Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36377) > Сторінка 376 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| PDTC124XMB315 | NXP USA Inc. |
Description: NOW NEXPERIA PDTC124XMB - SMALL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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PDTC124TMB315 | NXP USA Inc. |
Description: TRANS PREBIASQualification: AEC-Q101 Resistor - Base (R1): 22 kOhms Frequency - Transition: 230 MHz Power - Max: 250 mW Voltage - Collector Emitter Breakdown (Max): 50 V Current - Collector (Ic) (Max): 100 mA Grade: Automotive Supplier Device Package: DFN1006B-3 DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Current - Collector Cutoff (Max): 1µA Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Transistor Type: NPN - Pre-Biased Mounting Type: Surface Mount Package / Case: SC-101, SOT-883 Packaging: Bulk |
на замовлення 190000 шт: термін постачання 21-31 дні (днів) |
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BAS21AVD/DG/B2135 | NXP USA Inc. |
Description: BAS21AVD - RECTIFIER DIODE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| BAS21AVD135 | NXP USA Inc. | Description: NOW NEXPERIA BAS21AVD - RECTIFIE |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MC912D60AVFUE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 80QFPDigiKey Programmable: Not Verified Number of I/O: 48 Supplier Device Package: 80-QFP (14x14) Peripherals: POR, PWM, WDT Connectivity: CANbus, MI Bus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x8/10b Core Processor: CPU12 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C RAM Size: 2K x 8 Program Memory Size: 60KB (60K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| S912D60AH2VPVE | NXP USA Inc. | Description: IC MCU 16BIT SGF 112LQFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| S912D60AH2VPVER | NXP USA Inc. | Description: IC MCU 16BIT SGF 112LQFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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74LV241DB,112 | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 20SSOPPackaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 20-SSOP |
на замовлення 1348 шт: термін постачання 21-31 дні (днів) |
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74LV241N,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20DIPSupplier Device Package: 20-DIP Current - Output High, Low: 8mA, 8mA Number of Bits per Element: 4 Voltage - Supply: 1V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Through Hole Output Type: 3-State Package / Case: 20-DIP (0.300", 7.62mm) Packaging: Tube |
на замовлення 2823 шт: термін постачання 21-31 дні (днів) |
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MC68HC908QT2CPE-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 RAM Size: 128 x 8 Program Memory Size: 1.5KB (1.5K x 8) Speed: 8MHz Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 5 Part Status: Active Supplier Device Package: 8-PDIP Peripherals: LVD, POR, PWM Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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LPC2148FBD64,157 | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 512KB (512K x 8) RAM Size: 40K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 14x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 45 DigiKey Programmable: Not Verified |
на замовлення 428 шт: термін постачання 21-31 дні (днів) |
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74LVC161DB118 | NXP USA Inc. |
Description: BINARY COUNTER, LVC/LCX/Z SERIES |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BFG480W,115 | NXP USA Inc. |
Description: RF TRANS NPN 4.5V 21GHZ CMPAK-4Packaging: Cut Tape (CT) Package / Case: SC-82A, SOT-343 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 16dB Power - Max: 360mW Current - Collector (Ic) (Max): 250mA Voltage - Collector Emitter Breakdown (Max): 4.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V Frequency - Transition: 21GHz Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz Supplier Device Package: CMPAK-4 Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SAF3566HV/V1100557 | NXP USA Inc. |
Description: CAR RADIO DIGITAL SIGNAL PROCESSPackaging: Bulk Part Status: Active |
на замовлення 100 шт: термін постачання 21-31 дні (днів) |
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LPC11U12FHN33/201K | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFNDigiKey Programmable: Not Verified Number of I/O: 26 Supplier Device Package: 32-HVQFN (7x7) Peripherals: Brown-out Detect/Reset, POR, WDT Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b SAR Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 6K x 8 Program Memory Size: 16KB (16K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Packaging: Tray |
на замовлення 313 шт: термін постачання 21-31 дні (днів) |
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| NCF2961EHN3/0200CY | NXP USA Inc. |
