Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36377) > Сторінка 357 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PDTB123EU115 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
на замовлення 145960 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
PDTB123YU115 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
на замовлення 75890 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
PDTB123YQA147 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
на замовлення 44000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
PDTB123EU135 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
на замовлення 39549 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
PDTB123YU135 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
на замовлення 30000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| BUK7506-55A127 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET Input Capacitance (Ciss) (Max) @ Vds: 6000 pF @ 25 V Drain to Source Voltage (Vdss): 55 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 10V Part Status: Active Supplier Device Package: TO-220AB Vgs(th) (Max) @ Id: 4V @ 1mA Power Dissipation (Max): 300W (Tc) Rds On (Max) @ Id, Vgs: 6.3mOhm @ 25A, 10V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-220-3 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
PMN25EN,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 6.2A 6TSOPInput Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V Drain to Source Voltage (Vdss): 30 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Part Status: Obsolete Supplier Device Package: SC-74 Vgs(th) (Max) @ Id: 2.5V @ 250µA Power Dissipation (Max): 540mW (Ta), 6.25W (Tc) Rds On (Max) @ Id, Vgs: 23mOhm @ 6.2A, 10V Current - Continuous Drain (Id) @ 25°C: 6.2A (Ta) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-74, SOT-457 Packaging: Bulk |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
PMN27UP,115-NXP | NXP USA Inc. |
Description: MOSFET P-CH 20V 5.7A 6TSOPInput Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 10 V Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 4.5 V Drain to Source Voltage (Vdss): 20 V Vgs (Max): ±8V Part Status: Active Supplier Device Package: 6-TSOP Vgs(th) (Max) @ Id: 950mV @ 250µA Power Dissipation (Max): 540mW (Ta), 6.25W (Tc) Rds On (Max) @ Id, Vgs: 32mOhm @ 2.4A, 4.5V Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta) FET Type: P-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-74, SOT-457 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
PMN20EN,115 | NXP USA Inc. |
Description: MOSFET N-CH 30V 6.7A 6TSOP FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-74, SOT-457 Packaging: Bulk Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V Drain to Source Voltage (Vdss): 30 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Part Status: Obsolete Supplier Device Package: SC-74 Vgs(th) (Max) @ Id: 2.5V @ 250µA Power Dissipation (Max): 545mW (Ta) Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj) |
на замовлення 18000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
PMV28UN,215 | NXP USA Inc. |
Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
на замовлення 6399 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
|
PH9030AL115 | NXP USA Inc. |
Description: POWER FIELD-EFFECT TRANSISTOR |
на замовлення 10500 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
|
PHP225,118-NXP | NXP USA Inc. | Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
PHT6N06T,135 | NXP USA Inc. |
Description: MOSFET N-CH 55V 5.5A SOT223 Input Capacitance (Ciss) (Max) @ Vds: 175 pF @ 25 V Gate Charge (Qg) (Max) @ Vgs: 5.6 nC @ 10 V Drain to Source Voltage (Vdss): 55 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 10V Supplier Device Package: SC-73 Vgs(th) (Max) @ Id: 4V @ 1mA Power Dissipation (Max): 8.3W (Tc) Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 10V Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Packaging: Bulk |
на замовлення 8364 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| PSMN3R9-60XS127 | NXP USA Inc. |
Description: POWER FIELD-EFFECT TRANSISTORPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| MCF5212LCVM66-NXP | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| 74HCT573DB,112-NXP | NXP USA Inc. |
Description: IC D-TYPE TRANSP SGL 8:8 20SSOPLogic Type: D-Type Transparent Latch Circuit: 8:8 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 20-SSOP (0.209", 5.30mm Width) Packaging: Tube Part Status: Active Supplier Device Package: 20-SSOP Delay Time - Propagation: 17ns Current - Output High, Low: 6mA, 6mA Independent Circuits: 1 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
