 90+ | 3865.41 грн |
| MIMX8MQ6DVAJZAB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
на замовлення 370 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4870.40 грн |
| 10+ | 3886.55 грн |
| 90+ | 3479.32 грн |
| 180+ | 3186.04 грн |
| MC56F82646VLF |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (32K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Packaging: Tray
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (32K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Packaging: Tray
на замовлення 200 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 452.55 грн |
| 10+ | 334.23 грн |
| 25+ | 308.83 грн |
| 80+ | 267.16 грн |
| MC56F82643VLC |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Description: IC MCU 32BIT 64KB FLASH 32LQFP
товару немає в наявності
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| MC56F82623VLC |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b
Core Processor: 56800EX
Program Memory Type: FLASH
товару немає в наявності
В кошику
од. на суму грн.
| NTBMS-FSNXP |
Виробник: NXP USA Inc.
Description: EVAL BD FS4503C MC33772B S32K144
Packaging: Bulk
Function: Battery Monitor, Car
Type: Power Management
Utilized IC / Part: FS4503C, MC33772B, S32K144
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
Description: EVAL BD FS4503C MC33772B S32K144
Packaging: Bulk
Function: Battery Monitor, Car
Type: Power Management
Utilized IC / Part: FS4503C, MC33772B, S32K144
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Contents: Board(s)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 73535.42 грн |
| MCIMX6Z0DVM09AB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
Description: IC MPU I.MX6 900MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
на замовлення 4101 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 780.88 грн |
| 10+ | 588.69 грн |
| 25+ | 547.90 грн |
| 152+ | 462.26 грн |
| 304+ | 448.34 грн |
| 608+ | 436.89 грн |
| 1064+ | 422.11 грн |
| FS32K116LAT0MFMT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 417 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 354.44 грн |
| 10+ | 241.21 грн |
| 25+ | 238.61 грн |
| 100+ | 220.28 грн |
| FS32K116LAT0MLFT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 598.91 грн |
| 10+ | 452.93 грн |
| FS32K118LAT0MLFT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 43
DigiKey Programmable: Not Verified
на замовлення 1157 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 410.61 грн |
| 10+ | 302.69 грн |
| 25+ | 279.57 грн |
| 100+ | 238.47 грн |
| 250+ | 227.07 грн |
| 500+ | 220.21 грн |
| 1000+ | 211.04 грн |
| FS32K118LAT0MLHT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 1125 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 583.09 грн |
| 10+ | 435.17 грн |
| 25+ | 403.60 грн |
| 100+ | 346.20 грн |
| 250+ | 330.67 грн |
| 800+ | 315.91 грн |
| S32K118EVB-Q064 |
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Виробник: NXP USA Inc.
Description: S32K118 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
Description: S32K118 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: S32K118
товару немає в наявності
В кошику
од. на суму грн.
| S32K116EVB-Q048 |
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Виробник: NXP USA Inc.
Description: S32K116 EVAL BRD
Description: S32K116 EVAL BRD
на замовлення 33 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| IMXAI2ETH-ATH |
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Виробник: NXP USA Inc.
Description: ENET 1GBPS PHY (STD ENET PHY)
Packaging: Bulk
For Use With/Related Products: i.MX 6
Accessory Type: Interface Board
Utilized IC / Part: i.MX 6
Part Status: Active
Description: ENET 1GBPS PHY (STD ENET PHY)
Packaging: Bulk
For Use With/Related Products: i.MX 6
Accessory Type: Interface Board
Utilized IC / Part: i.MX 6
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 15747.30 грн |
| MCIMX8QXP-CPU |
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Виробник: NXP USA Inc.
Description: I.MX 8 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Part Status: Active
Description: I.MX 8 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 8
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 100728.48 грн |
| MCIMX8-8X-BB |
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Виробник: NXP USA Inc.
Description: BASEBRD I.MX 8QUADXPLUS/8QUADMAX
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
Part Status: Active
Description: BASEBRD I.MX 8QUADXPLUS/8QUADMAX
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
Part Status: Active
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 48673.91 грн |
| MX8XMIPI4CAM2 |
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Виробник: NXP USA Inc.
Description: 4 CAMERA BOARD MINISAS OV10635
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
Description: 4 CAMERA BOARD MINISAS OV10635
Packaging: Bulk
For Use With/Related Products: i.MX 8
Accessory Type: Interface Board
Utilized IC / Part: i.MX 8
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 20765.65 грн |
| FS32K146HAT0MMHT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MRF101AN |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO220-3
Packaging: Tube
Package / Case: TO-220-3
Current Rating (Amps): 10µA
Frequency: 1.8MHz ~ 250MHz
Power - Output: 115W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-220-3
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V TO220-3
Packaging: Tube
Package / Case: TO-220-3
Current Rating (Amps): 10µA
Frequency: 1.8MHz ~ 250MHz
Power - Output: 115W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-220-3
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 486 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2845.81 грн |
| 10+ | 2238.12 грн |
| 50+ | 2036.99 грн |
| 100+ | 1853.21 грн |
| 250+ | 1791.53 грн |

