Description: COMBI KEY TX 014 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| NCF29A7XHN3/0200IY | NXP USA Inc. |
Description: TOKEN PLUS Part Status: Active Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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PCA2129T/Q900/2 | NXP USA Inc. |
Description: AUTOMOTIVE ACCURATE RTC WITH INT |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74ALVC14D,112 | NXP USA Inc. |
Description: IC HEX INV SCHMITT TRIG 14SOICPackaging: Tube |
на замовлення 3780 шт: термін постачання 21-31 дні (днів) |
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74HCT138DB118 | NXP USA Inc. |
Description: NOW NEXPERIA 74HCT138DB - DECODEPackaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Active |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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NTS0304EPWJ | NXP USA Inc. |
Description: IC TRANSLTR TRX 4BIT 14-TSSOPPackaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Bits: 4 Logic Type: Translating Transceiver Operating Temperature: -40°C ~ 125°C (TA) Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Supplier Device Package: 14-TSSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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NTS0304EPWJ | NXP USA Inc. |
Description: IC TRANSLTR TRX 4BIT 14-TSSOPPackaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Bits: 4 Logic Type: Translating Transceiver Operating Temperature: -40°C ~ 125°C (TA) Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Supplier Device Package: 14-TSSOP Part Status: Active |
на замовлення 798 шт: термін постачання 21-31 дні (днів) |
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OM13543 | NXP USA Inc. |
Description: EVAL BOARD FOR NTS0304EPackaging: Bulk Function: Logic-Level Translator Type: Interface Contents: Board(s) Utilized IC / Part: NTS0304E Supplied Contents: Board(s) Primary Attributes: Level Shifter Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| MMA1250KEG | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOICPackaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±5g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 50Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 400 Grade: Automotive Qualification: AEC-Q100 |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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MC33812EKR2518 | NXP USA Inc. |
Description: MULTIFUNCTIONAL IGNITION AND INJPackaging: Bulk |
на замовлення 5690 шт: термін постачання 21-31 дні (днів) |
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| A7101CGUK/T0B0407, | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR Packaging: Tape & Reel (TR) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Interface: I²C Operating Temperature: -25°C ~ 90°C (TA) Voltage - Supply: 1.62V ~ 3.6V Controller Series: A710x Program Memory Type: EEPROM (20kB) Applications: Authentication Core Processor: MX51 Supplier Device Package: 12-WLCSP (2.06x2.02) Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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BGA7350,115 | NXP USA Inc. |
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFNSupplier Device Package: 32-HVQFN (5x5) Test Frequency: 50MHz P1dB: 17dBm Noise Figure: 6dB Current - Supply: 245mA Gain: 19.5dB Voltage - Supply: 4.75V ~ 5.25V RF Type: General Purpose Frequency: 50MHz ~ 250MHz Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Bulk |
на замовлення 1468 шт: термін постачання 21-31 дні (днів) |
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SPC5746BSK1MKU2R | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74AHC573PW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, AHC/VHC/H/U/V SERIESPackaging: Bulk Part Status: Active |
на замовлення 5463 шт: термін постачання 21-31 дні (днів) |
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74AHC573BQ-Q100115 | NXP USA Inc. |
Description: BUS DRIVER, AHC/VHC/H/U/V SERIESPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| SL3S5050N0FUD/00BZ | NXP USA Inc. |
Description: IC RFID TRANSP UCODE DNA WAFER Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Type: RFID Transponder Standards: EPC, ISO 29167 Supplier Device Package: Wafer Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MC9S08QG4CFKE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 24QFNDigiKey Programmable: Not Verified Number of I/O: 12 Part Status: Active Speed: 20MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Bulk Supplier Device Package: 24-QFN-EP (4x4) Peripherals: LVD, POR, PWM, WDT Connectivity: I²C, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 256 x 8 Program Memory Size: 4KB (4K x 8) |
на замовлення 4186 шт: термін постачання 21-31 дні (днів) |
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PMEG6010AESBC315 | NXP USA Inc. |
