Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36377) > Сторінка 340 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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74LVC1GX04GW/C4125 | NXP USA Inc. |
Description: 74LVC1GX04GW - CLOCK GENERATORPackaging: Bulk Part Status: Active |
на замовлення 24000 шт: термін постачання 21-31 дні (днів) |
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74LVC1GX04GW/C2125 | NXP USA Inc. |
Description: 74LVC1GX04GW - CLOCK GENERATORPackaging: Bulk Part Status: Active |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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74LVC1GX04GW/S400125 | NXP USA Inc. |
Description: 74LVC1GX04GW - CLOCK GENERATORPackaging: Bulk Part Status: Active |
на замовлення 2796 шт: термін постачання 21-31 дні (днів) |
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74LVC1GX04GW-Q100125 | NXP USA Inc. |
Description: INVERTER/BUFFERPackaging: Bulk Part Status: Active |
на замовлення 32165 шт: термін постачання 21-31 дні (днів) |
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74LVC1GX04GV-Q100125 | NXP USA Inc. |
Description: INVERTER/BUFFERPackaging: Bulk Part Status: Active |
на замовлення 9000 шт: термін постачання 21-31 дні (днів) |
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MKV44F128VLF16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFPDigiKey Programmable: Not Verified Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 21x12b; D/A 1x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 24K x 8 Program Memory Size: 128KB (128K x 8) Speed: 168MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BAT760/ZL115 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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BGU7007,115 | NXP USA Inc. |
Description: IC RF AMP GPS 1575.42MHZ 6XSONPackaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 1575.42MHz RF Type: GPS/GNSS Voltage - Supply: 1.5V ~ 2.85V Gain: 18.5dB Current - Supply: 12.8mA Noise Figure: 0.85dB P1dB: -12dBm Test Frequency: 1.559GHz ~ 1.61GHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Part Status: Active |
на замовлення 18177 шт: термін постачання 21-31 дні (днів) |
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PMEG4002ELD/S500315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPart Status: Active Packaging: Bulk |
на замовлення 40283 шт: термін постачання 21-31 дні (днів) |
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MPC8321VRADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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S9S12GNA16F0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFPNumber of I/O: 40 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x12b Core Processor: 12V1 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) DigiKey Programmable: Not Verified RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC8536CVJANGA | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PMV65XPE215 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PMV65XPEA215 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPackaging: Bulk Part Status: Active Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 2.8A (Ta) Rds On (Max) @ Id, Vgs: 78mOhm @ 2.8A, 4.5V Power Dissipation (Max): 480mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 1.25V @ 250µA Supplier Device Package: TO-236AB Grade: Automotive Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 9 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 618 pF @ 10 V Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PMV65XP1215 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PMV65XP/MI215 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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PBSS2515M3145 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| 74LVC574APW/S400118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk |
на замовлення 13023 шт: термін постачання 21-31 дні (днів) |
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FS32K116BRT0MFMT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32HVQFNDigiKey Programmable: Not Verified Number of I/O: 28 Part Status: Active Supplier Device Package: 32-HVQFN (5x5) Peripherals: DMA, PWM, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Core Size: 32-Bit Single-Core Data Converters: A/D 13x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 17K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Tray Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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FS32K116LFT0MFMT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32HVQFNConnectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 13x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 17K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 28 Part Status: Active Supplier Device Package: 32-HVQFN (5x5) Peripherals: DMA, PWM, WDT |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC11A02UK,118 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 20WLCSPRAM Size: 4K x 8 Program Memory Size: 16KB (16K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 20-UFBGA, WLCSP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 20-WLCSP (2.55x2.55) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M0 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC11A02UK,118 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 20WLCSPProgram Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 16KB (16K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 20-UFBGA, WLCSP Packaging: Cut Tape (CT) DigiKey Programmable: Not Verified Number of I/O: 18 Supplier Device Package: 20-WLCSP (2.55x2.55) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M0 EEPROM Size: 2K x 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74ALVC125PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIESPackaging: Bulk |
