Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35300) > Сторінка 317 з 589
| Фото | Назва | Виробник | Інформація |
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BF513,215 | NXP USA Inc. |
Description: RF MOSFET JFET 10V SOT23Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 100MHz Configuration: N-Channel Technology: JFET Noise Figure: 1.5dB Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Voltage - Rated: 20 V Voltage - Test: 10 V Current - Test: 5 mA |
товару немає в наявності |
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MP3V5050GC6T1 | NXP USA Inc. |
Description: SENSOR 7.25PSIG 0.13" 2.82VPackaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 8-SMD, Gull Wing, Top Port Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.06 V ~ 2.82 V Operating Pressure: 7.25PSI (50kPa) Pressure Type: Vented Gauge Accuracy: ±2.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 2.7V ~ 3.3V Port Size: Male - 0.13" (3.17mm) Tube, Dual Applications: Board Mount Port Style: Barbless Maximum Pressure: 29.01PSI (200kPa) |
товару немає в наявності |
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HTMS8001FTB/AF,115 | NXP USA Inc. |
Description: RFID TAG R/W 100-150KHZ ENCAPPackaging: Cut Tape (CT) Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Style: Encapsulated Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Technology: Passive Standards: ISO 11784, ISO 11785 Writable Memory: 1.76kb (User) |
на замовлення 4907 шт: термін постачання 21-31 дні (днів) |
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TEA1738T/N1,118 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 8SOPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 80% Frequency - Switching: 26.5kHz ~ 78kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 12V ~ 30V Supplier Device Package: 8-SO Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage Voltage - Start Up: 20.6 V Part Status: Active Power (Watts): 75 W |
на замовлення 2372 шт: термін постачання 21-31 дні (днів) |
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SL2S1512FTBX | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ 3XSONPackaging: Cut Tape (CT) Package / Case: 3-XDFN Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 1.7V Standards: ISO 18000-6, EPC Supplier Device Package: 3-XSON (1x1.45) Part Status: Active |
на замовлення 9695 шт: термін постачання 21-31 дні (днів) |
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BAP70AM,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 300MW 6TSSOP |
на замовлення 588 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||||||
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BB156,115 | NXP USA Inc. |
Description: DIODE VAR CAP 10V 20MA SOD323Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz Capacitance Ratio Condition: C1/C7.5 Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 10 V Capacitance Ratio: 3.9 |
товару немає в наявності |
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TEA1731LTS/1,115 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK SC74 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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BAP50LX,315 | NXP USA Inc. |
Description: RF DIODE PIN 50V 150MW SOD2Packaging: Cut Tape (CT) Package / Case: SOD-882 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Resistance @ If, F: 3Ohm @ 10mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: SOD2 Current - Max: 50 mA Power Dissipation (Max): 150 mW |
на замовлення 7725 шт: термін постачання 21-31 дні (днів) |
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| HTMS8001FTK/AF,115 | NXP USA Inc. |
Description: RFID TAG R/W 100-150KHZ ENCAPPackaging: Cut Tape (CT) Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Style: Encapsulated Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Technology: Passive Standards: ISO 11784, ISO 11785 Writable Memory: 1.76kb (User) |
товару немає в наявності |
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BAP70-04W,115 | NXP USA Inc. |
Description: RF DIODE PIN 50V 260MW SC-70Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Diode Type: PIN - 1 Pair Series Connection Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz Voltage - Peak Reverse (Max): 50V Supplier Device Package: SC-70 Part Status: Obsolete Current - Max: 100 mA Power Dissipation (Max): 260 mW |
товару немає в наявності |
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MC9S08PL4CTG | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 3957 шт: термін постачання 21-31 дні (днів) |
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MC9S08PL60CQH | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFPPackaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 57 DigiKey Programmable: Not Verified |
товару немає в наявності |
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MC9S08PL8CTG | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
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MC9S08PL16CTG | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 16TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
товару немає в наявності |
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MC9S08PL16CTJ | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOPPackaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 10x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, UART/USART Peripherals: LVD, POR, PWM Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 18 DigiKey Programmable: Not Verified |
на замовлення 868 шт: термін постачання 21-31 дні (днів) |
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SPC5775BDK3MME2 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416MAPBGAPackaging: Tray Package / Case: 416-BGA Mounting Type: Surface Mount Speed: 220MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 40x12b eQADCx2 Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 416-MAPBGA (27x27) Part Status: Active Number of I/O: 293 DigiKey Programmable: Not Verified |