Description: DIODE SCHOTTKY 60V 1A DSN10062Packaging: Bulk Package / Case: 2-XDFN Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 2.4 ns Technology: Schottky Capacitance @ Vr, F: 20pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: DSN1006-2 Operating Temperature - Junction: 150°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 60 V Voltage - Forward (Vf) (Max) @ If: 625 mV @ 1 A Current - Reverse Leakage @ Vr: 650 µA @ 60 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PMEG6010ELR/B115 | NXP USA Inc. |
Description: RECTIFIER DIODE, SCHOTTKYPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IP4054CX15/LF135 | NXP USA Inc. |
Description: CONSUMER CIRCUIT Part Status: Active Packaging: Bulk |
на замовлення 18000 шт: термін постачання 21-31 дні (днів) |
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IP4054CX15/LF | NXP USA Inc. |
Description: CONSUMER CIRCUIT Part Status: Active Packaging: Bulk |
на замовлення 4500 шт: термін постачання 21-31 дні (днів) |
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| MCIMX31LCVMN4DR2518 | NXP USA Inc. |
Description: I.MX31 32-BIT MPU, ARM1136JF-S CPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MC33FS8430G1ES | NXP USA Inc. |
Description: SYSTEM BASIS CHIP FS8430Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Applications: System Basis Chip Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray |
на замовлення 133 шт: термін постачання 21-31 дні (днів) |
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74HCT540D-Q100118 | NXP USA Inc. |
Description: IC BUFFER INVERT 5.5V 20SOPart Status: Active Supplier Device Package: 20-SO Current - Output High, Low: 6mA, 6mA Number of Bits per Element: 8 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5601DF1VLL4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFPDigiKey Programmable: Not Verified Core Processor: e200z0h EEPROM Size: 4K x 16 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 12K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tape & Reel (TR) Number of I/O: 79 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 33x12b |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5601DF1VLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 16 Core Processor: e200z0h Data Converters: A/D 33x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5602CF2MLH4R | NXP USA Inc. | Description: IC MCU 32BIT 256KB FLASH 64LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5604BK0MLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 45 Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5604PEF1VLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPDigiKey Programmable: Not Verified Number of I/O: 68 Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 30x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 40K x 8 Program Memory Size: 512KB (512K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5603BF2VLQ4R | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 144LQFPDigiKey Programmable: Not Verified Number of I/O: 123 Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 36x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 28K x 8 Program Memory Size: 384KB (384K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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SPC5604PEF1VLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPDigiKey Programmable: Not Verified Number of I/O: 68 Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 30x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 40K x 8 Program Memory Size: 512KB (512K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPF5023AVNA0ES | NXP USA Inc. |
Description: PF5023Part Status: Active Supplier Device Package: 40-HVQFN (6x6) Current - Supply: 10µA Applications: High Performance i.MX 8, S32x Processor Based Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Packaging: Tray |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
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MPF5024AVNA0ES | NXP USA Inc. |
Description: PF5024 Supplier Device Package: 40-HVQFN (6x6) Applications: High Performance i.MX 8 Processor Based Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Packaging: Tray |
на замовлення 2865 шт: термін постачання 21-31 дні (днів) |
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JN5188THN/001Z | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLERDigiKey Programmable: Not Verified Part Status: Active Serial Interfaces: I2C, SPI, PWM, UART RF Family/Standard: 802.15.4 GPIO: 22 Supplier Device Package: 40-HVQFN (6x6) Current - Transmitting: 7.36mA ~ 20.28mA Current - Receiving: 4.3mA Protocol: Zigbee® Power - Output: 11.2dBm Voltage - Supply: 1.9V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TJ) Type: TxRx + MCU Memory Size: 640kB Flash, 152kB SRAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -101.3dBm Package / Case: 40-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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P89LPC952FAB512 | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 44PLCCDigiKey Programmable: Not Verified Number of I/O: 40 Part Status: Active Supplier Device Package: 44-PLCC (16.59x16.59) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I²C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: 8051 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C RAM Size: 512 x 8 Program Memory Size: 8KB (8K x 8) Speed: 18MHz Mounting Type: Surface Mount Package / Case: 44-LCC (J-Lead) Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| TDA8595J/N2S/S422112 | NXP USA Inc. |