LPC2364FET100,518 | NXP USA Inc. |
Description: IC MCU 16/32BIT 128KB 100TFBGADigiKey Programmable: Not Verified Number of I/O: 70 Part Status: Not For New Designs Supplier Device Package: 100-TFBGA (9x9) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16/32-Bit Data Converters: A/D 6x10b; D/A 1x10b Core Processor: ARM7® Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 34K x 8 Program Memory Size: 128KB (128K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 100-TFBGA Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
PDTD113ZQA147 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 50V 500MAPackaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V Supplier Device Package: DFN1010D-3 Grade: Automotive Part Status: Active Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 940 mW Frequency - Transition: 210 MHz Resistor - Base (R1): 1 kOhms Resistor - Emitter Base (R2): 10 kOhms Qualification: AEC-Q101 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| PDTD113ZU115 | NXP USA Inc. |
Description: 500 MA, 50 V NPN RESISTOR-EQUIPPPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
PDTD143XT215 | NXP USA Inc. |
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| PDTD123YU115 | NXP USA Inc. | Description: 0.5A, 50V, NPN, SOT323 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
ASL5008FHV/0Y | NXP USA Inc. |
Description: ASL5008FHV/0 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
74LVC16245AEV,518 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 56VFBGAMounting Type: Surface Mount Output Type: 3-State Package / Case: 56-VFBGA Packaging: Bulk Part Status: Active Supplier Device Package: 56-VFBGA (4.5x7) Current - Output High, Low: 24mA, 24mA Number of Bits per Element: 8 Voltage - Supply: 1.2V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Transceiver, Non-Inverting Number of Elements: 2 |
на замовлення 3239 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| TJA1027TK/20/1,118 | NXP USA Inc. | Description: LIN 2.2A/SAE J2602 TRANSCEIVER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| TJA1027TK/20/1 | NXP USA Inc. | Description: LIN 2.2A/SAE J2602 TRANSCEIVER |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| OM13062UL,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC11U37H EVAL BRD Platform: LPCXpresso™ Utilized IC / Part: LPC11U37H Core Processor: ARM® Cortex®-M0 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
OM13022598 | NXP USA Inc. |
Description: IAR KICKSTART LPC11U24 EVAL BRD Platform: IAR KickStart Utilized IC / Part: LPC11U24 Core Processor: ARM® Cortex®-M0 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| MIMX8MD6DVAJZAA557 | NXP USA Inc. |
Description: 8M QUAD APPLICATIONS PROCESSOR |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
MIMX8MQ6DVAJZAA | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGAAdditional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC Part Status: Active Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Graphics Acceleration: Yes RAM Controllers: DDR3L, DDR4, LPDDR4 Co-Processors/DSP: ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit USB: USB 3.0 (2) Ethernet: GbE Supplier Device Package: 621-FCPBGA (17x17) Core Processor: ARM® Cortex®-A53 Operating Temperature: 0°C ~ 95°C (TJ) Speed: 1.5GHz Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Packaging: Tray |
на замовлення 758 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| MIMX8MQ6DVAJZAA,557 | NXP USA Inc. |
Description: I.MX 8M: ARM CORTEX A53 QUAD CORPackaging: Tray Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
8MIC-RPI-MX8 | NXP USA Inc. |
Description: 8 MICROPHONE BOARD FOR VOICEPart Status: Active Contents: Board(s) Type: Audio Function: Microphone Packaging: Bulk |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| 74LVC1T45U/C025 | NXP USA Inc. |
Description: BUS TRANSCVR, LVC/LCX/Z SERIESPart Status: Active Packaging: Bulk Number of Circuits: 1 Voltage - VCCB: 1.2 V ~ 5.5 V Voltage - VCCA: 1.2 V ~ 5.5 V Channels per Circuit: 1 Translator Type: Voltage Level Output Signal: CMOS, LVTTL Channel Type: Bidirectional Data Rate: 420Mbps Operating Temperature: -40°C ~ 125°C (TA) Output Type: Tri-State |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
LPC2420FBD208K | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208LQFPNumber of I/O: 160 Part Status: Active Supplier Device Package: 208-LQFP (28x28) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16/32-Bit Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM7® Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 82K x 8 Speed: 72MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
