Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35312) > Сторінка 343 з 589
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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PMV65XPEA215 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPackaging: Bulk Part Status: Active Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 2.8A (Ta) Rds On (Max) @ Id, Vgs: 78mOhm @ 2.8A, 4.5V Power Dissipation (Max): 480mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 1.25V @ 250µA Supplier Device Package: TO-236AB Grade: Automotive Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 9 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 618 pF @ 10 V Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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PMV65XP1215 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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PMV65XP/MI215 | NXP USA Inc. |
Description: P-CHANNEL MOSFETPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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PBSS2515M3145 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| 74LVC574APW/S400118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk |
на замовлення 13023 шт: термін постачання 21-31 дні (днів) |
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FS32K116BRT0MFMT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32HVQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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FS32K116LFT0MFMT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32HVQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 17K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 13x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LPC11A02UK,118 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 20WLCSPPackaging: Tape & Reel (TR) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 20-WLCSP (2.55x2.55) Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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LPC11A02UK,118 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 20WLCSPPackaging: Cut Tape (CT) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 20-WLCSP (2.55x2.55) Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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74ALVC125PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIESPackaging: Bulk |
на замовлення 1790 шт: термін постачання 21-31 дні (днів) |
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| TDF8554J/N3,112 | NXP USA Inc. |
Description: IC AUDIO POWER AMP DBS37P Packaging: Tray Package / Case: 37-SIP Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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BAW62,143 | NXP USA Inc. |
Description: DIODE STANDARD 75V 250MA ALF2Packaging: Bulk Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 4 ns Technology: Standard Capacitance @ Vr, F: 2pF @ 0V, 1MHz Current - Average Rectified (Io): 250mA Supplier Device Package: ALF2 Operating Temperature - Junction: 200°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 75 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA Current - Reverse Leakage @ Vr: 5 µA @ 75 V |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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74HC153PW-Q100118 | NXP USA Inc. |
Description: 74HC153 - 4 LINE MUXPackaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 8002 шт: термін постачання 21-31 дні (днів) |
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KITPF5020FRDMEVM | NXP USA Inc. |
Description: KITPF5020FRDMEVMPackaging: Bulk Utilized IC / Part: PF5020 Supplied Contents: Board(s) Embedded: No |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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PDTA144EU/ZL115 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk Part Status: Active |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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74AHCT259PW,118 | NXP USA Inc. |
Description: IC 8BIT ADDRESSBLE LATCH 16TSSOPPackaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Standard Mounting Type: Surface Mount Circuit: 1:8 Logic Type: D-Type, Addressable Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 8mA, 8mA Delay Time - Propagation: 4.1ns Supplier Device Package: 16-TSSOP |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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HEF4040BT-Q100118 | NXP USA Inc. |
Description: BINARY COUNTERPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PDZ5.6B/ZL115 | NXP USA Inc. |
Description: DIODE ZENER |
на замовлення 156000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||
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74LVC125APW/S999118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Obsolete Package / Case: 14-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 14-TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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74LVC125APW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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74LVC126APW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Obsolete |
на замовлення 11460 шт: термін постачання 21-31 дні (днів) |
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74LVC126APW/C4118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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BFU630F,115 | NXP USA Inc. |
Description: RF TRANS NPN 5.5V 21GHZ 4-DFPPackaging: Cut Tape (CT) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13dB ~ 22.5dB Power - Max: 200mW Current - Collector (Ic) (Max): 30mA Voltage - Collector Emitter Breakdown (Max): 5.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 5mA, 2V Frequency - Transition: 21GHz Noise Figure (dB Typ @ f): 0.75dB ~ 1.3dB @ 1.5GHz ~ 5.8GHz Supplier Device Package: 4-DFP Part Status: Active |
на замовлення 9705 шт: термін постачання 21-31 дні (днів) |
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| BC857AQA147 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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74HC158D/C118 | NXP USA Inc. |
Description: 74HC158 2 LINE MUXPackaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| OT409135 | NXP USA Inc. |
Description: NOW WEEN - OT409 - TBC - SC-73 Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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NVT2010BS,118 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR VOLT 24HVQFN |
на замовлення 998 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||
| PXLS60220AES | NXP USA Inc. |
Description: XTRINSIC 1 AXIS ACCELEROMETER Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PXLS60311AES | NXP USA Inc. |
Description: XTRINSIC 2 AXIS LOW/LOW XY ACCEL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PXLS60333AES | NXP USA Inc. |