Description: I2C-BUS CONTROLLED 4 X 45 W POWEPackaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MC33FS5502Y3ES | NXP USA Inc. |
Description: HIGH VOLTAGE PMIC QFN56 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Power Supplies Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
на замовлення 1377 шт: термін постачання 21-31 дні (днів) |
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MC33FS5502Y0ESR2 | NXP USA Inc. |
Description: HIGH VOLTAGE PMIC QFN56 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Power Supplies Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33FS5502Y3ESR2 | NXP USA Inc. |
Description: HIGH VOLTAGE PMIC QFN56 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Power Supplies Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| BUK7509-75A,127 | NXP USA Inc. |
Description: MOSFET N-CH 75V 75A TO220ABPackaging: Tube |
на замовлення 7296 шт: термін постачання 21-31 дні (днів) |
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SA56004HD112 | NXP USA Inc. |
Description: DIGITAL TEMPERATURE SENSOR, SMBUPackaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 1565 шт: термін постачання 21-31 дні (днів) |
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PBSS2515M315 | NXP USA Inc. |
Description: NOW NEXPERIA PBSS2515M - SMALL SPackaging: Bulk Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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RDVCU5775EVM | NXP USA Inc. |
Description: MPC5775B BMS & VCU REF DESIGNPackaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5775B Part Status: Active |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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BUK652R6-40C,127 | NXP USA Inc. |
Description: MOSFET N-CH 40V 120A TO220ABPackaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V Power Dissipation (Max): 263W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 199 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 11334 pF @ 25 V |
на замовлення 2041 шт: термін постачання 21-31 дні (днів) |
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74AUP2G157GF,115 | NXP USA Inc. |
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1Supplier Device Package: 8-XSON (1.35x1) Voltage Supply Source: Single Supply Current - Output High, Low: 4mA, 4mA Independent Circuits: 1 Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: Multiplexer Circuit: 1 x 2:1 Mounting Type: Surface Mount Package / Case: 8-XFDFN Packaging: Bulk |
на замовлення 84985 шт: термін постачання 21-31 дні (днів) |
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| PDTC124XMB315 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PDTC124XMB - SMALL
Description: NOW NEXPERIA PDTC124XMB - SMALL
товару немає в наявності
В кошику
од. на суму грн.
| PDTC124TMB315 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS
Qualification: AEC-Q101
Resistor - Base (R1): 22 kOhms
Frequency - Transition: 230 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1006B-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
Description: TRANS PREBIAS
Qualification: AEC-Q101
Resistor - Base (R1): 22 kOhms
Frequency - Transition: 230 MHz
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1006B-3
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Current - Collector Cutoff (Max): 1µA
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: SC-101, SOT-883
Packaging: Bulk
на замовлення 190000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11225+ | 2.16 грн |
| BAS21AVD/DG/B2135 |
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Виробник: NXP USA Inc.
Description: BAS21AVD - RECTIFIER DIODE
Description: BAS21AVD - RECTIFIER DIODE
товару немає в наявності
В кошику
од. на суму грн.
| BAS21AVD135 |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BAS21AVD - RECTIFIE
Description: NOW NEXPERIA BAS21AVD - RECTIFIE
товару немає в наявності
В кошику
од. на суму грн.
| MC912D60AVFUE8 |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, MI Bus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: CPU12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
Description: IC MCU 16BIT 60KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, MI Bus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: CPU12
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
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В кошику
од. на суму грн.
| S912D60AH2VPVE |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT SGF 112LQFP
Description: IC MCU 16BIT SGF 112LQFP
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од. на суму грн.