на замовлення 1790 шт: термін постачання 21-31 дні (днів) |
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| TDF8554J/N3,112 | NXP USA Inc. |
Description: IC AUDIO POWER AMP DBS37P Voltage - Supply: 6V ~ 18V Operating Temperature: -40°C ~ 105°C (TA) Type: Class AB Mounting Type: Through Hole Output Type: 4-Channel (Quad) Package / Case: 37-SIP Formed Leads Packaging: Tray Part Status: Obsolete Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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74HC153PW-Q100118 | NXP USA Inc. |
Description: 74HC153 - 4 LINE MUXPart Status: Active Supplier Device Package: 16-TSSOP Voltage Supply Source: Single Supply Current - Output High, Low: 5.2mA, 5.2mA Independent Circuits: 1 Voltage - Supply: 2V ~ 6V Operating Temperature: -40°C ~ 125°C Type: Multiplexer Circuit: 2 x 4:1 Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Qualification: AEC-Q100 Grade: Automotive Packaging: Bulk |
на замовлення 8002 шт: термін постачання 21-31 дні (днів) |
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KITPF5020FRDMEVM | NXP USA Inc. |
Description: EVAL BOARD FOR PF5020Contents: Board(s) Embedded: No Supplied Contents: Board(s) Utilized IC / Part: PF5020 Packaging: Bulk |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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PDTA144EU/ZL115 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk Part Status: Active |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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74AHCT259PW,118 | NXP USA Inc. |
Description: IC 8BIT ADDRESSBLE LATCH 16TSSOPMounting Type: Surface Mount Output Type: Standard Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Bulk Supplier Device Package: 16-TSSOP Delay Time - Propagation: 4.1ns Current - Output High, Low: 8mA, 8mA Independent Circuits: 1 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C Logic Type: D-Type, Addressable Circuit: 1:8 |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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HEF4040BT-Q100118 | NXP USA Inc. |
Description: BINARY COUNTERPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| PDZ5.6B/ZL115 | NXP USA Inc. |
Description: DIODE ZENER |
на замовлення 156000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||||
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74LVC125APW/S999118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 14-TSSOP Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74LVC125APW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74LVC126APW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Obsolete |
на замовлення 11460 шт: термін постачання 21-31 дні (днів) |
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74LVC126APW/C4118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BFU630F,115 | NXP USA Inc. |
Description: RF TRANS NPN 5.5V 21GHZ 4-DFPPackaging: Cut Tape (CT) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13dB ~ 22.5dB Power - Max: 200mW Current - Collector (Ic) (Max): 30mA Voltage - Collector Emitter Breakdown (Max): 5.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 5mA, 2V Frequency - Transition: 21GHz Noise Figure (dB Typ @ f): 0.75dB ~ 1.3dB @ 1.5GHz ~ 5.8GHz Supplier Device Package: 4-DFP Part Status: Active |
на замовлення 9705 шт: термін постачання 21-31 дні (днів) |
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| BC857AQA147 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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74HC158D/C118 | NXP USA Inc. |
Description: 74HC158 2 LINE MUXCurrent - Output High, Low: 5.2mA, 5.2mA Independent Circuits: 1 Voltage - Supply: 2V ~ 6V Operating Temperature: -40°C ~ 125°C Type: Multiplexer Circuit: 4 x 2:1 Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Packaging: Bulk Supplier Device Package: 16-SO Voltage Supply Source: Single Supply |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| OT409135 | NXP USA Inc. |
Description: NOW WEEN - OT409 - TBC - SC-73 Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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NVT2010BS,118 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR VOLT 24HVQFN |
на замовлення 998 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
| PXLS60220AES | NXP USA Inc. |
Description: XTRINSIC 1 AXIS ACCELEROMETER Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PXLS60311AES | NXP USA Inc. |
Description: XTRINSIC 2 AXIS LOW/LOW XY ACCEL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PXLS60333AES | NXP USA Inc. |
Description: XTRINSIC 2 AXIS HIGH/HIGH XY ACC Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PXLS60422AES | NXP USA Inc. | Description: XTRINSIC 2 AXIS MED/MED XZ ACCEL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PXLS63322AES | NXP USA Inc. | Description: XTRINSIC 2 AXIS MED/MED XY ACCEL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PXLS63333AES | NXP USA Inc. | Description: XTRINSIC 2 AXIS HIGH/HIGH XY PSI |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PXLS63433AES | NXP USA Inc. |
Description: PSI5 PROTOCOL 2 AXIS HIGH/HIGH Part Status: Active Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| PXLS80333AES | NXP USA Inc. | Description: 2 AXIS HI/HI XY |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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LPC5514JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 217 шт: термін постачання 21-31 дні (днів) |