Description: XTRINSIC 2 AXIS HIGH/HIGH XY ACC Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PXLS60422AES | NXP USA Inc. | Description: XTRINSIC 2 AXIS MED/MED XZ ACCEL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PXLS63322AES | NXP USA Inc. | Description: XTRINSIC 2 AXIS MED/MED XY ACCEL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PXLS63333AES | NXP USA Inc. | Description: XTRINSIC 2 AXIS HIGH/HIGH XY PSI |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PXLS63433AES | NXP USA Inc. |
Description: PSI5 PROTOCOL 2 AXIS HIGH/HIGH Packaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| PXLS80333AES | NXP USA Inc. | Description: 2 AXIS HI/HI XY |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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LPC5514JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 95 шт: термін постачання 21-31 дні (днів) |
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LPC55S14JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 113 шт: термін постачання 21-31 дні (днів) |
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LPC5516JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 154 шт: термін постачання 21-31 дні (днів) |
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LPC55S16JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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LPC5526JBD100K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 417 шт: термін постачання 21-31 дні (днів) |
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LPC5516JEV98E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 98VFBGAPackaging: Tray Package / Case: 98-VFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 98-VFBGA (7x7) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 248 шт: термін постачання 21-31 дні (днів) |
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LPC55S66JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 697 шт: термін постачання 21-31 дні (днів) |
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LPC55S26JEV98K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 98VFBGAPackaging: Tray Package / Case: 98-VFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 98-VFBGA (7x7) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 1112 шт: термін постачання 21-31 дні (днів) |
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LPC55S28JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 570 шт: термін постачання 21-31 дні (днів) |
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LPC55S28JBD100K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 421 шт: термін постачання 21-31 дні (днів) |
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LPC55S16JEV98E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 98VFBGAPackaging: Tray Package / Case: 98-VFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 98-VFBGA (7x7) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 1965 шт: термін постачання 21-31 дні (днів) |
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LPC5528JBD100K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 131 шт: термін постачання 21-31 дні (днів) |
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LPC5512JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 175 шт: термін постачання 21-31 дні (днів) |
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LPC55S14JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 70 шт: термін постачання 21-31 дні (днів) |
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LPC5516JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 102 шт: термін постачання 21-31 дні (днів) |
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LPC55S16JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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LPC5512JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64HTQFPPackaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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LPC5514JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 100HLQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 84 шт: термін постачання 21-31 дні (днів) |
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LPC55S66JEV98K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 98VFBGAPackaging: Tray Package / Case: 98-VFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 98-VFBGA (7x7) Number of I/O: 64 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| SAF775CHV/N208Q/KK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Type: Audio, Car Signal Processor Supplier Device Package: 176-HLQFP (24x24) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SAF4000EL/101S500Y | NXP USA Inc. | Description: SOFTWARE DEFINED RADIO |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| SAF4000EL/101S504Y | NXP USA Inc. | Description: SOFTWARE DEFINED RADIO |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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HEF4894BP,112 | NXP USA Inc. |
Description: IC REGISTER SHIFT 12STAGE 20-DIPPackaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: Open Drain Mounting Type: Through Hole Number of Elements: 1 Function: Serial to Parallel, Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 15V Supplier Device Package: 20-DIP Part Status: Obsolete Number of Bits per Element: 12 |
на замовлення 755 шт: термін постачання 21-31 дні (днів) |
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PDTC143XQA147 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk Part Status: Active Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V Supplier Device Package: DFN1010D-3 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 280 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 4.7 kOhms Resistor - Emitter Base (R2): 10 kOhms Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PDTC143EQA147 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| PMV65XPEA215 |
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Виробник: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.8A (Ta)
Rds On (Max) @ Id, Vgs: 78mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 480mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: TO-236AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 9 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 618 pF @ 10 V
Qualification: AEC-Q101
Description: P-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.8A (Ta)
Rds On (Max) @ Id, Vgs: 78mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 480mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: TO-236AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 9 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 618 pF @ 10 V
Qualification: AEC-Q101
товару немає в наявності
В кошику
од. на суму грн.