| S912D60AH2VPVER |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT SGF 112LQFP
Description: IC MCU 16BIT SGF 112LQFP
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В кошику
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| 74LV241DB,112 |
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Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SSOP
Description: IC BUF NON-INVERT 3.6V 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SSOP
на замовлення 1348 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 888+ | 25.46 грн |
| 74LV241N,112 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20DIP
Supplier Device Package: 20-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
Description: IC BUFFER NON-INVERT 3.6V 20DIP
Supplier Device Package: 20-DIP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Through Hole
Output Type: 3-State
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
на замовлення 2823 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 346+ | 66.04 грн |
| MC68HC908QT2CPE-NXP |
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
RAM Size: 128 x 8
Program Memory Size: 1.5KB (1.5K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 5
Part Status: Active
Supplier Device Package: 8-PDIP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Description: MICROCONTROLLER, 8 BIT, HC08/S08
RAM Size: 128 x 8
Program Memory Size: 1.5KB (1.5K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 5
Part Status: Active
Supplier Device Package: 8-PDIP
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
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В кошику
од. на суму грн.
| LPC2148FBD64,157 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 14x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 14x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
на замовлення 428 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1838.66 грн |
| 10+ | 1424.91 грн |
| 25+ | 1338.59 грн |
| 160+ | 1144.03 грн |
| 320+ | 1115.03 грн |
| 74LVC161DB118 |
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Виробник: NXP USA Inc.
Description: BINARY COUNTER, LVC/LCX/Z SERIES
Description: BINARY COUNTER, LVC/LCX/Z SERIES
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В кошику
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| BFG480W,115 | ![]() |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 4.5V 21GHZ CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 16dB
Power - Max: 360mW
Current - Collector (Ic) (Max): 250mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Description: RF TRANS NPN 4.5V 21GHZ CMPAK-4
Packaging: Cut Tape (CT)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 16dB
Power - Max: 360mW
Current - Collector (Ic) (Max): 250mA
Voltage - Collector Emitter Breakdown (Max): 4.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz
Supplier Device Package: CMPAK-4
Part Status: Obsolete
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| SAF3566HV/V1100557 |
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Виробник: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
на замовлення 100 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 34+ | 719.17 грн |
| LPC11U12FHN33/201K |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 6K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 6K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
на замовлення 313 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 250.01 грн |
| 10+ | 181.63 грн |
| 25+ | 166.76 грн |
| 100+ | 141.20 грн |
| 260+ | 133.62 грн |
| PCA2129T/Q900/2 |
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Виробник: NXP USA Inc.
Description: AUTOMOTIVE ACCURATE RTC WITH INT
Description: AUTOMOTIVE ACCURATE RTC WITH INT
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В кошику
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| 74ALVC14D,112 |
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на замовлення 3780 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2420+ | 9.09 грн |
| 74HCT138DB118 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74HCT138DB - DECODE
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Description: NOW NEXPERIA 74HCT138DB - DECODE
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2000+ | 10.86 грн |
| NTS0304EPWJ |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR TRX 4BIT 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
Description: IC TRANSLTR TRX 4BIT 14-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
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| NTS0304EPWJ |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR TRX 4BIT 14-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
Description: IC TRANSLTR TRX 4BIT 14-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 14-TSSOP
Part Status: Active
на замовлення 798 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 70.41 грн |
| 10+ | 48.76 грн |
| 25+ | 44.04 грн |
| 100+ | 36.45 грн |
| 250+ | 34.12 грн |
| 500+ | 32.71 грн |
| OM13543 |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR NTS0304E
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Contents: Board(s)
Utilized IC / Part: NTS0304E
Supplied Contents: Board(s)
Primary Attributes: Level Shifter
Part Status: Active
Description: EVAL BOARD FOR NTS0304E
Packaging: Bulk
Function: Logic-Level Translator
Type: Interface
Contents: Board(s)
Utilized IC / Part: NTS0304E
Supplied Contents: Board(s)
Primary Attributes: Level Shifter
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7060.34 грн |
| MMA1250KEG |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 400
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 400
Grade: Automotive
Qualification: AEC-Q100
на замовлення 13 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 975.50 грн |
| 10+ | 744.03 грн |
| MC33812EKR2518 |
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на замовлення 5690 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 127+ | 177.48 грн |
| A7101CGUK/T0B0407, |
Виробник: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Active
DigiKey Programmable: Not Verified
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I²C
Operating Temperature: -25°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 3.6V
Controller Series: A710x
Program Memory Type: EEPROM (20kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 12-WLCSP (2.06x2.02)
Part Status: Active
DigiKey Programmable: Not Verified
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| BGA7350,115 |
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Виробник: NXP USA Inc.