на замовлення 167 шт: термін постачання 21-31 дні (днів) |
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MPC5775BE-416DS | NXP USA Inc. |
Description: MPC5775E EVAL BRD ADAPTERPackaging: Bulk Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5775B, MPC5775E Part Status: Active Mounting Type: Socket |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| TEA19051BABTK/1J | NXP USA Inc. |
Description: IC SMPS CTRLR SMART CHRG HVSON16Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| TEA19051BACTK/1J | NXP USA Inc. |
Description: IC SMPS CTRLR SMART CHRG HVSON16Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| TEA19051BAFTK/1J | NXP USA Inc. |
Description: IC SMPS CTRLR SMART CHRG HVSON16Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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FRDM33771BSPIEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC33771Packaging: Bulk Function: Battery Cell Controller Type: Power Management Contents: Board(s) Utilized IC / Part: MC33771 Supplied Contents: Board(s) Primary Attributes: 14-Channel Secondary Attributes: On-Board LEDs Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| K32W032S1M2CAVAR | NXP USA Inc. |
Description: MCU KINETIS BT5/FSK WLCSP Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 1.25MB (1.25M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D - 12bit; D/A - 12bit Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Supplier Device Package: 191-WLCSP (5.97x5.85) Number of I/O: 104 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| SAF7730HV/N231D,51 | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFPPackaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Type: Car Signal Processor Operating Temperature: -40°C ~ 85°C (TA) Clock Rate: 400MHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| SAF7730HV/N231D,55 | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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SPC5744PK1MLQ5 | NXP USA Inc. | Description: IC MCU 32BIT 2.5MB FLASH 144LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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SPC5744PK1MLQ5R | NXP USA Inc. | Description: IC MCU 32BIT 2.5MB FLASH 144LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1550A7EP | NXP USA Inc. |
Description: PF1550Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1550A7EPR2 | NXP USA Inc. |
Description: PF1550Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC32PF1510A1EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC32PF1510A3EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1510A4EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1510A6EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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FRDM-PF1550EVM | NXP USA Inc. |
Description: EVAL BOARD FOR PF1550Packaging: Bulk Function: Battery Charger Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: PF1550 Supplied Contents: Board(s), Cable(s) Secondary Attributes: On-Board Test Points Embedded: Yes, MCU, 32-Bit |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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MC32PF1510A1EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
на замовлення 4682 шт: термін постачання 21-31 дні (днів) |
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MC32PF1510A3EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
на замовлення 3328 шт: термін постачання 21-31 дні (днів) |
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MC34PF1510A4EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1510A6EPR2 | NXP USA Inc. |
Description: PF1510Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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MC32PF1550A1EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
на замовлення 4759 шт: термін постачання 21-31 дні (днів) |
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MC32PF1550A3EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1550A1EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MC34PF1550A4EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MWCT1003AVLHR | NXP USA Inc. |
Description: 5W MULTI-COIL AUTO 5V PREMIUMPackaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.7V ~ 3.6V Applications: Wireless Power Transmitter Supplier Device Package: 64-LQFP (10x10) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MKW41Z512VHT4R | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 64VFLGAPackaging: Cut Tape (CT) Package / Case: 64-VFLGA Sensitivity: -100dBm Mounting Type: Surface Mount Frequency: 2.36GHz ~ 2.48GHz Memory Size: 512kB Flash, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 3.6V Power - Output: 3.5dBm Protocol: Bluetooth v4.2 Current - Receiving: 6.76mA Data Rate (Max): 1Mbps Current - Transmitting: 6.08mA Supplier Device Package: 64-VFLGA (7x7) Modulation: FSK, GFSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 1875 шт: термін постачання 21-31 дні (днів) |
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PCT2075GV/N005X | NXP USA Inc. |
Description: DIGITAL TEMP SENSOR & THERMAL WAFeatures: Output Switch, Programmable Limit, Shutdown Mode Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 6-TSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±2°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Last Time Buy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PCT2075GV/P110X | NXP USA Inc. |
Description: DIGITAL TEMP SENSOR & THERMAL WAFeatures: Output Switch, Programmable Limit, Shutdown Mode Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 6-TSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±2°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Last Time Buy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PCT2075GV/N005X | NXP USA Inc. |