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LPC55S14JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC5516JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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LPC55S16JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64HTQFPDigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 64-HTQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 10x16b SAR Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 96K x 8 Program Memory Size: 256KB (256K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Packaging: Tray |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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LPC5526JBD100K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 387 шт: термін постачання 21-31 дні (днів) |
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LPC5516JEV98E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 98VFBGAPackaging: Tray Package / Case: 98-VFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 98-VFBGA (7x7) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 248 шт: термін постачання 21-31 дні (днів) |
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LPC55S66JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 244 шт: термін постачання 21-31 дні (днів) |
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LPC55S26JEV98K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 98VFBGAPackaging: Tray Package / Case: 98-VFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 98-VFBGA (7x7) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 1112 шт: термін постачання 21-31 дні (днів) |
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LPC55S28JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 2570 шт: термін постачання 21-31 дні (днів) |
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LPC55S28JBD100K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 353 шт: термін постачання 21-31 дні (днів) |
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LPC55S16JEV98E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 98VFBGAPackaging: Tray Package / Case: 98-VFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 98-VFBGA (7x7) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 1433 шт: термін постачання 21-31 дні (днів) |
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LPC5528JBD100K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 716 шт: термін постачання 21-31 дні (днів) |
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LPC5512JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
| 74LVC1GX04GW/C4125 |
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на замовлення 24000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1664+ | 14.24 грн |
| 74LVC1GX04GW/C2125 |
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на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1664+ | 14.24 грн |
| 74LVC1GX04GW/S400125 |
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на замовлення 2796 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1664+ | 14.24 грн |
| 74LVC1GX04GW-Q100125 |
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на замовлення 32165 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1332+ | 18.20 грн |
| 74LVC1GX04GV-Q100125 |
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на замовлення 9000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1055+ | 22.15 грн |
| MKV44F128VLF16 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 21x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 168MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 21x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 24K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 168MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| BGU7007,115 |
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Виробник: NXP USA Inc.
Description: IC RF AMP GPS 1575.42MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1575.42MHz
RF Type: GPS/GNSS
Voltage - Supply: 1.5V ~ 2.85V
Gain: 18.5dB
Current - Supply: 12.8mA
Noise Figure: 0.85dB
P1dB: -12dBm
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
Description: IC RF AMP GPS 1575.42MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1575.42MHz
RF Type: GPS/GNSS
Voltage - Supply: 1.5V ~ 2.85V
Gain: 18.5dB
Current - Supply: 12.8mA
Noise Figure: 0.85dB
P1dB: -12dBm
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
на замовлення 18177 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 81.49 грн |
| 10+ | 67.88 грн |
| 25+ | 63.97 грн |
| 100+ | 55.02 грн |
| 250+ | 52.01 грн |
| 500+ | 49.89 грн |
| 1000+ | 47.09 грн |
| PMEG4002ELD/S500315 |
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на замовлення 40283 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6836+ | 3.16 грн |
| MPC8321VRADDCA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Part Status: Active
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3185.22 грн |
| 10+ | 2510.48 грн |
| 40+ | 2312.88 грн |
| S9S12GNA16F0MLF |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: 12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
DigiKey Programmable: Not Verified
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: 12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
DigiKey Programmable: Not Verified
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MPC8536CVJANGA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCBGA
Description: IC MPU MPC85XX 800MHZ 783FCBGA
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В кошику
од. на суму грн.