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Test Frequency: 50MHz
P1dB: 17dBm
Noise Figure: 6dB
Current - Supply: 245mA
Gain: 19.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: General Purpose
Frequency: 50MHz ~ 250MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFN
Supplier Device Package: 32-HVQFN (5x5)
Test Frequency: 50MHz
P1dB: 17dBm
Noise Figure: 6dB
Current - Supply: 245mA
Gain: 19.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: General Purpose
Frequency: 50MHz ~ 250MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
на замовлення 1468 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 86+ | 258.86 грн |
| SPC5746BSK1MKU2R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Description: IC MCU 32BIT 3MB FLASH 176LQFP
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| 74AHC573PW-Q100118 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
на замовлення 5463 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1823+ | 11.58 грн |
| 74AHC573BQ-Q100115 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Description: BUS DRIVER, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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| SL3S5050N0FUD/00BZ |
Виробник: NXP USA Inc.
Description: IC RFID TRANSP UCODE DNA WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Type: RFID Transponder
Standards: EPC, ISO 29167
Supplier Device Package: Wafer
Part Status: Active
Description: IC RFID TRANSP UCODE DNA WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Type: RFID Transponder
Standards: EPC, ISO 29167
Supplier Device Package: Wafer
Part Status: Active
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| MC9S08QG4CFKE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
Supplier Device Package: 24-QFN-EP (4x4)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Description: IC MCU 8BIT 4KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 12
Part Status: Active
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Bulk
Supplier Device Package: 24-QFN-EP (4x4)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
на замовлення 4186 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 135+ | 177.22 грн |
| PMEG6010AESBC315 |
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Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 60V 1A DSN10062
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 625 mV @ 1 A
Current - Reverse Leakage @ Vr: 650 µA @ 60 V
Description: DIODE SCHOTTKY 60V 1A DSN10062
Packaging: Bulk
Package / Case: 2-XDFN
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2.4 ns
Technology: Schottky
Capacitance @ Vr, F: 20pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: DSN1006-2
Operating Temperature - Junction: 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 60 V
Voltage - Forward (Vf) (Max) @ If: 625 mV @ 1 A
Current - Reverse Leakage @ Vr: 650 µA @ 60 V
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| IP4054CX15/LF135 |
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1255+ | 18.99 грн |
| IP4054CX15/LF |
на замовлення 4500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 919+ | 24.45 грн |
| MCIMX31LCVMN4DR2518 |
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Виробник: NXP USA Inc.
Description: I.MX31 32-BIT MPU, ARM1136JF-S C
Packaging: Bulk
Part Status: Active
Description: I.MX31 32-BIT MPU, ARM1136JF-S C
Packaging: Bulk
Part Status: Active
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| MC33FS8430G1ES |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8430
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP FS8430
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
на замовлення 133 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 791.95 грн |
| 10+ | 688.80 грн |
| 25+ | 656.78 грн |
| 80+ | 535.19 грн |
| 74HCT540D-Q100118 |
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Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SO
Part Status: Active
Supplier Device Package: 20-SO
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Description: IC BUFFER INVERT 5.5V 20SO
Part Status: Active
Supplier Device Package: 20-SO
Current - Output High, Low: 6mA, 6mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
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| SPC5601DF1VLL4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Core Processor: e200z0h
EEPROM Size: 4K x 16
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 33x12b
Description: IC MCU 32BIT 128KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Core Processor: e200z0h
EEPROM Size: 4K x 16
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 79
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 33x12b
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| SPC5601DF1VLL4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 33x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
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| SPC5602CF2MLH4R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
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| SPC5604BK0MLH4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 512KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 45
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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| SPC5604PEF1VLL6R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 30x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 40K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 30x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 40K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
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| SPC5603BF2VLQ4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 123
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 384KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 123
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 36x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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| SPC5604PEF1VLL6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 30x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 40K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 30x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 40K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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| MPF5023AVNA0ES |
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Виробник: NXP USA Inc.