| PBSS2515M3145 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 74LVC574APW/S400118 |
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на замовлення 13023 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2049+ | 12.39 грн |
| FS32K116BRT0MFMT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| FS32K116LFT0MFMT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 17K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 13x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LPC11A02UK,118 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Number of I/O: 18
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LPC11A02UK,118 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-WLCSP (2.55x2.55)
Number of I/O: 18
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| 74ALVC125PW-Q100118 |
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на замовлення 1790 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1790+ | 14.10 грн |
| TDF8554J/N3,112 |
Виробник: NXP USA Inc.
Description: IC AUDIO POWER AMP DBS37P
Packaging: Tray
Package / Case: 37-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm
Part Status: Obsolete
Description: IC AUDIO POWER AMP DBS37P
Packaging: Tray
Package / Case: 37-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| BAW62,143 |
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Виробник: NXP USA Inc.
Description: DIODE STANDARD 75V 250MA ALF2
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
Description: DIODE STANDARD 75V 250MA ALF2
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 13172+ | 1.58 грн |
| 74HC153PW-Q100118 |
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Виробник: NXP USA Inc.
Description: 74HC153 - 4 LINE MUX
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: 74HC153 - 4 LINE MUX
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 8002 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1481+ | 15.06 грн |
| KITPF5020FRDMEVM |
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Виробник: NXP USA Inc.
Description: KITPF5020FRDMEVM
Packaging: Bulk
Utilized IC / Part: PF5020
Supplied Contents: Board(s)
Embedded: No
Description: KITPF5020FRDMEVM
Packaging: Bulk
Utilized IC / Part: PF5020
Supplied Contents: Board(s)
Embedded: No
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 21223.91 грн |
| PDTA144EU/ZL115 |
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на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6000+ | 3.78 грн |
| 74AHCT259PW,118 |
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Виробник: NXP USA Inc.
Description: IC 8BIT ADDRESSBLE LATCH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Delay Time - Propagation: 4.1ns
Supplier Device Package: 16-TSSOP
Description: IC 8BIT ADDRESSBLE LATCH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Delay Time - Propagation: 4.1ns
Supplier Device Package: 16-TSSOP
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 784+ | 28.62 грн |
| PDZ5.6B/ZL115 |
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Виробник: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
на замовлення 156000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 74LVC125APW/S999118 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Obsolete
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-TSSOP
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Obsolete
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-TSSOP
товару немає в наявності
В кошику
од. на суму грн.
| 74LVC126APW/AU118 |
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на замовлення 11460 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2959+ | 7.53 грн |
| BFU630F,115 |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 5.5V 21GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB ~ 22.5dB
Power - Max: 200mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 5mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 0.75dB ~ 1.3dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Part Status: Active
Description: RF TRANS NPN 5.5V 21GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB ~ 22.5dB
Power - Max: 200mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 5mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 0.75dB ~ 1.3dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Part Status: Active
на замовлення 9705 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 90.87 грн |
| 10+ | 54.57 грн |
| 100+ | 35.91 грн |
| 500+ | 26.16 грн |
| 1000+ | 23.73 грн |
| BC857AQA147 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 74HC158D/C118 |
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Виробник: NXP USA Inc.
Description: 74HC158 2 LINE MUX
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: 74HC158 2 LINE MUX
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
товару немає в наявності
В кошику
од. на суму грн.
| NVT2010BS,118 |
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Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR VOLT 24HVQFN
Description: IC TRANSLATOR BIDIR VOLT 24HVQFN
на замовлення 998 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| PXLS60422AES |
Виробник: NXP USA Inc.
Description: XTRINSIC 2 AXIS MED/MED XZ ACCEL
Description: XTRINSIC 2 AXIS MED/MED XZ ACCEL
товару немає в наявності
В кошику
од. на суму грн.
| PXLS63322AES |
Виробник: NXP USA Inc.