на замовлення 340 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
74HC253DB,112-NXP | NXP USA Inc. |
Description: IC DATA SEL/MULTPL 2X4:1 16SSOPPart Status: Active Supplier Device Package: 16-SSOP Voltage Supply Source: Single Supply Current - Output High, Low: 7.8mA, 7.8mA Independent Circuits: 2 Voltage - Supply: 2V ~ 6V Operating Temperature: -40°C ~ 125°C (TA) Type: Data Selector/Multiplexer Circuit: 2 x 4:1 Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| JN5179-001-M10Z | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TH SMDPart Status: Obsolete Serial Interfaces: I2C, SPI, UART RF Family/Standard: 802.15.4 Antenna Type: Integrated, Trace Current - Transmitting: 114mA Current - Receiving: 16.4mA Protocol: Zigbee® Power - Output: 8.5dBm Voltage - Supply: 3.6V Operating Temperature: -40°C ~ 85°C Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -96dBm Package / Case: Module Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 3965 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
|
MCIMX6Q7CVT08AE | NXP USA Inc. |
Description: IC MPU I.MX6Q 800MHZ 624FCBGAPackaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
на замовлення 238 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
FRDM-K32L2B3 | NXP USA Inc. |
Description: FREEDOM EVAL BOARD K32L2B3Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: K32 L2B Platform: Freedom |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
S08PB16-EVK | NXP USA Inc. |
Description: S08PLS EVAL KITPackaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08PB16 Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
MPC5748G-GW-RDB | NXP USA Inc. |
Description: MPC5748G ETHERNET GATEWAYPart Status: Active Utilized IC / Part: MPC5748G Board Type: Evaluation Platform Core Processor: e200 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Bulk |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
BC859CW/ZL115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPart Status: Active Packaging: Bulk |
на замовлення 280999 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
MKV46F128VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
A2I20D020GNR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WBSupplier Device Package: TO-270WB-17 Test Frequency: 2.2GHz Gain: 35dB Voltage - Supply: 28V RF Type: W-CDMA Frequency: 1.4GHz ~ 2.2GHz Mounting Type: Surface Mount Package / Case: TO-270-17 Variant, Flat Leads Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
SPC5645SF1VLUR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Number of I/O: 128 Part Status: Active Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x10b Core Processor: e200z4d Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1.064M x 8 Program Memory Size: 2MB (2M x 8) Speed: 125MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
LS1043AXE7KQA | NXP USA Inc. |
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1. |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
BF821/DG/B2215 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORCurrent - Collector Cutoff (Max): 10nA (ICBO) Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA Operating Temperature: 150°C (TJ) Transistor Type: PNP Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Part Status: Active Packaging: Bulk Qualification: AEC-Q101 Power - Max: 250 mW Voltage - Collector Emitter Breakdown (Max): 300 V Current - Collector (Ic) (Max): 50 mA Grade: Automotive Supplier Device Package: SOT-23-3 (TO-236) Frequency - Transition: 60MHz DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
PCA9450CHNY | NXP USA Inc. |
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQFPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.85V ~ 5.5V Applications: General Purpose Current - Supply: 20µA Supplier Device Package: 56-HVQFN (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
PCA9450CHNY | NXP USA Inc. |
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQFPackaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.85V ~ 5.5V Applications: General Purpose Current - Supply: 20µA Supplier Device Package: 56-HVQFN (7x7) |
на замовлення 173 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
LPC1820FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPPart Status: Discontinued at Digi-Key Supplier Device Package: 144-LQFP (20x20) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M3 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 168K x 8 Speed: 180MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 83 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BZX84-B9V1/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENERPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