Description: PF5023
Part Status: Active
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 10µA
Applications: High Performance i.MX 8, S32x Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Description: PF5023
Part Status: Active
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 10µA
Applications: High Performance i.MX 8, S32x Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
на замовлення 490 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 435.93 грн |
| 10+ | 379.03 грн |
| 25+ | 361.37 грн |
| 80+ | 294.45 грн |
| 230+ | 281.23 грн |
| 490+ | 256.41 грн |
| MPF5024AVNA0ES |
Виробник: NXP USA Inc.
Description: PF5024
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Description: PF5024
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
на замовлення 2865 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 344.16 грн |
| 10+ | 254.16 грн |
| 25+ | 234.84 грн |
| 100+ | 200.42 грн |
| 490+ | 191.01 грн |
| JN5188THN/001Z |
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Виробник: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.36mA ~ 20.28mA
Current - Receiving: 4.3mA
Protocol: Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: WIRELESS MICROCONTROLLER
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, PWM, UART
RF Family/Standard: 802.15.4
GPIO: 22
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 7.36mA ~ 20.28mA
Current - Receiving: 4.3mA
Protocol: Zigbee®
Power - Output: 11.2dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TJ)
Type: TxRx + MCU
Memory Size: 640kB Flash, 152kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -101.3dBm
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| P89LPC952FAB512 |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44PLCC
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 44-PLCC (16.59x16.59)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Bulk
Description: IC MCU 8BIT 8KB FLASH 44PLCC
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 44-PLCC (16.59x16.59)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Bulk
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| TDA8595J/N2S/S422112 |
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Виробник: NXP USA Inc.
Description: I2C-BUS CONTROLLED 4 X 45 W POWE
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: I2C-BUS CONTROLLED 4 X 45 W POWE
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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| MC33FS5502Y3ES |
Виробник: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 1377 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 481.82 грн |
| 10+ | 359.37 грн |
| 25+ | 333.24 грн |
| 100+ | 293.28 грн |
| MC33FS5502Y0ESR2 |
Виробник: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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| MC33FS5502Y3ESR2 |
Виробник: NXP USA Inc.
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: HIGH VOLTAGE PMIC QFN56
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Power Supplies
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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| BUK7509-75A,127 |
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на замовлення 7296 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 365+ | 62.11 грн |
| SA56004HD112 |
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Виробник: NXP USA Inc.
Description: DIGITAL TEMPERATURE SENSOR, SMBU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: DIGITAL TEMPERATURE SENSOR, SMBU
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1565 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 634+ | 34.25 грн |
| PBSS2515M315 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PBSS2515M - SMALL S
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PBSS2515M - SMALL S
Packaging: Bulk
Part Status: Active
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| RDVCU5775EVM |
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Виробник: NXP USA Inc.
Description: MPC5775B BMS & VCU REF DESIGN
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B
Part Status: Active
Description: MPC5775B BMS & VCU REF DESIGN
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5775B
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 33607.01 грн |
| BUK652R6-40C,127 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 199 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11334 pF @ 25 V
Description: MOSFET N-CH 40V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 199 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11334 pF @ 25 V
на замовлення 2041 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 290+ | 78.94 грн |
| 74AUP2G157GF,115 |
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Виробник: NXP USA Inc.
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Supplier Device Package: 8-XSON (1.35x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Supplier Device Package: 8-XSON (1.35x1)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 84985 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1528+ | 15.18 грн |











