| PMV65XPEA215 |
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Виробник: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.8A (Ta)
Rds On (Max) @ Id, Vgs: 78mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 480mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: TO-236AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 9 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 618 pF @ 10 V
Qualification: AEC-Q101
Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.8A (Ta)
Rds On (Max) @ Id, Vgs: 78mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 480mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: TO-236AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 9 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 618 pF @ 10 V
Qualification: AEC-Q101
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од. на суму грн.
| PBSS2515M3145 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
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В кошику
од. на суму грн.
| 74LVC574APW/S400118 |
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на замовлення 13023 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2049+ | 11.87 грн |
| FS32K116BRT0MFMT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
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В кошику
од. на суму грн.
| FS32K116LFT0MFMT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 17K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Active
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, PWM, WDT
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В кошику
од. на суму грн.
| LPC11A02UK,118 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20WLCSP
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-WLCSP (2.55x2.55)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC MCU 32BIT 16KB FLASH 20WLCSP
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-WLCSP (2.55x2.55)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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| LPC11A02UK,118 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20WLCSP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-WLCSP (2.55x2.55)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 2K x 8
Description: IC MCU 32BIT 16KB FLASH 20WLCSP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-WLCSP (2.55x2.55)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 2K x 8
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| 74ALVC125PW-Q100118 |
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на замовлення 1790 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1790+ | 13.51 грн |
| TDF8554J/N3,112 |
Виробник: NXP USA Inc.
Description: IC AUDIO POWER AMP DBS37P
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 105°C (TA)
Type: Class AB
Mounting Type: Through Hole
Output Type: 4-Channel (Quad)
Package / Case: 37-SIP Formed Leads
Packaging: Tray
Part Status: Obsolete
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm
Description: IC AUDIO POWER AMP DBS37P
Voltage - Supply: 6V ~ 18V
Operating Temperature: -40°C ~ 105°C (TA)
Type: Class AB
Mounting Type: Through Hole
Output Type: 4-Channel (Quad)
Package / Case: 37-SIP Formed Leads
Packaging: Tray
Part Status: Obsolete
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm
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| 74HC153PW-Q100118 |
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Виробник: NXP USA Inc.
Description: 74HC153 - 4 LINE MUX
Part Status: Active
Supplier Device Package: 16-TSSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 5.2mA, 5.2mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Qualification: AEC-Q100
Grade: Automotive
Packaging: Bulk
Description: 74HC153 - 4 LINE MUX
Part Status: Active
Supplier Device Package: 16-TSSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 5.2mA, 5.2mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Qualification: AEC-Q100
Grade: Automotive
Packaging: Bulk
на замовлення 8002 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1481+ | 14.43 грн |
| KITPF5020FRDMEVM |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PF5020
Contents: Board(s)
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: PF5020
Packaging: Bulk
Description: EVAL BOARD FOR PF5020
Contents: Board(s)
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: PF5020
Packaging: Bulk
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 18376.34 грн |
| PDTA144EU/ZL115 |
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на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6000+ | 3.62 грн |
| 74AHCT259PW,118 |
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Виробник: NXP USA Inc.
Description: IC 8BIT ADDRESSBLE LATCH 16TSSOP
Mounting Type: Surface Mount
Output Type: Standard
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Supplier Device Package: 16-TSSOP
Delay Time - Propagation: 4.1ns
Current - Output High, Low: 8mA, 8mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type, Addressable
Circuit: 1:8
Description: IC 8BIT ADDRESSBLE LATCH 16TSSOP
Mounting Type: Surface Mount
Output Type: Standard
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Supplier Device Package: 16-TSSOP
Delay Time - Propagation: 4.1ns
Current - Output High, Low: 8mA, 8mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type, Addressable
Circuit: 1:8
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 784+ | 27.41 грн |
| PDZ5.6B/ZL115 |
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Виробник: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
на замовлення 156000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 74LVC125APW/S999118 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
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| 74LVC126APW/AU118 |
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на замовлення 11460 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2959+ | 7.21 грн |
| BFU630F,115 |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 5.5V 21GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB ~ 22.5dB
Power - Max: 200mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 5mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 0.75dB ~ 1.3dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Part Status: Active
Description: RF TRANS NPN 5.5V 21GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB ~ 22.5dB
Power - Max: 200mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 5mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 0.75dB ~ 1.3dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Part Status: Active
на замовлення 9705 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 87.03 грн |
| 10+ | 52.26 грн |
| 100+ | 34.39 грн |
| 500+ | 25.05 грн |
| 1000+ | 22.73 грн |
| BC857AQA147 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Part Status: Active
Packaging: Bulk
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Part Status: Active
Packaging: Bulk
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| 74HC158D/C118 |
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Виробник: NXP USA Inc.