BZX84-B9V1/LF1R | NXP USA Inc. |
Description: DIODE ZENER 9.1V 250MW TO236ABQualification: AEC-Q101 Grade: Automotive Current - Reverse Leakage @ Vr: 500 nA @ 6 V Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Power - Max: 250 mW Part Status: Active Supplier Device Package: SOT-23 (TO-236AB) Impedance (Max) (Zzt): 15 Ohms Voltage - Zener (Nom) (Vz): 9.1 V Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Tolerance: ±2% Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
74LVC1G19GW-Q100125 | NXP USA Inc. |
Description: DECODER/DRIVER, LVC/LCX/Z SERIESPart Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| 74LVC1G19GS132 | NXP USA Inc. |
Description: DECODER/DRIVER, LVC/LCX/Z SERIE Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BLF8G10LS-160,112 | NXP USA Inc. |
Description: RF PFET, 1-ELEMENT, ULTRA HIGH F |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | |||||||||||||||
| MC908QY4CDWER518 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08DigiKey Programmable: Not Verified Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
MPF5024AMBA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 4 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
74HCT4066PW-Q100118 | NXP USA Inc. |
Description: DIFFERENTIAL MUXQualification: AEC-Q100 Number of Circuits: 4 Grade: Automotive Current - Leakage (IS(off)) (Max): 1µA Channel Capacitance (CS(off), CD(off)): 3.5pF Switch Time (Ton, Toff) (Max): 20ns, 30ns Channel-to-Channel Matching (ΔRon): 3Ohm Multiplexer/Demultiplexer Circuit: 1:1 Switch Circuit: SPST - NO Crosstalk: -60dB @ 1MHz Voltage - Supply, Single (V+): 4.5V ~ 5.5V Supplier Device Package: 14-TSSOP -3db Bandwidth: 200MHz On-State Resistance (Max): 95Ohm Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 14-TSSOP (0.173", 4.40mm Width) Part Status: Active Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
74HCT4066PW/C118 | NXP USA Inc. |
Description: 74HCT4066PW - SPST, 4 FUNCPart Status: Active Packaging: Bulk |
на замовлення 3500 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| 74HCT4066D-Q100118 | NXP USA Inc. |
Description: DIFFERENTIAL MUX Packaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
NTP52101G0JHKZ | NXP USA Inc. |
Description: NTAGPackaging: Tape & Reel (TR) Package / Case: 16-XFQFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: PWM Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 16-XQFN (1.8x2.6) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
NTP52101G0JHKZ | NXP USA Inc. |
Description: NTAGPackaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: PWM Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 16-XQFN (1.8x2.6) Part Status: Active |
на замовлення 4697 шт: термін постачання 21-31 дні (днів) |
|
| PDTB123EU115 |
![]() |
на замовлення 145960 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8036+ | 3.00 грн |
| PDTB123YU115 |
![]() |
на замовлення 75890 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8036+ | 3.00 грн |
| PDTB123YQA147 |
![]() |
на замовлення 44000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8219+ | 3.00 грн |
| PDTB123EU135 |
![]() |
на замовлення 39549 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8036+ | 2.89 грн |
| PDTB123YU135 |
![]() |
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8036+ | 2.89 грн |
| BUK7506-55A127 |
Виробник: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 6000 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
Description: N-CHANNEL POWER MOSFET
Input Capacitance (Ciss) (Max) @ Vds: 6000 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| PMN25EN,115 |
![]() |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 6.2A 6TSOP
Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-74
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 23mOhm @ 6.2A, 10V
Current - Continuous Drain (Id) @ 25°C: 6.2A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Bulk
Description: MOSFET N-CH 30V 6.2A 6TSOP
Input Capacitance (Ciss) (Max) @ Vds: 492 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-74
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 23mOhm @ 6.2A, 10V
Current - Continuous Drain (Id) @ 25°C: 6.2A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Bulk
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3328+ | 6.51 грн |
| PMN27UP,115-NXP |
![]() |
Виробник: NXP USA Inc.