Description: DIGITAL TEMP SENSOR & THERMAL WAFeatures: Output Switch, Programmable Limit, Shutdown Mode Packaging: Cut Tape (CT) Package / Case: SC-74, SOT-457 Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 6-TSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±2°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Last Time Buy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PCT2075GV/P110X | NXP USA Inc. |
Description: DIGITAL TEMP SENSOR & THERMAL WAFeatures: Output Switch, Programmable Limit, Shutdown Mode Packaging: Cut Tape (CT) Package / Case: SC-74, SOT-457 Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 6-TSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±2°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Last Time Buy |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1060-EVK | NXP USA Inc. |
Description: I.MX RT1060 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-M7 Utilized IC / Part: i.MX RT1060 |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1062DVL6A | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Discontinued at Digi-Key Number of I/O: 127 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MIMXRT1062CVL5A | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Part Status: Discontinued at Digi-Key Number of I/O: 127 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MIMXRT1051DVJ6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 512K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 202 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1052CVJ5B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 932 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1052DVJ6B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 512K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 399 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1061DVL6A | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MIMXRT1061CVL5A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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FS32R372SDK0MMMT | NXP USA Inc. |
Description: IC MCU RADAR S32R LFBGA257Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Interface: CAN, I2C, LINFlexD, SPI RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.19V ~ 1.31V Program Memory Type: FLASH (1.3MB) Applications: Industrial Radar Core Processor: e200z7 Supplier Device Package: 257-LFBGA (14x14) Grade: Automotive Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 753 шт: термін постачання 21-31 дні (днів) |
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FS32R372SEK0MMMT | NXP USA Inc. |
Description: S32R RADAR MICROCONTROLLER - S32 Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Interface: CAN, I2C, LINFlexD, SPI RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.19V ~ 1.31V Program Memory Type: FLASH (1.3MB) Applications: Industrial Radar Core Processor: e200z7 Supplier Device Package: 257-LFBGA (14x14) Grade: Automotive Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| S32R372141EVB | NXP USA Inc. |
Description: S32R372 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Utilized IC / Part: S32R372 Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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S32R372RRSEVB | NXP USA Inc. |
Description: S32R372 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Utilized IC / Part: S32R372 |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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| BF513,215 |
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Виробник: NXP USA Inc.
Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
Description: RF MOSFET JFET 10V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 100MHz
Configuration: N-Channel
Technology: JFET
Noise Figure: 1.5dB
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Rated: 20 V
Voltage - Test: 10 V
Current - Test: 5 mA
товару немає в наявності
В кошику
од. на суму грн.
| MP3V5050GC6T1 |
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Виробник: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" 2.82V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Description: SENSOR 7.25PSIG 0.13" 2.82V
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
товару немає в наявності
В кошику
од. на суму грн.
| HTMS8001FTB/AF,115 |
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Виробник: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
на замовлення 4907 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 35.44 грн |
| 11+ | 28.89 грн |
| 25+ | 27.17 грн |
| 100+ | 23.33 грн |
| 250+ | 22.02 грн |
| 500+ | 21.10 грн |
| 1000+ | 19.90 грн |
| TEA1738T/N1,118 |
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Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 80%
Frequency - Switching: 26.5kHz ~ 78kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Active
Power (Watts): 75 W
на замовлення 2372 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 64.28 грн |
| 10+ | 44.68 грн |
| 25+ | 40.25 грн |
| 100+ | 33.22 грн |
| 250+ | 31.06 грн |
| 500+ | 29.75 грн |
| 1000+ | 28.20 грн |
| SL2S1512FTBX |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
Description: IC RFID TRANSP 13.56MHZ 3XSON
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 18000-6, EPC
Supplier Device Package: 3-XSON (1x1.45)
Part Status: Active
на замовлення 9695 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 12+ | 29.67 грн |
| 13+ | 24.76 грн |
| 25+ | 23.36 грн |
| 100+ | 20.03 грн |
| 250+ | 18.91 грн |
| 500+ | 18.11 грн |
| 1000+ | 17.07 грн |
| BAP70AM,115 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
Description: RF DIODE PIN 50V 300MW 6TSSOP
на замовлення 588 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| BB156,115 |
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Виробник: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
товару немає в наявності
В кошику
од. на суму грн.
| TEA1731LTS/1,115 |
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Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK SC74
Description: IC OFFLINE SWITCH FLYBACK SC74
товару немає в наявності
В кошику
од. на суму грн.