Description: 74HC158 2 LINE MUX
Current - Output High, Low: 5.2mA, 5.2mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 4 x 2:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
Description: 74HC158 2 LINE MUX
Current - Output High, Low: 5.2mA, 5.2mA
Independent Circuits: 1
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 4 x 2:1
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
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од. на суму грн.
| NVT2010BS,118 |
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Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR VOLT 24HVQFN
Description: IC TRANSLATOR BIDIR VOLT 24HVQFN
на замовлення 998 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| PXLS60422AES |
Виробник: NXP USA Inc.
Description: XTRINSIC 2 AXIS MED/MED XZ ACCEL
Description: XTRINSIC 2 AXIS MED/MED XZ ACCEL
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| PXLS63322AES |
Виробник: NXP USA Inc.
Description: XTRINSIC 2 AXIS MED/MED XY ACCEL
Description: XTRINSIC 2 AXIS MED/MED XY ACCEL
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| PXLS63333AES |
Виробник: NXP USA Inc.
Description: XTRINSIC 2 AXIS HIGH/HIGH XY PSI
Description: XTRINSIC 2 AXIS HIGH/HIGH XY PSI
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| PXLS80333AES |
Виробник: NXP USA Inc.
Description: 2 AXIS HI/HI XY
Description: 2 AXIS HI/HI XY
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| LPC5514JBD64E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 217 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 337.83 грн |
| 10+ | 247.53 грн |
| 25+ | 227.98 грн |
| 160+ | 188.62 грн |
| LPC55S14JBD64E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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| LPC5516JBD64E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 29 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 392.42 грн |
| 10+ | 288.59 грн |
| 25+ | 266.32 грн |
| LPC55S16JBD64E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
на замовлення 160 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 556.98 грн |
| 10+ | 421.46 грн |
| 160+ | 348.93 грн |
| LPC5526JBD100K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 387 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 253.96 грн |
| 10+ | 240.98 грн |
| LPC5516JEV98E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 248 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 512.67 грн |
| 10+ | 379.86 грн |
| 25+ | 351.46 грн |
| 80+ | 304.52 грн |
| LPC55S66JBD64K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 244 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 478.65 грн |
| 10+ | 354.87 грн |
| 25+ | 328.39 грн |
| 100+ | 280.84 грн |
| LPC55S26JEV98K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 1112 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 258.71 грн |
| LPC55S28JBD64K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 2570 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 521.38 грн |
| 10+ | 387.41 грн |
| 25+ | 358.84 грн |
| 100+ | 307.26 грн |
| 250+ | 293.21 грн |
| 800+ | 279.88 грн |
| 1600+ | 269.28 грн |
| LPC55S28JBD100K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 353 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 582.30 грн |
| 10+ | 434.34 грн |
| 24+ | 404.01 грн |
| 80+ | 349.85 грн |
| 230+ | 331.17 грн |
| LPC55S16JEV98E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 1433 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 511.09 грн |
| 10+ | 379.71 грн |
| 25+ | 351.58 грн |
| 100+ | 301.00 грн |
| 260+ | 286.67 грн |
| 520+ | 278.44 грн |
| 1040+ | 267.21 грн |
| LPC5528JBD100K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 716 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 426.44 грн |
| 10+ | 291.18 грн |
| 24+ | 285.35 грн |
| 80+ | 261.05 грн |
| 230+ | 259.52 грн |
| 450+ | 259.21 грн |
| LPC5512JBD100E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
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