Description: MOSFET P-CH 20V 5.7A 6TSOP
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Part Status: Active
Supplier Device Package: 6-TSOP
Vgs(th) (Max) @ Id: 950mV @ 250µA
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 2.4A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Bulk
Description: MOSFET P-CH 20V 5.7A 6TSOP
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Part Status: Active
Supplier Device Package: 6-TSOP
Vgs(th) (Max) @ Id: 950mV @ 250µA
Power Dissipation (Max): 540mW (Ta), 6.25W (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 2.4A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 5.7A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| PMN20EN,115 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 6.7A 6TSOP
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-74
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 545mW (Ta)
Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V
Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj)
Description: MOSFET N-CH 30V 6.7A 6TSOP
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: SC-74
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 545mW (Ta)
Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V
Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj)
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2664+ | 8.35 грн |
| PMV28UN,215 |
![]() |
Виробник: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
на замовлення 6399 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| PH9030AL115 |
![]() |
Виробник: NXP USA Inc.
Description: POWER FIELD-EFFECT TRANSISTOR
Description: POWER FIELD-EFFECT TRANSISTOR
на замовлення 10500 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| PHP225,118-NXP |
Виробник: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
товару немає в наявності
В кошику
од. на суму грн.
| PHT6N06T,135 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 5.5A SOT223
Input Capacitance (Ciss) (Max) @ Vds: 175 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 5.6 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 8.3W (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 10V
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
Description: MOSFET N-CH 55V 5.5A SOT223
Input Capacitance (Ciss) (Max) @ Vds: 175 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 5.6 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 8.3W (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 5A, 10V
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
на замовлення 8364 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1332+ | 17.46 грн |
| MCF5212LCVM66-NXP |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
товару немає в наявності
В кошику
од. на суму грн.
| 74HCT573DB,112-NXP |
![]() |
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Part Status: Active
Supplier Device Package: 20-SSOP
Delay Time - Propagation: 17ns
Current - Output High, Low: 6mA, 6mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Part Status: Active
Supplier Device Package: 20-SSOP
Delay Time - Propagation: 17ns
Current - Output High, Low: 6mA, 6mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
товару немає в наявності
В кошику
од. на суму грн.
| LPC2364FET100,518 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 128KB 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Not For New Designs
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 6x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 34K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Cut Tape (CT)
Description: IC MCU 16/32BIT 128KB 100TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 70
Part Status: Not For New Designs
Supplier Device Package: 100-TFBGA (9x9)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 6x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 34K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 100-TFBGA
Packaging: Cut Tape (CT)
товару немає в наявності
В кошику
од. на суму грн.
| PDTD113ZQA147 |
![]() |
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 500MA
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 940 mW
Frequency - Transition: 210 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
Description: TRANS PREBIAS NPN 50V 500MA
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Part Status: Active
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 940 mW
Frequency - Transition: 210 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
товару немає в наявності
В кошику
од. на суму грн.
| PDTD113ZU115 |
![]() |
Виробник: NXP USA Inc.
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP
Packaging: Bulk
Part Status: Active
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP
Packaging: Bulk
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| PDTD123YU115 |
Виробник: NXP USA Inc.
Description: 0.5A, 50V, NPN, SOT323
Description: 0.5A, 50V, NPN, SOT323
товару немає в наявності
В кошику
од. на суму грн.
| ASL5008FHV/0Y |
![]() |
Виробник: NXP USA Inc.
Description: ASL5008FHV/0
Description: ASL5008FHV/0
товару немає в наявності
В кошику
од. на суму грн.
| 74LVC16245AEV,518 |
![]() |
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-VFBGA
Packaging: Bulk
Part Status: Active
Supplier Device Package: 56-VFBGA (4.5x7)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-VFBGA
Packaging: Bulk
Part Status: Active
Supplier Device Package: 56-VFBGA (4.5x7)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
на замовлення 3239 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 143+ | 158.14 грн |
| TJA1027TK/20/1,118 |
Виробник: NXP USA Inc.
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
товару немає в наявності
В кошику
од. на суму грн.
| TJA1027TK/20/1 |
Виробник: NXP USA Inc.