| BAP50LX,315 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
на замовлення 7725 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 34+ | 9.89 грн |
| 50+ | 6.35 грн |
| 57+ | 5.59 грн |
| 100+ | 4.42 грн |
| 250+ | 4.04 грн |
| 500+ | 3.81 грн |
| 1000+ | 3.56 грн |
| 2500+ | 3.36 грн |
| 5000+ | 3.24 грн |
| HTMS8001FTK/AF,115 |
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Виробник: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Cut Tape (CT)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
товару немає в наявності
В кошику
од. на суму грн.
| BAP70-04W,115 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08PL4CTG |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 3957 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 78.29 грн |
| 10+ | 54.60 грн |
| 96+ | 43.67 грн |
| 192+ | 38.95 грн |
| 288+ | 37.92 грн |
| 576+ | 36.43 грн |
| 1056+ | 34.76 грн |
| 2592+ | 33.47 грн |
| MC9S08PL60CQH |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 57
DigiKey Programmable: Not Verified
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| MC9S08PL8CTG |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
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| MC9S08PL16CTG |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
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| MC9S08PL16CTJ |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 868 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 149.17 грн |
| 10+ | 106.18 грн |
| 75+ | 88.30 грн |
| 150+ | 78.97 грн |
| 300+ | 75.76 грн |
| 525+ | 73.58 грн |
| SPC5775BDK3MME2 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
Number of I/O: 293
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 40x12b eQADCx2
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
Part Status: Active
Number of I/O: 293
DigiKey Programmable: Not Verified
на замовлення 167 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2876.21 грн |
| 10+ | 2267.49 грн |
| 25+ | 2196.54 грн |
| MPC5775BE-416DS |
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Виробник: NXP USA Inc.
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
Description: MPC5775E EVAL BRD ADAPTER
Packaging: Bulk
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B, MPC5775E
Part Status: Active
Mounting Type: Socket
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 48972.15 грн |
| TEA19051BABTK/1J |
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Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| TEA19051BACTK/1J |
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Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| TEA19051BAFTK/1J |
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Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| FRDM33771BSPIEVB |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Secondary Attributes: On-Board LEDs
Part Status: Active
Description: EVAL BOARD FOR MC33771
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33771
Supplied Contents: Board(s)
Primary Attributes: 14-Channel
Secondary Attributes: On-Board LEDs
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 17619.85 грн |
| K32W032S1M2CAVAR |
Виробник: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
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| SAF7730HV/N231D,51 |
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Виробник: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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| SAF7730HV/N231D,55 |
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Виробник: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Description: IC HD RADIO PROCESSOR 144HLQFP
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| SPC5744PK1MLQ5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
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| SPC5744PK1MLQ5R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
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| MC34PF1550A7EP |
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Виробник: NXP USA Inc.
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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| MC34PF1550A7EPR2 |
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Виробник: NXP USA Inc.
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1550
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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| MC32PF1510A1EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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| MC32PF1510A3EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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| MC34PF1510A4EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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| MC34PF1510A6EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 180.09 грн |
| FRDM-PF1550EVM |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR PF1550
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PF1550
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: On-Board Test Points
Embedded: Yes, MCU, 32-Bit
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 21391.06 грн |
| MC32PF1510A1EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
на замовлення 4682 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 324.71 грн |
| 10+ | 236.97 грн |
| 25+ | 217.99 грн |
| 100+ | 185.03 грн |
| 250+ | 175.71 грн |
| 500+ | 170.10 грн |
| 1000+ | 162.76 грн |
| 2500+ | 157.96 грн |
| MC32PF1510A3EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
на замовлення 3328 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 297.51 грн |
| 10+ | 217.37 грн |
| 25+ | 200.02 грн |
| 100+ | 169.76 грн |
| 250+ | 161.22 грн |
| 500+ | 156.06 грн |
| 1000+ | 149.33 грн |
| 2500+ | 144.93 грн |
| MC34PF1510A4EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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од. на суму грн.
| MC34PF1510A6EPR2 |
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Виробник: NXP USA Inc.