Description: XTRINSIC 2 AXIS MED/MED XY ACCEL
Description: XTRINSIC 2 AXIS MED/MED XY ACCEL
товару немає в наявності
В кошику
од. на суму грн.
| PXLS63333AES |
Виробник: NXP USA Inc.
Description: XTRINSIC 2 AXIS HIGH/HIGH XY PSI
Description: XTRINSIC 2 AXIS HIGH/HIGH XY PSI
товару немає в наявності
В кошику
од. на суму грн.
| PXLS80333AES |
Виробник: NXP USA Inc.
Description: 2 AXIS HI/HI XY
Description: 2 AXIS HI/HI XY
товару немає в наявності
В кошику
од. на суму грн.
| LPC5514JBD64E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 95 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 501.44 грн |
| 10+ | 377.22 грн |
| LPC55S14JBD64E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 113 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 550.18 грн |
| 10+ | 413.42 грн |
| LPC5516JBD64E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 154 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 295.74 грн |
| 10+ | 260.60 грн |
| 25+ | 246.44 грн |
| LPC55S16JBD64E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 160 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 581.57 грн |
| 10+ | 440.07 грн |
| 160+ | 364.34 грн |
| LPC5526JBD100K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 417 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 382.48 грн |
| 10+ | 284.31 грн |
| 25+ | 279.50 грн |
| LPC5516JEV98E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 248 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 535.31 грн |
| 10+ | 396.63 грн |
| 25+ | 366.98 грн |
| 80+ | 317.96 грн |
| LPC55S66JBD64K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 697 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 645.18 грн |
| 10+ | 428.45 грн |
| 25+ | 378.50 грн |
| 80+ | 309.95 грн |
| 230+ | 279.39 грн |
| LPC55S26JEV98K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 1112 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 270.13 грн |
| LPC55S28JBD64K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 570 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 509.70 грн |
| 10+ | 395.20 грн |
| 25+ | 370.64 грн |
| 100+ | 326.34 грн |
| 250+ | 317.62 грн |
| LPC55S28JBD100K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 421 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 541.09 грн |
| 10+ | 308.73 грн |
| 24+ | 301.99 грн |
| 80+ | 276.73 грн |
| LPC55S16JEV98E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 1965 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 458.48 грн |
| 10+ | 341.03 грн |
| 25+ | 315.75 грн |
| 80+ | 276.24 грн |
| LPC5528JBD100K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 131 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 680.70 грн |
| 10+ | 515.08 грн |
| 80+ | 426.40 грн |
| LPC5512JBD100E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 175 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 375.04 грн |
| 10+ | 274.37 грн |
| 25+ | 252.74 грн |
| 90+ | 216.30 грн |
| LPC55S14JBD100E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 70 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 573.31 грн |
| 10+ | 433.94 грн |
| LPC5516JBD100E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 102 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 503.09 грн |
| 10+ | 372.45 грн |
| 25+ | 344.39 грн |
| 90+ | 296.05 грн |
| LPC55S16JBD100E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 669.96 грн |
| LPC5512JBD64E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 18 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 295.74 грн |
| 10+ | 156.55 грн |
| LPC5514JBD100E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 84 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 528.70 грн |
| 10+ | 400.21 грн |
| LPC55S66JEV98K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| SAF775CHV/N208Q/KK |
Виробник: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| SAF4000EL/101S500Y |
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Description: SOFTWARE DEFINED RADIO
товару немає в наявності
В кошику
од. на суму грн.
| SAF4000EL/101S504Y |
Виробник: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Description: SOFTWARE DEFINED RADIO
товару немає в наявності
В кошику
од. на суму грн.
| HEF4894BP,112 |
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Виробник: NXP USA Inc.
Description: IC REGISTER SHIFT 12STAGE 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Open Drain
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of Bits per Element: 12
Description: IC REGISTER SHIFT 12STAGE 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Open Drain
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of Bits per Element: 12
на замовлення 755 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 174+ | 136.81 грн |
| PDTC143XQA147 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 280 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 280 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
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| PDTC143EQA147 |
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Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.






