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
товару немає в наявності
В кошику
од. на суму грн.
| OM13062UL,598 |
Виробник: NXP USA Inc.
Description: LPCXPRESSO LPC11U37H EVAL BRD
Platform: LPCXpresso™
Utilized IC / Part: LPC11U37H
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: LPCXPRESSO LPC11U37H EVAL BRD
Platform: LPCXpresso™
Utilized IC / Part: LPC11U37H
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| OM13022598 |
Виробник: NXP USA Inc.
Description: IAR KICKSTART LPC11U24 EVAL BRD
Platform: IAR KickStart
Utilized IC / Part: LPC11U24
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: IAR KICKSTART LPC11U24 EVAL BRD
Platform: IAR KickStart
Utilized IC / Part: LPC11U24
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MIMX8MD6DVAJZAA557 |
![]() |
Виробник: NXP USA Inc.
Description: 8M QUAD APPLICATIONS PROCESSOR
Description: 8M QUAD APPLICATIONS PROCESSOR
товару немає в наявності
В кошику
од. на суму грн.
| MIMX8MQ6DVAJZAA |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: GbE
Supplier Device Package: 621-FCPBGA (17x17)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Tray
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Part Status: Active
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR3L, DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M4
Number of Cores/Bus Width: 4 Core, 64-Bit
USB: USB 3.0 (2)
Ethernet: GbE
Supplier Device Package: 621-FCPBGA (17x17)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Tray
на замовлення 758 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 4058.35 грн |
| MIMX8MQ6DVAJZAA,557 |
![]() |
Виробник: NXP USA Inc.
Description: I.MX 8M: ARM CORTEX A53 QUAD COR
Packaging: Tray
Part Status: Active
Description: I.MX 8M: ARM CORTEX A53 QUAD COR
Packaging: Tray
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 8MIC-RPI-MX8 |
![]() |
Виробник: NXP USA Inc.
Description: 8 MICROPHONE BOARD FOR VOICE
Part Status: Active
Contents: Board(s)
Type: Audio
Function: Microphone
Packaging: Bulk
Description: 8 MICROPHONE BOARD FOR VOICE
Part Status: Active
Contents: Board(s)
Type: Audio
Function: Microphone
Packaging: Bulk
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 16249.69 грн |
| 74LVC1T45U/C025 |
![]() |
Виробник: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
Number of Circuits: 1
Voltage - VCCB: 1.2 V ~ 5.5 V
Voltage - VCCA: 1.2 V ~ 5.5 V
Channels per Circuit: 1
Translator Type: Voltage Level
Output Signal: CMOS, LVTTL
Channel Type: Bidirectional
Data Rate: 420Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Output Type: Tri-State
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
Number of Circuits: 1
Voltage - VCCB: 1.2 V ~ 5.5 V
Voltage - VCCA: 1.2 V ~ 5.5 V
Channels per Circuit: 1
Translator Type: Voltage Level
Output Signal: CMOS, LVTTL
Channel Type: Bidirectional
Data Rate: 420Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Output Type: Tri-State
товару немає в наявності
В кошику
од. на суму грн.
| LPC2420FBD208K |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Number of I/O: 160
Part Status: Active
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Number of I/O: 160
Part Status: Active
Supplier Device Package: 208-LQFP (28x28)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
на замовлення 340 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 996.07 грн |
| 10+ | 767.04 грн |
| 180+ | 699.68 грн |
| 74HC253DB,112-NXP |
![]() |
Виробник: NXP USA Inc.