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: PF1510
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 332.12 грн |
| 10+ | 243.08 грн |
| 25+ | 223.96 грн |
| 100+ | 190.42 грн |
| 250+ | 181.01 грн |
| 500+ | 175.33 грн |
| 1000+ | 167.86 грн |
| 2500+ | 163.00 грн |
| MC32PF1550A1EPR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
на замовлення 4759 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 421.95 грн |
| 10+ | 364.98 грн |
| 25+ | 345.09 грн |
| 100+ | 280.69 грн |
| 250+ | 266.29 грн |
| 500+ | 238.94 грн |
| 1000+ | 198.21 грн |
| 2500+ | 188.30 грн |
| MC32PF1550A3EPR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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од. на суму грн.
| MC34PF1550A1EPR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
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В кошику
од. на суму грн.
| MC34PF1550A4EPR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
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од. на суму грн.
| MWCT1003AVLHR |
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Виробник: NXP USA Inc.
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
Description: 5W MULTI-COIL AUTO 5V PREMIUM
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
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од. на суму грн.
| MKW41Z512VHT4R |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 64VFLGA
Packaging: Cut Tape (CT)
Package / Case: 64-VFLGA
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.36GHz ~ 2.48GHz
Memory Size: 512kB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 3.5dBm
Protocol: Bluetooth v4.2
Current - Receiving: 6.76mA
Data Rate (Max): 1Mbps
Current - Transmitting: 6.08mA
Supplier Device Package: 64-VFLGA (7x7)
Modulation: FSK, GFSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1875 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 611.50 грн |
| 10+ | 459.34 грн |
| 25+ | 419.28 грн |
| 100+ | 366.26 грн |
| 250+ | 350.06 грн |
| 500+ | 340.33 грн |
| 1000+ | 325.83 грн |
| PCT2075GV/N005X |
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Виробник: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
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В кошику
од. на суму грн.
| PCT2075GV/P110X |
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Виробник: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
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В кошику
од. на суму грн.
| PCT2075GV/N005X |
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Виробник: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
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В кошику
од. на суму грн.
| PCT2075GV/P110X |
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Виробник: NXP USA Inc.
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
Description: DIGITAL TEMP SENSOR & THERMAL WA
Features: Output Switch, Programmable Limit, Shutdown Mode
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 6-TSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Last Time Buy
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 51.10 грн |
| 8+ | 41.58 грн |
| 10+ | 38.89 грн |
| MIMXRT1060-EVK |
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Виробник: NXP USA Inc.
Description: I.MX RT1060 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
Description: I.MX RT1060 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: i.MX RT1060
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8943.44 грн |
| MIMXRT1062DVL6A |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
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| MIMXRT1062CVL5A |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Part Status: Discontinued at Digi-Key
Number of I/O: 127
DigiKey Programmable: Not Verified
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| MIMXRT1051DVJ6B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 202 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 557.11 грн |
| 10+ | 424.42 грн |
| MIMXRT1052CVJ5B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 932 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 854.62 грн |
| 10+ | 649.49 грн |
| 25+ | 606.09 грн |
| 189+ | 550.81 грн |
| MIMXRT1052DVJ6B |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 399 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 776.33 грн |
| 10+ | 585.05 грн |
| 25+ | 544.48 грн |
| 189+ | 454.71 грн |
| 378+ | 441.70 грн |
| MIMXRT1061DVL6A |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
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| MIMXRT1061CVL5A |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Description: IC MCU 32BIT EXT MEM 196MAPBGA
товару немає в наявності
В кошику
од. на суму грн.
| FS32R372SDK0MMMT |
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Виробник: NXP USA Inc.
Description: IC MCU RADAR S32R LFBGA257
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU RADAR S32R LFBGA257
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 753 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4238.49 грн |
| 10+ | 3311.24 грн |
| 80+ | 2875.02 грн |
| FS32R372SEK0MMMT |
Виробник: NXP USA Inc.
Description: S32R RADAR MICROCONTROLLER - S32
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Description: S32R RADAR MICROCONTROLLER - S32
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Interface: CAN, I2C, LINFlexD, SPI
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.19V ~ 1.31V
Program Memory Type: FLASH (1.3MB)
Applications: Industrial Radar
Core Processor: e200z7
Supplier Device Package: 257-LFBGA (14x14)
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| S32R372141EVB |
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Виробник: NXP USA Inc.
Description: S32R372 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Utilized IC / Part: S32R372
Part Status: Active
Description: S32R372 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Utilized IC / Part: S32R372
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 32074.23 грн |
| S32R372RRSEVB |
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Виробник: NXP USA Inc.
Description: S32R372 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Utilized IC / Part: S32R372
Description: S32R372 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Utilized IC / Part: S32R372
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 28321.15 грн |




