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP
Part Status: Active
Supplier Device Package: 16-SSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 7.8mA, 7.8mA
Independent Circuits: 2
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Data Selector/Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP
Part Status: Active
Supplier Device Package: 16-SSOP
Voltage Supply Source: Single Supply
Current - Output High, Low: 7.8mA, 7.8mA
Independent Circuits: 2
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: Data Selector/Multiplexer
Circuit: 2 x 4:1
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| JN5179-001-M10Z |
![]() |
Виробник: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TH SMD
Part Status: Obsolete
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Antenna Type: Integrated, Trace
Current - Transmitting: 114mA
Current - Receiving: 16.4mA
Protocol: Zigbee®
Power - Output: 8.5dBm
Voltage - Supply: 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -96dBm
Package / Case: Module
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TH SMD
Part Status: Obsolete
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: 802.15.4
Antenna Type: Integrated, Trace
Current - Transmitting: 114mA
Current - Receiving: 16.4mA
Protocol: Zigbee®
Power - Output: 8.5dBm
Voltage - Supply: 3.6V
Operating Temperature: -40°C ~ 85°C
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -96dBm
Package / Case: Module
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 3965 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 25+ | 836.89 грн |
| MCIMX6Q7CVT08AE |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6Q 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
на замовлення 238 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7995.49 грн |
| 10+ | 6468.58 грн |
| 60+ | 5932.84 грн |
| FRDM-K32L2B3 |
![]() |
Виробник: NXP USA Inc.
Description: FREEDOM EVAL BOARD K32L2B3
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2B
Platform: Freedom
Description: FREEDOM EVAL BOARD K32L2B3
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2B
Platform: Freedom
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2170.95 грн |
| S08PB16-EVK |
![]() |
Виробник: NXP USA Inc.
Description: S08PLS EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08PB16
Part Status: Active
Description: S08PLS EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08PB16
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2207.34 грн |
| MPC5748G-GW-RDB |
![]() |
Виробник: NXP USA Inc.
Description: MPC5748G ETHERNET GATEWAY
Part Status: Active
Utilized IC / Part: MPC5748G
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Description: MPC5748G ETHERNET GATEWAY
Part Status: Active
Utilized IC / Part: MPC5748G
Board Type: Evaluation Platform
Core Processor: e200
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 40910.24 грн |
| BC859CW/ZL115 |
![]() |
Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Part Status: Active
Packaging: Bulk
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Part Status: Active
Packaging: Bulk
на замовлення 280999 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 15000+ | 1.58 грн |
| MKV46F128VLL16 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Description: IC MCU 32BIT 128KB FLASH 100LQFP
товару немає в наявності
В кошику
од. на суму грн.
| A2I20D020GNR1 |
![]() |
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Supplier Device Package: TO-270WB-17
Test Frequency: 2.2GHz
Gain: 35dB
Voltage - Supply: 28V
RF Type: W-CDMA
Frequency: 1.4GHz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: TO-270-17 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Supplier Device Package: TO-270WB-17
Test Frequency: 2.2GHz
Gain: 35dB
Voltage - Supply: 28V
RF Type: W-CDMA
Frequency: 1.4GHz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: TO-270-17 Variant, Flat Leads
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| SPC5645SF1VLUR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Number of I/O: 128
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Number of I/O: 128
Part Status: Active
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LS1043AXE7KQA |
![]() |
Виробник: NXP USA Inc.
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1.
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1.
товару немає в наявності
В кошику
од. на суму грн.
| BF821/DG/B2215 |
![]() |
Виробник: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Current - Collector Cutoff (Max): 10nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA
Operating Temperature: 150°C (TJ)
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Part Status: Active
Packaging: Bulk
Qualification: AEC-Q101
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 300 V
Current - Collector (Ic) (Max): 50 mA
Grade: Automotive
Supplier Device Package: SOT-23-3 (TO-236)
Frequency - Transition: 60MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Current - Collector Cutoff (Max): 10nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA
Operating Temperature: 150°C (TJ)
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Part Status: Active
Packaging: Bulk
Qualification: AEC-Q101
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 300 V
Current - Collector (Ic) (Max): 50 mA
Grade: Automotive
Supplier Device Package: SOT-23-3 (TO-236)
Frequency - Transition: 60MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
товару немає в наявності
В кошику
од. на суму грн.
| PCA9450CHNY |
![]() |
Виробник: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
товару немає в наявності
В кошику
од. на суму грн.
| PCA9450CHNY |
![]() |
Виробник: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
на замовлення 173 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 411.40 грн |
| 10+ | 303.30 грн |
| 25+ | 280.09 грн |
| 100+ | 238.92 грн |
| LPC1820FBD144,551 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Part Status: Discontinued at Digi-Key
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 168K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 83
Description: IC MCU 32BIT ROMLESS 144LQFP
Part Status: Discontinued at Digi-Key
Supplier Device Package: 144-LQFP (20x20)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 168K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 83
товару немає в наявності
В кошику
од. на суму грн.
| BZX84-B9V1/LF1R |
![]() |
Виробник: NXP USA Inc.
Description: DIODE ZENER 9.1V 250MW TO236AB
Qualification: AEC-Q101
Grade: Automotive
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 15 Ohms
Voltage - Zener (Nom) (Vz): 9.1 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Description: DIODE ZENER 9.1V 250MW TO236AB
Qualification: AEC-Q101
Grade: Automotive
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Power - Max: 250 mW
Part Status: Active
Supplier Device Package: SOT-23 (TO-236AB)
Impedance (Max) (Zzt): 15 Ohms
Voltage - Zener (Nom) (Vz): 9.1 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Tolerance: ±2%
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| 74LVC1G19GW-Q100125 |
![]() |
Виробник: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 74LVC1G19GS132 |
Виробник: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIE
Part Status: Active
Packaging: Bulk
Description: DECODER/DRIVER, LVC/LCX/Z SERIE
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| BLF8G10LS-160,112 |
![]() |
Виробник: NXP USA Inc.
Description: RF PFET, 1-ELEMENT, ULTRA HIGH F
Description: RF PFET, 1-ELEMENT, ULTRA HIGH F
на замовлення 4 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| MC908QY4CDWER518 |
![]() |
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
Description: MICROCONTROLLER, 8 BIT, HC08/S08
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MPF5024AMBA0ES |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 490 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 500.81 грн |
| 10+ | 372.47 грн |
| 25+ | 344.97 грн |
| 100+ | 295.37 грн |
| 490+ | 273.91 грн |
| 74HCT4066PW-Q100118 |
![]() |
Виробник: NXP USA Inc.
Description: DIFFERENTIAL MUX
Qualification: AEC-Q100
Number of Circuits: 4
Grade: Automotive
Current - Leakage (IS(off)) (Max): 1µA
Channel Capacitance (CS(off), CD(off)): 3.5pF
Switch Time (Ton, Toff) (Max): 20ns, 30ns
Channel-to-Channel Matching (ΔRon): 3Ohm
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NO
Crosstalk: -60dB @ 1MHz
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Supplier Device Package: 14-TSSOP
-3db Bandwidth: 200MHz
On-State Resistance (Max): 95Ohm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Part Status: Active
Packaging: Bulk
Description: DIFFERENTIAL MUX
Qualification: AEC-Q100
Number of Circuits: 4
Grade: Automotive
Current - Leakage (IS(off)) (Max): 1µA
Channel Capacitance (CS(off), CD(off)): 3.5pF
Switch Time (Ton, Toff) (Max): 20ns, 30ns
Channel-to-Channel Matching (ΔRon): 3Ohm
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NO
Crosstalk: -60dB @ 1MHz
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Supplier Device Package: 14-TSSOP
-3db Bandwidth: 200MHz
On-State Resistance (Max): 95Ohm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Part Status: Active
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 74HCT4066PW/C118 |
![]() |
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2404+ | 9.49 грн |
| NTP52101G0JHKZ |
![]() |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| NTP52101G0JHKZ |
![]() |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
на замовлення 4697 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 94.94 грн |
| 10+ | 78.32 грн |
| 25+ | 73.87 грн |
| 100+ | 63.58 грн |
| 250+ | 60.13 грн |
| 500+ | 57.69 грн |
| 1000+ | 54.49 грн |





































